Circuit board detection equipment used after PCB etching

By adding a side-mounted infrared auxiliary component and a limiting strip positioning structure to the optical detection unit, the problem of blurred edges in the high-precision fine line detection of existing equipment is solved, realizing accurate detection of high-density fine lines and improving equipment safety.

CN224035236UActive Publication Date: 2026-03-24ZHEJIANG OULONG ELECTRIC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2026-01-30
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Existing PCB etching inspection equipment suffers from blurred lines and unclear boundaries when inspecting high-precision fine lines and tiny BGA pads, resulting in large measurement errors and failing to meet the inspection requirements of high-density fine lines.

Method used

A side-mounted infrared auxiliary component is added to the optical inspection unit, and its illumination direction is at an angle of 30°-45° to the axis of the industrial camera lens. Combined with the positioning structure of the limit strip and the infrared beam sensor, the inspection accuracy and safety are improved.

Benefits of technology

It significantly reduces measurement errors in line width, line spacing, and tiny BGA pads, meeting the testing requirements of high-density, fine-line circuits, while also improving the operational safety and testing consistency of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a circuit board detection device used after PCB etching, and aims to solve the problems that the edge is fuzzy and the measurement error is large when high-precision fine lines are detected by the existing device. The equipment comprises a supporting rack, a bearing platform, a motion module, an optical detection execution unit and a main control system, the optical detection execution unit comprises an industrial camera, an annular LED light source and a side-arranged infrared auxiliary assembly, and the side-arranged infrared auxiliary assembly obliquely irradiates the PCB to strengthen the edge contour of the fine line. The bearing platform is provided with a limiting strip positioning structure, adjustable foot cups are assembled at the bottom of the supporting rack, and an infrared correlation sensor is arranged at an operation opening of the mounting rack. According to the equipment, the gray scale difference between the circuit and the substrate can be remarkably improved, the measurement error is reduced, the PCB positioning accuracy and the platform level are guaranteed, meanwhile, the operation safety is improved, and the high-density fine circuit PCB detection requirement is met.
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Description

Technical Field

[0001] This utility model relates to the technical field of circuit board testing equipment, and in particular to a circuit board testing equipment for PCBs after etching. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs), the etching process directly determines the final form of the circuits and BGA patterns. Its quality directly affects the overall performance and reliability of the PCB. Therefore, post-etching inspection has become a key link in ensuring product quality.

[0003] In existing processes, after PCB etching, the line width, line spacing, and BGA graphic dimensions need to be precisely inspected using specialized equipment. Currently, the mainstream PCB etching post-inspection equipment in the industry consists of a support frame, a carrier platform, an XY motion positioning module, and an optical inspection unit. The optical inspection unit is equipped with only a camera and a ring light source for basic illumination to illuminate and inspect the graphics on the PCB.

[0004] However, existing equipment has a key technical defect when inspecting high-precision fine lines, i.e., line widths less than 10 micrometers and tiny BGA pads: relying solely on the uniform surface illumination provided by the ring light source will result in insufficient grayscale difference between the edge of the fine line and the substrate. Especially for PCBs with slightly fluctuating surface flatness after etching or shallow sidewalls of the lines, the vertical illumination of the ring light source will cause the edge of the fine line to be blurred and the boundary to be unclear. The system cannot accurately extract the edge coordinates, which ultimately results in large measurement errors in line width and line spacing, and cannot meet the inspection requirements of high-density fine line PCBs. Utility Model Content

[0005] The main purpose of this utility model is to provide a circuit board inspection device for PCB etching. It aims to accurately enhance the fine line edge contour through the structural design of the side-mounted infrared auxiliary component, improve the inspection accuracy and consistency, and at the same time ensure the safe operation of the equipment, thus adapting to actual inspection needs.

[0006] To achieve the above objectives, this utility model proposes a circuit board inspection device after PCB etching, comprising:

[0007] A support frame, which is a frame structure and is equipped with adjustable feet at the bottom for leveling.

