Thermal analysis sensor with boss structure

Abstract

The utility model relates to a thermal analysis sensor with a boss structure, and belongs to the technical field of thermal analysis. The thermal analysis sensor includes: a first substrate; thermopiles are arranged in the first substrate, and the thermopiles are distributed between the first surface of the first substrate and the second surface of the first substrate; the first surface of the first substrate and the second surface of the first substrate are opposite surfaces; and the base is connected with the second surface of the first substrate, and the size of the first substrate is smaller than that of the base, so that the first substrate forms a boss on the base. The first substrate adopting the boss form can concentrate heat and reduce transverse heat diffusion. Namely, heat transfer on the first substrate provided by the utility model cannot diffuse to the surrounding area, but can diffuse more longitudinally, so that the heat utilization efficiency is improved, and the heat loss is low.

Description

Technical Field

[0001] This utility model belongs to the field of thermal analysis technology and relates to a thermal analysis sensor with a boss structure. Background Technology

[0002] Differential scanning calorimetry (DSC) is a high-precision analytical instrument used to study the thermal properties of materials. By monitoring the difference in heat flow between a sample and a reference material under programmed temperature control in real time, it can accurately capture physical transformations (such as melting, crystallization, and glass transition) and chemical reactions (such as decomposition and solidification) that occur during heating or cooling. DSC is widely used in polymer materials, pharmaceuticals, metals, ceramics, and other fields, providing key data such as melting point, phase transition temperature, thermal effect (enthalpy change), and thermal stability, offering crucial support for materials research and development, quality control, and process optimization. Its high sensitivity and accuracy make it an indispensable tool in materials science and thermal analysis.

[0003] Thermocouples, as the core component of differential scanning calorimeters, are used to detect the temperature difference between the sample and the reference material and convert it into a heat flow signal. Studies of existing differential scanning calorimeters have revealed low thermal efficiency and high heat loss in the sample measurement or reference regions, resulting in low measurement accuracy or sensitivity. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides a thermal analysis sensor with a boss structure.

[0005] To achieve the above objectives, the technical solution adopted in this application is:

[0006] In a first aspect, this application provides a thermal analysis sensor with a boss structure, comprising: a first substrate; a thermopile disposed in the first substrate and the thermopile being distributed between a first surface and a second surface of the first substrate; the first surface and the second surface of the first substrate being opposite surfaces; and a base connected to the second surface of the first substrate, wherein the size of the first substrate is smaller than the size of the base, such that a boss is formed on the base of the first substrate.

[0007] Optionally, the thermocouple stack includes N pairs of thermocouples; the N pairs of thermocouples include N thermocouple units of a first material and N thermocouple units of a second material; N is a positive integer; the N thermocouple units of the first material are disposed through the first substrate; the first end of the N thermocouple units of the first material is located on the first surface of the first substrate, and the second end of the N thermocouple units of the first material is located on the second surface of the first substrate; the N thermocouple units of the second material are disposed through the first substrate; the first end of the N thermocouple units of the second material is located on the first surface of the first substrate, and the second end of the N thermocouple units of the second material is located on the second surface of the first substrate; wherein, the first end of each thermocouple unit of the first material is connected to the first end of an adjacent thermocouple unit of the second material, and the second end of each thermocouple unit of the first material is connected to the second end of another adjacent thermocouple unit of the second material, so that the N thermocouple units of the first material and the N thermocouple units of the second material in the first substrate are connected in series.

[0008] Optionally, the first ends of two thermocouple units connected in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; the second ends of two thermocouple units connected in the second surface of the first substrate form a lower surface thermoelectric junction; the second surface of the first substrate includes N lower surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in a concentric circle structure, and the N lower surface thermoelectric junctions are also arranged in a concentric circle structure; correspondingly, the shape of the first substrate is cylindrical, and the first surface and the second surface of the first substrate are the upper and lower bottom surfaces of the cylinder, respectively.

[0009] Optionally, the first ends of two thermocouple units connected in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; the second ends of two thermocouple units connected in the second surface of the first substrate form a lower surface thermoelectric junction; the second surface of the first substrate includes N lower surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in a matrix structure, and the N lower surface thermoelectric junctions are also arranged in a matrix structure; correspondingly, the shape of the first substrate is a cube, and the first surface and the second surface of the first substrate are rectangular.

