Cleaning device and chip preparation system

Abstract

The utility model discloses a cleaning device which comprises a cleaning box, a rotating mechanism, a carrying table, a spraying mechanism and an air inlet and outlet mechanism. The rotating mechanism comprises a driving assembly and an adjusting assembly, and the driving assembly is connected with the adjusting assembly; the carrying table is arranged in the cleaning box and connected with the adjusting assembly. The adjusting assembly can adjust the inclination angle of the carrying table relative to the horizontal direction. The spraying mechanism comprises a liquid supply assembly and a spraying assembly, the spraying assembly is arranged in the cleaning box, and the end, away from the liquid supply assembly, of the spraying assembly extends to the position above the carrying table. By the adoption of the cleaning device, an operator places the wafer to be cleaned on the carrying table, then gas in the cleaning box is replaced through the gas inlet and outlet mechanism, and then the inclination angle of the carrying table is adjusted according to requirements. And then, the driving assembly drives the carrying table to drive the wafer to rotate, and meanwhile, the spraying assembly sprays cleaning liquid to the wafer on the carrying table, so that the photoresist on the wafer is clearly removed. The utility model also discloses a chip preparation system.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of wafer cleaning equipment, and particularly relates to a cleaning device and a chip preparation system. BACKGROUND

[0002] In a traditional process, a focal plane micro-bridge structure is often carried with a sacrifice layer for scribing, and after scribing, a subsequent process such as releasing is performed. A large amount of foreign matters will be generated in the scribing process, and a part of the foreign matters will be washed away by water flow, but a considerable part of the foreign matters will impact and damage the image elements under the action of the water flow, thereby affecting the chip yield and the imaging performance of the detector.

[0003] To solve this problem, a layer of photoresist is usually coated on the surface of the micro-bridge structure, and then the scribing operation is performed. In the scribing process, the photoresist can protect the micro-bridge structure and avoid the generation of a large amount of foreign matters, and also can avoid the foreign matters from entering the structure. After scribing, the wafer is cleaned, and since the foreign matters remaining in the scribing process are basically adsorbed on the surface of the photoresist, the photoresist only needs to be cleaned and removed, so that the foreign matters can be removed at the same time, and the foreign matters are avoided from remaining. CONTENT OF THE UTILITY MODEL

[0004] Therefore, it is necessary to provide a cleaning device and a chip preparation system which are applied to wafer cleaning and can remove photoresist.

[0005] The technical scheme provided in the application is as follows:

[0006] A cleaning device comprises:

[0007] a cleaning box;

[0008] a rotating mechanism comprising a driving assembly and an adjusting assembly, wherein the driving assembly is arranged in the cleaning box and connected with the adjusting assembly to drive the adjusting assembly to rotate around a vertical axis;

[0009] a carrier arranged in the cleaning box and connected with the adjusting assembly, wherein the adjusting assembly can adjust the inclination angle of the carrier relative to the horizontal direction;

[0010] a spraying mechanism comprising a liquid supply assembly and a spraying assembly, wherein the liquid supply assembly is connected with the spraying assembly, the spraying assembly is arranged in the cleaning box, and an end of the spraying assembly away from the liquid supply assembly extends above the carrier;

[0011] an air inlet and outlet mechanism arranged in the cleaning box and capable of replacing the gas in the cleaning box.

[0012] The operator places the wafer to be cleaned on the loading platform, and then replaces the gas in the cleaning box through the gas inlet and outlet mechanism, and then adjusts the inclination angle of the loading platform according to the requirement. Next, the driving assembly drives the loading platform to rotate the wafer, and the spraying assembly sprays cleaning liquid towards the wafer on the loading platform, so that the photoresist on the wafer is clearly removed. In addition, since the gas inlet and outlet mechanism can replace the gas in the cleaning box with clean gas, the impurities in the gas can be avoided to contaminate the wafer, thereby improving the chip yield and the imaging performance of the detector.

