Wafer box bottom parallelism detection device of ion implanter

Abstract

The utility model discloses a wafer cassette bottom parallelism detection device of an ion implanter in the technical field of semiconductor manufacturing equipment, which comprises a bottom plate and a middle base plate which are detachably connected in a covering manner, and a plurality of square grooves with wire grooves are formed in one surface, close to the middle base plate, of the bottom plate. A plurality of square grooves are formed in the bottom plate and located in the positions, close to the corners, of the surface of the bottom plate, a sensor support is fixedly installed in each square groove of the bottom plate, a pressure sensor is fixedly installed in each sensor support, the pressure sensors are electrically connected with a PLC control system through circuits, and the circuits are embedded in the wire grooves. A middle cushion block and a plurality of circumferential cushion blocks are installed on the face, away from the bottom plate, of the middle cushion plate, and a through groove corresponding to the square groove is formed in the surface of the middle cushion plate. According to the utility model, the real-time monitoring of the placing state of the wafer box is realized through the cooperative work of multiple sensors, the deviation direction is quickly positioned, and the process efficiency and the equipment operation stability are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a wafer box bottom parallelism detection device of ion implanter belongs to semiconductor manufacturing equipment technical field. BACKGROUND

[0002] Ion implantation refers to when a beam of ions is shot at a solid material in a vacuum, the beam of ions knocks atoms or molecules out of the surface of the solid material, this phenomenon is called sputtering, and when the beam of ions is shot at the solid material, it bounces back from the surface of the solid material, or penetrates through the solid material, these phenomena are called scattering, and another phenomenon is that after the beam of ions is shot at the solid material, the speed of the beam of ions is gradually reduced by the resistance of the solid material, and eventually stops in the solid material, this phenomenon is called ion implantation.

[0003] In the ion implantation process, the wafer box needs to be accurately placed on the equipment bottom plate to ensure the smoothness of the mechanical arm grabbing the wafer. In the prior art, when placing the wafer box manually, the box body and the bottom plate are not parallel due to operation errors, a certain direction is suspended, and then the mechanical arm is grabbed obliquely, which affects the process efficiency and wafer safety. The traditional solution relies on manual visual adjustment, which has the problems of low efficiency and poor precision. SUMMARY

[0004] The utility model aims at overcoming the insufficient in the prior art, provides a wafer box bottom parallelism detection device of ion implanter, through the cooperation of multiple sensors realizes the real-time monitoring of wafer box placement state, quickly locates deviation direction, improves process efficiency and equipment operation stability.

[0005] To achieve the above-mentioned purpose, the utility model is adopted The technical scheme is realized as follows:

[0006] Firstly, the utility model provides a wafer box bottom parallelism detection device of ion implanter, including the bottom plate and the intermediate pad plate of detachable cover connection, the side of the bottom plate close to the intermediate pad plate is equipped with a plurality of square grooves with line grooves, and the plurality of square grooves are located on the surface of the bottom plate close to the corner position, the sensor support is fixedly installed in each square groove of the bottom plate, and the pressure sensor is fixedly installed in each sensor support, the pressure sensor is electrically connected with the PLC control system through the line, and the line is buried in the line groove, the side of the intermediate pad plate away from the bottom plate is installed with the middle pad block and a plurality of circumferential pad blocks, the surface of the intermediate pad plate is equipped with the through groove corresponding to the square groove, when the bottom plate and the intermediate pad plate cover installation are completed, the pressure detection surface of the pressure sensor exposes along the through groove.

[0007] Further, the surface of the bottom plate and the intermediate pad plate is provided with a plurality of screw holes, the surface of the middle pad block and the circumferential pad block is provided with mounting holes, and the middle pad block and the circumferential pad block are installed on the screw holes on the surface of the bottom plate and the intermediate pad plate through the mounting holes.

[0008] Further, the surface of the middle pad block and the circumferential pad block is provided with a plurality of screw holes, the surface of the middle pad block and the circumferential pad block is provided with mounting holes, and the middle pad block and the circumferential pad block are installed on the screw holes on the surface of the bottom plate and the intermediate pad plate through the mounting holes.