[0010] Optionally, the thickness of the first substrate is A millimeters; A is a positive number; and the range of A is 0.3 to 1.2.

[0011] Optionally, the thermocouple stack includes N pairs of thermocouples; the N pairs of thermocouples include N thermocouple units of a first material and N thermocouple units of a second material; the first substrate includes a first insulating plate and a second insulating plate; N is a positive integer; the N thermocouple units of the first material are disposed on the first insulating plate, and the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end; the N thermocouple units of the second material are disposed on the second insulating plate; and the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end; wherein, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post, so that the thermocouple units of the first material on the first insulating plate and the thermocouple units of the second material on the second insulating plate are connected in series.

[0012] Optionally, the thickness of both the first insulating plate and the second insulating plate is B mm; B > 0; the first insulating plate and the second insulating plate are adjacent to each other, or the first insulating plate and the second insulating plate are spaced apart, and the thickness of the space is at least B mm; wherein B is 0.1 to 0.5.

[0013] Optionally, an inner ring opening is provided at the first end of each thermocouple unit of the first material in the first insulating plate; the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post in the corresponding inner ring opening; an outer ring opening is provided at the second end of each thermocouple unit of the second material in the second insulating plate; the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post in the corresponding outer ring opening.

[0014] Optionally, the first substrate corresponds to the sample measurement area of ​​the thermal analysis sensor; the thermal analysis sensor further includes a second substrate; the second substrate corresponds to the reference area of ​​the thermal analysis sensor; wherein the thermopile in the first substrate and the thermopile in the second substrate have the same structure, and the end of the thermopile in the first substrate is connected to the end of the thermopile in the second substrate.

[0015] Optionally, the thermal analysis sensor has at least two sample measurement areas.

[0016] The beneficial effects of the embodiments of this application include:

[0017] The first substrate, employing a boss-shaped design, concentrates heat and reduces lateral heat diffusion. That is, existing substrates with thermopile configurations are typically the same size as the base, causing heat transfer (lateral diffusion) throughout the entire substrate. However, the heat transfer on the first substrate provided in this application does not diffuse to the surrounding area but rather diffuses more longitudinally, improving heat utilization efficiency and reducing heat loss. It is evident that the aforementioned boss-structured thermal analysis sensor can reduce heat loss. Furthermore, this design is more compatible with differential thermopile structures to further amplify the temperature difference between the upper and lower surfaces, improving the overall measurement sensitivity of the thermal analysis sensor. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a thermal analysis sensor with a first boss structure provided in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the structure of a thermal analysis sensor with a second boss structure provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the structure of the first substrate and thermopile provided in the embodiments of this application;

[0021] Figure 4 This is a schematic diagram of a thermopile structure provided in an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the arrangement of a thermopile provided in an embodiment of this application;

[0023] Figure 6 A schematic diagram of another arrangement of the thermopile provided in an embodiment of this application;

[0024] Figure 7 This is a schematic diagram of the structure of the second type of first substrate and thermopile provided in the embodiments of this application;

[0025] Figure 8 This is a schematic diagram of another thermopile structure provided in an embodiment of this application;

[0026] Figure 9 This is a schematic diagram of the structure of a thermal analysis sensor with a third boss structure provided in an embodiment of this application;

[0027] Figure 10 This is a schematic diagram of the structure of a thermal analysis sensor with a fourth boss structure provided in an embodiment of this application.

[0028] Figure label:

[0029] 100 - Thermal analysis sensor; 10 - First substrate; 101 - First insulating plate; 102 - Second insulating plate; 20 - Base; 30 - Thermocouple stack; 301 - Thermocouple unit of first material; 302 - Thermocouple unit of second material; 303 - Metal pillar; 40 - Second substrate; 50 - Insulating protective layer. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Thermocouples, as the core component of differential scanning calorimeters, are used to detect the temperature difference between the sample and the reference material and convert it into a heat flow signal. Studies of existing differential scanning calorimeters have revealed low thermal efficiency and high heat loss in the sample measurement or reference regions, resulting in low measurement accuracy or sensitivity.

[0032] In view of the above problems, this application provides the following embodiments to solve them:

[0033] Please see Figure 1 as well as Figure 2 This application provides a thermal analysis sensor 100 with a boss structure, including a first substrate 10 and a base 20.

[0034] A thermopile 30 is disposed in the first substrate 10. The thermopile 30 is distributed between the first surface and the second surface of the first substrate 10. The first surface and the second surface of the first substrate 10 are opposite surfaces.

