Two-phase staggered charging module printed circuit board
By optimizing the structure and component configuration of the printed circuit board, the problems of heat dissipation difficulties, unreasonable circuit layout and high cost of the charging module were solved, realizing a charging module design with high heat dissipation, low loss and high integration, which meets the needs of high power charging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-23
- Publication Date
- 2026-03-20
AI Technical Summary
Existing charging modules suffer from heat dissipation difficulties, unreasonable circuit layout, and high costs during high-power charging. Furthermore, the separation of the control module from the power board leads to low system stability and integration.
Design a two-phase interleaved charging module printed circuit board, divide the components into three areas, and use silicon carbide MOSFETs and LLC integrated control modules to optimize the circuit layout. Integrate LLC control modules with power components, and use high-efficiency heat sinks and inductor-capacitor combinations to achieve high-efficiency heat dissipation and low loss.
The heat dissipation performance, stability and integration of the charging module have been improved, the cost has been reduced, and the charging efficiency and power conversion efficiency have been improved to meet the high-power charging requirements.
Smart Images

Figure CN224021925U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of circuit board design, in particular to a two-phase staggered charging module printed circuit board. BACKGROUND
[0002] In the rapid development process of new energy vehicle industry, the construction of charging infrastructure becomes a key link, among which the charging pile as the main charging equipment, one of its core components is the charging module. The charging module not only determines the output power and efficiency of the charging pile, but also directly affects the safety and stability of the charging process. With the increasing demand for charging power of electric vehicles, especially the increasing demand for high-power charging of 40KW and above, the traditional charging module faces many challenges.
[0003] Firstly, the existing charging module generally has the problem of difficult heat dissipation when charging at high power. In the case of high-power operation, internal components of the charging module (such as MOS tubes, electrolytic capacitors, etc.) will generate a large amount of heat, and the traditional heat dissipation design often cannot effectively dissipate the heat in time, resulting in overheating of the equipment, which in turn affects the stability and safety of the system. Especially under long-time high-load work, overheating may cause component damage, and even lead to equipment failure. In addition, poor heat dissipation also leads to reduced efficiency of the charging module, affecting the charging speed and prolonging the charging time.
[0004] Secondly, the circuit layout of the existing charging module mostly adopts traditional wiring design, resulting in large output voltage ripple in the circuit. Larger ripple not only affects the quality of the power supply, but also may affect the stability of the downstream circuit. In order to solve this problem, the existing technology usually reduces the voltage ripple by increasing the filter or complex circuit design, but this often increases the complexity and cost of the system.
[0005] Thirdly, the manufacturing cost of the traditional charging module is high, especially in high-power applications, often requiring the use of expensive high-frequency components and complex circuit board design. With the increasing requirement of cost control in the market, how to reduce the cost while ensuring the performance has become a major challenge in the design of charging module.
[0006] In addition, the control module of the existing charging module is usually separated from the power board, which not only increases the volume and complexity of the system, but also increases the production cost and process difficulty. The separation design of the control module and the power board makes the overall integration low, reducing the stability of the system.
[0007] In order to deal with these technical challenges, it is urgent to design a new charging module, which can effectively solve the problems of poor heat dissipation, unreasonable circuit layout, high cost and improve the working efficiency and reliability of the charging module. Therefore, how to design a high-power charging module with high heat dissipation efficiency, low loss, low noise and cost optimization has become an important direction of current technology research and development. Utility model content
[0008] The utility model provides a kind of two-phase staggered charging module printed circuit board.It can solve the above problems existing in related art.The technical solution is as follows:
[0009] The application provides a kind of two-phase staggered charging module printed circuit board, applicable to 40KW charging module, comprising:
[0010] Printed circuit board, first printed area, second printed area, third printed area are sequentially provided with through line connection on the printed circuit board from left to right;
[0011] The first printed area is provided with input port, one LLC electrolytic capacitor, silicon carbide MOS tube and LLC integrated control module 15;
[0012] The second printed area is provided with LLC resonant inductor, LLC resonant capacitor and LLC resonant transformer;
[0013] The third printed area is provided with three LLC electrolytic capacitors, relay, rectifier diode heat sink, common mode inductor, differential mode inductor 45, output filter capacitor, anti-reverse diode heat sink and output terminal 52.
