LED packaging substrate and lamp bead

Abstract

The utility model provides an LED packaging substrate and a lamp bead, the LED packaging substrate comprises a substrate main body and a metal function layer arranged on a first side surface of the substrate main body, the metal function layer comprises a first bearing part used for bearing a control chip and a second bearing part used for bearing a light-emitting chip, and a switching part is arranged between the first bearing part and the second bearing part at an interval, so that the control chip and the light-emitting chip can be electrically connected through the switching part. Thus, the control chip and the light-emitting chip are electrically connected through the switching part, wire welding is smoother, parameter setting of a wire welding machine is more reasonable, the potential quality hazard of poor welding is not prone to being generated, and the product reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED product, in particular to an LED packaging substrate and a lamp bead. BACKGROUND

[0002] With the continuous development of LED technology, some LED products are provided with an IC chip, which regulates and controls multiple LED wafers. When the IC chip and the LED wafer are connected, the pads of the IC chip need to be wired to the pads of the LED wafer. Since the two chips are directly connected by electrodes, quality problems such as poor welding may occur, for example, the solder ball is too large, the tension is insufficient, the wire arc height is insufficient, etc., which leads to insufficient reliability of the material. In the subsequent long-term use, poor welding gradually occurs, resulting in fatal defects such as dead lamp failure. . CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides an LED packaging substrate and a lamp bead, which can improve the connection quality of the control chip and the light-emitting chip.

[0004] In order to achieve the above purpose, the present application provides the following technical solutions:

[0005] An LED packaging substrate comprises a substrate main body and a metal functional layer arranged on a first side surface of the substrate main body, the metal functional layer comprises a first bearing part for bearing a control chip and a second bearing part for bearing a light-emitting chip, a switching part is arranged between the first bearing part and the second bearing part, and the first bearing part and the second bearing part are arranged separately from the switching part, so that the control chip and the light-emitting chip can be electrically connected through the switching part.

[0006] Optionally, a plurality of switching parts are arranged, so that the control chip can be electrically connected to a plurality of light-emitting chips through the plurality of switching parts, respectively.

[0007] Optionally, the switching part is arranged as a metal pad, so that one of the pads on the control chip and one of the pads on the light-emitting chip can be connected to the same metal pad through a wire.

[0008] Optionally, the switching part is connected to the substrate main body through a connecting part, and the connecting part is embedded in the substrate main body.

[0009] Optionally, a reinforcing part is arranged on a second side surface of the substrate main body, and two ends of the connecting part are connected to the switching part and the reinforcing part, respectively, so as to limit the switching part and the reinforcing part on both sides of the substrate main body.

[0010] Optionally, a plurality of the connecting portions and the reinforcing portions are provided, the first ends of the plurality of the connecting portions are connected to the plurality of the adapter portions one by one, and the second ends of the plurality of the connecting portions are connected to the plurality of the reinforcing portions one by one.

[0011] Optionally, the reinforcing portion is an electroplated circuit layer and is electrically connected to the adapter portion through the connecting portion.

[0012] Optionally, the second side of the substrate body is provided with an insulating layer, and the insulating layer covers and wraps the electroplated circuit layer.

[0013] Optionally, the thickness of the adapter portion is 0.07-0.15 mm.

[0014] Optionally, the area of the adapter portion is 0.15-0.96 mm2.

[0015] A lamp bead comprising the LED packaging substrate according to any one of the above.

[0016] The LED packaging substrate and the lamp bead provided by the present application have the following advantages: the adapter portion is arranged on the first side of the substrate body and is arranged between the first bearing portion and the second bearing portion, so that the first bearing portion, the second bearing portion and the adapter portion are arranged spaced apart from each other, and the parts are arranged independently relative to each other, so that the internal structure is not easily connected in short circuit. When the control chip and the light emitting chip are connected, the pads of the control chip can be wire-bonded to the adapter portion, and the pads of the light emitting chip can be wire-bonded to the adapter portion, so that the electrical connection between the control chip and the light emitting chip is realized through the adapter portion, the wire-bonding is smoother, the parameter setting of the wire-bonding machine is more reasonable, and the quality risk of poor welding is not easily caused, which is beneficial to increasing the product reliability. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of the provided drawings.

