Processor heat dissipation assembly

Abstract

The utility model provides a processor heat dissipation assembly. The processor heat dissipation assembly comprises a processor; the sticking layer is arranged on the first surface of the processor; the heat conduction piece is provided with a first concave part, is arranged on the first surface of the bonding layer and wraps the processor; and the liquid cooling pipeline is provided with a first convex part, the first convex part is arranged in the first concave part, and the liquid cooling pipeline wraps the heat conduction piece. Therefore, the first convex part of the liquid cooling pipeline can quickly take away heat conducted to the heat conduction piece by the processor, and the temperature of the processor is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of processor heat dissipation, and particularly relates to a processor heat dissipation assembly. BACKGROUND

[0002] With the continuous progress of integrated circuit manufacturing process and the increasing demand for computing, a processor is arranged on a circuit board. However, with the increasing performance of the processor (CPU / GPU), the number of cores, the main frequency and the instruction execution efficiency also increase greatly. However, with the increasing performance, the heat generated by the processor also increases, and the heat dissipation problem gradually becomes one of the key factors that limit the performance improvement of the processor and the stable operation of the system.

[0003] The processor performs data processing through the switching action of transistors during operation, and a large amount of electrical energy is converted into heat energy in the process. In particular, in high-performance computing, high-load operation (such as games, video rendering, AI computing, etc.) or long-time continuous operation scenarios, the heat dissipation problem is particularly prominent. If the heat cannot be effectively and timely dissipated from the processor core, the chip temperature will rise, which will cause the processor to automatically reduce the main frequency to control the temperature, resulting in performance degradation. CONTENT OF THE INVENTION

[0004] In view of this, the present application provides a processor heat dissipation assembly, which can improve the heat dissipation problem of the processor and cause performance degradation.

[0005] The present application provides a processor heat dissipation assembly, comprising:

[0006] a processor;

[0007] a paste layer arranged on a first surface of the processor;

[0008] a heat conduction member provided with a first recess and arranged on a first surface of the paste layer and wrapping the processor;

[0009] a liquid cooling pipe provided with a first protrusion, the first protrusion being arranged in the first recess, and the liquid cooling pipe wrapping the heat conduction member.

[0010] Optionally, a circuit board provided with a first through hole and a second through hole;

[0011] the liquid cooling pipe respectively penetrating the first through hole and the second through hole, and covering a first surface of the circuit board.

[0012] Optionally, the normal projection plane of the first through hole is tangent to one end of the normal projection plane of the heat conduction member, and the normal projection plane of the second through hole is tangent to the other end of the normal projection plane of the heat conduction member.

[0013] Optionally, the liquid inlet is arranged at the lower edge of the first surface of the liquid cooling pipe, and the liquid outlet is arranged at the upper edge of the second surface of the liquid cooling pipe.

[0014] Optionally, the liquid cooling pipe is provided with a second recess, and the second recess is provided with a thermoelectric refrigeration piece.

[0015] Optionally, the metal particles are arranged in the adhesive layer.

[0016] Optionally, the first recess penetrates the heat-conducting member.

[0017] Optionally, the first recess and the first protruding part are respectively in a meander shape.

[0018] Optionally, the heat-conducting member is a heat-conducting metal.

[0019] As described above, in the processor heat dissipation assembly of the present application, the first surface of the processor is provided with an adhesive layer adhering to a heat-conducting member, and the heat-conducting member is provided with a first recess and corresponds to a first protruding part of a liquid cooling pipe, so that the first protruding part of the liquid cooling pipe can quickly take away the heat conducted to the heat-conducting member from the processor, thereby reducing the temperature of the processor. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a structural schematic diagram of the processor heat dissipation assembly of the present application;

[0021] Figure 2 is a structural schematic diagram of the heat-conducting member of the present application;

[0022] Figure 3 is a structural schematic diagram of the liquid cooling pipe of the present application;

[0023] Figure 4 is a structural schematic diagram of the adhesive layer of the present application;

[0024] Figure 5 is a structural schematic diagram of the processor heat dissipation assembly of the present application provided with a thermoelectric refrigeration piece;

[0025] Figure 6 is a structural schematic diagram of the processor heat dissipation assembly of the present application wrapping the processor.

