Wafer positioning ring structure

Abstract

A wafer positioning ring structure comprises a grinding ring, an assembling ring and a positioning unit. The positioning unit comprises a plurality of first positioning parts which are arranged on one of the grinding ring and the assembling ring at intervals, and a plurality of second positioning parts which are arranged on the other one of the grinding ring and the assembling ring at intervals. And the second positioning parts can be movably combined with the first positioning parts respectively. Through the design, the assembling ring can be positioned on the top side of the grinding ring only by operating the assembling ring to enable the first positioning parts to be combined with the second positioning parts respectively, and the assembling efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a positioning ring structure, especially a wafer positioning ring structure for positioning wafer to carry out chemical mechanical grinding process. BACKGROUND

[0002] Referring to Figure 1 、 2 , 3, the known wafer positioning ring structure includes a grinding ring 1, a connecting ring 2 superimposed on the grinding ring 1, and a plurality of screws 3 fixed on the bottom of the connecting ring 2. The grinding ring 1 has a plurality of combination holes 11 arranged at intervals along the circumference and corresponding to the screws 3 respectively. Each combination hole 11 has a through hole part 12, and a limiting hole part 13 extending along the circumferential direction of the grinding ring 1 and communicating with the through hole part 12. Each screw 3 has a body part 31 fixed on the connecting ring 2 by screwing, and a head part 32 extending downward from the body part 31 and having a width greater than that of the body part 31.

[0003] When the connecting ring 2 is to be fixed on the grinding ring 1, the screws 3 are first fixed on the connecting ring 2 by screwing, and then the screws 3 are aligned with the combination holes 11 respectively. The head part 32 of each screw 3 can pass through the through hole part 12 of the corresponding combination hole 11 downward, and the connecting ring 2 is rotated to move the head part 32 of each screw 3 into the limiting hole part 13 of the combination hole 11. At this time, the head part 32 of each screw 3 is stopped by the corresponding limiting hole part 13 and cannot be pulled out upward, and the installation of the known wafer positioning ring structure is completed. However, the above installation method needs to sequentially screw the screws 3 on the connecting ring 2 and align the screws 3 with the combination holes 11 respectively, which is quite troublesome and time-consuming. SUMMARY

[0004] The utility model aims at providing a wafer positioning ring structure which can improve at least one disadvantage of the prior art.

[0005] The wafer positioning ring structure of the utility model comprises a grinding ring, a connecting ring, and a positioning unit.

[0006] The positioning unit comprises a plurality of first positioning parts arranged at intervals on one of the grinding ring and the connecting ring, and a plurality of second positioning parts arranged at intervals on the other of the grinding ring and the connecting ring. The second positioning parts can be combined with the first positioning parts respectively and can be separated from the first positioning parts, so as to position the connecting ring on the top side of the grinding ring.

[0007] The wafer positioning ring structure of the utility model comprises a grinding ring, a connecting ring, and a positioning unit. Each first positioning part is a clamping block, and each second positioning part is a slot.

[0008] The wafer positioning ring structure of the utility model, the grinding ring includes the grinding inner ring surface and the grinding outer ring surface which are opposite inside and outside, every first positioning part is integrally formed with the grinding ring and protrudes outward from the grinding outer ring surface, the assembly ring includes the assembly inner ring surface and the assembly outer ring surface which are opposite inside and outside, every second positioning part is recessed in the assembly inner ring surface.

[0009] The wafer positioning ring structure of the utility model, the grinding ring includes the grinding inner ring surface and the grinding outer ring surface which are opposite inside and outside, the grinding outer ring surface has a plurality of clamping groove parts for clamping and installing the first positioning part respectively, the assembly ring includes the assembly inner ring surface and the assembly outer ring surface which are opposite inside and outside, every second positioning part is recessed in the assembly inner ring surface.

[0010] The wafer positioning ring structure of the utility model, the assembly ring further includes the assembly ring bottom surface which is connected with the assembly inner ring surface and the assembly outer ring surface and faces downward, every second positioning part has the sliding groove part recessed in the assembly inner ring surface along the circumferential direction of the assembly ring and the embedding part which is connected with the sliding groove part and penetrates through the assembly ring bottom surface downward.

[0011] The wafer positioning ring structure of the utility model, the grinding ring includes the grinding inner ring surface and the grinding outer ring surface which are opposite inside and outside, every second positioning part is recessed in the grinding outer ring surface, the assembly ring includes the assembly inner ring surface and the assembly outer ring surface which are opposite inside and outside, every first positioning part is integrally formed with the assembly ring and protrudes away from the assembly inner ring surface and the assembly outer ring surface.