[0013] Further, the adjusting assembly comprises a connecting piece and an adjusting driving piece, the driving assembly is connected with the adjusting driving piece, the loading platform is rotatably connected with the connecting piece around the horizontal axis, and the adjusting driving piece is arranged on the connecting piece and connected with the loading platform.

[0014] Further, the side of the loading platform away from the adjusting assembly is provided with a placing groove, and the bottom wall of the placing groove is provided with an adsorption hole.

[0015] The cleaning device further comprises an adsorption assembly in communication with the adsorption hole.

[0016] Further, the liquid supply assembly comprises a liquid storage tank and a liquid supply driving piece, the liquid supply driving piece is connected with the liquid storage tank and the spraying assembly, so as to pump the cleaning liquid in the liquid storage tank to the spraying assembly.

[0017] Further, the spraying assembly comprises a first adjusting rod, a second adjusting rod and a nozzle, the first adjusting rod is arranged in the cleaning box along the vertical direction, the second adjusting rod is connected to the top of the first adjusting rod and is arranged at an angle with the first adjusting rod, the first adjusting rod and the second adjusting rod can adjust the length, the nozzle is arranged at the end of the second adjusting rod away from the first adjusting rod and above the loading platform, and the liquid supply assembly is connected with the nozzle.

[0018] Further, the gas inlet and outlet mechanism comprises a gas inlet assembly and a gas outlet assembly, the gas inlet assembly and the gas outlet assembly are connected with the cleaning box, the gas inlet assembly is used for inputting gas into the cleaning box, and the gas outlet assembly is used for discharging the gas in the cleaning box.

[0019] Further, the gas inlet assembly comprises a plurality of gas outlet ends, at least part of the gas outlet ends are directed towards the loading platform.

[0020] Further, the cleaning device further comprises a temperature control mechanism arranged in the cleaning box for adjusting the temperature in the cleaning box.

[0021] Further, the bottom wall of the cleaning box is provided with a liquid discharge port.

[0022] The cleaning device further comprises a recovery assembly which is in communication with the liquid outlet.

[0023] A chip preparation system comprises the cleaning device as described above.

[0024] In summary, the cleaning device provided by the present application has at least the following advantages:

[0025] 1. The photoresist on the surface of the wafer after scribing can be cleaned;

[0026] 2. The inclination angle of the carrier can be adjusted during the cleaning process, thereby improving the cleaning effect on the wafer;

[0027] 3. The driving assembly drives the carrier to rotate, thereby achieving comprehensive cleaning of the wafer;

[0028] 4. The spraying mechanism can spray different cleaning liquids in sequence, thereby further improving the cleaning effect;

[0029] 5. The in-out gas mechanism can replace the gas in the cleaning box with clean nitrogen before cleaning, and the wafer can be blown dry after cleaning by the in-gas assembly. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, illustrate the present application and explain the principles of the present application, and do not constitute a limitation of the present application.

[0031] Figure 1 The structure diagram of the cleaning device provided by an embodiment of the present application is shown.

[0032] Explanation of reference numerals:

[0033] 100, cleaning device; 200, wafer; 110, cleaning box; 120, rotating mechanism; 130, carrier; 140, spraying mechanism; 141, liquid supply assembly; 1411, liquid storage tank; 1412, liquid supply driving member; 142, spraying assembly; 1421, first adjusting rod; 1422, second adjusting rod; 1423, nozzle; 150, in-out gas mechanism; 160, recovery assembly; 161, recovery pipe; 162, filter; 163, recovery valve; 164, recovery tank; 170, temperature control mechanism. DETAILED DESCRIPTION

[0034] With reference to the accompanying drawings, the technical solutions in the embodiments of the present application will be clearly and completely described below, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0036] In one aspect, as shown in the drawings, an embodiment of the present application provides a cleaning device 100, comprising a cleaning box 110, a rotating mechanism 120, a carrier 130 and a spraying mechanism 140. Figure 1

[0037] The rotating mechanism 120 comprises a driving assembly and an adjusting assembly, the driving assembly is arranged in the cleaning box 110 and connected with the adjusting assembly to drive the adjusting assembly to rotate around the vertical axis. The carrier 130 is arranged in the cleaning box 110 and connected with the adjusting assembly; the adjusting assembly can adjust the inclination angle of the carrier 130 relative to the horizontal direction. Specifically, Figure 1 At this time, the carrier 130 is high on the left and low on the right, if it is necessary to adjust the inclination angle, the carrier 130 can be rotated clockwise or counterclockwise by the adjusting assembly.

