Temperature acquisition assembly, CCS device with temperature acquisition assembly and battery module with temperature acquisition assembly

Abstract

The utility model relates to the technical field of temperature acquisition, in particular to a temperature acquisition assembly, a CCS device with the temperature acquisition assembly and a battery module with the temperature acquisition assembly. The temperature acquisition assembly comprises a ceramic circuit board which comprises a heat-conducting ceramic substrate and a conductive circuit formed on the ceramic substrate, and the ceramic substrate is used for being attached to the surface of a heat source; and the temperature sensor is electrically connected with the conductive circuit and is directly attached to the ceramic substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of temperature acquisition, and in particular to a temperature acquisition assembly, a CCS device having the same, and a battery module. BACKGROUND

[0002] FPC (Flexible Printed Circuit, flexible circuit board) or FFC (Flexible Flat Cable, flexible flat cable) type CCS (Cells Contact System, integrated busbar) products are widely used in signal acquisition of new energy battery modules.

[0003] In the CCS device of the related art with the FPC type and the temperature sensor, the temperature of the battery cell (battery monomer) is acquired by welding the metal nickel sheet extending from the FPC on the surface of the aluminum busbar, and the aluminum busbar is welded on the pole of the battery cell, and the temperature of the battery cell is transmitted to the temperature sensor of the CCS device via the aluminum busbar and the metal nickel sheet. The working principle of the temperature sensor is that the resistance of the thermistor therein changes according to the temperature, in order to avoid the influence of the conductor on the resistance of the thermistor due to the contact of the conductor with the non-pin (electrode) part of the thermistor, causing the temperature sampling value to deviate, the insulation of the bottom and the peripheral position of the temperature sensor (thermistor) needs to be ensured. Therefore, the thermistor cannot be in direct contact with the metal nickel sheet with high thermal conductivity, which results in a gap (generally designed to be more than 1 mm) between the metal nickel sheet welded on the aluminum busbar and the thermistor, and the thermal resistance of the intermediate part is very large, and the heat conduction mainly depends on the packaging glue such as UV glue on the upper part of the NTC. SUMMARY

[0004] The present application aims to solve at least one of the above technical problems, and proposes a temperature acquisition assembly, a CCS device having the same, and a battery module.

[0005] In a first aspect, a temperature acquisition assembly is provided, comprising:

[0006] A ceramic circuit board comprising a thermally conductive ceramic substrate and a conductive circuit formed on the ceramic substrate, the ceramic substrate being configured to be attached to a surface of a heat source;

[0007] A temperature sensor electrically connected to the conductive circuit and directly attached to the ceramic substrate.

[0008] In some possible embodiments, the ceramic substrate has a first surface and a second surface opposite to each other in a thickness direction, the temperature sensor is directly attached to the first surface of the ceramic substrate, and the second surface is configured to be directly attached to the surface of the heat source.

[0009] In some possible embodiments, the temperature sensor comprises a thermistor and a first pin and a second pin leading out from the thermistor, wherein the first pin and the second pin are electrically connected with the conductive circuit, and the thermistor directly abuts against the ceramic substrate.

[0010] In some possible embodiments, when viewed from the second surface, the abutting area of the thermistor against the second surface is not less than 50% of the area of the thermistor.

[0011] In some possible embodiments, the conductive circuit comprises:

[0012] a first conductive trace, one end of which is connected to the first pin;

[0013] a first pad, connected to the other end of the first trace;

[0014] a second conductive trace, one end of which is connected to the second pin;

[0015] a second pad, connected to the other end of the second trace.

[0016] In some possible embodiments, the ceramic substrate has a first surface and a second surface opposite to each other in the thickness direction, wherein the thermistor directly abuts against the first surface of the ceramic substrate, the first conductive trace, the second conductive trace, the first pad and the second pad are all formed on the first surface of the ceramic substrate, and the second surface is used to directly abut against the surface of the heat source.

[0017] In some possible embodiments, the first surface of the ceramic substrate has an inwardly recessed long groove, the conductive circuit comprises a conductive trace filled in the long groove, the temperature sensor is welded to the conductive trace, and the part of the conductive trace welded to the temperature sensor is not higher than the first surface.

[0018] In some possible embodiments, the heat source is a busbar for electrically connecting adjacent battery cells in a battery module, and the conductive circuit comprises a voltage collection circuit electrically isolated from the temperature sensor.