[0026] Legend of reference signs: circuit board 1, processor 2, solder ball 3, adhesive layer 4, heat-conducting member 5, liquid cooling pipe 6, processor heat dissipation assembly 10, first through hole 11, second through hole 12, heat-conducting member body 51, first recess 52, liquid cooling pipe body 61, first protruding part 62, liquid inlet 63, liquid outlet 64, metal particle 41, thermoelectric refrigeration piece 7. DETAILED DESCRIPTION

[0027] Reference within this specification to "one embodiment" or "an embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. The appearance of the phrases "in one embodiment" or "in some embodiments" or "in other embodiments" or "in still other embodiments" or the like in various places throughout this specification are not necessarily all referring to the same embodiment, nor are they necessarily referring to any particular embodiment. Rather, they mean that, in some embodiments, that particular feature, structure, or characteristic can be included or will be implemented, while in other embodiments, the particular feature, structure, or characteristic can not be included or implemented. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" or "in other embodiments" or "in still other embodiments" or the like in various places throughout this specification are not necessarily referring to the same embodiment nor are they necessarily referring to any particular embodiment.

[0028] The terms "first", "second", and the like, as used herein do not imply or mean any relative importance or any particular order. Thus, the features defined by "first", "second", and the like, can include one or more of the features implicitly or explicitly.

[0029] In the embodiments of the present application, unless specifically defined and limited otherwise, the term "connection" should be understood broadly, for example, "connection" can be fixed connection, or detachable connection, or integral; can be direct connection, or indirect connection through intermediate medium.

[0030] It should be noted that, in the description of the embodiments of the present application, unless specifically defined and limited otherwise, the terms "connected" and "connection" should be understood broadly, for example, can be fixed connection, or integral connection; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through intermediate medium, or internal communication of two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0031] To solve the problem that a large amount of electric energy is converted into heat energy in the process of data processing by the switching action of transistors in the running process of the processor, especially in the high-performance computing, high-load running (such as games, video rendering, AI computing, etc.) or long-time continuous operation scenarios, the heat dissipation problem is particularly prominent. If the heat cannot be effectively and timely dissipated from the processor core, the chip temperature will rise, which will cause the processor to automatically reduce the main frequency to control the temperature, resulting in the problem of performance degradation.

[0032] Referring to Figures 1-3, this application embodiment provides a processor heat dissipation assembly 100, including a processor 2; an adhesive layer 4 disposed on a first surface of the processor 2; a thermal conductive element 5 having a first recess 52 disposed on the first surface of the adhesive layer 4 and wrapping around the processor 2; and a liquid cooling pipe 6 having a first protrusion 62 disposed within the first recess 52, and the liquid cooling pipe 6 wrapping around the thermal conductive element 5.

[0033] In this circuit board 1, the processor 2 is connected to the circuit board 1 via solder balls 3. The first surface of the processor 2 is provided with an adhesive layer 4, on which a heat-conducting component 5 is attached. The heat-conducting component 5 covers the processor 2. The heat-conducting component 5 includes a heat-conducting component body 51 and a first recess 52. The liquid cooling pipe 6 includes a liquid cooling pipe body 61 and a first protrusion 62. The first protrusion 62 is correspondingly disposed in the first recess 52, so that the liquid cooling pipe body 61 is attached to the heat-conducting component body 51, and the liquid cooling pipe 6 covers the heat-conducting component 5.

[0034] As described above, the first surface of the processor 2 is the upper surface, and the lower surface of the heat-conducting component 5 is recessed, corresponding to the size of the processor 2. The processor 2 is disposed within the recess of the heat-conducting component 5. The adhesive layer 4 on the upper surface of the processor 2 is attached to the recess of the heat-conducting component 5. The upper surface of the heat-conducting component 5 has a first recess 52, and the first protrusion 62 of the liquid cooling pipe 6 is disposed within the first recess 52, and the liquid cooling pipe 6 covers the outer surface of the heat-conducting component 5. The heat generated by the processor 2 is conducted through the heat-conducting component 5. The first protrusion 62 of the liquid cooling pipe 6 is disposed within the first recess 52 of the heat-conducting component 5, enabling the liquid cooling pipe 6 to quickly liquid cool and remove the heat from the heat-conducting component 5, thereby improving the heat dissipation efficiency. At the same time, since the first recess 52 and the first protrusion 62 are structurally fitted and attached, the mechanical stability and sealing of the processor heat dissipation assembly 100 are ensured.

[0035] In some embodiments, the adhesive layer 4 may be selected from high thermal conductivity silicone grease, phase change material (PCM) or thermally conductive gel.

[0036] In some embodiments, refer to Figure 6 As shown, the processor heat dissipation assembly 10 also includes a circuit board 1, which has a first through hole 11 and a second through hole 12; a liquid cooling pipe 6 passes through the first through hole 11 and the second through hole 12 respectively, and the liquid cooling pipe 6 covers the first surface of the circuit board 1.

