Glue sealing equipment for chip dispensing processing
By introducing a placement slot, lifting drive assembly, cleaning frame, and dust collection device into the encapsulation equipment, the problem of difficult cleaning of impurities and dust on the chip surface in the prior art is solved, achieving efficient chip cleaning and encapsulation results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2026-03-24
AI Technical Summary
Existing encapsulation equipment cannot effectively remove impurities and dust from the chip surface, affecting the encapsulation effect.
A chip dispensing encapsulation device was designed, comprising a placement tank, a lifting drive assembly, a cleaning frame, and a dust collection device. The lifting drive assembly drives the lower pressure block to move downward, the cleaning frame and cleaning roller clean the chip surface, and the dust collection device removes the dust.
It achieves efficient cleaning of the chip surface, ensuring that the chip surface is free of impurities before encapsulation, thus improving the encapsulation effect and quality.
Smart Images
Figure CN224025562U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of glue sealing equipment, especially relates to a glue sealing equipment for chip dispensing processing. BACKGROUND
[0002] Chip, also known as microcircuit, microchip, integrated circuit. It refers to the silicon chip containing integrated circuits, which is very small and often part of a computer or other electronic devices. Dispensing is a process, also known as glue application, glue coating, glue filling, glue dripping, etc. It is to apply, fill or drop electronic glue, oil or other liquids to the product, so that the product can play the role of sticking, filling, insulation, fixing and surface smoothing. The chip needs to be sealed after dispensing.
[0003] In the prior art, the chip surface needs to be ensured free of impurities and dust before sealing. However, the current glue sealing device does not have the above function. UTILITY MODEL CONTENT
[0004] The utility model aims at solving the problems in the prior art and provides a glue sealing equipment for chip dispensing processing.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A glue sealing equipment for chip dispensing processing, comprising a base, the base is provided with a mounting frame, the mounting frame is provided with a glue sealing assembly, and the base is provided with a placing seat;
[0007] The placing seat is provided with a placing groove, and the two sides of the placing seat are provided with a lower pressing block through a lifting drive assembly, and one side of the lower pressing block is provided with a cleaning assembly;
[0008] The cleaning assembly comprises a cleaning frame, a plurality of cleaning rollers and a dust collection device, the cleaning frame is rotatably arranged on one side of the lower pressing block through a rotating shaft, one side of the cleaning frame is provided with a plurality of grooves, a plurality of cleaning rollers are rotatably arranged in the corresponding grooves, the dust collection device is arranged on the lifting drive assembly, one end of the cleaning frame is provided with a plurality of dust suction ports, and the input end of the dust collection device is communicated with the plurality of dust suction ports.
[0009] Preferably, the lifting drive assembly comprises an electric sliding rail and a lifting plate, the electric sliding rail is arranged on one side of the placing seat, the lifting plate is arranged on the electric sliding rail, the dust collection device is arranged above the lifting plate, and the lower pressing block is arranged below the lifting plate.
[0010] Preferably, the outer periphery of the cleaning roller is provided with cleaning cotton.
[0011] Preferably, one side of the cleaning frame is provided with a limiting groove matched with the lower pressing block.
[0012] Preferably, both sides of the placing groove are open.
[0013] Preferably, one side of the cleaning frame is provided with a rubber pad.
[0014] Preferably, the glue sealing assembly comprises a cross slide, a lifting driving device and a glue sealing device body, the cross slide is arranged on a mounting frame, the lifting driving device is arranged at a driving end of the cross slide, and the glue sealing device body is arranged at a driving end of the lifting driving device.
[0015] Preferably, the bottom end of the inner side of the cleaning frame is arc-shaped.