[0014] Optionally, the input port includes first input port 1 and second input port 13;The first LLC electrolytic capacitor includes a first electrolytic capacitor 2, a second electrolytic capacitor 3, a third electrolytic capacitor 4, a fourth electrolytic capacitor 5, a fifth electrolytic capacitor 10, a sixth electrolytic capacitor 11, a seventh electrolytic capacitor 12 and an eighth electrolytic capacitor 14;The silicon carbide MOS tube includes first MOS tube 6, second MOS tube 7, third MOS tube 8 and fourth MOS tube 9.
[0015] Optionally, in the second printed area, the LLC resonant inductor includes first resonant inductor 16, second resonant inductor 21, third resonant inductor 24 and fourth resonant inductor 29;The LLC resonant capacitor includes first resonant capacitor 19, second resonant capacitor 20, third resonant capacitor 27 and fourth resonant capacitor 28;The LLC resonant transformer includes first transformer 17, second transformer 18, third transformer 22, fourth transformer 23, fifth transformer 25, sixth transformer 26, seventh transformer 30 and eighth transformer 31.
[0016] Optionally, in the third printed area, the three-zone LLC electrolytic capacitor includes a three-zone first capacitor 32, a three-zone second capacitor 33, a three-zone third capacitor 34, a three-zone fourth capacitor 35, a three-zone fifth capacitor 38, and a three-zone sixth capacitor 39; the relay includes a first relay 36, a second relay 37, and a third relay 40; the rectifier diode heat sink includes a first rectifier heat sink 41, a second rectifier heat sink 42, a third rectifier heat sink 43, and a fourth rectifier heat sink 44; the common mode inductor includes a first common mode inductor 46 and a second common mode inductor 47; the output filter capacitor includes a first output capacitor 48 and a second output capacitor 49; the anti-reverse diode heat sink includes a first anti-reverse heat sink 50 and a second anti-reverse heat sink 51.
[0017] Optionally, the first printed area is provided with the first input port 1 and the second input port 13 from top to bottom;
[0018] The first electrolytic capacitor 2, the one-zone second electrolytic capacitor 3, the one-zone third electrolytic capacitor 4, and the one-zone fourth electrolytic capacitor 5 are arranged in parallel with the one-zone fifth electrolytic capacitor 10, the one-zone sixth electrolytic capacitor 11, the one-zone seventh electrolytic capacitor 12, and the one-zone eighth electrolytic capacitor 14 on the upper and lower sides of the printed board;
[0019] The first MOS tube 6, the second MOS tube 7, the third MOS tube 8, and the fourth MOS tube 9 are arranged between the two groups of capacitors from top to bottom;
[0020] The LLC integrated control module 15 is arranged beside the one-zone eighth electrolytic capacitor 14.
[0021] Optionally, the first MOS tube 6, the second MOS tube 7, the third MOS tube 8, and the fourth MOS tube 9 of the first printed area are connected one by one with the first resonant inductor 16, the second resonant inductor 21, the third resonant inductor 24, and the fourth resonant inductor 29 of the second printed area;
[0022] The first resonant capacitor 19 and the second resonant capacitor 20 are arranged between the first resonant inductor 16 and the second resonant inductor 21; the third resonant capacitor 27 and the fourth resonant capacitor 28 are arranged between the third resonant inductor 24 and the fourth resonant inductor 29;
[0023] Each of the LLC resonant transformers is arranged on the right side of the LLC resonant inductor and the LLC resonant capacitor.
[0024] Optionally, the three-zone first capacitor 32, the three-zone second capacitor 33, the three-zone third capacitor 34, the three-zone fourth capacitor 35, the three-zone fifth capacitor 38, and the three-zone sixth capacitor 39 are designed from top to bottom.
[0025] The first relay 36, the second relay 37 and the third relay 40 are arranged in parallel on the right side of the three-zone LLC electrolytic capacitor;
[0026] The first rectifier fin 41, the second rectifier fin 42, the third rectifier fin 43 and the fourth rectifier fin 44 are in series connection, and the rectifier fin in series connection is connected in parallel on both sides of the output filter capacitor.