[0012] The wafer positioning ring structure of the utility model, the grinding ring includes the grinding inner ring surface and the grinding outer ring surface which are opposite inside and outside, every second positioning part is recessed in the grinding outer ring surface, the assembly ring includes the assembly inner ring surface and the assembly outer ring surface which are opposite inside and outside, the assembly inner ring surface has a plurality of clamping groove parts for clamping and installing the first positioning part respectively.

[0013] The wafer positioning ring structure of the utility model, the grinding ring further includes the grinding ring top surface which is connected with the grinding inner ring surface and the grinding outer ring surface and faces upward, every second positioning part has the sliding groove part recessed in the grinding outer ring surface along the circumferential direction of the grinding ring and the embedding part which is connected with the sliding groove part and penetrates through the grinding ring top surface upward.

[0014] The wafer positioning ring structure of the utility model, every sliding groove part has the sliding area which is connected with the embedding part and can slide the corresponding first positioning part and the positioning area which is connected with the sliding area and is away from the embedding part and can limit the corresponding first positioning part.

[0015] The first positioning part of each first positioning part is in a semicircular shape.

[0016] The utility model discloses beneficial effect lies in: through the first positioning part interval setting in one of the grinding ring with the group joint ring, and the second positioning part interval setting in the other of the grinding ring with the group joint ring and can respectively with the first positioning part can remove the design of combination, as long as operating the group joint ring makes the first positioning part respectively combine in the second positioning part, can make the group joint ring position on the grinding ring, help to promote the assembly efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] The other features and effects of the utility model will be clearly presented in the embodiments with reference to the drawings, wherein:

[0018] Figure 1 is the exploded view of the known wafer positioning ring structure;

[0019] Figure 2 is the partial enlarged view of Figure 1 ;

[0020] Figure 3 is the incomplete side view section view, illustrates the positioning situation of the known wafer positioning ring structure;

[0021] Figure 4 is the perspective view, illustrates the first embodiment of wafer positioning ring structure of the utility model;

[0022] Figure 5 is the view similar to Figure 4 , but viewed from another angle;

[0023] Figure 6 is the exploded view, illustrates the first embodiment;

[0024] Figure 7 is the incomplete perspective view, illustrates one second positioning part of the first embodiment;

[0025] Figure 8 is the incomplete perspective view, illustrates one first positioning part of the first embodiment;

[0026] Figure 9 is the incomplete overhead section view flow chart, illustrates the sliding positioning situation of one first positioning part of the first embodiment in corresponding second positioning part;

[0027] Figure 10 is the incomplete side view section view, illustrates the situation that the group joint ring of the first embodiment is positioned in the grinding ring;

[0028] Figure 11 is an incomplete perspective view illustrating a second embodiment of the wafer positioning ring structure of the present application, and illustrating one of the first positioning portions;

[0029] Figure 12 is an incomplete top view illustrating a sliding positioning of one of the first positioning portions of the second embodiment in the corresponding second positioning portion;

[0030] Figure 13 is an exploded perspective view illustrating a third embodiment of the wafer positioning ring structure of the present application;

[0031] Figure 14 is an incomplete perspective view illustrating one of the second positioning portions of the third embodiment;

[0032] Figure 15 is an incomplete perspective view illustrating one of the first positioning portions of the third embodiment;

[0033] Figure 16 is an incomplete top view illustrating a sliding positioning of one of the first positioning portions of the third embodiment in the corresponding second positioning portion;

[0034] Figure 17 is an incomplete side view illustrating the set ring of the third embodiment positioned in the polishing ring;

[0035] Figure 18 is an incomplete perspective view illustrating a fourth embodiment of the wafer positioning ring structure of the present application, and illustrating one of the first positioning portions. DETAILED DESCRIPTION

[0036] Before the present application is described in detail, it is to be understood that like components are denoted by like numerals in the drawings.

[0037] Referring to Figure 4 , 5 , 6, a first embodiment of the wafer positioning ring structure of the present application is adapted to be installed in a polishing head body, and is used for positioning a wafer for chemical-mechanical polishing (CMP) process. The wafer positioning ring structure comprises a polishing ring 4, a set ring 5, and a positioning unit 6.