[0018] Figure 1 A front view of an LED packaging substrate without a control chip and a light emitting chip for some embodiments;

[0019] Figure 2 A front view of an LED packaging substrate with a control chip and a light emitting chip for some embodiments;

[0020] Figure 3 A sectional view of an LED packaging substrate for a first embodiment;

[0021] Figure 4 A back view of the LED packaging substrate shown in the first embodiment;

[0022] Figure 5 A sectional view of the LED packaging substrate shown in the second embodiment;

[0023] Figure 6 A back view of the LED packaging substrate shown in the second embodiment.

[0024] In the figure: 1, substrate body; 2, metal functional layer; 21, first bearing part; 22, second bearing part; 3, adapter part; 4, connecting part; 5, reinforcing part; 6, insulating layer; 7, encapsulating glue; 8, control chip; 9, light-emitting chip; 10, identification layer; 11, extension part. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0026] As Figures 1-6 shown, the present embodiment provides an LED packaging substrate, which comprises a substrate body 1, a metal functional layer 2 and an adapter part 3. The metal functional layer 2 has a first bearing part 21 and a second bearing part 22. The first bearing part 21 is used to bear a control chip 8, which can be set as an IC chip. The second bearing part 22 is used to bear a light-emitting chip 9, which is set in a number of one or more, i.e. one light-emitting chip 9 can be set on one second bearing part 22, or multiple light-emitting chips 9 can be set on one second bearing part 22. The substrate body 1 has opposite first and second sides. The metal functional layer 2 is arranged on the first side of the substrate body 1. In packaging, the control chip 8 is packaged on the first bearing part 21, the light-emitting chip 9 is packaged on the second bearing part 22, and the encapsulating glue 7 is packaged on the first side of the substrate body 1, covering and wrapping the control chip 8 and the light-emitting chip 9. For example, the substrate body 1 is set as a BT board, and the first and second sides are the upper and lower sides in Figure 3 and Figure 5

[0027] ​It should be noted that the metal functional layer 2 includes a first conductive part and a second conductive part, which are arranged in a spaced manner and have opposite polarities, for example, the first conductive part and the second conductive part are arranged as positive and negative electrodes respectively, and are arranged on opposite sides of the first side of the substrate body 1. Preferably, the substrate body 1 is arranged in a square shape, and the first conductive part and the second conductive part are respectively located on both sides of the length direction or the width direction of the substrate body 1. The first bearing part 21 and the second bearing part 22 are both located between the first conductive part and the second conductive part, and the first conductive part and the second conductive part can conduct electricity for the control chip 8 and the light-emitting chip 9.

[0028] Specifically, the second side of the substrate body 1 is provided with an extension part 11, which is arranged symmetrically with the conductive part (i.e. the first conductive part and the second conductive part mentioned above) with respect to the substrate body 1, and the extension part 11 and the conductive part are electrically connected at the edge of the substrate body 1. In this way, by arranging the extension part 11, the structural strength and electrical conductivity of the metal functional layer 2 can be improved. Preferably, the extension part 11 and the metal functional layer 2 are made of the same metal material and are integrally formed.

[0029] The adapter 3 is arranged on the first side of the substrate body 1 and is arranged in a spaced manner between the first bearing part 21 and the second bearing part 22, so that the first bearing part 21, the second bearing part 22 and the adapter 3 are arranged in a spaced manner, and each part is arranged independently, which is not easy to cause internal structure connection short circuit. When the control chip 8 and the light-emitting chip 9 are connected, the pads of the control chip 8 can be wire-bonded to the adapter 3, and the pads of the light-emitting chip 9 can be wire-bonded to the adapter 3, and the electrical connection between the control chip 8 and the light-emitting chip 9 is realized through the adapter 3. The wire bonding is more smooth, the parameter setting of the wire bonding machine is more reasonable, and the quality risk of poor welding is not easy to occur, which is beneficial to increase the product reliability.

