High-speed pick-and-place head structure of SMT chip mounter

Abstract

The utility model relates to the technical field of chip mounters, in particular to a high-speed head taking and placing structure of an SMT chip mounter, which comprises a support, a transverse groove is fixedly mounted on the upper side of the support, a sliding plate is arranged on the inner side of the transverse groove in a sliding manner, and an SMT chip mounting assembly is arranged below the sliding plate; the SMT chip mounting assembly comprises a pressure equalizing cavity, an air pump is fixedly installed on the upper side of the pressure equalizing cavity, the output end of the air pump is communicated with the interior of the pressure equalizing cavity, the upper end of the air pump is communicated with an air pipe, the lower side of the pressure equalizing cavity is communicated with a plurality of pick-and-place pipes, electromagnetic valves are fixedly installed on the pick-and-place pipes, and pick-and-place heads are fixedly installed at the lower ends of the pick-and-place pipes. According to the utility model, the opening states of the SMT assembly and the plurality of pick-and-place pipes are controlled by the independently arranged solenoid valves, single adsorption and multiple synchronous adsorption can be carried out, the working efficiency is high, in addition, the inner cavity at the inner side of the pick-and-place head is matched with the plurality of air holes, the adsorption stability of the pick-and-place head is improved, and the service life of the pick-and-place head is prolonged. And thus, the stability during chip mounting is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to patch machine technical field especially relates to a kind of SMT patch machine high-speed pick-and-place head structure. BACKGROUND

[0002] SMT patch machine, full name is surface mount technology patch machine, is one of the key equipment indispensable in modern electronic manufacturing industry.

[0003] Referring to the utility model patent for granted announcement No.CN218163092U discloses a kind of SMT patch machine's material taking structure, including patch machine body, the upper surface of patch machine body is provided with patch workbench, by the material taking device of being set, the interval of first vacuum suction head and second vacuum suction head can be adjusted, to adapt to the adsorption material taking operation of different length circuit board, first vacuum suction head and second vacuum suction head cooperate to be able to adsorb the circuit board multiple parts when material taking, it is beneficial to improve the adsorption effect and the balance when circuit board is suspended and translates, by the rotary seat, rotating block and telescopic sleeve and positioning insert rod, when first vacuum suction head and second vacuum suction head are used for suction material, distance-adjusting slide box is rotated at rotating block by rotary seat and adjusts direction, the first vacuum suction head and second vacuum suction head of adjustment direction can adapt to the material taking operation of different width circuit board.

[0004] The simple vacuum pick-and-place head set in the above-mentioned patent is easy to cause unstable adsorption when adsorbing components, thereby affecting the stability of patching. To improve the stability of adsorption, we propose a SMT patch machine high-speed pick-and-place head structure. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in the prior art and proposes a SMT patch machine high-speed pick-and-place head structure.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

[0007] A SMT patch machine high-speed pick-and-place head structure, comprising a bracket, a horizontal groove is fixedly installed on the upper side of the bracket, a sliding plate is slidably arranged inside the horizontal groove, and an SMT patch assembly is arranged below the sliding plate.

[0008] Further, the equalizing cavity is fixedly installed between the sliding plate and the slide plate and is provided with an electric telescopic rod, and telescopic rods are arranged on both sides of the electric telescopic rod.

[0009] Further, the rubber pad is fixedly installed on the outer ring of the lower port of the pick-and-place head.

[0010] Further, the conveying belt is arranged in the horizontal groove and is used for conveying the PCB substrate.

[0011] Further, the horizontal plate is fixedly installed on the right side of the support, the element placing assembly is arranged on the horizontal plate, the element placing assembly comprises a plurality of placing grooves, the placing grooves are fixedly installed on the upper side of the horizontal plate, the blocking bars are fixedly installed on the lower port of the placing grooves, and the electronic elements are placed in the placing grooves.

[0012] Further, the placing grooves are provided with horizontal sections and inclined sections, the horizontal sections and the inclined sections are smoothly connected with arc sections, and the plurality of placing grooves correspond to the plurality of pick-and-place head installation positions.

[0013] Further, the controller is fixedly installed on the side wall of the support.

[0014] Further, the driving motor is fixedly installed on the side edge of the horizontal groove, the output end of the driving motor penetrates into the inside of the horizontal groove, the threaded rod is fixedly connected to the output end of the driving motor, and the threaded rod penetrates through the sliding plate.