[0016] Compared with the prior art, the chip point gluing processing glue sealing equipment has the beneficial effects that:
[0017] The chip can be placed into the placing groove, one of the lower pressing blocks is driven to move downward to press and hold the chip, the other lower pressing block is driven to move, the cleaning frame is driven to move downward, the cleaning roller is driven to move along the chip to clean the chip, the dust is sucked by the dust suction device, and compared with the prior art, the device can clean the chip during the movement of the lower pressing block, and the use effect is excellent. BRIEF DESCRIPTION OF DRAWINGS
[0018] Fig. 1 A three-dimensional schematic view of the chip point gluing processing glue sealing equipment is provided.
[0019] Fig. 2 A cleaning frame schematic view of the chip point gluing processing glue sealing equipment is provided.
[0020] Fig. 3 A cleaning frame bottom schematic view of the chip point gluing processing glue sealing equipment is provided.
[0021] In the figure: 1, base; 2, mounting frame; 3, placing seat; 4, placing groove; 5, lower pressing block; 6, cleaning frame; 7, cleaning roller; 8, dust suction device; 9, groove; 10, dust suction port; 11, electric sliding rail; 12, lifting plate; 13, limiting groove; 14, rubber pad; 15, cross slide; 16, lifting driving device; 17, glue sealing device body. DETAILED DESCRIPTION
[0022] Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, obviously, the described embodiment is only a part of the embodiment of the utility model, and is not all the embodiment.
[0023] Referring to Figs. 1 to 3 A kind of chip dispensing processing is glued with glue sealing equipment, including base 1, installation frame 2 is provided on the base 1, glue sealing assembly is provided on the installation frame 2, placing seat 3 is provided on the base 1;
[0024] The placing seat 3 is provided with placing groove 4, and the two sides of the placing seat 3 are both installed with lower pressing block 5 by lifting drive component, and one side of one of the lower pressing block 5 is provided with cleaning assembly;
[0025] The cleaning assembly includes cleaning frame 6, a plurality of cleaning rollers 7 and dust suction device 8, the cleaning frame 6 is rotatably arranged on the side of lower pressing block 5 by pivot, the side of the cleaning frame 6 is provided with a plurality of grooves 9, a plurality of the cleaning rollers 7 are rotatably arranged in corresponding grooves 9, the dust suction device 8 is arranged on lifting drive component, one end of the cleaning frame 6 is provided with a plurality of dust suction ports 10, the input end of the dust suction device 8 is communicated with a plurality of dust suction ports 10, and the cleaning roller 7 and the groove 9 are both arranged on the bottom surface of the cleaning frame 6.
[0026] When the device is used, the chip can be placed into the placing groove 4, then one of the lower pressing block 5 is driven to move downward to press and hold the chip by the lifting drive component, and the other lower pressing block 5 is driven to move, so that the cleaning frame 6 can be driven to move downward, the cleaning roller 7 is driven to move along the chip by the cleaning frame 6, the chip is cleaned, the dust is sucked by the dust suction device 8 arranged, compared with the prior art, the cleaning frame 6 and the cleaning roller 7 arranged in the device can clean the chip during the movement of the lower pressing block 5, and then the chip is glued by the glue sealing assembly.
[0027] The dust suction device 8 is a device capable of generating negative pressure such as a dust collector or an air extractor, which is communicated with the dust suction port 10 through a pipeline to suck the dust on the chip, and the device is a prior art and will not be described in detail.
[0028] Further, the lifting drive component includes electric sliding rail 11 and lifting plate 12, the electric sliding rail 11 is arranged on the side of the placing seat 3, the lifting plate 12 is arranged on the electric sliding rail 11, the dust suction device 8 is arranged above the lifting plate 12, and the lower pressing block 5 is arranged below the lifting plate 12, the lifting plate 12 can be driven to move up and down by the electric sliding rail 11 arranged, the lower pressing block 5 on the lifting plate 12 is driven to move, so as to realize the clamping of the chip, and prevent the chip from deviating during gluing.
[0029] Further, the outer periphery of the cleaning roller 7 is provided with cleaning cotton, which can extend to difficult-to-clean positions and increase cleanliness.
