Chip packaging cover plate
By introducing a porous metal structure and cooling channels into the chip packaging cover, combined with coolant, the heat dissipation problem of the chip packaging cover is solved, achieving efficient thermal management and chip stability protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-03-20
AI Technical Summary
The limited thermal conductivity of existing chip packaging cover materials leads to increased diffusion thermal resistance when heat flux density increases, and uneven temperature distribution causes wafer damage or deformation, affecting the stability of components and systems.
It adopts a porous metal structure heat dissipation layer and heat dissipation fin design, combined with cooling channels and coolant, to achieve efficient heat transfer and dissipation through the inlet and outlet. It uses pure water or fluorinated liquid as coolant to enhance the heat dissipation effect.
It effectively reduces chip temperature, improves heat dissipation efficiency, enhances chip protection and mechanical support, and ensures system stability.
Smart Images
Figure CN224022243U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip cover plate technical field, especially chip's packaging cover plate. BACKGROUND
[0002] Chip packaging cover plate as the connecting medium of wafer and other devices, not only can protect wafer, reduce the influence of external environment to chip, and can provide good mechanical support, electrical connection and heat dissipation path, plays the decisive role to improve the performance of chip, processing technology and service life. Common chip packaging cover plate is generally single or composite metal material, limited to the thermal conductivity of material itself, the continuous enhancement of chip unit heat flux density will lead to the increase of diffusion thermal resistance, and the thermal stress or thermal deformation produced by uneven temperature distribution will cause the damage, deformation or fracture of wafer, influence the stability of component and system. SUMMARY
[0003] According to the utility model embodiment, provide a kind of packaging cover plate of chip, comprising: chip, shell and heat dissipation mechanism;
[0004] Cooling flow channel is opened in the shell, the heat dissipation mechanism is located in the shell, and is located below cooling flow channel, the both ends of the shell are equipped with liquid inlet and liquid outlet respectively, cooling liquid is circulated in the cooling flow channel, the lower portion of the shell is equipped with back-shaped mounting foot, the chip is located below the shell, and is located in the middle of mounting foot, the shell is integrally formed structure.
[0005] Further, the heat dissipation mechanism is a heat dissipation layer, the heat dissipation layer is laid below the cooling flow channel, and the heat dissipation layer is a porous metal structure.
[0006] Further, the porous metal structure is sintered.
[0007] Further, the heat dissipation mechanism is a heat dissipation fin, and the heat dissipation fins are uniformly arranged below the cooling flow channel.
[0008] Further, the cooling liquid is pure water or fluorinated liquid or glycol solution.
[0009] Further, the wall thickness of the contact surface between the shell and the chip is 0.2mm-0.3mm.
[0010] Further, the lower portion of the shell is equipped with a circuit board, the mounting foot is installed on the circuit board using mechanical installation, glue adhesion or welding method, the lower portion of the chip is equipped with a mounting pin, and the mounting pin is connected with the circuit board.
[0011] According to an embodiment of this utility model, a chip packaging cover is provided. The chip is mounted below a housing, which is mounted using mounting feet. Heat generated during chip use is transferred to the outer wall of the housing in contact with the chip. Coolant is introduced into the cooling channels through an inlet, and a heat dissipation mechanism improves the heat transfer efficiency of the coolant, thereby reducing the chip temperature. The integrated design of the housing ensures strong protection for the chip while improving heat dissipation efficiency, thus enhancing the chip's cooling effect.
[0012] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description
[0013] Fig. 1 This is a structural diagram of a chip packaging cover according to an embodiment of the present utility model;
[0014] Fig. 2 This is a structural diagram of a chip packaging cover according to an embodiment of the present utility model.
[0015] The attached diagram is labeled as follows: 1 for chip, 11 for mounting pin, 2 for housing, 21 for cooling channel, 22 for liquid inlet, 23 for liquid outlet, 24 for mounting base, 3 for heat dissipation layer, 4 for heat dissipation fins, and 5 for circuit board. Detailed Implementation
[0016] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.
[0017] like Figs. 1-2 As shown, a chip 1 packaging cover plate according to an embodiment of the present utility model includes: chip 1, housing 2 and heat dissipation mechanism;
[0018] The housing 2 has a cooling channel 21 inside, and the heat dissipation mechanism is located inside the housing 2 and below the cooling channel 21. The housing 2 has an inlet 22 and an outlet 23 at both ends, and coolant flows through the cooling channel 21. The housing 2 has a U-shaped mounting foot 24 at the bottom, and the chip 1 is located at the bottom of the housing 2 and in the middle of the mounting foot 24. The housing 2 is an integrally formed structure.