[0027] Optionally, the differential mode inductor 45 is arranged below the fourth rectifier fin 44, and the second common mode inductor 47 is arranged below the differential mode inductor 45 and the first common mode inductor 46.
[0028] Optionally, the first output capacitor 48 is arranged on the right side of the first common mode inductor 46, and the second output capacitor 49 is arranged below the first common mode inductor 46.
[0029] Optionally, the first anti-reverse fin 50 and the second anti-reverse fin 51 are arranged on the right side of the second output capacitor 49, and the output terminal 52 is arranged on the right side of the first anti-reverse fin 50 and the second anti-reverse fin 51 and close to the printed board edge.
[0030] The technical scheme provided by the utility model has at least the following beneficial effects:
[0031] The utility model discloses a two-phase interleaved charging module printed circuit board suitable for 40KW charging module, and realizes excellent technical effect through reasonable structure layout and component configuration. First, the printed circuit board is divided into three areas, and the layout of various components is optimized respectively, and the heat dissipation performance is improved, especially in the layout of silicon carbide MOS tube and electrolytic capacitor, the uniform dispersion of heat is effectively promoted, the overheating problem is reduced, and the overall heat dissipation efficiency is improved. Secondly, the silicon carbide MOS tube in the module effectively reduces the power loss and improves the charging efficiency. By integrating LLC control module and power components on the same board, the embodiment not only improves the system stability, but also simplifies the design and production process, improves the integration of the module, reduces external components, and further reduces the manufacturing cost. Overall, the embodiment optimizes the circuit design and component layout, improves the working efficiency, stability and heat dissipation performance of the module, and meets the demand of high-power charging. BRIEF DESCRIPTION OF DRAWINGS
[0032] In order to more clearly illustrate the technical solutions in the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.
[0033] Figure 1 is a structural schematic diagram of a two-phase interleaved charging module printed circuit board provided by an illustrative embodiment of the present application. DETAILED DESCRIPTION
[0034] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the embodiments of the present application in combination with the drawings.
[0035] Embodiment 1
[0036] Please refer to Figure 1 which shows a structural schematic diagram of a two-phase interleaved charging module printed circuit board provided by an illustrative embodiment of the present application.
[0037] The present application provides a two-phase interleaved charging module printed circuit board, which is suitable for a 40KW charging module, comprising a printed circuit board, wherein a first printed area, a second printed area and a third printed area are sequentially arranged on the printed circuit board from left to right and connected by a circuit.
[0038] The first printed area is provided with an input port, a first LLC electrolytic capacitor, a silicon carbide MOS tube and an LLC integrated control module 15.
[0039] The second printed area is provided with an LLC resonant inductor, an LLC resonant capacitor and an LLC resonant transformer.
[0040] The third printed area is provided with a third LLC electrolytic capacitor, a relay, a rectifier diode heat sink, a common mode inductor, a differential mode inductor 45, an output filter capacitor, an anti-reverse diode heat sink and an output terminal 52.
[0041] In summary, the present embodiment provides a structural design of a two-phase interleaved charging module printed circuit board suitable for a 40KW charging module. Through reasonable structural layout, Embodiment 1 achieves the following technical effects.
[0042] Efficient heat dissipation: by dividing the printed circuit board into three different printed areas, the layout of each component is optimized, and the heat dissipation performance is enhanced. In particular, the distribution design of the silicon carbide MOS tube and the electrolytic capacitor enables heat to be more effectively conducted from the high-temperature area to the low-temperature area, reducing the heat accumulation of the system, thereby improving the overall heat dissipation efficiency of the system.
[0043] Stability improvement: The LLC control module, silicon carbide MOSFET, and electrolytic capacitor are integrated in the first printed area. This layout reduces the mutual interference between components, improving the stability of the circuit. In addition, the use of silicon carbide MOSFET helps to reduce power loss and improve efficiency, making the charging module more stable and reliable.
[0044] High module integration: This embodiment adopts a two-phase interleaved design, which not only provides high output power but also optimizes the overall layout of the circuit through integrated design, reducing additional external components, making the charging module more compact and easy to integrate into the charging pile system.