[0035] It should be noted that because the thermopile 30 is distributed between the first surface and the second surface of the first substrate 10, the thermopile 30 can effectively measure the temperature difference in the vertical direction. In other words, the thermopile 30 adopts a differential structure.

[0036] The base 20 is connected to the second surface of the first substrate 10, and the size of the first substrate 10 is smaller than the size of the base 20, so that the first substrate 10 forms a boss on the base 20.

[0037] In summary, the thermal analysis sensor 100 with a boss structure provided in this application embodiment has the following beneficial effects:

[0038] The first substrate 10, with its protrusion design, concentrates heat and reduces lateral heat diffusion. That is, conventional substrates with thermopile configurations are typically the same size as the base, causing heat transfer (lateral diffusion) throughout the entire substrate. However, the heat transfer on the first substrate 10 provided in this application does not diffuse to the surrounding area but rather diffuses more longitudinally, improving heat utilization efficiency and reducing heat loss. It is evident that the aforementioned protrusion structure in the thermal analysis sensor can reduce heat loss. Furthermore, this configuration is more compatible with the differential thermopile structure 30, further amplifying the temperature difference between the upper and lower surfaces and improving the measurement sensitivity of the entire thermal analysis sensor 100.

[0039] The following describes a thermopile 30 with a differential upper and lower structure provided in an embodiment of this application.

[0040] For details, please refer to Figure 3 and Figure 4 The thermopile 30 includes N pairs of thermocouples.

[0041] N thermocouples include N thermocouple units 301 of a first material and N thermocouple units 302 of a second material; N is a positive integer; the number can be set according to requirements, such as the range of N from 100 to 200, which is not limited in this application.

[0042] N thermocouple units 301 made of a first material are disposed through the first substrate 10. The first ends of the N thermocouple units 301 are located on the first surface of the first substrate 10, and the second ends of the N thermocouple units 301 are located on the second surface of the first substrate 10. Similarly, N thermocouple units 302 made of a second material are disposed through the first substrate 10; the first ends of the N thermocouple units 302 made of the second material are located on the first surface of the first substrate 10, and the second ends of the N thermocouple units 302 made of the second material are located on the second surface of the first substrate 10.

[0043] In this configuration, the first end of each thermocouple unit 301 of the first material is connected to the first end of an adjacent thermocouple unit 302 of the second material, and the second end of each thermocouple unit 301 of the first material is connected to the second end of another adjacent thermocouple unit 302 of the second material, so that N thermocouple units 301 of the first material and N thermocouple units 302 of the second material in the first substrate are connected in series.

[0044] It can be understood that for any thermocouple unit 301 of the first material, the thermocouple unit 302 of the second material connected to its first end is different from the thermocouple unit 302 of the second material connected to its second end, thereby causing thermocouple units of different materials to be arranged in an alternating manner and connected in series.

[0045] It should be noted that adjacent thermocouple units 301 of the first material and thermocouple units 302 of the second material constitute a pair of thermocouples, thereby making the thermal analysis sensor 100 include N pairs of thermocouples, which form a thermopile 30. To facilitate understanding of the structure of the thermal analysis sensor 100 provided in this embodiment, therefore... Figure 3 The first substrate 10 is separated from the thermopile 30 to demonstrate their connection. Figure 4 The complete structure of the thermopile 30 formed in the first substrate 10 is shown.

[0046] In one embodiment, both the thermocouple unit 301 of the first material and the thermocouple unit 302 of the second material are cylindrical structures, that is, the first substrate 10 includes 2N circular through holes to accommodate N thermocouple units 301 of the first material and N thermocouple units 302 of the second material.

[0047] Furthermore, it should be noted that the aforementioned thermocouple unit 301 of the first material and thermocouple unit 302 of the second material are two thermocouple units made of different materials. In one embodiment, the first material is gold-platinum-palladium, and the second material is gold. Adjacent thermocouple units 301 of the first material and thermocouple units 302 of the second material can be connected by gold. The first substrate 10 can be a ceramic plate; specifically, the first substrate 10 can be a co-fired high-temperature resistant ceramic sheet. Of course, this is not limited, and other high-temperature resistant insulating materials can also be used.

[0048] Of course, in practical applications, other thermocouple materials can also be used, as long as the first material and the second material are different, while the material of the metal column can be the same as any of them.