[0038] Referring to Figure 6 , 8,10, the grinding ring 4 is used for positioning the wafer and is annular, and comprises a grinding inner annular surface 41 and a grinding outer annular surface 42 opposite to each other, a grinding ring top surface 43 upwardly connecting the grinding inner annular surface 41 and the grinding outer annular surface 42, and a grinding ring bottom surface 44 downwardly connecting the grinding inner annular surface 41 and the grinding outer annular surface 42.

[0039] The grinding outer annular surface 42 has a first joint surface portion 421 extending downwardly from the grinding ring top surface 43, a first horizontal surface portion 422 extending radially outwardly from an end of the first joint surface portion 421, and a first exposed surface portion 423 extending downwardly from an end of the first horizontal surface portion 422 and connecting the grinding ring bottom surface 44.

[0040] Referring to Figure 6 , 7 ,10, the assembly ring 5 is annular, and comprises an assembly inner annular surface 51 and an assembly outer annular surface 52 opposite to each other, an assembly ring bottom surface 53 connecting the assembly inner annular surface 51 and the assembly outer annular surface 52 and facing the first horizontal surface portion 422, and an assembly ring top surface 54 upwardly connecting the assembly inner annular surface 51 and the assembly outer annular surface 52.

[0041] The assembly inner annular surface 51 has a second extension surface portion 511 extending downwardly from the assembly ring top surface 54, a second horizontal surface portion 512 extending radially outwardly from an end of the second extension surface portion 511 and facing the grinding ring top surface 43, and a second joint surface portion 513 extending downwardly from an end of the second horizontal surface portion 512 and connecting the assembly ring bottom surface 53. The second joint surface portion 513 faces the first joint surface portion 421.

[0042] The positioning unit 6 comprises a plurality of first positioning portions 61 arranged at equal angles along a circumferential direction of the grinding ring 4 on the grinding ring 4, and a plurality of second positioning portions 62 arranged at equal angles along a circumferential direction of the assembly ring 5 on the assembly ring 5.

[0043] Referring to Figure 8 Each of the first positioning portions 61 is a clamping block, protrudes radially outwardly from the first joint surface portion 421 of the grinding outer annular surface 42 and has a semicircular cross section, and each of the first positioning portions 61 is integrally formed with the grinding ring 4.

[0044] Each of the second positioning portions 62 is a slot and is recessed in the second joint surface portion 513 of the joint inner annular surface 51. Each of the second positioning portions 62 is integrally formed with the joint ring 5 and has a sliding groove portion 63 recessed in the second joint surface portion 513 in a direction along a circumference of the joint ring 5 and having an arc-shaped cross section, and a slot portion 64 communicating with the sliding groove portion 63 and extending downwardly through the joint ring bottom surface 53 and having a semicircular cross section.

[0045] Each of the sliding groove portions 63 has a sliding region 631 communicating with the slot portion 64 and allowing the corresponding first positioning portion 61 to slide, and a positioning region 632 communicating with the sliding region 631 and away from the slot portion 64 and allowing the corresponding first positioning portion 61 to be positioned.

[0046] It should be noted that the polishing ring 4 and the first positioning portion 61 are integrally formed and are made of engineering plastics, such as but not limited to polyphenylene sulfide (PPS), polyether ether ketone (PEEK), etc. The joint ring 5 is made of metal materials, such as but not limited to stainless steel, etc.

[0047] Referring to Figure 6 , 9 , 10, when assembling the wafer positioning ring structure of the present application, the portion of the joint ring bottom surface 53 adjacent to the joint inner annular surface 51 is first abutted on the first positioning portion 61. Then, the joint ring 5 is slightly rotated and slightly pushed downward, and when the second positioning portion 62 is driven to be respectively located above the first positioning portion 61, each of the first positioning portions 61 can be moved upwardly into the corresponding sliding groove portion 63 of the joint ring 5 through the corresponding slot portion 64. That is, even if the second positioning portion 62 is not accurately aligned with the first positioning portion 61, after the joint ring 5 is slightly rotated, the first positioning portion 61 can be easily respectively entered into the second positioning portion 62. At this time, the joint ring 5 is stacked on the top side of the polishing ring 4.

[0048] Further, the joint ring 5 is rotated along the rotation direction D in Figure 9 , each of the first positioning portions 61 is relatively moved into the positioning region 632 from the sliding region 631 of the corresponding sliding groove portion 63. At this time, each of the first positioning portions 61 is combined and positioned with the corresponding second positioning portion 62, so that the joint ring 5 is positioned on the top side of the polishing ring 4.