[0019] The temperature collection assembly further comprises a conductive sheet fixed to the ceramic circuit board and electrically connected with the voltage collection circuit, and the conductive sheet is used to be welded to the surface of the busbar.

[0020] Preferably, the conductive sheet has a first part overlapping the ceramic circuit board, and a second part extending outside the ceramic circuit board, the first part is welded to the voltage collection circuit, and the second part is used to be welded to the surface of the busbar.

[0021] Preferably, the surface of the busbar has a concave socket, and a part of the second portion is bent to form a socket nose for embedding into the socket.

[0022] In some possible embodiments, the ceramic substrate has a thermal conductivity not less than 20 W / (m·K), and preferably, the ceramic substrate is formed of alumina ceramic or aluminum nitride ceramic.

[0023] In a second aspect, a CCS device is provided, comprising a plurality of temperature acquisition assemblies as described in the first aspect.

[0024] In a third aspect, a battery module is provided, comprising:

[0025] a plurality of battery cells;

[0026] at least one busbar electrically connecting adjacent battery cells;

[0027] at least one temperature acquisition assembly as described in the first aspect, wherein the ceramic substrate directly abuts to the surface of the busbar.

[0028] In a fourth aspect, a method for using the temperature acquisition assembly as described in the first aspect is provided, the method comprising:

[0029] abutting the ceramic circuit board to the surface of the heat source;

[0030] acquiring the temperature of the heat source by using the temperature sensor.

[0031] According to the temperature acquisition assembly provided in the present application, in working, the ceramic substrate abuts to the surface of the heat source, and based on the fact that the ceramic substrate has good thermal conductivity and the temperature sensor directly abuts to the ceramic substrate, the heat of the heat source can be rapidly transmitted to the temperature sensor via the ceramic substrate, thereby improving the timeliness and accuracy of the temperature measurement of the temperature sensor on the heat source. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present application, but not limit the present application.

[0033] Figure 1 is a perspective view of the temperature acquisition assembly provided in the first embodiment of the present application.

[0034] Figure 2 is a plan view of Figure 1 .

[0035] Figure 3 is a plan view of Figure 2the right view of figure

[0036] Figure 4 is Figure 2 the bottom view of figure

[0037] Figure 5 is Figure 1 the partial schematic view of the temperature acquisition assembly of figure

[0038] Figure 6 is the planar front view of the temperature acquisition assembly provided by the second embodiment of the present application.

[0039] Figure 7 is Figure 6 the right view of figure

[0040] Figure 8 is Figure 6 the partial schematic view of the temperature acquisition assembly of figure

[0041] BRIEF DESCRIPTION OF DRAWINGS

[0042] 100 - battery module;

[0043] 10 - temperature acquisition assembly;

[0044] 1 - battery cell;

[0045] 2 - busbar, 2A - bayonet;

[0046] 3 - ceramic circuit board, 31 - ceramic substrate, 31A - first face, 31B - second face, 31C - long slot, 32 - conductive circuit, 321 - first conductive trace, 322 - second conductive trace, 323 - third conductive trace, 324 - first pad, 325 - second pad, 326 - third pad;

[0047] 4 - temperature sensor, 41 - first pin, 42 - second pin, 43 - thermistor;

[0048] 5 - conductive sheet, 5A - first portion, 5B - second portion, 5B1 - bayonet;

[0049] 6 - external wire. DETAILED DESCRIPTION

[0050] In order to make the objects, technical solutions and advantages of the present application clearer, the following will be combined with the accompanying drawings for the embodiments of the present application to make a clear and complete description of the technical solutions of the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the described embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without any inventive effort fall within the scope of protection of the present application. It can be understood that some technical means of the various embodiments described herein can be replaced or combined with each other without conflict.

[0051] In the description of the present application, if there are terms "first", "second", etc., they are only used to distinguish the described objects, and do not have any order or technical meaning. Therefore, the objects defined with "first", "second", etc. can explicitly or implicitly include one or more of the objects, and for example, the term "first element" itself does not mean the existence of "second element", and the term "second element" itself does not mean the existence of "first element". In addition, "one" or "an" and the like do not represent a quantity limitation, but represent the existence of at least one, and "multiple" represents no less than two.

[0052] In the description of the present application, the terms "include", "have" indicate the existence of the described features, numbers, operations, elements and / or their combinations, but do not exclude the existence or addition of one or more other features, numbers, operations, elements and / or their combinations.