[0008] The support platform is fixed in the middle of the support frame and serves as a flat table surface for supporting the PCB to be tested.

[0009] A motion module is mounted on the support frame, and an optical detection unit is located above the support platform. The motion module can drive the optical detection unit to move two-dimensionally along the plane of the support platform.

[0010] An optical inspection execution unit includes an industrial camera, a ring LED light source, and a side-mounted infrared auxiliary component; the industrial camera is fixed on a motion module, and the ring LED light source is coaxially positioned below the industrial camera;

[0011] The side-mounted infrared auxiliary component is fixed to one side of the ring LED light source. Its illumination direction forms an angle of 30°-45° with the lens axis of the industrial camera and points obliquely towards the support platform. It is used to emit infrared light to the area of ​​the PCB to be inspected in order to enhance the edge contour of fine lines.

[0012] The main control system is mounted on a support frame and is electrically connected to the motion module, industrial camera, ring LED light source and side-mounted infrared auxiliary components.

[0013] In one possible implementation, the support frame includes a reference portion for mounting the support platform and a pair of mounting brackets, the pair of mounting brackets being disposed on both sides of the support platform, and the motion module being disposed above the pair of mounting brackets.

[0014] In one possible implementation, a pair of mounting brackets form an operating opening on one side of the supporting frame; it also includes a safety protection component mounted on the mounting brackets and positioned opposite the operating opening, the safety protection component including an infrared beam sensor arranged along the edge of the operating opening, the infrared beam sensor being electrically connected to the main control system; when the infrared beam sensor is triggered, it sends a signal to the main control system, which then controls the motion module and optical detection execution unit to stop working, thereby pausing the equipment.

[0015] In one possible implementation, the motion module includes a pair of Y-axis drive rail assemblies and an X-axis drive rail assembly. The pair of Y-axis drive rail assemblies are respectively arranged above a pair of mounting brackets and are arranged along the length of the mounting brackets. The X-axis drive rail assembly is disposed on the pair of Y-axis drive rail assemblies. The optical detection execution unit is disposed on the X-axis drive rail assembly. The module also includes a drive motor that connects the X-axis drive rail assembly and the Y-axis drive rail assembly and drives both of them to drive the optical detection execution unit to achieve two-dimensional movement.

[0016] In one possible implementation, both the Y-axis drive guide rail assembly and the X-axis drive guide rail assembly are belt drive assemblies, including a guide rail frame and a drive belt disposed on the guide rail frame. A slider is disposed on the drive belt, and the X-axis drive guide rail assembly and the Y-axis drive guide rail assembly, as well as the X-axis drive guide rail assembly and the optical detection execution unit, are connected by sliders.

[0017] In one possible implementation, the drive motor includes a first motor and a second motor, which correspond to the Y-axis drive rail assembly and the X-axis drive rail assembly, respectively; the output shaft of the first motor is connected to one of the Y-axis drive rail assemblies, and the pair of drive rail assemblies are connected by a transmission shaft; the second motor is connected to the X-axis drive rail assembly.

[0018] In one possible implementation, the support platform is fixed to the reference part, and a pair of limiting strips are provided above it. The pair of limiting strips are attached to the support platform and perpendicular to each other to form a positioning structure. The positioning structure is used to limit the placement position of the PCB on the support platform.

[0019] In one possible implementation, the bearing platform is provided with two sets of hole structures, each set of hole structures corresponding to a limiting strip, including a plurality of connecting holes, the plurality of connecting holes being spaced apart along the length direction of the limiting strip corresponding to them, the limiting strip being provided with through holes corresponding to the plurality of connecting holes, and the limiting strip and the bearing platform being connected by bolts passing through the through holes and connecting holes.