[0037] The processor heat dissipation assembly 10 further comprises a circuit board 1, the circuit board 1 is provided with a first through hole 11 and a second through hole 12 for the liquid cooling pipe 6 to pass through, the liquid cooling pipe 6 extends to the lower surface of the circuit board 1 through the first through hole 11 and the second through hole 12, and a part of the liquid cooling pipe 6 is arranged on the back of the circuit board 1 through the first through hole 11 and the second through hole 12, and the other part is arranged on the front of the circuit board 1 and covers the heat conduction piece 5 above the processor 2, so that the liquid cooling pipe 6 can form a wrapping on the upper surface and the lower surface of the circuit board 1. By arranging the first through hole 11 and the second through hole 12 on the circuit board 1, the liquid cooling pipe 6 penetrates the first through hole 11 and the second through hole 12 to wrap the processor 2, so that the liquid cooling pipe 6 can extend to the lower surface of the circuit board 1 to absorb heat, which helps the liquid cooling pipe 6 to realize a more efficient closed-loop flow arrangement and improve the heat dissipation efficiency of the processor 2.

[0038] In some embodiments, continuing to refer to Figure 6 As shown, the front projection plane of the first through hole 11 is tangent to one end of the front projection plane of the heat conduction piece 5, and the front projection plane of the second through hole 12 is tangent to the other end of the front projection plane of the heat conduction piece 5.

[0039] The tangent front projection plane means that when viewed from the direction perpendicular to the circuit board 1 (i.e., the top view direction), the edge of the first through hole 11 just coincides with one side edge of the heat conduction piece 5, and the edge of the second through hole 12 coincides with the other side edge of the heat conduction piece 5. By designing the backflow path to be tangent, after the liquid cooling pipe 6 penetrates the first through hole 11 and the second through hole 12, it can form a heat exchange interface with the heat conduction piece 5 at both ends, so that the liquid cooling pipe 6 quickly completes backflow, speeds up the contact with the heat conduction piece 5, reduces the heat conduction path between the cooling liquid and the heat source, and improves the heat dissipation efficiency.

[0040] In some embodiments, continuing to refer to Figure 6 As shown, the liquid cooling pipe 6 comprises an upper pipe 61 and a lower pipe 62, the upper pipe 61 is located on the upper surface of the circuit board 1, and the lower pipe 62 is located on the lower surface of the circuit board 1 and realizes the communication of the liquid passage through the first through hole 11 and the second through hole 12 arranged on the circuit board 1, and the upper pipe 61 and the lower pipe 62 are detachably connected, for example, through a buckle structure 21, a plug-in sealing assembly 22, a bolt locking assembly 23, etc. By detachably connecting the upper pipe 61 and the lower pipe 62, the modular assembly and the later maintenance of the liquid cooling pipe 6 are facilitated, the liquid cooling pipe 6 can be disassembled without damaging the overall structure of the circuit board 1, and local replacement, cleaning or upgrading operations can be performed, thereby improving the manufacturability and maintenance convenience of the product.

[0041] In some embodiments, the liquid cooling pipe 6 is provided with an inlet 63 and an outlet 64, and the inlet 63 and the outlet 64 are oppositely arranged.

[0042] The liquid inlet 63 and the liquid outlet 64 are oppositely arranged at two ends of the liquid cooling pipe 6, i.e., the liquid inlet 63 and the liquid outlet 64 are respectively arranged at opposite sides of the liquid cooling pipe 6.

[0043] In some embodiments, with continued reference to Figure 3 and Figure 6 as shown, the liquid inlet 63 is arranged at a lower edge of a first surface 65 of the liquid cooling pipe 6, and the liquid outlet 64 is arranged at an upper edge of a second surface 66 of the liquid cooling pipe 6.

[0044] The liquid inlet 63 is arranged at a lower edge of a first surface 65 of the liquid cooling pipe 6, and the liquid outlet 64 is arranged at an upper edge of a second surface 66 of the liquid cooling pipe 6. The cooling liquid enters the liquid cooling pipe 6 from the first surface 65 at the lower edge, and is discharged from the second surface 66 at the upper edge after completing heat exchange with the heat conduction member 5. By arranging the liquid inlet 63 at the lower edge of the first surface and the liquid outlet 64 at the upper edge of the second surface, the cooling liquid enters the liquid cooling pipe 6 from the bottom, gradually covers the surface of the heat conduction member during the rising process, absorbs heat from bottom to top, the heat exchange path is longer and more uniform, and the heat dissipation efficiency is improved.

[0045] In some embodiments, with reference to Figure 5 as shown, a third surface of the liquid cooling pipe 6 is provided with a second recess (not shown in the figure), and the second recess is provided with a thermoelectric refrigeration piece 7.