[0030] It should be noted that the height of the control chip 8 is different from the height of the light-emitting chip 9, for example, the control chip 8 is an IC chip, the height of the IC chip is more than 180 microns, the height of the light-emitting chip 9 is 150-180 microns when it is a four-element wafer, and the height of the light-emitting chip 9 is about 100 microns when it is a double-electrode wafer. From the pad of the IC chip to the pad of the light-emitting chip 9, the height is often insufficient to meet the standard, and the line arc mode specified in the industry, such as QA line arc, T line arc, M line arc, etc. In the present scheme, the adapter 3 is additionally arranged on the first side of the substrate body 1, and the connection area space is sufficient. Whether it is from the pad of the control chip 8 to the adapter 3 on the substrate body 1 or from the pad of the light-emitting chip 9 to the adapter 3 on the substrate body 1, both can realize the two-pad position ball forming process, enhance the internal structure connection strength of the lamp bead, and not easy to appear failure.

[0031] In specific solutions, the area of the adapter 3 is set to 0.15-0.96 square millimeters, for example, the length of the adapter 3 is set to 0.5-1.2 millimeters, the width of the adapter 3 is set to 0.3-0.8 millimeters, and the thickness of the adapter 3 is set to 0.07-0.15 millimeters, so as to facilitate the balling at the two-pad position, improve the tensile value of the wire, and further meet the various parameter requirements of the wire bonding process, such as the size of the two gold balls, the gold ball thrust, the wire tension, the wire arc height, the length, and the like.

[0032] As shown in Figures 1-2 The adapter 3 is provided with a plurality of, for example, two, three, or four, the number of adapters 3 is set according to the number of light-emitting chips 9, so that each light-emitting chip 9 can be electrically connected to the control chip 8 through the adapter 3. Here, the plurality of adapters 3 are arranged at intervals, and the arrangement direction of the plurality of adapters 3 is perpendicular to the arrangement direction of the control chip 8 and the light-emitting chip 9, so as to avoid mutual interference between the plurality of wires.

[0033] The adapter 3 is set as a single metal pad fixed on the first side of the substrate body 1. During packaging, the control chip 8 is arranged on the first bearing portion 21, and the light-emitting chip 9 is arranged on the second bearing portion 22. One of the pads on the control chip 8 and one of the pads on the light-emitting chip 9 are connected to the same metal pad through the wire, so that the control chip 8 and the light-emitting chip 9 are electrically connected through the adapter 3. In this way, the two wires from the control chip 8 and the light-emitting chip 9 are connected through the same metal pad, which is beneficial to simplify the processing technology and improve the connection reliability.

[0034] It can be understood that the adapter 3 is provided with a plurality of, that is, the above-mentioned independent metal pads are also provided with a plurality of, which are independently arranged between adjacent two metal pads. Each metal pad only connects the wire from the control chip 8 and the wire from the light-emitting chip 9, which can increase the size of the metal pad to some extent, and further improve the reliability and stability of the wire connection.

[0035] In some embodiments, the adapter 3 is connected to the substrate body 1 through the connecting portion 4, wherein the connecting portion 4 is embedded in the inside of the substrate body 1. Through the embedded connection of the connecting portion 4 relative to the substrate body 1, the stability of the connection of the adapter 3 on the substrate body 1 can be improved, and the adapter 3 can be prevented from being separated from the substrate body 1. For example, the size of the end of the connecting portion 4 away from the adapter 3 is greater than the size of the end close to the adapter 3, and then the connecting portion 4 is clamped in the substrate body 1.