[0053] In the description of the present application, the reference to "one embodiment" or "some embodiments" and the like means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in further some embodiments" and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized.

[0054] Figures 1 to 4 An embodiment of the present application provides a temperature acquisition assembly 10 which can measure the temperature of a heat source by coupling to the surface of the heat source. The heat source can be a busbar 2 for electrically connecting adjacent battery cells 1 in a battery module 100. Since the busbar 2 is usually formed of copper or aluminum with high thermal conductivity and is closely combined with the battery cells 1 in the battery module 100, the busbar 2 has a temperature value substantially consistent with the battery cells 1, and thus the measured temperature of the busbar 2 can be interpreted as the temperature of the corresponding battery cell.

[0055] The temperature acquisition component 10 comprises a ceramic circuit board 3 and a temperature sensor 4. The ceramic circuit board 3 comprises a ceramic substrate 31 with good thermal conductivity and an electrically conductive circuit 32 formed on the ceramic substrate 31. The temperature sensor 4 is electrically connected to the electrically conductive circuit 32 and directly adheres to the ceramic substrate 31.

[0056] In operation, the ceramic substrate 31 is adhered to the surface of a heat source. Based on the ceramic substrate 31 having good thermal conductivity and the temperature sensor 4 being temperature sensitive and directly adhered to the ceramic substrate 31, the heat (temperature) of the heat source can be rapidly transferred to the temperature sensor 4 via the ceramic substrate 31, thereby improving the timeliness and accuracy of the temperature sensor 4 in measuring the temperature of the heat source.

[0057] In this embodiment, the ceramic substrate 31 is formed of alumina (Al2O3) ceramic or aluminum nitride (AlN) ceramic, which has a thermal conductivity significantly higher than that of a PCB substrate, not less than 20 W / (m·K).

[0058] It can be understood that, due to the ceramic substrate 31 having good insulation, even if the temperature sensor 4 is directly adhered to the ceramic substrate 31, the electrical performance of the temperature sensor 4 will not be affected (e.g., be locally short-circuited), thereby being able to accurately measure the temperature value of the heat source.

[0059] Specifically, the ceramic substrate 31 has a first face 31A and a second face 31B opposite to each other in the thickness direction, the temperature sensor 4 directly adheres to the first face 31A of the ceramic substrate 31, the second face 31B of the ceramic substrate 31 is used to directly adhere to the surface of the heat source, and the aforementioned electrically conductive circuit 32 is entirely formed on the first face 31A of the ceramic substrate 31.

[0060] The temperature sensor 4 comprises a thermistor 43 and a first lead 41 and a second lead 42 leading out from the thermistor 43, and the first lead 41 and the second lead 42 can also be respectively referred to as a positive electrode lead and a negative electrode lead. The electrically conductive circuit 32 comprises a first electrically conductive trace 321, a second electrically conductive trace 322, a first pad 324, and a second pad 325, wherein the first electrically conductive trace 321 and the second electrically conductive trace 322 can be copper foil traces formed on the first face 31A of the ceramic substrate 31 by thin film technology, one end of the first electrically conductive trace 321 is connected to the first lead 41 of the temperature sensor 4, and the other end is connected to the first pad 324, one end of the second electrically conductive trace 322 is connected to the second lead 42 of the temperature sensor 4, and the other end is connected to the second pad 325.

[0061] As mentioned above, since the ceramic substrate 31 has good insulation, even if the thermistor 43 is directly attached to the ceramic substrate 31 in a large area, the current resistance value of the thermistor 43 will not be affected (no local short circuit) during temperature measurement, so that the temperature value of the heat source can be accurately measured.

[0062] It can be understood that the larger the area of the thermistor 43 attached to the second surface 31B, the faster the heat is transferred to the thermistor 43 through the ceramic substrate 31. Therefore, in some embodiments, a flat thermistor 43 can be used, and one flat main surface of the thermistor 43 is attached to the ceramic substrate 31. In general, the temperature acquisition assembly 10 can be configured such that the area of the thermistor 43 attached to the second surface 31B is not less than 50% of the area of the thermistor 43 (i.e. the projected area of the thermistor 43 on the second surface 31B) when viewed from the second surface 31B.