[0045] High-efficiency power conversion: The second printed area uses a reasonable configuration of LLC resonant inductor, capacitor, and resonant transformer, effectively reducing power conversion loss and improving energy conversion efficiency. This allows the charging module to maintain high efficiency even at high power output, meeting the demand for 40KW high-power charging.
[0046] In summary, embodiment 1 provides a two-phase interleaved charging module printed circuit board suitable for 40KW charging modules, which achieves excellent technical effects through reasonable structure layout and component configuration. First, the printed circuit board is divided into three areas, optimizing the layout of each component and improving heat dissipation performance. Especially in the layout of silicon carbide MOSFET and electrolytic capacitor, it effectively promotes the uniform dispersion of heat, reduces overheating problems, and improves overall heat dissipation efficiency. Second, the silicon carbide MOSFET in the module effectively reduces power loss and improves charging efficiency. By integrating the LLC control module and power components on the same board, this embodiment not only improves system stability but also simplifies design and production processes, improves module integration, reduces external components, and thus reduces manufacturing costs. Overall, this embodiment optimizes circuit design and component layout to improve module efficiency, stability, and heat dissipation performance, meeting the demand for high-power charging.
[0047] Embodiment 2
[0048] Optionally, the input port includes a first input port 1 and a second input port 13; the first LLC electrolytic capacitor includes a first electrolytic capacitor 2, a second electrolytic capacitor 3, a third electrolytic capacitor 4, a fourth electrolytic capacitor 5, a fifth electrolytic capacitor 10, a sixth electrolytic capacitor 11, a seventh electrolytic capacitor 12, and an eighth electrolytic capacitor 14; the silicon carbide MOSFET includes a first MOSFET 6, a second MOSFET 7, a third MOSFET 8, and a fourth MOSFET 9.
[0049] Optionally, in the second printed area, the LLC resonant inductance includes the first resonant inductance 16, the second resonant inductance 21, the third resonant inductance 24, and the fourth resonant inductance 29; the LLC resonant capacitance includes the first resonant capacitance 19, the second resonant capacitance 20, the third resonant capacitance 27, and the fourth resonant capacitance 28; and the LLC resonant transformer includes the first transformer 17, the second transformer 18, the third transformer 22, the fourth transformer 23, the fifth transformer 25, the sixth transformer 26, the seventh transformer 30, and the eighth transformer 31.
[0050] Optionally, in the third printed area, the three-area LLC electrolytic capacitor includes a three-area first capacitor 32, a three-area second capacitor 33, a three-area third capacitor 34, a three-area fourth capacitor 35, a three-area fifth capacitor 38, and a three-area sixth capacitor 39; the relay includes a first relay 36, a second relay 37, and a third relay 40; the rectifier diode heat sink includes a first rectifier heat sink 41, a second rectifier heat sink 42, a third rectifier heat sink 43, and a fourth rectifier heat sink 44; the common-mode inductance includes a first common-mode inductance 46 and a second common-mode inductance 47; the output filter capacitor includes a first output capacitor 48 and a second output capacitor 49; and the anti-reverse diode heat sink includes a first anti-reverse heat sink 50 and a second anti-reverse heat sink 51.
[0051] Optionally, the first printed area is provided with a first input port 1 and a second input port 13 from top to bottom; the first electrolytic capacitor 2, the one-area second electrolytic capacitor 3, the one-area third electrolytic capacitor 4, the one-area fourth electrolytic capacitor 5, the one-area fifth electrolytic capacitor 10, the one-area sixth electrolytic capacitor 11, the one-area seventh electrolytic capacitor 12, and the one-area eighth electrolytic capacitor 14 are arranged in parallel on the upper and lower sides of the printed board; and the first MOS tube 6, the second MOS tube 7, the third MOS tube 8, and the fourth MOS tube 9 are arranged between the two groups of capacitors from top to bottom.
[0052] The LLC integrated control module 15 is arranged beside the one-area eighth electrolytic capacitor 14.
[0053] Optionally, the first MOS tube 6, the second MOS tube 7, the third MOS tube 8, and the fourth MOS tube 9 of the first printed area are connected to the first resonant inductance 16, the second resonant inductance 21, the third resonant inductance 24, and the fourth resonant inductance 29 of the second printed area one by one.