[0009] Further, the PLC control system is located on the side of the bottom plate, and a plurality of wire grooves converge into a bus groove at one end away from the square groove and then extend to the side wall of the bottom plate.

[0010] Further, the number of the circumferential pad blocks is consistent with the number of the square grooves, and each circumferential pad block is arranged on one side of each square groove.

[0011] Further, the middle pad block and the circumferential pad block are made of non-rigid materials.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] The utility model discloses a wafer box bottom parallelism detection device of ion implanter, wherein sensor circuit adopts hidden design, wire groove is set up on the bottom plate, and sensor circuit is buried in the groove, and forms closed structure after covering intermediate pad plate, avoids that line is exposed and influences the appearance and security, and the wafer box positioning and detection are accurate, and four side edges of wafer box are contacted four pressure sensors after placing, if the pressure signal is not generated in some direction, then the place is in the air, triggers the alarm and prompts the operator to adjust, thereby can realize all -round monitoring, four sensors are distributed in the four corners of the bottom plate, realize that there is no dead angle detection in front and back and left and right, ensure that parallelism error can be accurately positioned. BRIEF DESCRIPTION OF DRAWINGS

[0014] The drawings accompanying the specification of this utility model form a part of the utility model and serve to provide further understanding of the utility model, and the illustrative embodiments of the utility model and the explanation thereof serve to explain the utility model, and do not constitute improper limitation on the utility model.

[0015] Figure 1 The structure principle view of the wafer box bottom parallelism detection device of ion implanter provided for the utility model embodiment is provided.

[0016] Figure 2 The bottom plate schematic view of the wafer box bottom parallelism detection device of ion implanter provided for the utility model embodiment is provided.

[0017] Figure 3 The wafer box placement schematic view of the wafer box bottom parallelism detection device of ion implanter provided for the utility model embodiment is provided.

[0018] In the diagram: 1. Base plate; 2. Intermediate pad; 3. Sensor bracket; 4. Pressure sensor; 5. Central pad; 6. Circumferential pad. Detailed Implementation

[0019] The present invention will now be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0020] The following detailed description is exemplary and intended to provide further detailed explanation of the present invention. Unless otherwise specified, all technical terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this invention.

[0021] Example:

[0022] Please see Figure 1 This embodiment provides a wafer cassette bottom parallelism detection device for an ion implanter, including a base plate 1, an intermediate pad 2, a sensor bracket 3, a pressure sensor 4, a central pad 5, and a circumferential pad 6. The base plate 1 has a wire groove to accommodate sensor wiring, and the surface is covered by the intermediate pad 2 to hide the wiring. The intermediate pad 2 is fixedly connected to the base plate 1. A square groove is opened on the surface of the base plate 1 to install the sensor bracket 3. The sensor bracket 3 is fixed in the square groove to support the pressure sensor 4. There are four pressure sensors 4, distributed at the four corners of the base plate 1, used to detect the pressure applied to each position of the wafer cassette. The central pad 5 and the circumferential pad 6 are used to limit the wafer cassette to ensure that its placement meets the requirements of the robotic arm's gripping.

[0023] The processing technology of this technical solution is as follows:

[0024] Base plate 1 processing: Cut wire grooves (2mm wide, 3mm deep) on the original base plate for arranging sensor circuits;

[0025] Sensor installation: Embed the four pressure sensors 4 into the square slots at the four corners of the base plate 1, and adjust them to the height that matches the side of the wafer box using the sensor bracket 3 (error ≤ 0.1mm);

[0026] Fixing the intermediate pad 2: Cover the base plate 1 with the intermediate pad 2 and tighten it with bolts to ensure that the wire trough is completely sealed;

[0027] Limiting block configuration: Install central pad 5 and circumferential pad 6 to limit the horizontal displacement range of the wafer cassette (±1mm);

[0028] System commissioning: connect pressure sensor 4 to PLC control system, set pressure threshold (e.g. > 5N), and calibrate alarm response sensitivity.

