Buckle locking type heat dissipation structure

Abstract

The utility model discloses a buckle locking type heat radiation structure comprising a heat radiation plate which comprises a substrate and sinking platforms arranged at two ends of the substrate, and riveting columns are arranged on the sinking platforms; the buckle is riveted on the sinking platform through the riveting column; the buckle is clamped on a PCB (Printed Circuit Board), and the substrate is propped against an electronic element arranged on the PCB. According to the utility model, the heat dissipation plate and the buckle are designed to complete the heat dissipation of the electronic component, and the heat dissipation plate is clamped with the PCB through the buckle, so that the substrate is in contact with the electronic component, and the heat dissipation of the electronic component is completed.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component heat dissipation field, specifically is a buckle locking type heat dissipation structure. BACKGROUND

[0002] Electronic components are the basic units of electronic systems, and they play a crucial role in various electronic devices and systems.

[0003] When electronic components work, they generate heat, and the components need to be cooled. The current electronic component cooling method of the circuit is air cooling, which has low cooling efficiency. When the product power is high, the cooling efficiency of the electronic component is not enough, which can affect the working efficiency of the electronic component and the entire PCB.

[0004] Therefore, how to design a heat dissipation structure to assist the heat dissipation of electronic components is a problem to be solved at present. INVENTION CONTENT

[0005] The utility model discloses a buckle locking type heat dissipation structure to solve the above-mentioned problems existing in the prior art.

[0006] Technical scheme: a buckle locking type heat dissipation structure, comprising:

[0007] The heat dissipation plate comprises a base plate and a sunken platform provided at both ends of the base plate, and the sunken platform is provided with a riveting column;

[0008] The buckle is riveted on the sunken platform through the riveting column;

[0009] The buckle is clamped on the PCB, and the base plate abuts against the electronic component mounted on the PCB.

[0010] The utility model discloses a heat dissipation plate and a buckle, which complete the heat dissipation work of the electronic component. The buckle is clamped on the PCB, and the base plate abuts against the electronic component mounted on the PCB.

[0011] The base plate and the buckle member are completely riveted without the possibility of loosening. This connection method has low cost (without screwing, screwing affects the combination effect and wastes working time and increases the installation space).

[0012] The design of the sunken platform allows the buckle to be embedded in the base plate, so that the buckle direction is fixed and cannot rotate 360 degrees before riveting. The installation method is only one kind, and the installation speed and position degree are accurately and efficiently controlled.

[0013] In further embodiments, the buckle comprises:

[0014] The connecting part is adapted to the sunken platform;

[0015] The two groups of buckling feet are mirror installed below the connecting part.

[0016] In a further embodiment, the connecting part is provided with a connecting hole matched with the riveting column.

[0017] In a further embodiment, the two groups of buckling feet have a predetermined gap.

[0018] Each group of buckling feet comprises a connecting segment connected with the connecting part and a protruding segment connected with the connecting segment.

[0019] The protruding segment of the buckle passes through the reserved through hole of the PCB board, and the substrate is tightly attached to the surface of the heat-conducting silica gel skin of the required heat dissipation component (such as a MOS tube, an MCU chip, etc.), at this time, the substrate is combined with the heat-conducting silica gel skin by artificial compression, and the pre-tightening force is maintained through the combination of the buckle and the PCB board, so that the heat of the electronic element is conducted to the substrate, and then the heat dissipation area is expanded, and the heat dissipation work is completed.

[0020] According to the heat dissipation requirement, the size or thickness of the substrate can be designed to increase the heat dissipation power, and at the same time, the layout of the buckle can be increased or changed to increase the pre-tightening force.

[0021] In actual use, the buckle and the PCB board can also be welded together through wave soldering, and no matter the vibration or other influences of the PCB board, the substrate is tightly pressed against the required heat dissipation component.

[0022] In a further embodiment, the protruding segment is clamped with the PCB board, the height of the connecting segment is determined by the height of the PCB board and the electronic element, and when installed, the height of the connecting segment is matched with the height of the PCB board and the electronic element, so that when the protruding segment is clamped with the PCB board, the substrate abuts against the electronic element.

[0023] The material of the substrate comprises aluminum.

[0024] Beneficial effects: the buckle locking type heat dissipation structure, the utility model discloses a heat dissipation plate and buckle are designed, and the heat dissipation work of electronic element is completed, and the buckle is clamped with the PCB board, and then the substrate is contacted with the electronic element, and then the heat dissipation work of electronic element is completed. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is the structural schematic diagram of the utility model.

[0026] Figure 2 It is the part explosion structure schematic diagram of the utility model.

[0027] Figure 3 It is the assembly structure schematic diagram of the utility model when dissipating heat.

[0028] Figure 4 is the assembly profile structure schematic diagram of the heat dissipation of the utility model.

[0029] The reference signs are:

[0030] 1, heat dissipation plate;11, base plate;12, sunken platform;13, riveting column;

[0031] 2, buckle;21, connecting part;211, connecting hole;22, buckling leg;

[0032] 3, PCB board;31, electronic component. DETAILED DESCRIPTION

[0033] The application relates to a buckle locking type heat dissipation structure, which is explained in detail below through a specific embodiment.