[0030] Further, one side of the cleaning frame 6 is provided with a limiting groove 13, which is matched with the pressing block 5, and after the cleaning of the cleaning frame 6 is completed, the limiting groove 13 can be matched with another pressing block 5 to prevent the cleaning frame 6 from affecting the sealing.
[0031] Further, the two sides of the placing groove 4 are open, which can realize a flow line type feeding.
[0032] Further, one side of the cleaning frame 6 is provided with a rubber pad 14, which can be in contact with the chip after the cleaning of the cleaning frame 6 is completed, so as to prevent the cleaning frame 6 from damaging the chip.
[0033] Further, the sealing assembly comprises a cross slide 15, a lifting driving device 16 and a sealing device body 17, the cross slide 15 is arranged on the mounting frame 2, the lifting driving device 16 is arranged on the driving end of the cross slide 15, and the sealing device body 17 is arranged on the driving end of the lifting driving device 16, the cross slide 15 can drive the sealing device body 17 to move to different positions, and the lifting driving device 16 can move the sealing device body 17 to different heights, so as to be applicable to chips of different sizes.
[0034] Further, the bottom end of the inner side of the cleaning frame 6 is arc-shaped, which can guide the cleaning frame 6 during the downward movement of the cleaning frame 6, so that the cleaning frame 6 can clean the surface of the chip.
[0035] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A glue sealing device for chip dispensing processing, comprising a base (1), characterized in that: The base (1) is provided with a mounting rack (2), the mounting rack (2) is provided with a sealing glue assembly, and the base (1) is provided with a placing seat (3); The placing seat (3) is provided with a placing groove (4), and the placing seat (3) is provided with a pressing block (5) on both sides through a lifting driving assembly; one side of the pressing block (5) is provided with a cleaning assembly; The cleaning assembly comprises a cleaning frame (6), a plurality of cleaning rollers (7) and a dust collection device (8), the cleaning frame (6) is rotatably arranged on one side of the pressing block (5) through a rotating shaft, one side of the cleaning frame (6) is provided with a plurality of grooves (9), a plurality of cleaning rollers (7) are rotatably arranged in the corresponding grooves (9), the dust collection device (8) is arranged on the lifting driving assembly, one end of the cleaning frame (6) is provided with a plurality of dust suction ports (10), and the input end of the dust collection device (8) is in communication with the plurality of dust suction ports (10).
2. The encapsulation equipment for chip dispensing processing according to claim 1, characterized in that: The lifting driving assembly comprises an electric sliding rail (11) and a lifting plate (12), the electric sliding rail (11) is arranged on one side of the placing seat (3), the lifting plate (12) is arranged on the electric sliding rail (11), the dust collection device (8) is arranged above the lifting plate (12), and the pressing block (5) is arranged below the lifting plate (12).
3. The encapsulation equipment for chip dispensing processing according to claim 1, characterized in that: The outer periphery of the cleaning roller (7) is provided with cleaning cotton.
4. The encapsulation device for chip dispensing processing according to claim 1, characterized in that: One side of the cleaning frame (6) is provided with a limiting groove (13), and the limiting groove (13) is matched with the pressing block (5).
5. The encapsulation device for chip dispensing processing according to claim 1, characterized in that: Both sides of the placing groove (4) are open.
6. The encapsulation device for chip dispensing processing according to claim 1, characterized in that: One side of the cleaning frame (6) is provided with a rubber pad (14).
7. The encapsulation device for chip dispensing processing according to claim 1, characterized in that: The sealing glue assembly comprises a cross sliding table (15), a lifting driving device (16) and a sealing glue device body (17), the cross sliding table (15) is arranged on the mounting rack (2), the lifting driving device (16) is arranged at the driving end of the cross sliding table (15), and the sealing glue device body (17) is arranged at the driving end of the lifting driving device (16).
8. The encapsulation apparatus for chip dispensing processing according to claim 1, characterized in that: The bottom end of the inner side of the cleaning frame (6) is in a circular arc shape.