[0020] In one possible implementation, the main control system includes a control box fixed to a support frame, a host computer, a display screen, and a keyboard and mouse. The host computer is integrated into the control box, which also houses a main control board, a drive module, a signal acquisition module, and an interface module electrically connected to the host computer. The drive module is electrically connected to a motion module and is used to output drive signals. The signal acquisition module is electrically connected to an infrared beam sensor and is used to acquire positioning information and safety trigger signals. The interface module is electrically connected to an industrial camera, a ring LED light source, and a side-mounted infrared auxiliary component, respectively. The display screen, keyboard, and mouse are all connected to the host computer for signal connection to realize the input of detection parameters, display of equipment operating status, and control of the detection process.

[0021] Compared with the prior art, the beneficial effects of this application are as follows:

[0022] By adding a side-mounted infrared auxiliary component to the optical inspection unit and setting its illumination direction to be at an angle of 30°-45° with the axis of the industrial camera lens, the infrared light obliquely illuminates the edge of the fine PCB lines, which can significantly improve the grayscale difference between the lines and the substrate. This effectively solves the problem of blurred edges and unclear boundaries of fine lines caused by relying solely on a ring light source, greatly reduces the measurement errors of line width, line spacing and tiny BGA pads, and meets the inspection requirements of high-density fine PCBs with small line widths.

[0023] Meanwhile, a limit bar positioning structure is set on the carrier platform, which, together with the adjustable feet at the bottom of the support frame, can achieve rapid and accurate positioning of the PCB, avoid misalignment of the detection area caused by material loading offset, and ensure the level of the carrier platform to prevent image distortion, thereby further improving detection accuracy and consistency.

[0024] In addition, an infrared beam sensor is installed at the operating opening of the mounting bracket and interlocked with the main control system. When a foreign object or human limb is detected, the equipment will stop immediately, effectively avoiding the risk of collision with moving parts and improving the safety of equipment operation. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0027] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0028] Figure 3 This is a partial structural diagram of the mounting bracket of this utility model;

[0029] Figure 4 This is a partial structural diagram of the support platform of this utility model;

[0030] Figure 5 This is a structural diagram of the motion module of this utility model;

[0031] Figure 6 for Figure 5 Enlarged view at point B;

[0032] Figure 7 This is a structural diagram of the drive guide rail assembly of this utility model.

[0033] Explanation of icon numbers:

[0034] 1. Support frame; 2. Base section; 3. Mounting bracket; 4. Operating opening; 5. Adjustable feet; 6. Bearing platform; 7. Limiting strip; 8. Connecting hole; 9. Through hole; 10. Motion module; 11. Y-axis drive guide rail assembly; 12. X-axis drive guide rail assembly; 13. Drive motor; 14. First motor; 15. Second motor; 16. Drive shaft; 18. Guide rail frame; 19. Drive belt; 20. Slider; 21. Optical detection execution unit; 22. Industrial camera; 23. Ring LED light source; 24. Side-mounted infrared auxiliary assembly; 25. Safety protection assembly; 26. Infrared beam sensor; 27. Control box; 28. Display screen; 29. ​​Keyboard.

[0035] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0037] Reference Figures 1 to 7 This embodiment proposes a circuit board inspection device after PCB etching, including a support frame 1. The support frame 1 adopts an aluminum alloy frame structure. The aluminum alloy material combines lightweight and high strength, which can avoid the impact of frame deformation on inspection accuracy during equipment operation. Adjustable feet 5 are installed at the four corners of the bottom of the frame. The adjustable feet 5 are connected to the bottom of the frame by threads. The operator can rotate the adjustable feet 5 to complete the horizontal calibration of the frame, ensuring the stability of the overall installation benchmark of the equipment and fundamentally avoiding inspection deviations caused by frame tilt.

[0038] A flat reference section 2 is integrally formed in the middle of the support frame 1. The surface of the reference section 2 is precision-polished and is specifically used to install the support platform 6. The reference section 2 is a frame-shaped horizontal bar set on the support frame 1. Vertically extending mounting brackets 3 are symmetrically connected to its upper sides by bolts. The mounting brackets 3 are arranged perpendicular to the reference section 2. The top of the mounting brackets 3 is a flat mounting surface that has been milled to stabilize the assembly of the motion module 10. At the same time, a pair of mounting brackets 3 form an open operation opening 4 on the same side of the support frame 1. The height of the operation opening 4 is adapted to the height of the platform 6, which facilitates the operator to smoothly complete the loading and unloading operations of PCBs.