[0015] Compared with the related art, the SMT pick-and-place head structure of the SMT chip mounter has the following beneficial effects:

[0016] In the SMT pick-and-place head structure of the SMT chip mounter, the equalizing cavity, the air pump, the plurality of pick-and-place pipes and the pick-and-place head are arranged in the SMT chip mounting assembly, the air pump is started to generate negative pressure and high pressure in the equalizing cavity, the inside of the pick-and-place head is in the adsorption state when the inside of the equalizing cavity is in the negative pressure state, the pick-and-place head can place and mount the adsorbed elements on the PCB substrate when the inside of the equalizing cavity is in the high pressure state, the opening and closing states of the plurality of pick-and-place pipes are controlled by the separately arranged electromagnetic valves, the single adsorption and the multiple synchronous adsorption can be realized, and the working efficiency is high.

[0017] In addition, an inner cavity is formed in the inside of the pick-and-place head, the inner cavity is communicated with the pick-and-place pipe through a plurality of air holes, and when the pick-and-place pipe generates gas suction or gas delivery, the inner cavity in the inside of the pick-and-place head generates uniform air pressure effect, so that the pick-and-place head end port can generate uniform adsorption effect, the pick-and-place head can stably adsorb the element, the adsorption stability of the pick-and-place head is improved, the stability during patching is improved, the production quality of the PCB substrate patching is ensured, and the practicability is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A three-dimensional structure diagram of the SMT patching machine high-speed pick-and-place head structure is provided for the utility model Figure One ;

[0019] Figure 2 A three-dimensional structure diagram of the SMT patching machine high-speed pick-and-place head structure is provided for the utility model Figure Two ;

[0020] Figure 3 A three-dimensional structure diagram of the SMT patching machine high-speed pick-and-place head structure is provided for the utility model Figure One ;

[0021] Figure 4 A three-dimensional structure diagram of the SMT patching machine high-speed pick-and-place head structure is provided for the utility model Figure Two ;

[0022] Figure 5 A three-dimensional structure diagram of the SMT patching machine high-speed pick-and-place head structure is provided for the utility model Figure Three ;

[0023] Figure 6 A three-dimensional structure diagram of the SMT patching machine high-speed pick-and-place head structure is provided for the utility model Figure Four .

[0024] In the figure: 1, support; 2, controller; 3, transverse groove; 4, driving motor; 5, threaded rod; 6, SMT patching assembly; 61, pressure equalizing cavity; 62, air pump; 63, air pipe; 64, electric telescopic rod; 65, telescopic rod; 66, pick-and-place pipe; 67, electromagnetic valve; 68, pick-and-place head; 69, inner cavity; 610, air hole; 611, rubber pad; 7, horizontal plate; 8, element placing assembly; 81, placing groove; 82, blocking strip; 83, electronic element; 9, conveying belt; 10, PCB substrate; 11, sliding plate. DETAILED DESCRIPTION

[0025] The utility model will be further described below in combination with the drawings and embodiments.

[0026] REFERENCE Figures 1-6The utility model provides a kind of SMT pick-and-place head structure of high speed of patch machine: including support 1, support 1 upper side fixed installation has horizontal groove 3, horizontal groove 3 inside slide plate 11 is slidably arranged, and SMT patch assembly 6 is arranged in the lower of slide plate 11;SMT patch assembly 6 includes equalizing chamber 61, equalizing chamber 61 upper side fixed installation has air pump 62, air pump 62 output and equalizing chamber 61 inside are communicated, air pipe 63 is communicated and installed on the upper end of air pump 62, and the lower side of equalizing chamber 61 is communicated and installed with a plurality of pick-and-place tube 66, and electromagnetic valve 67 is fixedly installed on pick-and-place tube 66, and pick-and-place head 68 is fixedly installed on the lower end of pick-and-place tube 66, and the inside of pick-and-place head 68 is provided with inner cavity 69, and a plurality of air holes 610 are arranged between inner cavity 69 and the inside of pick-and-place tube 66.

[0027] By the above-mentioned manner, when the air pump 62 starts suction, the negative pressure is generated in the equalizing chamber 61, and the negative pressure is also generated in the pick-and-place tube 66 connected with the equalizing chamber 61, so that the negative pressure suction is generated at the lower side port of the pick-and-place head 68, and the component is adsorbed for adsorption work. When the air pump 62 starts to fill air into the equalizing chamber 61, the air is blown downward in the pick-and-place head 68, and the adsorbed component is placed and attached on the PCB substrate 10 for patch work.