[0038] The spraying mechanism 140 comprises a liquid supply assembly 141 and a spraying assembly 142. The liquid supply assembly 141 is connected with the spraying assembly 142, the spraying assembly 142 is arranged in the cleaning box 110, and the end of the spraying assembly 142 away from the liquid supply assembly 141 extends to above the carrier 130, so that the liquid supply assembly 141 provides cleaning liquid, and the cleaning liquid is sprayed to the surface of the wafer 200 on the carrier 130 through the spraying assembly 142.

[0039] Further, the cleaning device 100 further comprises an air inlet and outlet mechanism 150, the air inlet and outlet mechanism 150 is arranged in the cleaning box 110, and the air inlet and outlet mechanism 150 can displace the gas in the cleaning box 110. In this way, the gas in the cleaning box 110 can be displaced into clean gas, such as nitrogen, before the wafer 200 is cleaned, so as to avoid impurities in the gas from entering and contaminating the wafer 200 during the cleaning process. ​

[0040] With the cleaning device 100, the operator places the wafer 200 to be cleaned on the carrier 130, and then replaces the gas in the cleaning box 110 through the gas inlet and outlet mechanism 150, and then adjusts the inclination angle of the carrier 130 according to the requirement. Next, the driving assembly drives the carrier 130 to rotate with the wafer 200, and the spraying assembly 142 sprays the cleaning liquid to the wafer 200 on the carrier 130, so as to clearly remove the photoresist on the wafer 200. In addition, since the gas inlet and outlet mechanism 150 can replace the gas in the cleaning box 110 with clean gas, the impurities in the gas can be avoided to pollute the wafer 200, thereby improving the chip yield and the imaging performance of the detector.

[0041] It should be explained that the wafer 200 in the embodiment can be a wafer 200 after scribing. For different wafers 200, the spraying angle of the cleaning liquid will affect the cleaning effect, so in order to adjust the spraying angle, the inclination angle of the carrier 130 can be adjusted to improve the cleaning effect. In addition, the driving assembly drives the carrier 130 to rotate, which can realize comprehensive cleaning of the wafer 200.

[0042] In one embodiment, the bottom wall of the cleaning box 110 is provided with a liquid discharge port, and the cleaning device 100 further comprises a recovery assembly 160 which is in communication with the liquid discharge port, so as to recover the cleaned liquid. Specifically, Figure 1 In one embodiment, the cleaning box 110 is arranged in an elevated manner, and the recovery assembly 160 is arranged below the cleaning box 110.

[0043] Further, the bottom wall of the cleaning box 110 is arranged to be inclined relative to the horizontal direction, and the liquid discharge port is located at the lowest position in the horizontal direction of the bottom wall of the cleaning box 110, so as to discharge the liquid in the cleaning box 110 to the recovery assembly 160 as much as possible.

[0044] In one embodiment, the recovery assembly 160 comprises a recovery pipe 161, a filter 162, a recovery valve 163 and a recovery tank 164. One end of the recovery pipe 161 is in communication with the liquid discharge port, and the other end is in communication with the recovery tank 164. The filter 162 and the recovery valve 163 are arranged on the recovery pipe 161. The filter 162 is used for filtering the liquid, and the recovery valve 163 is used for controlling the opening and closing of the recovery pipe 161, i.e. controlling the recovery of the liquid.

[0045] In one embodiment, the driving assembly comprises a mounting seat and a rotary driving member. The mounting seat is arranged on the cleaning box 110, and the rotary driving member is arranged on the mounting seat and connected with the adjusting assembly to drive the adjusting assembly to rotate around the vertical axis. Specifically, the adjusting assembly is rotatably arranged on the mounting seat, and the rotary driving member is a motor, and the driving end of the motor is connected with the adjusting assembly.