[0039] like Figure 3-4 As shown, the support platform 6 is made of high-rigidity metal and is fixedly installed on the reference part 2 in the middle of the support frame 1 by bolts. The support platform 6 and the reference part 2 fit tightly together to form a flat placement surface. This surface has undergone high-precision grinding to provide a stable support foundation for the PCB to be tested, effectively preventing the PCB from warping due to unevenness of the surface, and thus avoiding testing deviations caused by warping.

[0040] The upper surface of the support platform 6 has two sets of perforated structures, distributed vertically. Each set of perforated structures is fitted with a limiting strip 7, a long strip of metal whose bottom fits against the upper surface of the support platform 6. The limiting strip 7 has through holes 9 that match the perforated structures. Bolts are passed through the through holes 9 and the connecting holes 8 of the support platform 6 and tightened to secure the limiting strip 7 to the support platform 6. The two limiting strips 7 are perpendicular to each other, forming a right-angle positioning structure. When placing the PCB, it can be quickly positioned by aligning it with the right-angled edges of the two limiting strips 7, effectively limiting the PCB's placement and preventing misalignment of the detection area caused by PCB displacement during loading.

[0041] In addition, the detachable design of the bolt connection allows operators to adjust the fixed position of the limit strip 7 on the corresponding hole structure after removing the bolts according to different PCB sizes, thereby adapting to the testing needs of PCBs of different sizes and significantly improving the versatility of the equipment.

[0042] Furthermore, such as Figure 1-2 As shown in Figures 5-7, the motion module 10 is bolted to the top mounting surface of a pair of mounting brackets 3. Its core function is to drive the optical detection execution unit 21 to achieve two-dimensional planar movement. It consists of a pair of Y-axis drive guide rail assemblies 11, X-axis drive guide rail assemblies 12 and drive motor 13.

[0043] Among them, a pair of Y-axis drive rail assemblies 11 are arranged parallel to each other along the length of the mounting frame 3, and the sliders 20 of both are set upwards; the X-axis drive rail assembly 12 is horizontally mounted across the sliders 20 of the pair of Y-axis drive rail assemblies 11, and is fixedly connected to the sliders 20 by bolts to achieve a stable sliding connection with the Y-axis drive rail assembly 11; the optical detection execution unit 21 is fixed to the sliders 20 of the X-axis drive rail assembly 12 by a connector, and moves synchronously with the sliders 20.

[0044] The drive motor 13 is divided into a first motor 14 and a second motor 15. The first motor 14 is fixed to the end of one of the mounting brackets 3 by a motor mount. Its output shaft is connected to the transmission end of the corresponding Y-axis drive guide rail assembly 11 by a coupling. The ends of the two Y-axis drive guide rail assemblies 11 away from the first motor 14 are synchronously transmitted through a transmission shaft 16. The two ends of the transmission shaft 16 are respectively adapted and connected to the transmission ends of the two Y-axis drive guide rail assemblies 11 to ensure the smoothness and synchronicity of the X-axis drive guide rail assembly 12 during the movement in the Y-axis direction. The second motor 15 is fixed to the end of the X-axis drive guide rail assembly 12 by a motor mount. Its output shaft is directly connected to the transmission end of the X-axis drive guide rail assembly 12 by a coupling to provide stable power for the movement in the X-axis direction.

[0045] Both the Y-axis and X-axis drive rail assemblies 12 adopt a belt drive structure. Each rail assembly includes a rail frame 18, drive pulleys, and a drive belt 19. The drive pulleys are mounted at both ends of the rail frame 18, and the drive belt 19 is sleeved on the two drive pulleys. The slider 20 is fixedly connected to the drive belt 19. Belt drive has the advantages of low operating noise and smooth transmission, enabling the optical inspection execution unit 21 to achieve accurate full-area scanning above the support platform 6, fully ensuring the inspection coverage requirements of PCBs of different sizes, with no blind spots.