[0028] In the present manner, the controller 2 is fixedly installed on the side wall of the support 1, and the drive motor 4 is fixedly installed on the side edge of the horizontal groove 3. The output end of the drive motor 4 is rotatably penetrated into the inside of the horizontal groove 3, and the threaded rod 5 is fixedly connected on the output end of the drive motor 4. The threaded rod 5 is screwed through the slide plate 11.

[0029] By the above-mentioned manner, when the drive motor 4 is started, the threaded rod 5 is driven to rotate, and the slide plate 11 is driven to slide in the horizontal groove 3 through the screw transmission, so as to drive the SMT patch assembly 6 installed below to reciprocate between the conveying belt 9 and the component placing assembly 8.

[0030] In the present manner, the electric telescopic rod 64 is fixedly installed between the equalizing chamber 61 and the slide plate 11, and the telescopic rod 65 is arranged on both sides of the electric telescopic rod 64. The telescopic rod 65 is fixedly installed between the slide plate 11 and the equalizing chamber 61.

[0031] By the above-mentioned manner, when the electric telescopic rod 64 is started, the pick-and-place head 68 can be driven to move downward to approach the placing groove 81 or to approach the upper side of the conveying belt 9. When approaching the placing groove 81, the electronic component 83 placed in the inside of the placing groove 81 is adsorbed. When approaching the PCB substrate 10 conveyed on the conveying belt 9, the patch work is carried out.

[0032] In the present manner, the rubber pad 611 is fixedly installed on the outer circle of the lower side port of the pick-and-place head 68.

[0033] Through the above manner, the rubber pad 611 improves the sealing performance of the pick-and-place head 68 when vacuum adsorbed, and improves the stability of adsorption.

[0034] In the present mode, the horizontal groove 3 is provided with a conveying belt 9, and the PCB substrate 10 is conveyed on the conveying belt 9.

[0035] Through the above manner, the conveying belt 9 is used to convey the PCB substrate 10, and the working state is controlled by the controller 2.

[0036] In the present mode, the bracket 1 is fixedly installed with a horizontal plate 7 on the right side, and the horizontal plate 7 is provided with an element placing assembly 8, the element placing assembly 8 includes a plurality of placing grooves 81, the placing grooves 81 are fixedly installed on the upper side of the horizontal plate 7, the placing grooves 81 are fixedly installed with a blocking strip 82 at the lower side port, the electronic elements 83 are placed in the inner side of the placing grooves 81, the placing grooves 81 are provided with a horizontal section and an inclined section, the horizontal section and the inclined section are smoothly connected with an arc section, and the plurality of placing grooves 81 correspond to the mounting positions of the plurality of pick-and-place heads 68.

[0037] Through the above manner, the placing grooves 81 are provided with a horizontal section and an inclined section, and when the electronic elements 83 are placed in the inner side of the placing grooves 81, the electronic elements 83 located in the inclined section have a sliding force, which pushes the electronic elements 83 of the horizontal section close to the blocking strip 82 at the port of the placing groove 81, has an automatic feeding effect, and the plurality of placing grooves 81 correspond to the mounting positions of the plurality of pick-and-place heads 68, so that when the plurality of pick-and-place heads 68 move to the upper side of the placing grooves 81, the plurality of pick-and-place heads 68 correspond to the electronic elements 83 placed on the plurality of placing grooves 81 one by one, and a plurality of immobile electronic elements 83 can be synchronously adsorbed.

[0038] The working principle of the SMT chip mounter high-speed pick-and-place head structure is as follows:

[0039] In use, the controller 2 controls the driving motor 4 to start, the driving slide plate 11 slides in the transverse groove 3, and the SMT patch assembly 6 below is driven to move to above the component placing assembly 8, the controller 2 controls the electric telescopic rod 64 to extend, and the equalizing cavity 61, the taking and placing pipe 66 and the taking and placing head 68 are driven to move downwards until the taking and placing head 68 is close to the electronic component 83 in the placing groove 81, the controller 2 starts the air pump 62, the air pump 62 starts to suck air, negative pressure is generated in the equalizing cavity 61, and the taking and placing head 68 port can uniformly adsorb the electronic component 83, according to the patch requirement, the controller 2 can control the electromagnetic valve 67 on the corresponding taking and placing pipe 66 to open, single taking and placing head 68 adsorbs the electronic component 83 or multiple taking and placing heads 68 synchronously adsorb the electronic component 83 is realized, after adsorption is completed, the controller 2 controls the electric telescopic rod 64 to contract, and the taking and placing head 68 and the adsorbed electronic component 83 are lifted to the initial position, the controller 2 controls the driving motor 4 again, the slide plate 11 drives the SMT patch assembly 6 to move to above the conveying belt 9, and the taking and placing head 68 is aligned with the patch position on the PCB substrate 10 on the conveying belt, the controller 2 controls the electric telescopic rod 64 to extend again, and the taking and placing head 68 is close to the PCB substrate 10, the controller 2 controls the air pump 62 to switch the working mode, and starts to fill air into the equalizing cavity 61, the high-pressure gas in the equalizing cavity 61 enters the inner cavity 69 of the taking and placing head 68 through the taking and placing pipe 66 and the air hole 610 and is blown out from the lower port of the taking and placing head 68, and the adsorbed electronic component 83 is lowered and is attached on the PCB substrate 10, after the patch is completed, the controller 2 controls the electric telescopic rod 64 to contract, and the taking and placing head 68 is lifted, at the same time, the conveying belt 9 moves forward by one patch spacing, and is prepared for the next patch operation.

[0040] The above only describes the embodiments of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent process conversion using the utility model specification and drawing contents, or direct or indirect application in other related technical fields, are all included in the patent protection range of the utility model.

Claims

1. A high-speed pick-and-place head structure for an SMT placement machine, characterized in that, Includes a bracket (1), a horizontal groove (3) is fixedly installed on the upper side of the bracket (1), a sliding plate (11) is slidably arranged inside the horizontal groove (3), and an SMT component (6) is arranged below the sliding plate (11); The SMT placement assembly (6) includes a pressure equalization chamber (61). An air pump (62) is fixedly installed on the upper side of the pressure equalization chamber (61). The output end of the air pump (62) is connected to the inside of the pressure equalization chamber (61). An air pipe (63) is connected to the upper end of the air pump (62). Several pick-and-place tubes (66) are connected to the lower side of the pressure equalization chamber (61). A solenoid valve (67) is fixedly installed on the pick-and-place tube (66). A pick-and-place head (68) is fixedly installed at the lower end of the pick-and-place tube (66). An inner cavity (69) is provided inside the pick-and-place head (68). Several air holes (610) are opened between the inner cavity (69) and the inner side of the pick-and-place tube (66).

2. The high-speed pick-and-place head structure for an SMT placement machine according to claim 1, characterized in that, An electric telescopic rod (64) is fixedly installed between the pressure equalization chamber (61) and the slide plate (11). Telescopic rods (65) are provided on both sides of the electric telescopic rod (64). The telescopic rods (65) are fixedly installed between the slide plate (11) and the pressure equalization chamber (61).

3. The high-speed pick-and-place head structure for an SMT placement machine according to claim 1, characterized in that, A rubber pad (611) is fixedly installed on the outer ring of the lower port of the pick-and-place head (68).

4. The high-speed pick-and-place head structure for an SMT placement machine according to claim 1, characterized in that, A conveyor belt (9) is placed under the transverse groove (3), and a PCB substrate (10) is conveyed on the conveyor belt (9).

5. The high-speed pick-and-place head structure for an SMT placement machine according to claim 1, characterized in that, A horizontal plate (7) is fixedly installed on the right side of the bracket (1). A component placement assembly (8) is provided on the horizontal plate (7). The component placement assembly (8) includes several placement slots (81). The placement slots (81) are fixedly installed on the upper side of the horizontal plate (7). A baffle (82) is fixedly installed at the lower port of the placement slot (81). Electronic components (83) are placed inside the placement slots (81).

6. The high-speed pick-and-place head structure for an SMT placement machine according to claim 5, characterized in that, The placement slot (81) is provided with a horizontal section and an inclined section, and an arc section is smoothly connected between the horizontal section and the inclined section. The placement slots (81) correspond to the installation positions of the pick-and-place heads (68).

7. The high-speed pick-and-place head structure for an SMT placement machine according to claim 1, characterized in that, A controller (2) is fixedly installed on the side wall of the bracket (1).

8. The high-speed pick-and-place head structure for an SMT placement machine according to claim 1, characterized in that, A drive motor (4) is fixedly installed on the side of the transverse groove (3). The output end of the drive motor (4) rotates through to the inside of the transverse groove (3), and a threaded rod (5) is fixedly connected to the output end of the drive motor (4). The threaded rod (5) is screwed through the slide plate (11).

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