[0049] The principle of the thermal analysis sensor 100, which includes the above-mentioned thermopile 30 with a boss structure for sensing the upper and lower temperature differences, will be explained below.

[0050] In the specific measurement application of the thermal analysis sensor 100, the first surface of its first substrate 10 is positioned closer to the crucible. The first ends of two connected thermocouple units on the first surface of the first substrate 10 form an upper surface thermoelectric junction; that is, the first surface of the first substrate 10 includes N upper surface thermoelectric junctions. The second ends of two connected thermocouple units on the second surface of the first substrate 10 form a lower surface thermoelectric junction; that is, the second surface of the first substrate 10 includes N lower surface thermoelectric junctions. It can be understood that the two thermoelectric junctions of N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the first substrate 10, thus enabling measurement when a temperature difference exists between the two surfaces, resulting in a thermoelectric potential.

[0051] It should be noted that, with the above structure, the two thermocouple junctions of the N pairs of thermocouples are respectively distributed on the upper and lower surfaces of the first substrate 10. The upper surface of the first substrate 10 contacts the heat source for measurement, thereby enabling measurement by detecting the overall temperature difference between the two surfaces. That is, by detecting the temperature difference between the upper and lower surfaces, the direction of heat transfer during the reaction of the sample in the crucible can be more closely aligned, improving measurement accuracy. Simultaneously, the arrangement of the upper and lower thermocouple junctions, compared to the traditional method of placing thermocouples on the same plane, significantly increases the density of the thermocouple junctions, allowing the upper surface to more completely capture the heat released by the reaction of the sample in the crucible, thereby improving the thermoelectric conversion coefficient of the heat flow measurement. Furthermore, this through-type thermocouple structure reduces the thermal measurement time constant, enabling the thermal analysis sensor 100 to capture transient temperature changes more quickly, detect smaller temperature differences per unit time, and improve thermal resolution and detection sensitivity.

[0052] In one embodiment, the first ends of two connected thermocouple units on the first surface of the first substrate 10 form an upper surface thermoelectric junction; the first surface of the first substrate 10 includes N upper surface thermoelectric junctions. The second ends of two connected thermocouple units on the second surface of the first substrate 10 form a lower surface thermoelectric junction; the second surface of the first substrate 10 includes N lower surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in a concentric circle structure, and the N lower surface thermoelectric junctions are also arranged in a concentric circle structure. Accordingly, the shape of the first substrate 10 is cylindrical (e.g., ...). Figure 3 As shown, the first surface of the first substrate 10 and the second surface of the first substrate 10 are respectively the upper bottom surface and the lower bottom surface of a cylinder.

[0053] Figure 5 The image shows the concentric circle structure of the thermoelectric junction of thermopile 30. These are connected in series, forming six concentric circles of different diameters from the outside in.

[0054] It should be noted that arranging the thermoelectric junctions in a concentric circular structure creates a radial distribution on the first substrate 10, uniformly covering the entire bottom area of ​​the crucible under test and avoiding the thermal blind spots caused by linear arrangements. Simultaneously, the concentric circular thermoelectric junctions can measure temperature differences at different radii, capturing radial heat flow distribution in real time and providing more comprehensive thermal field information, such as high-resolution temperature distribution maps. Furthermore, since the crucible is typically circular, the concentric circular arrangement of the thermoelectric junctions better conforms to the crucible's shape, matching the circular heat source at the bottom and further improving measurement accuracy. Additionally, the concentric circular distribution ensures symmetrical distribution of the thermoelectric junctions in all spatial directions, increasing the stability of the thermal analysis sensor 100 in complex environments and enabling more stable and reliable detection.

[0055] In one embodiment, the concentric circular structure formed by N upper surface thermoelectric junctions has an outer circle diameter of Q millimeters; Q is a positive number; wherein Q ranges from 3 to 10.

[0056] That is, the diameter of the outermost circle of the concentric circular structure formed by the N upper surface thermoelectric junctions ranges from 3 mm to 10 mm.

[0057] Depending on the diameter, different numbers of upper surface thermoelectric junctions are formed.

[0058] For example, the concentric circle structure can form 140 pairs of thermoelectric junctions within a diameter of 6.5 mm.