[0046] like Figure 2 , 6 As shown, the optical inspection execution unit 21 is the core component for PCB circuit defect detection. The industrial camera 22 is fixed on the slider 20 of the X-axis drive guide rail assembly 12 by a camera bracket. The height of the camera bracket is adjustable to ensure that the lens of the industrial camera 22 is vertically downward and accurately aligned with the center area of ​​the platform 6. The ring LED light source 23 is coaxially mounted directly below the industrial camera 22 through a connecting sleeve. The connecting sleeve is adapted to the outer ring of the camera lens. The ring LED light source 23 can project uniform and shadowless illumination light onto the PCB surface, providing clear basic lighting conditions for circuit image acquisition and ensuring the basic clarity of the circuit image.

[0047] To address the issue of blurred edges during high-precision fine line inspection, a side-mounted infrared auxiliary component 24 is fixedly mounted on one side of the ring LED light source 23 via a bracket. The bracket is bolted to the housing of the ring LED light source 23, allowing for fine-tuning of the installation angle. This ensures that the illumination direction of the component forms a specific angle with the lens axis of the industrial camera 22, enabling precise oblique emission of infrared light towards the area of ​​the PCB being inspected. Utilizing the difference in reflectivity between the infrared light and the substrate, the edge contours of fine lines are effectively enhanced, resulting in clearer line boundaries and significantly improved inspection accuracy.

[0048] In addition, such as Figure 3 As shown, to enhance equipment operational safety, a safety protection component 25, which is an infrared beam sensor 26, is installed at the edge of the operating opening 4 of the mounting frame 3. A protective frame is also provided around the edge of the operating opening 4. The transmitting and receiving ends of the infrared beam sensor 26 are respectively embedded in the two sides of the protective frame and are electrically connected to the main control system via wires. When an operator's limb or a foreign object accidentally enters the area of ​​the operating opening 4, the infrared beam of the infrared beam sensor 26 is blocked. The sensor immediately sends a trigger signal to the main control system, which then quickly controls the motion module 10 and the optical detection execution unit 21 to stop working, preventing collisions between moving parts and foreign objects and fully ensuring the safety of the equipment and the operator.

[0049] The main control system serves as the control hub of the equipment, with the control box 27 at its core. The control box 27 is bolted to the support frame 1. The control box 27 integrates a host, main control board, drive module, signal acquisition module, and interface module. These modules are connected in an orderly manner via wiring. The main control board is the core control component, responsible for parsing and issuing various commands. The drive module establishes an electrical connection with the first motor 14 and the second motor 15 of the motion module 10, receiving commands from the main control board and outputting precise drive signals to control the start, stop, and speed of the motors, thereby achieving smooth and precise movement of the motion module 10.

[0050] The signal acquisition module is electrically connected to the infrared beam sensor 26 to acquire safety trigger signals in real time and transmit them to the main control board. The interface module adopts a waterproof and dustproof design and establishes electrical connections with the industrial camera 22, the ring LED light source 23 and the side-mounted infrared auxiliary component 24 respectively to achieve stable transmission of commands and data and ensure the coordinated operation of each detection component.

[0051] The control box 27 is externally mounted with a display screen 28, a keyboard 29, and a mouse via a bracket. The bracket is fixed to the front of the support frame 1 for easy viewing and operation by the operator. All three components are connected to the main unit via wires. The operator can input relevant detection parameters, such as detection range and scanning speed, via the keyboard 29 and mouse. The display screen 28 displays the equipment's operating status, detection progress, and detection results in real time, enabling visual control of the detection process and effectively improving detection efficiency and ease of operation.