[0063] In the present embodiment, the first surface 31A of the ceramic substrate 31 has an inwardly recessed long groove 31C, and the first conductive trace 321 and the second conductive trace 322 are filled in the long groove 31C, and the top of the first conductive trace 321 and the second conductive trace 322 is substantially flush with the first surface 31A of the ceramic substrate 31, while the first pad 324 and the second pad 325 are higher than the first surface 31A. The first pad 324 and the second pad 325 are used to solder the external lead 6 to transmit the temperature sensed by the thermistor 43 to the temperature monitoring device to monitor the temperature state of the battery module 100 in real time, for example, to the battery management system (BMS). In addition, the external lead 6 can be a FPC (Flexible Printed Circuit), a FFC (Flexible Flat Cable) or a common enameled wire.

[0064] Figure 5 is schematically shown Figures 1 to 4 One application scenario of such a temperature acquisition assembly 10 is that the heat source is a busbar 2 for electrically connecting adjacent battery cells 1 in the battery module 100, and the busbar 2 is a plate-shaped aluminum or copper bar. The second surface 31B of the ceramic substrate 31 of the temperature acquisition assembly 10 is directly attached to the surface of the busbar 2. In addition, the temperature acquisition assembly 10 can be bonded to the busbar 2 by using insulating thermal conductive glue to improve the position stability of the temperature acquisition assembly on the busbar 2 and the degree of adhesion to the busbar 2.

[0065] Next, please refer to Figure 6 and Figure 7 ,Figure 6 and Figure 7 Another embodiment of the temperature acquisition assembly 10 is schematically shown, and Figure 8 An application scenario of the temperature acquisition assembly 10 is shown, which is the same as Figure 5 the application scenario shown.

[0066] In Figures 1 to 4 the temperature acquisition assembly provided, the conductive circuit 32 only includes the temperature acquisition circuit connected with the temperature sensor 4, and thus it does not have the function of acquiring the voltage of the battery monomer 1. However Figure 6 and Figure 7 The temperature acquisition assembly 10 provided is different, in that the conductive circuit 32 further includes the voltage acquisition circuit electrically isolated (i.e. not connected) from the temperature sensor 4, and the temperature acquisition assembly 10 is further configured with the conductive sheet 5 fixed to the ceramic circuit board 3 and electrically connected with the aforementioned voltage acquisition circuit. In use, as Figure 8 shown, the conductive sheet 5 can be welded to the surface of the busbar 2 as a heat source, and the external lead wire 6 is connected to the voltage acquisition circuit in a welding manner, whereby the voltage (potential) of the battery monomer 1 can be transmitted to the external lead wire 6 in sequence via the busbar 2, the conductive sheet 5, and the voltage acquisition circuit, so as to transmit the voltage of the battery monomer 1 to the monitoring device such as the BMS by using the external lead wire 6, to monitor the voltage state of the relevant battery monomer 1 in the battery module 100 in real time. In addition, since the conductive sheet 5 fixed to the ceramic circuit board 3 is welded to the surface of the busbar 2, in actual application, the temperature acquisition assembly 10 can be inhibited from being detached from the busbar 2. The conductive sheet 5 can be a nickel sheet.

[0067] More specifically, the voltage acquisition circuit includes a third conductive trace 323 and a third solder pad 326. The third conductive trace 323 can be a copper foil circuit formed on the first face 31A of the ceramic substrate 31 by thin film technology, but is separated from the first conductive trace 321 and the second conductive trace 322, and one end of the third conductive trace 323 is welded with the conductive sheet 5, thereby realizing the mechanical fixation of the conductive sheet 5 to the ceramic circuit board 3 and the electrical connection of the conductive sheet 5 to the voltage acquisition circuit. The third solder pad 326 is connected at the other end of the third conductive trace 323 for welding with the external lead wire 6.

[0068] Similar to the part of the conductive circuit 32 connected to the temperature sensor 4, the third conductive trace 323 is filled in the corresponding long slot 31C of the first face 31A of the ceramic substrate 31, and the top of the third conductive trace 323 is substantially flush with the first face 31A of the ceramic substrate 31, while the third pad 326 is higher than the first face 31A. In addition, in order to facilitate the soldering of the (three cores of the) external lead wire 6 to the first pad 324, the second pad 325 and the third pad 326, the first pad 324, the second pad 325 and the third pad 326 are arranged side by side at the same side edge of the ceramic substrate 31.