[0046] In one embodiment, the adjusting assembly comprises a connecting member rotatably arranged on the mounting base about an axis in the vertical direction, and a rotating driving member connected with the connecting member. The platform 130 is rotatably connected with the connecting member about an axis in the horizontal direction, so that the platform 130 can adjust the inclination angle thereof relative to the horizontal direction. Preferably, the adjusting assembly further comprises an adjusting driving member arranged on the connecting member and connected with the platform 130 to drive the platform 130 to rotate, so that the inclination angle of the platform 130 relative to the horizontal direction is adjusted by the adjusting driving member. Specifically, the adjusting driving member is an electric motor.

[0047] In other embodiments, the adjusting assembly can also adjust the inclination angle of the platform 130 in a manual manner. For example, the adjusting assembly comprises a connecting member and a locking member. The connecting member is connected in the manner as described above. The locking member is used to lock and release the platform 130, and when the locking member locks the platform 130, the platform 130 is fixed relative to the connecting member; when the locking member releases the platform 130, the platform 130 can rotate relative to the connecting member. Optionally, the locking member is a locking screw which is threadedly connected to the platform 130 and can abut against the connecting member at one end, so as to lock and release the platform 130. It can be understood that if the inclination angle of the platform 130 is adjusted in a manual manner, the adjustment needs to be performed before cleaning, and after the inclination angle is adjusted, the platform 130 is fixed relative to the connecting member.

[0048] In one embodiment, the side of the platform 130 away from the adjusting assembly is provided with a placing groove for placing the wafer 200. Further, the top of the side wall of the placing groove is provided with a limiting portion for limiting the wafer 200 placed in the placing groove from being separated during the rotation of the platform 130. Preferably, in order to avoid damage to the wafer 200, the surface of the limiting portion can be covered with a flexible pad.

[0049] In one embodiment, the bottom wall of the placing groove is provided with a suction hole; the cleaning device 100 further comprises a suction assembly which is in communication with the suction hole, so that the wafer 200 in the placing groove is suctioned and fixed by generating negative pressure in the suction hole. Preferably, the number of the suction holes is multiple.

[0050] It should be noted that the suction assembly can comprise a vacuum motor and a connecting pipe, one end of the connecting pipe being connected with the vacuum motor and the other end being in communication with the suction hole. In addition, the vacuum motor can be arranged on the connecting member or fixed relative to the cleaning box 110, and the vacuum motor can be connected with the connecting pipe through a rotary joint, which is not limited herein.

[0051] In one embodiment, the platform 130 is further provided with a liquid outlet in communication with the placing groove, the liquid outlet being located at one end of the platform 130 at a lower horizontal level, so as to discharge the cleaning liquid sprayed into the placing groove. Specifically, the liquid outlet is a through hole penetrating through the platform 130. Figure 1In the embodiment shown, the liquid outlet is located at the right end of the carrier 130 and communicates with the bottom of the placement groove or penetrates the bottom wall of the placement groove, which is not limited herein.

[0052] In one embodiment, the liquid supply assembly 141 includes a liquid storage tank 1411 for storing cleaning liquid and a liquid supply driving member 1412 connected with the liquid storage tank 1411 and the spraying assembly 142 to pump the cleaning liquid in the liquid storage tank 1411 to the spraying assembly 142. Optionally, the liquid supply driving member 1412 is a delivery pump.

[0053] Further, the liquid supply assembly 141 can include a plurality of liquid storage tanks 1411, each of which can store different types of cleaning liquid for different cleaning needs. Meanwhile, it can be determined that the recovery tank 164 in the recovery assembly 160 can also be provided as a plurality of tanks, each of the liquid storage tanks 1411 and each of the recovery tanks 164 corresponds to each other, which can be realized by Figure 1 valves as shown, so that the recovery tank 164 recovers the corresponding cleaning liquid. For example, the plurality of liquid storage tanks 1411 can also store ethanol, isopropanol and deionized water respectively, and the cleaning is performed by ethanol first, then by isopropanol, and finally by deionized water, and the cleaned liquid is recovered by the corresponding recovery tank 164. In addition, the control mechanism can be electrically connected with the valves to switch the cleaning liquid.