[0059] Please see Figure 6 As another structure, the N upper surface thermoelectric junctions are arranged in a matrix structure, and the N lower surface thermoelectric junctions are also arranged in a matrix structure. Correspondingly, the first substrate 10 is cubic in shape, and the first surface and the second surface of the first substrate 10 are rectangular.

[0060] Figure 6 The diagram shows the matrix structure of the thermoelectric junction of thermopile 30.

[0061] It should be noted that the matrix structure arranges the thermoelectric junctions in a regular grid pattern, which can be effectively applied to the thermal field distribution of rectangular or square heat sources, and has high resolution in the X and Y directions.

[0062] The number of upper surface thermoelectric junctions is formed according to the different dimensions of the matrix structure.

[0063] For example, the matrix structure can form 112 pairs of thermoelectric junctions within a diameter range of 6.5 mm x 6.5 mm.

[0064] In addition, the above-mentioned thermoelectric junctions can also be distributed in polygonal structures, such as triangular structures, hexagonal structures, pentagonal star structures, etc., which are not limited here.

[0065] In one embodiment, the thickness of the first substrate 10 is A millimeters.

[0066] Where A is a positive number; the range of A is 0.3 mm to 1.2 mm.

[0067] For example, in a specific application, the value of A is 0.6 mm. Then the thickness of the first substrate 10 is 0.6 mm. When the first substrate 10 is constructed using a 0.1 mm insulating ceramic substrate, six insulating ceramic substrates can be stacked to form a first substrate 10 with a thickness of 0.6 mm.

[0068] Furthermore, the range of A can be from 0.4 mm to 1 mm.

[0069] It should be noted that setting the thickness of the first substrate 10 to 0.4 mm to 1 mm can make the temperature difference between the upper surface (close to the heat source) and the lower surface (away from the heat source) of the first substrate 10 significant, thereby improving the sensitivity of differential measurement. In other words, it can achieve a significant temperature difference between the upper and lower surfaces, thus enhancing the signal output.

[0070] The following describes another thermopile 30 with a differential upper and lower structure provided in the embodiments of this application.

[0071] Please participate Figure 7 and Figure 8 The first substrate 10 includes a first insulating plate 1011 and a second insulating plate 102.

[0072] N thermocouple units 301 of the first material are disposed on the first insulating plate 1011, and the N thermocouple units 301 of the first material are arranged in a ring and spaced apart; each thermocouple unit 301 of the first material includes a first end and a second end opposite to each other.

[0073] Correspondingly, N thermocouple units 302 of the second material are disposed on the second insulating plate 102; and the N thermocouple units 302 of the second material are arranged in a ring and spaced apart; each thermocouple unit 302 of the second material includes a first end and a second end opposite to each other.

[0074] In this configuration, the first end of each thermocouple unit 301 of the first material is connected to the first end of a thermocouple unit 302 of the second material via a metal post 3033, and the second end of each thermocouple unit 301 of the first material is connected to the second end of another thermocouple unit 302 of the second material via a metal post 3033, so that the thermocouple units of the first material on the first insulating plate 1011 and the thermocouple units of the second material on the second insulating plate 102 are connected in series.

[0075] It should be noted that the thermocouple unit 301 of the first material is a long strip structure with a first end and a second end, that is, the first end and the second end are the two ends of the long strip structure. Since the N thermocouple units 301 of the first material are arranged in a ring and spaced apart, the first ends of the N thermocouple units 301 of the first material form an inner circle, and the second ends of the N thermocouple units 301 of the first material form an outer circle, that is, the first end is located inside the second end relative to the first end, and the second end is located outside the first end relative to the first end.

[0076] N thermocouple units 302 of a second material are formed on the second insulating plate 102. The N thermocouple units 302 of the second material are arranged in a ring and spaced apart; each thermocouple unit 302 of the second material includes a first end and a second end. Similarly, N is a positive integer.

[0077] Here, the number of thermocouple units 301 of the first material in the first insulating plate 101 is the same as the number of thermocouple units 302 of the second material in the second insulating plate 102. The first material and the second material are different materials.

[0078] The N mentioned above can be 17, 20, 21, etc., and the first and second ends of the thermocouple unit 302 of the second material mentioned above are opposite ends.