[0049] It is worth mentioning that, since the cross-section of each of the first positioning parts 61 is semi-circular, when each of the first positioning parts 61 slides in the corresponding second positioning part 62, it helps to reduce the friction generated during the sliding, making the operation of rotating the assembly ring 5 smoother.

[0050] See Figure 11 , 12 The second embodiment of the wafer positioning ring structure of this utility model is substantially the same as the first embodiment, except that the grinding ring 4 and the first positioning part 61 are not integrally formed. For ease of explanation, the following will only describe the differences between the embodiments.

[0051] The polished outer annular surface 42 also has several recessed slots 424 at equal angles along the periphery of the first mating surface 421. Each of the first positioning portions 61 has an arc-shaped mounting section 611 and a semi-circular retaining section 612 that tapers from the mounting section 611 along its arcuate extension direction and protrudes laterally outward. The mounting sections 611 engage with the slots 424. The retaining sections 612 are respectively used to engage with the corresponding second positioning portions 62.

[0052] When assembling the wafer positioning ring structure of this utility model, the first positioning part 61 must first be engaged into the slot part 424 of the polishing outer ring surface 42, and then the assembly ring 5 is abutted against the polishing ring 4. Then, the assembly ring 5 can be positioned on the top side of the polishing ring 4 in the manner of the first embodiment, so further details are omitted.

[0053] See Figure 13 , 14 15. The third embodiment of the wafer positioning ring structure of this utility model is substantially the same as the first embodiment, except that the positions of the first positioning part 61 and the second positioning part 62 are different. For ease of explanation, the following description will only focus on the differences between the embodiments.

[0054] In this third embodiment, the first positioning part 61 is disposed at equal angular intervals along the periphery of the assembly ring 5, and the second positioning part 62 is disposed at equal angular intervals along the periphery of the grinding ring 4.

[0055] Each of the first positioning portions 61 extends radially inward from the second mating portion 513 of the inner annular surface 51 and has a semi-circular cross-section. Each of the first positioning portions 61 is integrally formed with the assembly ring 5.

[0056] Each of the second positioning portions 62 is recessed in the first joint surface portion 421 of the grinding outer ring surface 42, and is integrally formed with the grinding ring 4, and has a sliding groove portion 63 recessed in the first joint surface portion 421 along the circumferential direction of the grinding ring 4, and a socket portion 64 communicating with the sliding groove portion 63 and penetrating upwardly through the grinding ring top surface 43 and being semicircular in cross section.

[0057] It should be noted that in the third embodiment, the grinding ring 4 is made of engineering plastic, such as but not limited to polyphenylene sulfide (PPS), polyether ether ketone (PEEK), etc. The set ring 5 and the first positioning portion 61 are integrally formed, and are both made of metal material, such as but not limited to stainless steel, etc.

[0058] Referring to Figure 13 , 16 , 17, when assembling the wafer positioning ring structure of the utility model, the first positioning portion 61 is first abutted against the grinding ring top surface 43. Then, the set ring 5 is slightly turned and slightly pushed downward, and when the first positioning portion 61 is driven to be respectively located above the second positioning portion 62, each of the first positioning portions 61 can be moved downward into the corresponding sliding groove portion 63 relative to the grinding ring 4 through the corresponding socket portion 64.

[0059] Further, the set ring 5 is rotated along the rotation direction D in Figure 16 , and each of the first positioning portions 61 will be driven to move from the sliding area 631 of the corresponding sliding groove portion 63 into the positioning area 632. At this time, each of the first positioning portions 61 is combined and positioned with the corresponding second positioning portion 62, so that the set ring 5 is positioned on the top side of the grinding ring 4.

[0060] Referring to Figure 18 , the fourth embodiment of the wafer positioning ring structure of the utility model is substantially the same as the structure of the third embodiment, and the difference lies in that the set ring 5 and the first positioning portion 61 are not integrally formed. For the convenience of description, only the differences between the embodiments will be described below.

[0061] The set inner ring surface 51 also has a plurality of clamping groove portions 514 recessed in the second joint surface portion 513 at equal angles along the circumferential direction of the second joint surface portion 513. Each of the first positioning portions 61 has an installation segment 611 in an arc shape, and a clamping segment 612 in a semicircular shape and protruding outwardly transversely and decreasing from the installation segment 611 along the extension direction of the arc bending of the installation segment 611. The installation segment 611 is clamped into the clamping groove portion 514 respectively. The clamping segment 612 is used for clamping into the corresponding second positioning portion 62 respectively.