[0054] In one embodiment, the spraying assembly 142 includes a first adjusting rod 1421, a second adjusting rod 1422 and a nozzle 1423. The first adjusting rod 1421 is arranged in the cleaning tank 110 in the vertical direction, the second adjusting rod 1422 is connected to the top of the first adjusting rod 1421 and is arranged at an angle with the first adjusting rod 1421, and the nozzle 1423 is arranged at the end of the second adjusting rod 1422 away from the first adjusting rod 1421 and above the carrier 130. The liquid supply assembly 141 is connected with the nozzle 1423 to enable the cleaning liquid to be sprayed onto the wafer 200 on the carrier 130 through the nozzle 1423.

[0055] Among them, the first adjusting rod 1421 and the second adjusting rod 1422 can adjust the length, for example, by using a telescopic rod design, so as to adjust the position of the nozzle 1423 and ensure that the cleaning liquid sprayed by the nozzle 1423 is sprayed to the area to be cleaned of the wafer 200. The height of the nozzle 1423 can also be adjusted to adjust the distance between the nozzle 1423 and the wafer 200 to adjust the impact force of the cleaning liquid on the wafer 200.

[0056] In one embodiment, the gas inlet and outlet mechanism 150 comprises a gas inlet assembly and a gas outlet assembly, both of which are arranged in the cleaning tank 110, the gas inlet assembly is used to input gas into the cleaning tank 110, and the gas outlet assembly is used to discharge the gas in the cleaning tank 110, so as to realize the replacement of the gas in the cleaning tank 110.

[0057] Further, the gas inlet assembly comprises a plurality of gas outlet ends, at least part of the gas outlet ends are directed to the carrier 130, so as to blow gas to the wafer 200 on the carrier 130, thereby blowing dry the surface of the wafer 200 after the wafer 200 is cleaned. By blowing dry the wafer 200 with clean gas, it is avoided that the wafer 200 is attached with too much impurities in the air after being taken out.

[0058] In one embodiment, the cleaning device 100 further comprises a temperature control mechanism 170 arranged in the cleaning tank 110, which is used to adjust the temperature in the cleaning tank 110. In actual application, the temperature control mechanism 170 can cooperate with the gas inlet assembly, the temperature control mechanism 170 can heat the gas passing through itself, and part of the gas outlet ends of the gas inlet assembly can be directed to the temperature control mechanism 170, so as to quickly adjust the temperature in the cleaning tank 110.

[0059] In order to facilitate the understanding of the technical solutions of the present application, hereinafter Figure 1 The working process of the cleaning device 100 in the above embodiment is described as follows:

[0060] The operator adjusts the position of the nozzle 1423 according to the cleaning requirement, places the wafer 200 in the placing groove of the carrier 130, and fixes the wafer 200 by the adsorption assembly and the adsorption hole. Then, the gas in the cleaning tank 110 is replaced with clean nitrogen by the gas inlet and outlet mechanism 150, and the temperature in the cleaning tank 110 is adjusted by the temperature control mechanism 170. Next, the carrier 130 is driven to rotate by the driving assembly, and the liquid supply assembly 141 successively sprays different cleaning liquids to the wafer 200 on the carrier 130 through the nozzle 1423, and the inclination angle of the carrier 130 can be adjusted by the adjusting assembly during the spraying process. During the cleaning process, the different cleaning liquids are respectively recovered into the recovery tank 164 by the recovery assembly 160. After the cleaning is completed, the wafer 200 is blown dry by the gas outlet assembly.