[0046] The liquid cooling pipe 6 is provided with a second recess at a third surface, the third surface is an upper surface, and the thermoelectric refrigeration piece 7 is arranged in the second recess. The thermoelectric refrigeration piece 7 uses the temperature difference generated in the semiconductor material by the electric current through the thermoelectric effect to absorb heat from the cold side and release heat through the hot side, thereby further reducing the temperature in the liquid cooling pipe 6, achieving rapid cooling of the processor 2, significantly improving the cooling performance of the processor heat dissipation assembly 10, and the arrangement of the second recess reduces the space of the processor heat dissipation assembly 10.

[0047] In some embodiments, with reference to Figure 4 as shown, the adhesive layer 4 is provided with metal particles 41.

[0048] The adhesive layer 4 is provided with metal particles 41, which act as fillers to form an effective heat conduction channel in the adhesive layer 4, improve the heat conduction efficiency, and reduce the problem of slow heat dissipation caused by insufficient heat conduction of the adhesive layer.

[0049] In some embodiments, with reference to Figure 2 as shown, the first recess 52 penetrates the heat conduction member 5.

[0050] The first recess 52 forms a channel through the heat conduction member 5, and the contact between the first protrusion 62 and the first recess 52 is increased, thereby improving the heat conduction and heat dissipation effect of the heat conduction member 5.

[0051] In some embodiments, with reference to Figures 2-3 As shown, the first recess 52 and the first protrusion 62 are respectively in a meander shape.

[0052] In some embodiments, the heat conduction member 5 is a heat conduction metal.

[0053] The heat conduction member is made of a metal material with high heat conduction performance, such as copper, aluminum, or graphene composite material, which ensures rapid absorption of the heat of the processor and improves the heat dissipation efficiency.

[0054] The above only describes some embodiments of the present application, and does not limit the patent scope of the present application. For those skilled in the art, any equivalent structural transformation based on the content of the specification and the drawings is also included in the patent protection scope of the present application.

[0055] In the description of the embodiments of the present application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the technical solutions of the corresponding embodiments, and do not indicate or imply that the device or element must have a particular orientation, be constructed and operated in a particular orientation, and cannot be understood as a limitation of the present application.

[0056] Although the terms "first", "second", and the like are used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. In addition, the singular forms "one", "a" and "the" are intended to include the plural forms. The terms "or" and "and / or" are interpreted as inclusive, or mean any one or any combination. Only when the combination of elements, functions, steps or operations is inherently mutually exclusive in some way, will there be an exception to this definition.

Claims

1. A processor heat dissipation component, characterized in that, include: processor; An adhesive layer is disposed on the first surface of the processor; A heat-conducting component, wherein the heat-conducting component has a first recessed portion and is disposed on the first surface of the adhesive layer, and encapsulates the processor; The liquid cooling pipe has a first protrusion located within the first recess, and the liquid cooling pipe encloses the heat-conducting component.

2. The processor heat dissipation assembly according to claim 1, characterized in that, Also includes: A circuit board, wherein the circuit board is provided with a first through hole and a second through hole; The liquid cooling pipes pass through the first through hole and the second through hole respectively, and the liquid cooling pipes cover the first surface of the circuit board.

3. The processor heat dissipation assembly according to claim 2, characterized in that, The orthographic projection surface of the first through hole is tangent to one end of the orthographic projection surface of the heat-conducting component, and the orthographic projection surface of the second through hole is tangent to the other end of the orthographic projection surface of the heat-conducting component.

4. The processor heat dissipation assembly according to any one of claims 1-3, characterized in that, The liquid cooling pipeline is provided with an inlet and an outlet, and the inlet and outlet are arranged opposite to each other.

5. The processor heat dissipation assembly according to claim 4, characterized in that, The liquid inlet is located at the lower edge of the first surface of the liquid cooling pipe, and the liquid outlet is located at the upper edge of the second surface of the liquid cooling pipe.

6. The processor heat dissipation assembly according to claim 1, characterized in that, The third surface of the liquid cooling pipe is provided with a second recess, and the second recess is provided with a thermoelectric cooling element.

7. The processor heat dissipation assembly according to claim 1, characterized in that, The adhesive layer contains metal particles.

8. The processor heat dissipation assembly according to claim 1, characterized in that, The first recess penetrates the heat-conducting component.

9. The processor heat dissipation assembly according to claim 1, characterized in that, The first recess and the first protrusion are respectively folded back.

10. The processor heat dissipation assembly according to claim 1, characterized in that, The heat-conducting component is a heat-conducting metal.

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