[0079] It should be noted that the thermocouple units of the two materials have the same structure. That is, the thermocouple unit 302 of the second material has a long strip structure with a first end and a second end, which are the two ends of the long strip structure. Since the N thermocouple units 302 of the second material are arranged in a ring and spaced apart, the first ends of the N thermocouple units 302 of the second material form an inner circle, and the second ends of the N thermocouple units 302 of the second material form an outer circle. That is, the first end is located inside the second end relative to the first end, and the second end is located outside the first end relative to the first end.

[0080] In this embodiment, the first end of each thermocouple unit 301 of the first material is connected to the first end of a thermocouple unit 302 of the second material through a metal post 303, and the second end of each thermocouple unit 301 of the first material is connected to the second end of another thermocouple unit 302 of the second material through a metal post 303, so that the thermocouple units 301 of the first material on the first insulating plate 101 and the thermocouple units 302 of the second material on the second insulating plate 102 are connected in series.

[0081] The first ends of N thermocouple units 301 of the first material and the first ends of N thermocouple units 302 of the second material form an inner thermoelectric junction. The second ends of N thermocouple units 301 of the first material and the second ends of N thermocouple units 302 of the second material form an outer thermoelectric junction.

[0082] Adjacent thermocouple units 301 of the first material and thermocouple units 302 of the second material constitute a pair of thermocouples (in a V-shape); N pairs of thermocouples form a thermopile.

[0083] Taking any one of the thermocouple units 301 made of the first material as an example: the first end of the thermocouple unit 301 made of the first material is connected via a metal post 303 to the first end of a thermocouple unit 302 made of a second material located directly below the first end of the first material thermocouple unit 301. This can be understood as the two thermocouple units of these two materials forming a pair of thermocouples (in a V-shape). Then, the second end of the thermocouple unit 301 made of the first material is connected via a metal post 303 to the second end of another thermocouple unit 302 made of a second material located directly below the second end of the first material thermocouple unit 301. This can be understood as a series connection of two different thermocouple pairs. This method allows N pairs of thermocouples to form a thermopile 30, which is achieved by connecting N thermocouples in a staggered arrangement, forming a ring-shaped overall arrangement. In terms of overall presentation, each thermocouple is connected to the adjacent thermocouple, such that a thermocouple unit 302 of a second material is connected between two adjacent thermocouple units 301 of the first material, or a thermocouple unit 301 of the first material is connected between two adjacent thermocouple units 302 of the second material.

[0084] Furthermore, in this embodiment, during actual measurement, the first insulating plate 101 is closer to the container holding the sample than the second insulating plate 102. If the sample is held in a crucible, the first insulating plate 101 is closer to the crucible than the second insulating plate 102, thereby allowing the inner thermoelectric junction to be closer to the bottom of the crucible.

[0085] Optionally, the thickness of both the first insulating plate 101 and the second insulating plate 102 is B millimeters; B > 0.

[0086] In one embodiment, the thickness of the first insulating plate 101 and the second insulating plate 102 is 0.1 mm.

[0087] Of course, the thickness in this embodiment is not intended to limit this application. In other embodiments, the thickness of the first insulating plate 101 and the second insulating plate 102 can also be set to 0.2 mm, etc.

[0088] Optionally, the first insulating plate 101 and the second insulating plate 102 are adjacent to each other, or the first insulating plate 101 and the second insulating plate 102 are spaced apart, with the thickness of the space being at least B millimeters; wherein the value of B can be 0.1 to 0.5.

[0089] In other words, the first insulating plate 101 and the second insulating plate 102 can be in direct contact, or multiple insulating plates can be placed between them to increase the spacing thickness.

[0090] When the first insulating plate 101 and the second insulating plate 102 are in contact with each other, the size of the metal column 303 is also B millimeters.

[0091] When the first insulating plate 101 and the second insulating plate 102 are arranged vertically at intervals, such as 2 mm apart, an insulating plate with a thickness of B is also arranged between the first insulating plate 101 and the second insulating plate 102.

[0092] As can be seen, in this embodiment of the application, the size of the metal column 303 is at least B millimeters.

[0093] For ease of understanding, the dimensions of the metal pillar 303 and the spacing of the insulating plate can be set in the manner described above.

[0094] In addition, the thermopile 30 can also be a flat thermopile, i.e., a thermopile structure with internal and external differentials, which is not limited in this application.