[0061] In summary, the cleaning device 100 provided by the present application has at least the following advantages:

[0062] 1. The photoresist on the surface of the wafer 200 after scribing can be cleaned;

[0063] 2. The inclination angle of the carrier 130 can be adjusted during the cleaning process, so as to improve the cleaning effect of the wafer 200;

[0064] 3. The driving assembly drives the carrier 130 to rotate, so as to realize comprehensive cleaning of the wafer 200;

[0065] 4. The spraying mechanism 140 can spray different cleaning liquids in sequence, so as to further improve the cleaning effect;

[0066] 5. Before cleaning, the in-out gas mechanism 150 can replace the gas in the cleaning box 110 with clean nitrogen, and after cleaning, the wafer 200 can be blown dry by the air inlet assembly.

[0067] On the other hand, the application also discloses a chip preparation system, which comprises the cleaning device 100 in the above embodiments.

[0068] It should be noted that the wafer 200 will be first scribed before being cleaned by the cleaning device 100, and after cleaning, the release of the sacrificial layer and other processes will be performed. Correspondingly, the chip preparation system will comprise a scribing device and a device for releasing the sacrificial layer, which will not be described here.

[0069] Although the embodiments of the application have been shown and described, it is to be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the application, and the scope of the application is defined by the appended claims and their equivalents.

Claims

1. A cleaning device, characterized in that, include: Cleaning box; A rotating mechanism includes a drive assembly and an adjustment assembly. The drive assembly is disposed in the cleaning tank and connected to the adjustment assembly to drive the adjustment assembly to rotate about a vertical axis. A platform is disposed inside the cleaning tank and connected to the adjustment assembly; the adjustment assembly is capable of adjusting the tilt angle of the platform relative to the horizontal direction. A spraying mechanism includes a liquid supply component and a spraying component. The liquid supply component is connected to the spraying component. The spraying component is disposed inside the cleaning tank, and one end of the spraying component away from the liquid supply component extends to the top of the platform. An air inlet / outlet mechanism is installed in the cleaning chamber and is capable of replacing the gas inside the cleaning chamber.

2. The cleaning device according to claim 1, characterized in that, The adjustment assembly includes a connector and an adjustment drive component. The drive component is connected to the drive assembly. The platform is rotatably connected to the connector about a horizontal axis. The adjustment drive component is disposed on the connector and connected to the platform.

3. The cleaning device according to claim 1, characterized in that, The platform is provided with a placement groove on the side away from the adjustment component, and the bottom wall of the placement groove is provided with an adsorption hole; The cleaning device also includes an adsorption component, which is connected to the adsorption pore.

4. The cleaning device according to claim 1, characterized in that, The liquid supply assembly includes a liquid storage tank and a liquid supply drive unit. The liquid supply drive unit is connected to the liquid storage tank and the spray assembly to pump the cleaning liquid in the liquid storage tank to the spray assembly.

5. The cleaning device according to claim 1, characterized in that, The spray assembly includes a first adjusting rod, a second adjusting rod, and a nozzle. The first adjusting rod is vertically disposed inside the cleaning tank. The second adjusting rod is connected to the top of the first adjusting rod and is angled to the first adjusting rod. Both the first and second adjusting rods are adjustable in length. The nozzle is disposed at the end of the second adjusting rod away from the first adjusting rod and is located above the platform. The liquid supply assembly is connected to the nozzle.

6. The cleaning apparatus according to claim 1, characterized in that, The air intake and exhaust mechanism includes an air intake component and an air exhaust component, both of which are connected to the cleaning chamber. The air intake component is used to input gas into the cleaning chamber, and the air exhaust component is used to discharge the gas from the cleaning chamber.

7. The cleaning apparatus according to claim 6, characterized in that, The air intake assembly includes multiple air outlets, at least a portion of which face the stage.

8. The cleaning apparatus according to claim 1, characterized in that, It also includes a temperature control mechanism, which is installed in the cleaning tank and is used to regulate the temperature inside the cleaning tank.

9. The cleaning apparatus according to claim 1, characterized in that, The bottom wall of the cleaning tank is provided with a drain outlet; The cleaning device also includes a recovery component, which is connected to the drain port.

10. A chip fabrication system, characterized in that, Includes the cleaning apparatus according to any one of claims 1-9.

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