[0029] The device ensures the safety of the sensor line by opening a wire slot on the original base plate to accommodate the sensor line, avoiding affecting other components. A thin plate is added to the original base plate to cover the sensor line. Then, square slots are opened on the base plate and the middle plate to accommodate the sensor and the sensor bracket. The four slot positions are shown in Figure 2 The pressure sensor is placed in the slot and adjusted to the correct position. Several limit blocks are used to limit the position of the wafer box, which can meet the position requirements of the original mechanical arm and the position requirements of the wafer box on the sensor, so that the side edges of the wafer box are pressed on the positions of the four sensors. The position of the placed wafer box is detected by whether the pressure sensor can sense the pressure caused by the wafer box. If the placement position is incorrect, the sensor will send data to the PLC control system, and the PLC control system will issue an alarm through an alarm device. The corresponding sensor will alarm if there is a problem in any direction, realizing the capture of the wafer box placement position. Please refer to Figure 3 In actual use, the operator places the wafer box on the device, and adjusts the box position through the detection prompt of the sensor. After adjustment, the pressure values of each sensor are balanced, and the mechanical arm can smoothly grasp the wafer.

[0030] From the technical knowledge, the utility model can realize through other implementation solutions which do not deviate from its spiritual essence or necessary characteristics. Therefore, the above disclosed implementation solutions are just examples in all aspects, and are not the only ones. All changes within the scope of the utility model or within the scope equivalent to the utility model are included in the utility model.

[0031] Finally, it should be noted that: the above examples are used to illustrate the technical solutions of the utility model, but not to limit them. Although the utility model has been described in detail with reference to the above examples, those skilled in the art should understand that the specific implementation of the utility model can be modified or replaced, without deviating from the spirit and scope of the utility model. Any modification or equivalent replacement, which is not included in the protection scope of the claims of the utility model, should be covered in the protection scope of the claims of the utility model.

Claims

1. A device for detecting the parallelism of the wafer cell bottom in an ion implanter, characterized in that, The system includes a detachable cover-connected base plate (1) and an intermediate pad plate (2). The base plate (1) has multiple square grooves with wire grooves on the side near the intermediate pad plate (2), and the multiple square grooves are located near the corners of the surface of the base plate (1). A sensor bracket (3) is fixedly installed in each square groove of the base plate (1), and a pressure sensor (4) is fixedly installed in each sensor bracket (3). The pressure sensor (4) is electrically connected to the PLC control system through a wire, and the wire is buried in the wire groove. The intermediate pad plate (2) has a central pad block (5) and multiple circumferential pad blocks (6) installed on the side away from the base plate (1). The surface of the intermediate pad plate (2) has through grooves corresponding to the square grooves. When the base plate (1) and the intermediate pad plate (2) are closed and installed, the pressure detection surface of the pressure sensor (4) is exposed along the through groove.

2. The wafer cell bottom parallelism detection device for the ion implanter according to claim 1, characterized in that, The surfaces of the base plate (1) and the intermediate pad (2) are provided with a plurality of screw holes. The surfaces of the central pad (5) and the circumferential pad (6) are provided with mounting holes. The central pad (5) and the circumferential pad (6) are installed on the screw holes on the surfaces of the base plate (1) and the intermediate pad (2) by means of bolts passing through the mounting holes.

3. The wafer cell bottom parallelism detection device for the ion implanter according to claim 2, characterized in that, The number of mounting holes on the surface of each of the central pad (5) and circumferential pad (6) is two.

4. The wafer cell bottom parallelism detection device for the ion implanter according to claim 1, characterized in that, The PLC control system is located on the side of the base plate (1), and multiple wire slots converge into a bus slot at one end away from the square slot and extend to the side wall of the base plate (1).

5. The wafer cell bottom parallelism detection device for an ion implanter according to claim 1, characterized in that, The number of circumferential pads (6) is the same as the number of square grooves, and each circumferential pad (6) is respectively set on one side of each square groove.

6. The wafer cell bottom parallelism detection device for an ion implanter according to claim 1, characterized in that, Both the central pad (5) and the circumferential pad (6) are made of non-rigid materials.

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