[0052] The working process of the equipment is as follows: Before testing, the operator first uses the adjustable feet 5 at the bottom of the rotating support frame 1 and a level to complete the horizontal calibration of the frame, ensuring the overall benchmark stability of the equipment; then, according to the size of the PCB to be tested, the fixing bolts of the limit strip 7 are removed, the positions of the two limit strips 7 on the bearing platform 6 are adjusted, and after the adjustment is completed, the bolts are tightened to fix the limit strip 7, forming a right-angle positioning structure that matches the size of the PCB.

[0053] After the inspection preparation is completed, the operator places the etched PCB on the support platform 6 through the operating opening 4, positioning the PCB so that its edges align with the right angles of the two limiting strips 7. Next, the operator inputs inspection parameters, such as the inspection area, scanning speed, and light source brightness, into the main control system via the keyboard 29 and mouse. After inputting the parameters, the operator confirms their accuracy on the display screen 28 and starts the inspection program.

[0054] The main control system then issues a command, and the drive module controls the first motor 14 and the second motor 15 of the motion module 10 to start. Through the coordinated transmission of the Y-axis and X-axis drive rail assembly 12, the optical detection execution unit 21 moves on the carrier platform 6 according to the set trajectory. At the same time, the main control system controls the ring LED light source 23 and the side infrared auxiliary component 24 to turn on. The ring LED light source 23 projects uniform illumination light onto the PCB surface, and the side infrared auxiliary component 24 emits infrared light obliquely to enhance the fine line edge contour. The industrial camera 22 is started in sync, and real-time images of the PCB lines are acquired and transmitted to the host through the interface module.

[0055] During the detection process, the signal acquisition module continuously receives signals from the infrared beam sensor 26 and monitors the safety status of the operating opening 4 area in real time. If any foreign object or limb is intruded, the equipment will immediately stop operating and display an alarm on the display screen 28.

[0056] After the optical inspection execution unit 21 completes the scanning of the set area, the host analyzes and processes the acquired image, identifies circuit defects, and generates an inspection report. The inspection results are displayed on the display screen 28 in real time. After the inspection is completed, the equipment automatically stops the operation of all moving parts and inspection parts. The operator can view the inspection report on the display screen 28, and after confirming that there are no errors, remove the inspected PCB from the operation opening 4 to complete one inspection cycle. If continuous inspection is required, the above steps of loading, parameter confirmation, and starting inspection can be repeated.

[0057] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0058] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board inspection device after PCB etching, characterized in that, include: Support frame (1), the support frame (1) is a frame structure, and the bottom is equipped with adjustable feet (5) for horizontal calibration. The support platform (6) is fixed in the middle of the support frame (1) and serves as a flat table for supporting the PCB to be tested; The motion module (10) is mounted on the support frame (1), and an optical detection unit is provided above the support platform (6). The motion module (10) can drive the optical detection unit to move two-dimensionally along the plane of the support platform (6). The optical detection execution unit (21) includes an industrial camera (22), a ring LED light source (23), and a side-mounted infrared auxiliary component (24); the industrial camera (22) is fixed on the motion module (10), and the ring LED light source (23) is coaxially arranged below the industrial camera (22); The side-mounted infrared auxiliary component (24) is fixed to one side of the ring LED light source (23). Its illumination direction is at an angle of 30°-45° to the lens axis of the industrial camera (22) and obliquely points to the support platform (6). It is used to emit infrared light to the area of ​​the PCB to be inspected in order to enhance the fine line edge contour. The main control system is mounted on the support frame (1) and is electrically connected to the motion module (10), industrial camera (22), ring LED light source (23) and side infrared auxiliary component (24).

2. The circuit board inspection equipment according to claim 1, characterized in that, The support frame (1) includes a base part (2) for mounting the bearing platform (6) and a pair of mounting brackets (3), the pair of mounting brackets (3) being disposed on both sides of the bearing platform (6), and the motion module (10) being disposed above the pair of mounting brackets (3).

