Semiconductor wafer surface polishing device

Abstract

The utility model relates to the technical field of semiconductor wafer polishing, in particular to a semiconductor wafer surface polishing device which comprises a polishing assembly, a bearing assembly, a lifting assembly and a driving assembly. A mounting hole is formed in the bearing assembly, a workbench used for bearing a semiconductor wafer is fixedly connected into the mounting hole, the bearing assembly comprises a supporting table, two clamping mechanisms are mounted at the top of the supporting table, and the two clamping mechanisms are arranged on the two sides of the workbench respectively to clamp the semiconductor wafer; the lifting assembly comprises a fixing plate and two external threaded rods which are in threaded connection in the fixing plate and are opposite in rotation direction. According to the device, the lifting assembly drives the bearing assembly to move, then the height of the clamping mechanism is adjusted to adapt to semiconductor wafers with different thicknesses, the clamping blocks are prevented from protruding out of the tops of the semiconductor wafers in the clamping process, and the polishing wheel can evenly polish the tops of the semiconductor wafers.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer polishing, more particularly to a semiconductor wafer surface polishing device. BACKGROUND

[0002] The semiconductor wafer polishing machine is a mechanical production equipment for realizing atomic-level flatness of the semiconductor wafer surface, which combines the effects of chemical corrosion and mechanical grinding, and performs precision polishing treatment on the wafer surface through polishing liquid and polishing pad.

[0003] In the prior art with the publication number CN220994033U, a wafer polishing device for semiconductor is disclosed. In the device, a support plate is installed on the top of the base, a threaded rod is spirally installed in the support plate, and a fixed clamping plate is installed on the end of the threaded rod. The semiconductor wafer is clamped by the fixed clamping plate. However, since the installation position of the fixed clamping plate is fixed, when the thickness of the semiconductor wafer is less than the height of the fixed clamping plate, the top of the fixed clamping plate protrudes from the top of the semiconductor wafer. During the polishing process, the movement of the polishing wheel is limited, which causes uneven polishing of the top of the semiconductor wafer. SUMMARY

[0004] The utility model provides a semiconductor wafer surface polishing device, through to the height of clamping mechanism adjustment, to adapt to the semiconductor wafer of not thickness, avoid in the clamping process clamping piece protruding from the top of the semiconductor wafer, so that the polishing wheel can uniformly polish the top of the semiconductor wafer.

[0005] The utility model provides a semiconductor wafer surface polishing device, including polishing assembly, bearing assembly, lifting assembly and drive assembly.

[0006] The polishing assembly includes a polishing machine, and the polishing machine body is provided with a mounting hole.

[0007] The bearing assembly includes a support table, and two sets of clamping mechanisms are installed on the top of the support table.

[0008] The lifting assembly includes a fixed plate and two external threaded rods with opposite rotation directions which are screw-connected in the fixed plate.

[0009] The drive assembly is used to drive the two drive shafts to rotate in opposite directions.

[0010] Preferably, the polishing machine bottom four corners are fixedly connected with supporting legs, and the polishing machine opening is hingedly connected with two symmetrical opening and closing doors.

[0011] Preferably, the polishing machine inner wall is provided with a polishing wheel above the workbench.

[0012] Preferably, the clamping mechanism comprises an arc plate fixedly installed on the top of the support table, a plurality of air cylinders fixedly installed on the inner wall of the support table at equal intervals, and clamping blocks fixedly connected to the output ends of the air cylinders.

[0013] Preferably, a plurality of air holes are formed in the top of the support table, a dust collector is fixedly connected to the outer wall of the polishing machine, and the air suction end of the dust collector extends into the polishing machine.

[0014] Preferably, the drive assembly comprises a worm, the worm is rotatably connected to the inside of the polishing machine, and the end of the worm extends to the outside of the polishing machine.

[0015] Preferably, the outer end of the worm is fixedly connected with a rotating wheel, and the outer wall of the rotating wheel is rotatably connected with a handle.

[0016] Preferably, the drive assembly further comprises two worm gears, the two worm gears are fixedly installed on the corresponding drive shafts, and the worm is engaged with the two worm gears.

[0017] Through the above technical scheme, the beneficial effects of the polishing machine are as follows:

[0018] 1. The lifting assembly drives the bearing assembly to move, thereby adjusting the height of the clamping mechanism to adapt to semiconductor wafers of different thicknesses, avoiding the protrusion of the clamping blocks from the top of the semiconductor wafers during clamping, and enabling the polishing wheel to uniformly polish the top of the semiconductor wafers.