[0036] The reinforcing portion 5 is arranged on the second side of the substrate body 1, and the two ends of the connecting portion 4 are connected to the adapter portion 3 and the reinforcing portion 5 respectively. Through the connecting effect of the connecting portion 4, the adapter portion 3 and the reinforcing portion 5 are limited on both sides of the substrate body 1, the connection strength between the adapter portion 3 and the substrate body 1 is further enhanced, and the adapter portion 3 is not easy to separate from the substrate body 1.

[0037] In specific solutions, the substrate body 1 is provided with a through hole penetrating through the first side and the second side, the sizes of the adapter portion 3 and the reinforcing portion 5 are greater than the size of the through hole, and the connecting portion 4 is arranged in the through hole. Through the connecting effect of the connecting portion 4, the adapter portion 3 and the reinforcing portion 5 are limited at the two port positions of the through hole.

[0038] As shown in Figure 3 The adapter portion 3 is provided with a plurality of adapter portions 3, the connecting portion 4 is provided with a plurality of connecting portions 4, and the reinforcing portion 5 is provided with a plurality of reinforcing portions 5. The first ends of the plurality of adapter portions 3 are one-to-one connected and fixed with the plurality of connecting portions 4, and the second ends of the plurality of adapter portions 3 are one-to-one connected and fixed with the plurality of reinforcing portions 5. In this way, the plurality of reinforcing portions 5 can reinforce the plurality of adapter portions 3 respectively, so as to avoid interference between the plurality of adapter portions 3. In other solutions, the reinforcing portion 5 can be provided with one reinforcing portion 5, and the reinforcing portion 5 is made of insulating material. The plurality of connecting portions 4 are connected to the same reinforcing portion 5. In this way, the plurality of connecting portions 4 and the plurality of adapter portions 3 are reinforced by the one reinforcing portion 5, so as to simplify the processing technology and improve the stability and consistency of the connection of the plurality of adapter portions 3.

[0039] In order to simplify the processing technology, the reinforcing portion 5 is provided as a plated circuit layer, and the connecting portion 4 is provided as a conductive material, so that the plated circuit layer is electrically connected to the adapter portion 3 through the connecting portion 4. During processing, a through hole is punched from the first side to the second side of the substrate body 1 to form a through hole. A layer of metal is plated in the through hole to fill the hole, so as to form the connecting portion 4. The substrate body 1 is plated with metal on both sides to cover the through hole. Finally, the substrate body 1 is polished on both sides to form the adapter portion 3 and the plated circuit layer. In this way, the adapter portion 3 is processed by the plating process, which is mature, stable and low in cost. Moreover, the adapter portion 3 and the reinforcing portion 5 on both sides of the substrate body 1 are connected through the connecting portion 4, the adapter portion 3 has high degree of integration with the substrate body 1, and is not easy to fall off.

[0040] The insulating layer 6 is arranged on the second side of the substrate body 1. The insulating layer 6 can be made of ink material, such as green paint. The insulating layer 6 covers and wraps the plated circuit layer, so as to avoid the plated circuit layer exposed on the second side of the substrate body 1, avoid short circuit between the plated circuit layer and other structures, and improve the structural reliability.

[0041] In some embodiments, the second side of the substrate body 1 is provided with an identification layer 10, which can be provided in the shape of an arrow or a triangle. The identification layer 10 can be used to identify the positive and negative electrodes on the substrate body 1, thereby improving the efficiency and accuracy of subsequent processing. Here, the identification layer 10 can be provided in the form of ink, such as green paint.

[0042] The embodiment of the present application provides a lamp bead comprising the LED packaging substrate in the above embodiment. In this way, when the control chip 8 and the light emitting chip 9 are connected, the pads of the control chip 8 can be wire-bonded to the adapter 3, and the pads of the light emitting chip 9 can be wire-bonded to the adapter 3, so that the electrical connection between the control chip 8 and the light emitting chip 9 is realized through the adapter 3. The wire bonding is smoother, the parameter setting of the wire bonding machine is more reasonable, and the quality risk of poor welding is less likely to occur, thereby being beneficial to increasing the product reliability.