[0062] When assembling the wafer positioning ring structure of the utility model, the first positioning parts 61 are first clamped into the clamping groove parts 514 of the assembly inner ring surface 51 respectively, and then the assembly ring 5 is abutted against the grinding ring 4. Next, the assembly ring 5 can be positioned on the top side of the grinding ring 4 in the manner of the third embodiment, and thus no further description is given.

[0063] As described above, by the first positioning parts 61 being arranged at one of the grinding ring 4 and the assembly ring 5, the second positioning parts 62 being arranged at the other of the grinding ring 4 and the assembly ring 5 and being capable of being combined with the first positioning parts 61 respectively, and the first positioning parts 61 being combined with the second positioning parts 62 respectively, the assembly ring 5 can be positioned on the grinding ring 4 by operating the assembly ring 5, which helps to improve the assembly efficiency.

[0064] The above is only an embodiment of the utility model, and cannot limit the scope of the utility model. Any simple equivalent change and modification according to the claims and the description of the utility model still falls within the scope of the utility model.

Claims

1. A wafer positioning ring structure, comprising a polishing ring and an assembly ring, wherein: The wafer positioning ring structure further comprises a positioning unit, which includes a plurality of first positioning portions arranged at intervals on one of the polishing ring and the adapter ring, and a plurality of second positioning portions arranged at intervals on the other one of the polishing ring and the adapter ring, the second positioning portions being capable of being removably combined with the first positioning portions respectively, and capable of positioning the adapter ring on the top side of the polishing ring.

2. The wafer positioning ring structure of claim 1, wherein: Each of the first positioning portions is a clamping block, and each of the second positioning portions is a slot.

3. The wafer positioning ring structure of claim 2, wherein: The polishing ring includes a polishing inner annular surface and a polishing outer annular surface opposite to each other, each of the first positioning portions is integrally formed with the polishing ring and protrudes outward from the polishing outer annular surface, and the adapter ring includes an adapter inner annular surface and an adapter outer annular surface opposite to each other, each of the second positioning portions is recessed in the adapter inner annular surface.

4. The wafer positioning ring structure of claim 2, wherein: The polishing ring includes a polishing inner annular surface and a polishing outer annular surface opposite to each other, the polishing outer annular surface has a plurality of clamping groove portions for clamping installation of the first positioning portions respectively, and the adapter ring includes an adapter inner annular surface and an adapter outer annular surface opposite to each other, each of the second positioning portions is recessed in the adapter inner annular surface.

5. The wafer positioning ring structure according to claim 3 or 4, characterized in that: The adapter ring further includes an adapter ring bottom surface downwardly connecting the adapter inner annular surface and the adapter outer annular surface, each of the second positioning portions has a sliding groove portion recessed in the adapter inner annular surface and extending along the circumferential direction of the adapter ring, and a slot portion communicating with the sliding groove portion and penetrating downwardly through the adapter ring bottom surface.

6. The wafer positioning ring structure of claim 2, wherein: The polishing ring includes a polishing inner annular surface and a polishing outer annular surface opposite to each other, each of the second positioning portions is recessed in the polishing outer annular surface, and the adapter ring includes an adapter inner annular surface and an adapter outer annular surface opposite to each other, each of the first positioning portions is integrally formed with the adapter ring and protrudes away from the adapter outer annular surface from the adapter inner annular surface.

7. The wafer positioning ring structure of claim 2, wherein: The polishing ring includes a polishing inner annular surface and a polishing outer annular surface opposite to each other, each of the second positioning portions is recessed in the polishing outer annular surface, and the adapter ring includes an adapter inner annular surface and an adapter outer annular surface opposite to each other, the adapter inner annular surface has a plurality of clamping groove portions for clamping installation of the first positioning portions respectively.

8. The wafer positioning ring structure of claim 6 or 7, wherein: The polishing ring further includes a polishing ring top surface upwardly connecting the polishing inner annular surface and the polishing outer annular surface, each of the second positioning portions has a sliding groove portion recessed in the polishing outer annular surface and extending along the circumferential direction of the polishing ring, and a slot portion communicating with the sliding groove portion and penetrating upwardly through the polishing ring top surface.

9. The wafer positioning ring structure of claim 5, wherein: Each of the sliding groove portions has a sliding region communicating with the slot portion and capable of sliding of the corresponding first positioning portion, and a positioning region communicating with the sliding region and away from the slot portion and capable of limiting of the corresponding first positioning portion.

10. The wafer positioning ring structure of claim 2, wherein: The cross section of each of the first positioning portions is semicircular.

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