[0019] 2. The cooperation of the worm gears and the worm has self-locking characteristics, and compared with the electric lifting mechanism, the position can be kept stable when power is off, preventing accidental displacement. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the local structure of the polishing machine of the utility model;

[0022] Figure 3 It is a schematic diagram of the internal structure of the polishing machine of the utility model;

[0023] Figure 4 It is a schematic diagram of the installation structure of the clamping block of the utility model;

[0024] Figure 5The partial disassembly structure schematic view of the utility model.

[0025] In the figure: 1, polishing machine; 2, support foot; 3, box door; 4, polishing wheel; 5, mounting hole; 6, workbench; 7, fixed plate; 8, support table; 9, air hole; 10, arc plate; 11, air cylinder; 12, clamping block; 13, worm; 14, rotating wheel; 15, handle; 16, drive shaft; 17, worm wheel; 18, cross plate; 19, external thread rod; 20, cross slot; 21, dust collector. DETAILED DESCRIPTION

[0026] Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without making creative labor belong to the scope of the utility model protection, in the utility model, unless there is explicit provision and limitation, the term "fixed connection" should be broadly understood, for example, "fixed connection" can be fixed installation, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected. For the ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0027] As Figures 1-3 And Figure 5 As shown in a kind of semiconductor wafer surface polishing device, including polishing assembly, bearing assembly, lifting assembly and drive assembly, polishing assembly includes polishing machine 1, polishing machine 1 body is provided with mounting hole 5, mounting hole 5 is fixedly connected with the workbench 6 for bearing semiconductor wafer in, bearing assembly includes support table 8, support table 8 top is equipped with two sets of clamping mechanism, two sets of clamping mechanism are respectively arranged on the both sides of workbench 6 and form clamping to semiconductor wafer, lifting assembly includes fixed plate 7 and two external thread rods 19 of opposite rotation that are screw-connected in fixed plate 7, external thread rod 19 top is rotationally connected with support table 8, external thread rod 19 bottom is provided with cross slot 20, cross slot 20 inner wall is slidably connected with cross plate 18, cross plate 18 bottom is fixedly connected with drive shaft 16, drive shaft 16 is rotationally connected with the inner wall of polishing machine 1, drive assembly is used to drive two drive shafts 16 to rotate in opposite directions respectively.

[0028] Through reverse thread design, support table 8 synchronous lifting is realized, compared with traditional single screw adjustment, precision is improved.

[0029] In prior art, the installation position of fixed clamping plate is fixed, when the thickness of semiconductor wafer is less than the height of fixed clamping plate, at this time, fixed clamping plate top protrudes from the top of semiconductor wafer, in the polishing process, it leads to polishing wheel 4 movement limitation, in turn makes the top of semiconductor wafer unevenly polished;

[0030] In the device, the carrier assembly is driven by the lifting assembly to move, and then the height of the clamping mechanism is adjusted to adapt to semiconductor wafers of different thicknesses, so that the polishing wheel 4 can uniformly polish the top of the semiconductor wafer.

[0031] As shown in Figure 1 and Figure 2 , the bottom of the polishing machine 1 is fixedly connected with four supporting legs 2, and the opening of the polishing machine 1 is hingedly connected with two symmetrical opening and closing doors 3. The inner wall of the polishing machine 1 is provided with a polishing wheel 4, and the polishing wheel 4 is located above the workbench 6.

[0032] As shown in Figure 4 , the clamping mechanism includes an arc plate 10, which is fixedly installed on the top of the support 8. A plurality of air cylinders 11 are fixedly installed on the inner wall of the support 8 at equal intervals, and the output ends of the air cylinders 11 are fixedly connected with clamping blocks 12. The multi-point mode can avoid excessive stress concentration.

[0033] As shown in Figure 2 and Figure 4 , a plurality of air holes 9 are formed in the top of the support 8, and a dust collector 21 is fixedly connected to the outer wall of the polishing machine 1, and the suction end of the dust collector 21 extends into the polishing machine 1.

[0034] The air holes 9 are provided, and the dust collector 21 can facilitate dust removal, and the semiconductor wafer can be cooled at the same time.

[0035] As shown in Figure 4 , the driving assembly includes a worm 13, the worm 13 is rotatably connected inside the polishing machine 1, the worm 13 extends to the outside of the polishing machine 1 through the polishing machine 1, the outer end of the worm 13 is fixedly connected with a rotating wheel 14, and the outer wall of the rotating wheel 14 is rotatably connected with a handle 15.

[0036] As shown in Figure 4 , the driving assembly further comprises two worm gears 17, and the two worm gears 17 are fixedly installed on the corresponding drive shafts 16, and the worm 13 is engaged with the two worm gears 17.