[0069] Please refer again to Figures 6 to 8 In the present embodiment, the conductive sheet 5 has a first part 5A overlapping the ceramic circuit board 3 and a second part 5B extending outside the ceramic circuit board 3, wherein the first part 5A is soldered to one end of the third conductive trace 323, and the second part 5B is used for soldering to the surface of the busbar 2 as a heat source, and a part of the second part 5B is bent to form a clamping protrusion 5B1. In addition, the surface of the busbar 2 as the application object has a recessed clamping opening 2A, and in use, the clamping protrusion 5B1 is embedded in the clamping opening 2A, thereby facilitating the rapid positioning of the temperature acquisition assembly at the connection position of the conductive busbar.

[0070] The present embodiment also provides a CCS (Cells Contact System) device, which comprises a plurality of temperature acquisition assemblies 10 as shown in the present embodiment, and comprises a plurality of busbars 2, and the plurality of temperature acquisition assemblies 10 are respectively joined to the busbars 2 in a manner of abutting against the corresponding busbar 2. Figure 1 Or Figure 6 The present embodiment also provides a battery module 100, which comprises the aforementioned CCS device.

[0071] The present embodiment also provides a battery module 100, which comprises the aforementioned CCS device.

Claims

1. A temperature harvesting assembly, comprising: Comprise: A ceramic circuit board comprising a heat-conductive ceramic substrate and a conductive circuit formed on the ceramic substrate, the ceramic substrate being used to abut against a surface of a heat source; A temperature sensor electrically connected with the conductive circuit and directly abutting against the ceramic substrate; The temperature sensor comprises a thermistor and a first lead and a second lead drawn from the thermistor, wherein the first lead, the second lead are electrically connected with the conductive circuit, and the thermistor directly abuts against the ceramic substrate.

2. The temperature harvesting assembly of claim 1, wherein, The ceramic substrate has a first surface and a second surface opposite to each other in the thickness direction, the temperature sensor directly abuts against the first surface of the ceramic substrate, and the second surface is used to directly abut against the surface of the heat source.

3. The temperature harvesting assembly of claim 2, wherein, When viewed from the second surface, the abutting area of the thermistor against the second surface is not less than 50% of the area of the thermistor.

4. The temperature harvesting assembly of claim 1, wherein, The conductive circuit comprises: A first conductive trace connected at one end to the first lead; A first pad connected at the other end of the first conductive trace; A second conductive trace connected at one end to the second lead; A second pad connected at the other end of the second conductive trace.

5. The temperature harvesting assembly of claim 4, wherein, The ceramic substrate has a first surface and a second surface opposite to each other in the thickness direction, wherein the thermistor directly abuts against the first surface of the ceramic substrate, the first conductive trace, the second conductive trace, the first pad and the second pad are all formed on the first surface of the ceramic substrate, and the second surface is used to directly abut against the surface of the heat source.

6. The temperature harvesting assembly of claim 1, wherein, The first surface of the ceramic substrate has an inwardly recessed long groove, the conductive circuit comprises a conductive trace filled in the long groove, the temperature sensor is welded to the conductive trace, and the part of the conductive trace welded to the temperature sensor is not higher than the first surface.

7. The temperature harvesting assembly of claim 1, wherein, The heat source is a busbar for electrically connecting adjacent battery cells in a battery module, and the conductive circuit comprises a voltage acquisition circuit electrically isolated from the temperature sensor; The temperature acquisition assembly further comprises a conductive sheet fixed to the ceramic circuit board and electrically connected with the voltage acquisition circuit, the conductive sheet being used to be welded to the surface of the busbar.

8. The temperature harvesting assembly of claim 7, wherein, The conductive sheet has a first part overlapping the ceramic circuit board, and a second part extending outside the ceramic circuit board, the first part being welded to the voltage acquisition circuit, and the second part being used to be welded to the surface of the busbar.

9. The temperature harvesting assembly of claim 8, wherein, The surface of the busbar has a recessed bayonet, and a part of the second part is bent to form a clamping protrusion for being embedded in the bayonet.

10. The temperature harvesting assembly of any one of claims 1 to 9, wherein, The thermal conductivity of the ceramic substrate is not less than 20 W / (m·K).

11. The temperature harvesting assembly of claim 10, wherein, The ceramic substrate is formed of alumina ceramic or aluminum nitride ceramic.

12. A CCS device, characterized by Comprise:

13. A battery module, characterized by A plurality of temperature acquisition assemblies as claimed in any one of claims 1 to 11. Comprise: A plurality of battery cells; At least one busbar electrically connecting adjacent battery cells; At least one temperature acquisition assembly as claimed in any one of claims 1 to 11, wherein the ceramic substrate directly abuts against the surface of the busbar.

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