[0054] The first resonant capacitance 19 and the second resonant capacitance 20 are arranged between the first resonant inductance 16 and the second resonant inductance 21; the third resonant capacitance 27 and the fourth resonant capacitance 28 are arranged between the third resonant inductance 24 and the fourth resonant inductance 29; and each transformer in the LLC resonant transformer is arranged on the right side of the LLC resonant inductance and the LLC resonant capacitance.
[0055] Optionally, the three-zone first capacitor 32, the three-zone second capacitor 33, the three-zone third capacitor 34, the three-zone fourth capacitor 35, the three-zone fifth capacitor 38, and the three-zone sixth capacitor 39 are designed from top to bottom.
[0056] The first relay 36, the second relay 37, and the third relay 40 are arranged in parallel on the right side of the three-zone LLC electrolytic capacitor.
[0057] The rectifier diode fins, including the first rectifier fin 41, the second rectifier fin 42, the third rectifier fin 43, and the fourth rectifier fin 44, are in series connection. The rectifier diode fins in series connection are connected in parallel on both sides of the output filter capacitor.
[0058] Optionally, the differential mode inductor 45 is below the fourth rectifier fin 44, and the second common mode inductor 47 is below the differential mode inductor 45 and the first common mode inductor 46.
[0059] Optionally, the first output capacitor 48 is on the right side of the first common mode inductor 46, and the second output capacitor 49 is below the first common mode inductor 46.
[0060] Optionally, the first anti-reverse fin 50 and the second anti-reverse fin 51 are on the right side of the second output capacitor 49, and the output terminal 52 is on the right side of the first anti-reverse fin 50 and the second anti-reverse fin 51, close to the edge of the printed board.
[0061] In summary, in Embodiment 2, the design details of the printed circuit board are further optimized, especially in the layout of components, connection methods, and the configuration of capacitors and inductors, which brings the following technical effects.
[0062] More accurate circuit design: In Embodiment 2, all components are partitioned and reasonably laid out according to actual needs. The design of the first printed area, the second printed area, and the third printed area is more precise, especially in the corresponding relationship between the silicon carbide MOS tube and the LLC resonant inductor and capacitor, ensuring stable current flow, reducing voltage ripple, and improving the output quality of the power supply.
[0063] Excellent electromagnetic compatibility (EMC): By reasonably designing the positions of capacitors, inductors, and transformers, electromagnetic interference (EMI) in the circuit is reduced. Especially the appropriate layout of differential mode inductors and common mode inductors effectively reduces the influence of high-frequency noise on the system, thereby improving electromagnetic compatibility and ensuring that the charging module does not have adverse effects on the surrounding environment when working at high power.
[0064] Optimized Heat Dissipation: The design of Example 2 further optimizes the placement of each component for heat dissipation, such as the configuration of rectifier diode heat sinks and anti-reverse diode heat sinks. This ensures efficient heat dissipation from high heat-generating components like rectifier diodes, effectively reducing overall system temperature and ensuring the efficient and stable operation of the charging module.
[0065] Simplified Manufacturing Process and Reduced Costs: By integrating multiple components into the printed circuit board, the need for additional external connections and complex assemblies is eliminated, reducing the complexity of the production process and lowering manufacturing costs. Additionally, the higher integration of the circuit board reduces internal wiring, improving production efficiency and product consistency.
[0066] Improved Reliability and Safety of the Module: The rational layout of relays and anti-reverse diodes in the design improves the reliability of the module. Especially during high-power operation, the anti-reverse diode effectively protects the module from reverse current, enhancing the safety and long-term stability of the module.
[0067] In summary, Example 2 further optimizes the structure and circuit design of the charging module based on Example 1. First, through precise component layout, each capacitor, inductor, and transformer maximizes its role in the circuit, significantly improving current and voltage stability and effectively reducing voltage ripple. Second, this embodiment significantly improves the electromagnetic compatibility (EMC) of the module by optimizing the configuration of differential mode inductors and common mode inductors, reducing electromagnetic interference and ensuring that high-power charging does not affect other devices. At the same time, the design of rectifier diode and anti-reverse diode heat sinks further enhances heat dissipation, effectively reducing system temperature and ensuring efficient and stable operation of the charging module. In terms of manufacturing costs, the integrated design of this embodiment reduces the need for external connections and complex assemblies, simplifying the manufacturing process, reducing production costs, and improving product consistency and reliability. In summary, Example 2 optimizes circuit layout, enhances heat dissipation and electromagnetic compatibility, improves the overall performance, reliability and safety of the module, meets high-power charging requirements, and reduces costs.