[0019] The application installs the chip 1 below the shell 2 which is installed by the installing bottom foot 24, the heat generated by the chip 1 during use is transferred to the outer wall of the shell 2 which is in contact with the chip 1, the cooling liquid is introduced into the cooling flow channel 21 through the liquid inlet 22, the heat transfer efficiency of the cooling liquid is improved through the heat dissipation mechanism, so as to reduce the temperature of the chip 1. Through the integrated design of the shell 2, the heat dissipation efficiency is improved while the protection strength of the shell to the chip 1 is ensured, and the heat dissipation effect of the chip 1 is improved.
[0020] As shown in Fig. 1 , the heat dissipation mechanism is a heat dissipation layer 3 which is laid below the cooling flow channel 21, and the heat dissipation layer 3 is a porous metal structure. The porous metal structure is sintered.
[0021] The heat dissipation layer 3 is a porous metal structure sintered or a metal powder block sintered, which has certain air permeability, so that the cooling liquid can diffuse into the heat dissipation layer 3 by capillary action.
[0022] As shown in Fig. 2 , the heat dissipation mechanism is a heat dissipation fin 4 which is uniformly arranged below the cooling flow channel 21. The cooling liquid is pure water or fluorinated liquid or glycol solution.
[0023] The heat dissipation fin 4 is arranged on the inner wall of the bottom of the shell 2, the heat generated by the chip 1 can be transferred to the heat dissipation fin 4, the heat dissipation fin 4 is cooled by the cooling liquid, the contact area of the cooling liquid is increased, and the cooling effect is improved.
[0024] As shown in Figs. 1-2 , the wall thickness of the contact surface between the shell 2 and the chip 1 is 0.2mm-0.3mm. The thickness of the heat dissipation mechanism is not less than one fifth of the height of the cooling flow channel 21.
[0025] The wall thickness of the contact surface between the shell 2 and the chip 1 is 0.2mm-0.3mm, which can improve the heat dissipation efficiency while ensuring the protection strength of the shell to the chip 1. The thickness of the heat dissipation mechanism is not less than one fifth of the height of the cooling flow channel 21, which ensures the flow speed and cooling efficiency of the cooling liquid.
[0026] As shown in Figs. 1-2 , the shell 2 below is provided with a circuit board 5, the installing bottom foot 24 is installed on the circuit board 5 by mechanical installation, glue bonding or welding method, the lower side of the chip 1 is provided with an installing pin 11, and the installing pin 11 is connected with the circuit board 5.
[0027] The mounting foot 24 in the embodiment can be mounted by screw connection, by conductive glue or glass glue adhesion, or by welding, as long as it can be mounted and fixed to the circuit board 5.
[0028] The above, with reference to Figs. 1-2 The packaging cover plate of the chip 1 according to the embodiment of the present application is described above, the chip 1 is mounted below the shell 2, the shell 2 is mounted by the mounting foot 24, the heat generated during use of the chip 1 is transferred to the outer wall of the shell 2 in contact with the chip 1, the cooling liquid is introduced into the cooling flow channel 21 through the liquid inlet 22, and the heat transfer efficiency of the cooling liquid is improved through the heat dissipation mechanism, so as to reduce the temperature of the chip 1. Through the integrated design of the shell 2, the heat dissipation efficiency is improved while the protection strength of the shell to the chip 1 is ensured, and the heat dissipation effect of the chip 1 is improved.
[0029] It should be noted that in the present specification, the terms "comprising", "including", or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or include elements inherent to such processes, methods, articles or devices. Without more limitations, the elements defined by the statement "comprising" do not exclude the presence of other identical elements in the processes, methods, articles or devices including the elements.
[0030] Although the content of the present application has been described in detail by the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present application. After reading the above content, various modifications and alternatives of the present application will be obvious to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.
Claims
1. A chip packaging cover, characterized in that, include: Chip, housing, and heat dissipation mechanism; The housing has a cooling channel, the heat dissipation mechanism is located inside the housing and below the cooling channel, the housing has an inlet and an outlet at both ends, coolant flows in the cooling channel, the housing has a U-shaped mounting foot at the bottom, the chip is located at the bottom of the housing and in the middle of the mounting foot, and the housing is a one-piece molded structure.
2. The chip packaging cover as described in claim 1, characterized in that, The heat dissipation mechanism is a heat dissipation layer, which is laid below the cooling channel and has a porous metal structure.
3. The chip packaging cover as described in claim 2, characterized in that, The porous metal structure is formed by sintering.
4. The chip packaging cover as described in claim 1, characterized in that, The heat dissipation mechanism is heat dissipation fins, which are evenly arranged below the cooling channel.
5. The chip packaging cover as described in claim 1, characterized in that, The coolant is pure water, fluorinated liquid, or ethylene glycol solution.
6. The chip packaging cover as described in claim 1, characterized in that, The wall thickness of the contact surface between the shell and the chip is 0.2mm~0.3mm.
7. The chip packaging cover as described in claim 1, characterized in that, A circuit board is located below the housing. The mounting feet are mounted on the circuit board using mechanical mounting, adhesive bonding, or welding methods. Mounting pins are located below the chip and are connected to the circuit board.