[0095] Optionally, the first insulating plate 101 has an inner ring opening at the first end of each thermocouple unit 301 of the first material. The first end of each thermocouple unit 301 of the first material is connected to the first end of a thermocouple unit 302 of the second material through a metal post 303 in the corresponding inner ring opening. The second insulating plate 102 has an outer ring opening at the second end of each thermocouple unit 302 of the second material; the second end of each thermocouple unit 301 of the first material is connected to the second end of another thermocouple unit 302 of the second material through a metal post 303 in the corresponding outer ring opening.

[0096] The design of this method achieves the following effect: the inner thermoelectric junction is located in the upper layer, close to the bottom of the sample measurement crucible. This allows the upper layer to capture the heat released by the reaction of the sample inside the crucible more quickly, resulting in more accurate measurement results. Simultaneously, with the inner thermoelectric junction in the upper layer and the outer thermoelectric junction in the lower layer, the thermal reaction reaches equilibrium more quickly, improving rapid response performance.

[0097] Please see Figure 9 as well as Figure 10 The first substrate 10 corresponds to the sample measurement area of ​​the thermal analysis sensor 100.

[0098] The thermal analysis sensor also includes a second substrate 40; the second substrate 40 corresponds to the reference area of ​​the thermal analysis sensor 100.

[0099] The thermopile 30 in the first substrate 10 has the same structure as the thermopile 30 in the second substrate, and the end of the thermopile 30 in the first substrate 10 is connected to the end of the thermopile 30 in the second substrate 40.

[0100] For better understanding, please refer to... Figure 9 As shown, Figure 9 The separation of the thermopile on the two substrates makes it easier to understand.

[0101] Since the thermopile 30 in the first substrate 10 has the same structure as the thermopile in the second substrate 40, the explanation of the structure of the thermopile in the second substrate 40 can be referred to the explanation of the foregoing embodiments, and will not be repeated here.

[0102] It should be noted that in the actual measurement process, the sample is placed in the crucible, and then the crucible is placed in the sample measurement area (i.e., the first surface of the first substrate 10), while the empty crucible is placed in the reference area (i.e., the first surface of the second substrate 40) for measurement.

[0103] Optionally, the thermal analysis sensor 100 has at least two sample measurement areas.

[0104] In other words, the thermal analysis sensor 100 may include at least two first substrates 10. It should be noted that the thermopile in each sample measurement region needs to be connected to the thermopile in the reference region.

[0105] For example, the number of sample measurement areas can be three, and the thermocouple structure of each sample measurement area is the same as the thermocouple structure provided in the foregoing embodiments.

[0106] This method allows for the simultaneous measurement of the thermal effects of multiple different samples, significantly improving measurement efficiency and reducing the number of tests compared to traditional single-sample measurements. Furthermore, samples from the same batch can be measured under identical thermal field and heating rate conditions, eliminating errors caused by experimental conditions.

[0107] The thermal analysis sensor 100 may also include an insulating protective layer 50. The insulating protective layer 50 is disposed on the first substrate 10 and the second substrate 40 respectively.

[0108] Of course, the thermal analysis sensor 100 may also include other functional measurement boards, such as temperature measurement, and there are no limitations on this.

[0109] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0110] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0111] In the description of the embodiments of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "center", "top", "bottom", "top", "bottom", "inner", "outer", "inner side", "outer side", etc. indicate the orientation or positional relationship.

[0112] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "assembly" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0113] In the description of the embodiments of this utility model, specific features, structures, materials or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0114] In the description of the embodiments of this utility model, it should be understood that "-" and "~" represent a range between two values, and this range includes the endpoints. For example, "AB" represents a range greater than or equal to A and less than or equal to B. "A~B" represents a range greater than or equal to A and less than or equal to B.

[0115] In the description of the embodiments of this utility model, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0116] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermal analysis sensor with a boss structure, characterized in that, include: First substrate; A thermopile is disposed in the first substrate, and the thermopile is distributed between the first surface of the first substrate and the second surface of the first substrate; The first surface of the first substrate and the second surface of the first substrate are opposite surfaces; A base is connected to the second surface of the first substrate, and the size of the first substrate is smaller than the size of the base, such that the first substrate forms a boss on the base.