[0068] Finally, it should be noted that in two-phase interleaved design, two phases are powered by one total input channel, then each phase is divided by 50% voltage, and the phase difference is 90°. Further analysis is as follows.
[0069] The input port has two input ports (first input port and second input port), which indicates that the charging module design supports two independent input channels, which is one of the characteristics of two-phase interleaved design, allowing two independent power inputs to improve power balance and reduce total harmonic distortion of the system.
[0070] In the second printed area, there are multiple LLC resonant inductors and LLC resonant capacitors (first, second, third, and fourth resonant inductors / capacitors), which indicates the use of a multi-path LLC resonant circuit. This design is used in two-phase or multi-phase interleaved designs to balance current load and reduce input and output current ripple.
[0071] The complexity of the output terminals and protection circuits (differential mode inductors and common mode inductors) described in this application shows that the design is enhanced for electromagnetic compatibility (EMC) and protection measures in order to cope with dual-path power supply.
[0072] Silicon carbide MOSFETs are used in high-performance power supply designs due to their high-efficiency power conversion characteristics. Their use in this design achieves the most efficient power conversion in each phase, achieving better thermal performance and higher system efficiency in two-phase interleaved designs.
[0073] The circuit board is clearly divided into three printed areas (first, second, and third printed areas), each of which has different circuit functions. Each part is independently configured to optimize specific functions, maximizing the efficiency and independent operation of each phase in two-phase interleaved designs.
[0074] These designs collectively point to the implementation of a two-phase interleaved charging module that is carefully designed to improve efficiency, reduce ripple, improve thermal management, and enhance power quality. By optimizing the layout of components in different printed areas and using advanced semiconductor and resonant technology, this design can provide more stable and efficient performance in high-power applications.
[0075] The above is only an optional embodiment of the present application and does not limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A two-phase interleaved charging module printed circuit board, suitable for a 40KW charging module, characterized in that, include: A printed circuit board, wherein a first printing area, a second printing area, and a third printing area are sequentially provided from left to right by lines; The first printed area is provided with an input port, an LLC electrolytic capacitor in area 1, a silicon carbide MOS transistor and an LLC integrated control module (15). The second printing area is equipped with an LLC resonant inductor, an LLC resonant capacitor, and an LLC resonant transformer; The third printing area is provided with three LLC electrolytic capacitors, relays, rectifier diode heat sinks, common mode inductors, differential mode inductors (45), output filter capacitors, anti-reverse diode heat sinks, and output terminals (52).
2. The printed circuit board of the two-phase interleaved charging module according to claim 1, characterized in that, The input ports include a first input port (1) and a second input port (13); the first-zone LLC electrolytic capacitors include a first-zone electrolytic capacitor (2), a second-zone electrolytic capacitor (3), a third-zone electrolytic capacitor (4), a fourth-zone electrolytic capacitor (5), a fifth-zone electrolytic capacitor (10), a sixth-zone electrolytic capacitor (11), a seventh-zone electrolytic capacitor (12), and an eighth-zone electrolytic capacitor (14); the silicon carbide MOSFETs include a first MOSFET (6), a second MOSFET (7), a third MOSFET (8), and a fourth MOSFET (9).
3. The printed circuit board of the two-phase interleaved charging module according to claim 2, characterized in that, In the second printing area, the LLC resonant inductor includes a first resonant inductor (16), a second resonant inductor (21), a third resonant inductor (24), and a fourth resonant inductor (29); the LLC resonant capacitor includes a first resonant capacitor (19), a second resonant capacitor (20), a third resonant capacitor (27), and a fourth resonant capacitor (28); the LLC resonant transformer includes a first transformer (17), a second transformer (18), a third transformer (22), a fourth transformer (23), a fifth transformer (25), a sixth transformer (26), a seventh transformer (30), and an eighth transformer (31).