[0037] The cooperation of the worm gears 17 and the worm 13 has self-locking characteristics. Compared with the electric lifting mechanism, the position can be kept stable when power off, and accidental displacement is prevented.

[0038] Working principle: the semiconductor wafer is placed on the top of the workbench 6, according to the thickness of the semiconductor wafer, the rotating wheel 14 is driven to rotate by holding the handle 15, the worm 13 is driven to rotate by the rotating wheel 14, the two worm gears 17 are driven to rotate by the worm 13, the driving shaft 16 is driven to rotate by the worm gears 17, the cross plate 18 is driven to rotate by the driving shaft 16, the outer threaded rod 19 is driven to rotate by the cross plate 18, the two outer threaded rods 19 are respectively moved upwards or downwards along the fixed plate 7, the support platform 8 is moved by the outer threaded rod 19, the arc plate 10 is moved by the support platform 8, the clamping block 12 is moved by the arc plate 10, so that the height of the clamping block 12 is adjusted to adapt to the semiconductor wafer of different thicknesses;

[0039] The clamping block 12 is moved by the air cylinder 11, the semiconductor wafer is clamped and fixed by the clamping block 12, and the top of the semiconductor wafer is polished by the polishing wheel 4 on the polishing machine 1.

[0040] During the polishing process, the dust collector 21 generates suction through the air hole 9, so that the dust generated during the polishing process is cleaned.

[0041] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art within the technical range disclosed by the present application, according to the technical scheme and the utility model concept of the present application, is equivalent to replace or change, should be covered in the protection scope of the present application.

Claims

1. A semiconductor wafer surface polishing apparatus, characterized in that, Include: The polishing assembly includes a polishing machine (1), the polishing machine (1) body is provided with mounting hole (5), mounting hole (5) is fixedly connected with workbench (6) for bearing semiconductor wafer; The bearing assembly includes a support table (8), two sets of clamping mechanisms are installed on the top of the support table (8), and the two sets of clamping mechanisms are respectively arranged on both sides of the workbench (6) to clamp the semiconductor wafer; The lifting assembly includes a fixed plate (7) and two outer threaded rods (19) with opposite rotation directions which are threadedly connected in the fixed plate (7), the top of the outer threaded rod (19) is rotatably connected with the support table (8), the bottom of the outer threaded rod (19) is provided with a cross slot (20), the inner wall of the cross slot (20) is slidably connected with a cross plate (18), the bottom of the cross plate (18) is fixedly connected with a drive shaft (16), and the drive shaft (16) is rotatably connected with the inner wall of the polishing machine (1); The driving assembly is used to drive two drive shafts (16) to rotate in opposite directions.

2. The semiconductor wafer surface polishing apparatus according to claim 1, wherein: The bottom of the polishing machine (1) is fixedly connected with four supporting legs (2), and the opening of the polishing machine (1) is hingedly connected with two symmetrical box doors (3).

3. The semiconductor wafer surface polishing apparatus of claim 2, wherein: The inner wall of the polishing machine (1) is provided with a polishing wheel (4), and the polishing wheel (4) is located above the workbench (6).

4. The semiconductor wafer surface polishing apparatus of claim 3, wherein: The clamping mechanism includes an arc plate (10), the arc plate (10) is fixedly installed on the top of the support table (8), a plurality of air cylinders (11) are fixedly installed on the inner wall of the support table (8) at equal intervals, and the output end of each air cylinder (11) is fixedly connected with a clamping block (12).

5. The semiconductor wafer surface polishing apparatus of claim 4, wherein: A plurality of air holes (9) are formed in the top of the support table (8), a dust collector (21) is fixedly connected to the outer wall of the polishing machine (1), and the suction end of the dust collector (21) extends into the polishing machine (1).

6. The semiconductor wafer surface polishing apparatus of claim 5, wherein: The driving assembly includes a worm (13), the worm (13) is rotatably connected inside the polishing machine (1), and the end of the worm (13) extends to the outside of the polishing machine (1).

7. The semiconductor wafer surface polishing apparatus of claim 6, wherein: The outer end of the worm (13) is fixedly connected with a rotating wheel (14), and the outer wall of the rotating wheel (14) is rotatably connected with a handle (15).

8. The semiconductor wafer surface polishing apparatus of claim 7, wherein: The driving assembly further includes two worm gears (17), and the two worm gears (17) are respectively fixedly installed on the corresponding drive shafts (16), and the worm (13) is engaged with the two worm gears (17).

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