2. The thermal analysis sensor with a boss structure according to claim 1, characterized in that, The thermopile includes N pairs of thermocouples; the N pairs of thermocouples include N thermocouple units of a first material and N thermocouple units of a second material; N is a positive integer; The N thermocouple units of the first material are disposed through the first substrate; The first ends of the N thermocouple units of the first material are located on the first surface of the first substrate, and the second ends of the N thermocouple units of the first material are located on the second surface of the first substrate; the N thermocouple units of the second material are disposed through the first substrate. The first ends of the N thermocouple units of the second material are located on the first surface of the first substrate, and the second ends of the N thermocouple units of the second material are located on the second surface of the first substrate. In this configuration, the first end of each thermocouple unit of the first material is connected to the first end of an adjacent thermocouple unit of the second material, and the second end of each thermocouple unit of the first material is connected to the second end of another adjacent thermocouple unit of the second material, so that N thermocouple units of the first material and N thermocouple units of the second material in the first substrate are connected in series.

3. The thermal analysis sensor with a boss structure according to claim 2, characterized in that, The first ends of two thermocouple units connected in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; The second ends of two thermocouple units connected in the second surface of the first substrate form a lower surface thermoelectric junction; the second surface of the first substrate includes N lower surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in a concentric circle structure, and the N lower surface thermoelectric junctions are also arranged in a concentric circle structure. Accordingly, the first substrate is cylindrical in shape, and the first surface and the second surface of the first substrate are the upper and lower surfaces of the cylinder, respectively.

4. The thermal analysis sensor with a boss structure according to claim 2, characterized in that, The first ends of two thermocouple units connected in the first surface of the first substrate form an upper surface thermoelectric junction; the first surface of the first substrate includes N upper surface thermoelectric junctions; The second ends of two thermocouple units connected in the second surface of the first substrate form a lower surface thermoelectric junction; The second surface of the first substrate includes N lower surface thermoelectric junctions; the N upper surface thermoelectric junctions are arranged in a matrix structure, and the N lower surface thermoelectric junctions are also arranged in a matrix structure. Accordingly, the first substrate is cubic in shape, and the first surface and the second surface of the first substrate are rectangular.

5. The thermal analysis sensor with a boss structure according to claim 2, characterized in that, The thickness of the first substrate is A millimeters; A is a positive number; The range of A is 0.3 to 1.

2.

6. The thermal analysis sensor with a boss structure according to claim 1, characterized in that, The thermopile includes N pairs of thermocouples; the N pairs of thermocouples include N thermocouple units of a first material and N thermocouple units of a second material; the first substrate includes a first insulating plate and a second insulating plate; N is a positive integer; The N thermocouple units of the first material are disposed on the first insulating plate, and the N thermocouple units of the first material are arranged in a ring and spaced apart; each thermocouple unit of the first material includes a first end and a second end opposite to each other; The N thermocouple units of the second material are disposed on the second insulating plate; and the N thermocouple units of the second material are arranged in a ring and spaced apart; each thermocouple unit of the second material includes a first end and a second end opposite to each other; In this configuration, the first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material via a metal post, and the second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material via a metal post, so that the thermocouple units of the first material on the first insulating plate and the thermocouple units of the second material on the second insulating plate are connected in series.

7. The thermal analysis sensor with a boss structure according to claim 6, characterized in that, The thickness of both the first insulating plate and the second insulating plate is B millimeters; B > 0; The first insulating plate and the second insulating plate are adjacent to each other, or the first insulating plate and the second insulating plate are spaced apart, and the thickness of the gap is at least B millimeters; Where B is 0.1 to 0.

5.

8. The thermal analysis sensor with a boss structure according to claim 6, characterized in that, An inner ring opening is provided at the first end of each thermocouple unit of the first material in the first insulating plate; The first end of each thermocouple unit of the first material is connected to the first end of a thermocouple unit of the second material through a metal post in the corresponding inner ring opening; The second insulating plate has an outer ring opening at the second end corresponding to each thermocouple unit of the second material; The second end of each thermocouple unit of the first material is connected to the second end of another thermocouple unit of the second material through a metal post in the corresponding outer ring opening.

9. The thermal analysis sensor with a boss structure according to claim 1, characterized in that, The first substrate corresponds to the sample measurement area of ​​the thermal analysis sensor; The thermal analysis sensor also includes a second substrate; The second substrate corresponds to the reference area of ​​the thermal analysis sensor; The thermopile in the first substrate has the same structure as the thermopile in the second substrate, and the end of the thermopile in the first substrate is connected to the end of the thermopile in the second substrate.

10. The thermal analysis sensor with a boss structure according to claim 9, characterized in that, The thermal analysis sensor has at least two sample measurement areas.

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