4. The printed circuit board of the two-phase interleaved charging module according to claim 1, characterized in that, In the third printing area, the three-zone LLC electrolytic capacitors include a third-zone first capacitor (32), a third-zone second capacitor (33), a third-zone third capacitor (34), a third-zone fourth capacitor (35), a third-zone fifth capacitor (38), and a third-zone sixth capacitor (39); the relays include a first relay (36), a second relay (37), and a third relay (40); the rectifier diode heat sinks include a first rectifier heat sink (41), a second rectifier heat sink (42), a third rectifier heat sink (43), and a fourth rectifier heat sink (44); the common-mode inductor includes a first common-mode inductor (46) and a second common-mode inductor (47); the output filter capacitors include a first output capacitor (48) and a second output capacitor (49); and the anti-reverse diode heat sinks include a first anti-reverse heat sink (50) and a second anti-reverse heat sink (51).
5. The printed circuit board of the two-phase interleaved charging module according to claim 2, characterized in that, The first printing area is provided with the first input port (1) and the second input port (13) from top to bottom. The first electrolytic capacitor (2), the second electrolytic capacitor (3), the third electrolytic capacitor (4), and the fourth electrolytic capacitor (5) of the first zone are connected in parallel with the fifth electrolytic capacitor (10), the sixth electrolytic capacitor (11), the seventh electrolytic capacitor (12), and the eighth electrolytic capacitor (14) of the first zone and are arranged on the upper and lower sides of the printing plate. The first MOS transistor (6), the second MOS transistor (7), the third MOS transistor (8) and the fourth MOS transistor (9) are arranged from top to bottom between the two sets of capacitors; The LLC integrated control module (15) is located next to the eighth electrolytic capacitor (14) in the first zone.
6. The printed circuit board of the two-phase interleaved charging module according to claim 3, characterized in that, The first MOS transistor (6), the second MOS transistor (7), the third MOS transistor (8) and the fourth MOS transistor (9) in the first printed area are connected one-to-one with the first resonant inductor (16), the second resonant inductor (21), the third resonant inductor (24) and the fourth resonant inductor (29) in the second printed area; The first resonant capacitor (19) and the second resonant capacitor (20) are interposed between the first resonant inductor (16) and the second resonant inductor (21); the third resonant capacitor (27) and the fourth resonant capacitor (28) are interposed between the third resonant inductor (24) and the fourth resonant inductor (29); The transformers in the LLC resonant transformer are arranged to the right of the LLC resonant inductor and the LLC resonant capacitor.
7. The printed circuit board of the two-phase interleaved charging module according to claim 4, characterized in that, The three-zone first capacitor (32), three-zone second capacitor (33), three-zone third capacitor (34), three-zone fourth capacitor (35), three-zone fifth capacitor (38), and three-zone sixth capacitor (39) are designed from top to bottom; The first relay (36), the second relay (37), and the third relay (40) are arranged in parallel on the right side of the three-zone LLC electrolytic capacitor; The rectifier diode heat sink includes a first rectifier heat sink (41), a second rectifier heat sink (42), a third rectifier heat sink (43), and a fourth rectifier heat sink (44), which are connected in series. The rectifier diode heat sink, after the internal heat sinks are connected in series, is connected in parallel on both sides of the output filter capacitor.
8. The printed circuit board of the two-phase interleaved charging module according to claim 4, characterized in that, The differential mode inductor (45) is located below the fourth rectifier heat sink (44), and the second common mode inductor (47) is located below the differential mode inductor (45) and the first common mode inductor (46).
9. The printed circuit board of the two-phase interleaved charging module according to claim 4, characterized in that, The first output capacitor (48) is to the right of the first common-mode inductor (46), and the second output capacitor (49) is below the first common-mode inductor (46).
10. The printed circuit board of the two-phase interleaved charging module according to claim 4, characterized in that, The first anti-reverse heat sink (50) and the second anti-reverse heat sink (51) are to the right of the second output capacitor (49); the output terminal (52) is to the right of the first anti-reverse heat sink (50) and the second anti-reverse heat sink (51) and close to the edge of the printing plate.