3. The circuit board inspection equipment after PCB etching according to claim 2, characterized in that, A pair of mounting brackets (3) form an operation opening (4) on one side of the support frame (1); it also includes a safety protection component (25) mounted on the mounting bracket (3) and disposed opposite the operation opening (4), the safety protection component (25) including an infrared beam sensor (26) arranged along the edge of the operation opening (4), the infrared beam sensor (26) being electrically connected to the main control system; when the infrared beam sensor (26) is triggered, it sends a signal to the main control system, and the main control system controls the motion module (10) and the optical detection execution unit (21) to stop working, thereby pausing the equipment.

4. The circuit board inspection equipment after PCB etching according to claim 2, characterized in that, The motion module (10) includes a pair of Y-axis drive rail assemblies (11) and an X-axis drive rail assembly (12). The pair of Y-axis drive rail assemblies (11) are respectively arranged above a pair of mounting brackets (3) and are arranged along the length of the mounting brackets (3). The X-axis drive rail assembly (12) is arranged on the pair of Y-axis drive rail assemblies (11). The optical detection execution unit (21) is arranged on the X-axis drive rail assembly (12). It also includes a drive motor (13) that connects the X-axis drive rail assembly (12) and the Y-axis drive rail assembly (11) and drives both to drive the optical detection execution unit (21) to achieve two-dimensional movement.

5. The circuit board inspection equipment after PCB etching according to claim 4, characterized in that, The Y-axis drive guide rail assembly (11) and the X-axis drive guide rail assembly (12) both adopt belt drive assemblies, including a guide rail frame (18) and a transmission belt (19) set on the guide rail frame (18). A slider (20) is set on the transmission belt (19). The X-axis drive guide rail assembly (12) and the Y-axis drive guide rail assembly (11) are connected by the slider (20), and the X-axis drive guide rail assembly (12) and the optical detection execution unit (21) are connected by the slider (20).

6. The circuit board inspection equipment according to claim 5, characterized in that, The drive motor (13) includes a first motor (14) and a second motor (15), which correspond to the Y-axis drive rail assembly (11) and the X-axis drive rail assembly (12) respectively; the output shaft of the first motor (14) is connected to one of the Y-axis drive rail assemblies (11), and the pair of drive rail assemblies are connected by a transmission shaft (16); the second motor (15) is connected to the X-axis drive rail assembly (12).

7. The circuit board inspection equipment according to claim 1, characterized in that, The carrier platform (6) is fixed on the base part (2), and a pair of limiting strips (7) are provided above it. The pair of limiting strips (7) are attached to the carrier platform (6) and perpendicular to each other to form a positioning structure. The positioning structure is used to limit the placement position of the PCB on the carrier platform (6).

8. The circuit board inspection equipment according to claim 7, characterized in that, The bearing platform (6) is provided with two sets of hole structures, each set of hole structures corresponding to a limiting strip (7), including several connecting holes (8), the several connecting holes (8) are distributed at intervals along the length direction of their corresponding limiting strip (7), the limiting strip (7) is provided with through holes (9) that match the several connecting holes (8), the limiting strip (7) and the bearing platform (6) are connected by bolts that pass through the through holes (9) and the connecting holes (8).

9. The circuit board inspection equipment after PCB etching according to claim 3, characterized in that, The main control system includes a control box (27) fixed to the support frame (1), a host, a display screen (28), and a keyboard (29) and mouse. The host is integrated in the control box (27). The control box (27) is also equipped with a main control board, a drive module, a signal acquisition module and an interface module that are electrically connected to the host. The drive module is electrically connected to the motion module (10) and is used to output drive signals. The signal acquisition module is electrically connected to the infrared beam sensor (26) and is used to collect positioning information and safety trigger signals. The interface module is electrically connected to the industrial camera (22), the ring LED light source (23) and the side-mounted infrared auxiliary component (24) respectively. The display screen (28), keyboard (29) and mouse are all connected to the host signal and are used to realize the input of detection parameters, display of equipment operation status and control of detection process.