[0043] The basic principle of the present application is described above in combination with specific embodiments, but it should be pointed out that the advantages, advantages, effects and the like mentioned in the present application are only examples and are not limited, and these advantages, advantages, effects and the like cannot be considered as the must-have of each embodiment of the present application. In addition, the above-mentioned specific details are only for the purpose of example and for the purpose of understanding, and are not limited to the above-mentioned specific details, and the present application is not limited to the above-mentioned specific details.

[0044] The block diagrams of the devices, apparatuses, equipment, systems involved in the present application are only illustrative examples and are not intended to require or imply that the connection, arrangement, configuration must be as shown in the block diagram. As those skilled in the art will recognize, these devices, apparatuses, equipment, systems can be connected, arranged, configured in any manner. Words such as "include", "contain", "have" and the like are open-ended words, which mean "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0045] It should also be noted that in the devices, apparatuses and methods of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombination should be considered as equivalent solutions of the present application.

[0046] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0047] It should be understood that the limiting words "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiments description of the present application are only used for more clearly describing the technical solutions, and cannot be used to limit the protection scope of the present application.

[0048] The above description has been presented for the purpose of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the forms disclosed herein. Although several example aspects and embodiments have been discussed above, those of ordinary skill in the art will appreciate a variety of modifications, alternatives, permutations, additions, and sub-combinations of the described aspects and embodiments.

Claims

1. An LED packaging substrate, characterized in that, The substrate includes a substrate body (1) and a metal functional layer (2) disposed on a first side of the substrate body (1). The metal functional layer (2) includes a first support portion (21) for supporting a control chip (8) and a second support portion (22) for supporting a light-emitting chip (9). A connecting portion (3) is disposed between the first support portion (21) and the second support portion (22). The first support portion (21) and the second support portion (22) are both spaced apart from the connecting portion (3) so that the control chip (8) and the light-emitting chip (9) can be electrically connected through the connecting portion (3).

2. The LED packaging substrate according to claim 1, characterized in that, The adapter (3) is provided in multiple ways so that the control chip (8) can be electrically connected to the multiple light-emitting chips (9) through the multiple adapters (3).

3. The LED packaging substrate according to claim 1, characterized in that, The adapter is configured as a metal pad so that one of the pads on the control chip (8) and one of the pads on the light-emitting chip (9) can be connected to the same metal pad via bonding wires.

4. The LED packaging substrate according to claim 1, characterized in that, The adapter (3) is connected to the substrate body (1) via the connecting part (4), and the connecting part (4) is embedded in the substrate body (1).

5. The LED packaging substrate according to claim 4, characterized in that, A reinforcing part (5) is provided on the second side of the substrate body (1). The two ends of the connecting part (4) are respectively connected to the adapter part (3) and the reinforcing part (5) to limit the adapter part (3) and the reinforcing part (5) on both sides of the substrate body (1).

6. The LED packaging substrate according to claim 5, characterized in that, Both the connecting part (4) and the reinforcing part (5) are provided in multiple ways. The first end of the multiple connecting parts (4) is connected one-to-one with the multiple adapter parts (3), and the second end of the multiple connecting parts (4) is connected one-to-one with the multiple reinforcing parts (5).

7. The LED packaging substrate according to claim 5, characterized in that, The reinforcing part (5) is an electroplated circuit layer and is electrically connected to the adapter part (3) through the connecting part (4).

8. The LED packaging substrate according to claim 7, characterized in that, An insulating layer (6) is provided on the second side of the substrate body (1), and the insulating layer (6) covers and wraps the electroplated circuit layer.

9. The LED packaging substrate according to claim 1, characterized in that, The thickness of the adapter (3) is set to 0.07-0.15 mm.

10. The LED packaging substrate according to claim 1, characterized in that, The area of ​​the adapter (3) is set to 0.15-0.96 square millimeters.

11. A type of LED bead, characterized in that, It includes the LED packaging substrate as described in any one of claims 1-10.

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