[0034] A buckle locking type heat dissipation structure comprises:

[0035] A heat dissipation plate 1 comprises a base plate 11 and sunken platforms 12 arranged at both ends of the base plate 11, and the sunken platforms 12 are provided with riveting columns 13.

[0036] A buckle 2 is riveted on the sunken platforms 12 through the riveting columns 13.

[0037] The buckle 2 is clamped on a PCB board 3, and the base plate 11 abuts against an electronic component 31 mounted on the PCB board 3.

[0038] The utility model discloses a heat dissipation plate 1 and a buckle 2 are designed, and the heat dissipation work of the electronic component 31 is completed, the buckle 2 is clamped on the PCB board 3, and then the base plate 11 is in contact with the electronic component 31, and the heat dissipation work of the electronic component 31 is completed.

[0039] The base plate 11 and the buckle 2 are completely riveted through riveting, and there is no possibility of loosening, and the connection mode is low in cost (without screwing, the screw affects the combination effect, wastes operation time and increases the installation space).

[0040] Through the design of the sunken platforms 12, the buckle 2 is embedded in the base plate 11, so that the buckle 2 is fixed in direction and cannot rotate by 360 degrees before riveting, and there is only one installation mode, so that the installation speed and position degree are accurately and efficiently controlled.

[0041] The buckle 2 comprises:

[0042] A connecting part 21 is adapted to the sunken platforms 12.

[0043] Buckling legs 22 are designed in two groups and are mirror installed below the connecting part 21.

[0044] The connecting part 21 is provided with a connecting hole 211 matched with the riveting column 13.

[0045] The two groups of buckling feet 22 have a predetermined gap therebetween.

[0046] Each group of buckling feet 22 comprises a connecting segment connected with the connecting part 21, and a protruding segment connected with the connecting segment.

[0047] The protruding segment of the buckle 2 passes through a reserved through hole of the PCB 3, the substrate 11 is tightly attached to the surface of the heat-conducting silica gel skin of the required heat-dissipating component (such as MOS tube, MCU chip, etc.) of the PCB 3, at this time, the substrate 11 is combined with the heat-conducting silica gel skin by artificial compression, and the pre-tightening force is maintained by the combination of the buckle 2 and the PCB 3, the heat of the electronic element 31 is conducted to the substrate 11, and then the heat-dissipating area is expanded, and the heat-dissipating work is completed.

[0048] According to the heat-dissipating requirement, the size or thickness of the substrate 11 can be designed to increase the heat-dissipating power, and at the same time, the layout of the buckle 2 can be increased or changed to increase the pre-tightening force.

[0049] In actual use, the buckle 2 and the PCB 3 can also be welded together by wave soldering, and no matter the vibration or other influence of the PCB 3, the substrate 11 is tightly pressed against the required heat-dissipating component.

[0050] The protruding segment is clamped with the PCB 3, the height of the connecting segment is determined by the height of the PCB 3 and the electronic element 31, and when installed, the height of the connecting segment is matched with the height of the PCB 3 and the electronic element 31, and then when the protruding segment is clamped with the PCB 3, the substrate 11 abuts against the electronic element 31.

[0051] The material of the substrate 11 comprises aluminum.

[0052] Working principle: when working, the buckling feet 22 pass through the reserved through hole of the PCB 3, the substrate 11 is combined with the heat-conducting silica gel skin on the electronic element 31 by artificial depression, and the pre-tightening force is maintained by the combination of the protruding segment and the PCB 3, the heat of the electronic element 31 is conducted to the substrate 11, and then the heat-dissipating area is expanded, and the heat-dissipating work is completed.

[0053] The preferred embodiments of the utility model are described in detail above in combination with the drawings, but the utility model is not limited to the specific details in the above embodiments, and various equivalent transformations can be made to the technical scheme of the utility model within the technical concept of the utility model, and these equivalent transformations all belong to the protection scope of the utility model.

Claims

1. A snap-locking heat dissipation structure, characterized in that, include: The heat sink (1) includes a substrate (11) and recessed platforms (12) disposed at both ends of the substrate (11), and the recessed platforms (12) are provided with rivet posts (13). The buckle (2) is riveted to the sunken platform (12) by the rivet column (13); The buckle (2) is snapped onto the PCB board (3), and the substrate (11) abuts against the electronic components (31) mounted on the PCB board (3).

2. The snap-locking heat dissipation structure according to claim 1, characterized in that: The buckle (2) includes: The connecting part (21) is adapted to the sunken platform (12); The buckle (22) is designed in two sets and is installed in a mirror image below the connecting part (21).

3. The snap-locking heat dissipation structure according to claim 2, characterized in that: The connecting part (21) has a connecting hole (211) that is adapted to the rivet post (13).

4. The snap-locking heat dissipation structure according to claim 2, characterized in that: There is a predetermined gap between the two sets of buckles (22); Each set of buckle feet (22) includes a connecting segment connected to the connecting part (21) and a protruding segment connected to the connecting segment.

5. The snap-locking heat dissipation structure according to claim 4, characterized in that: The protruding section is snapped into the PCB board (3).

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