Wafer loading machine and wafer detection system

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a wafer loading machine and a wafer detection system. The wafer loading machine comprises a wafer loading platform, an assembling structure, a pitching adjusting assembly and a deflection adjusting assembly. The assembling structure comprises a supporting seat and an adjusting seat arranged on the supporting seat, and the adjusting seat is connected with the wafer loading platform; the pitching adjusting assembly is connected to the adjusting base and used for driving the adjusting base to generate offset in the vertical direction relative to the supporting base. The deflection adjusting assembly is connected to the adjusting base and used for driving the adjusting base to generate offset in the horizontal direction relative to the supporting base. According to the wafer loading machine provided by the invention, the alignment precision of the wafer loading machine and the wafer carrying manipulator can be improved by adjusting the pitching angle and the deflection angle, so that the wafer placing stability and the safety during taking, placing and carrying are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor testing, in particular to a wafer loading machine and a wafer detection system. BACKGROUND

[0002] AOI (Automated Optical Inspection) belongs to the wafer processing flow of the semiconductor front-end, which measures the key dimensions of the wafer through optical algorithms, such as line width, line height, film thickness and roughness, etc. The AOI device usually includes a wafer loading machine, a wafer handling robot, a wafer pre-alignment, a slide stage and an optical detection part, etc.

[0003] In the related art, when the wafer is fed through the wafer loading machine, the wafer handling robot is usually needed to handle the wafer. Therefore, in order to improve the safety of wafer handling, the alignment accuracy of the wafer loading machine and the wafer handling robot is required to be high, and if there is an alignment deviation, it may cause a pickup angle deviation, and there is a risk of handling loosening.

[0004] Therefore, there is an urgent need for a wafer loading machine with high alignment accuracy. Invention content

[0005] Therefore, it is necessary to provide a wafer loading machine which can improve the alignment accuracy with the wafer handling robot through the adjustment of the pitch angle and the yaw angle, and further improve the wafer placement stability and the safety during pick-and-place handling.

[0006] A wafer loading machine, comprising a wafer loading platform, an assembly structure, a pitch adjustment assembly and a yaw adjustment assembly; the assembly structure comprises a support seat and an adjustment seat arranged on the support seat, and the adjustment seat is connected with the wafer loading platform; the pitch adjustment assembly is connected with the adjustment seat and is used to drive the adjustment seat to produce an offset amount in the vertical direction relative to the support seat; and the yaw adjustment assembly is connected with the adjustment seat and is used to drive the adjustment seat to produce an offset amount in the horizontal direction relative to the support seat.

[0007] It can be understood that the wafer loading platform is connected with the adjusting seat, the support seat can be connected with a target position for mounting the wafer loading platform. The pitch adjusting assembly drives the adjusting seat to produce a certain offset relative to the support seat in the vertical direction, so as to satisfy the pitch angle adjustment of the adjusting seat, that is, to realize the levelness adjustment of the adjusting seat, and then to satisfy the levelness adjustment of the wafer loading platform; and the yaw adjusting assembly drives the adjusting seat to produce a certain offset relative to the support seat in the horizontal direction, so as to satisfy the yaw angle adjustment of the adjusting seat in the horizontal direction, and then to satisfy the yaw angle adjustment of the wafer loading platform in the horizontal plane. In this way, the alignment accuracy of the wafer loading platform relative to the wafer transfer robot can be improved, and then the wafer placement stability and the safety during the pick-and-place transfer can be improved.

[0008] In some embodiments, the pitch adjusting assembly includes a plurality of pitch adjusting columns, the plurality of pitch adjusting columns are arranged at intervals along the circumference of the adjusting seat, and each of the pitch adjusting columns is capable of being extended and retracted along its own axis relative to the adjusting seat, so as to drive the adjusting seat to produce an offset in the vertical direction.

[0009] In some embodiments, the adjusting seat is provided with a plurality of adjusting holes arranged at intervals along its own circumference, each of the adjusting holes corresponds to mounting one of the pitch adjusting columns, and the end of each of the pitch adjusting columns towards the support seat is provided with an adjusting boss, and the adjusting boss is capable of abutting against the support seat.

[0010] In some embodiments, the adjusting seat has a central axis in the vertical direction; the yaw adjusting assembly includes a first yaw adjusting column and a second yaw adjusting column, and the two are separately arranged at two ends of the adjusting seat in a first direction; at least one of the first yaw adjusting column and the second yaw adjusting column is capable of being extended and retracted along its own axis relative to the adjusting seat, so as to drive the adjusting seat to yaw around the central axis; and the first direction is arranged at an angle with the vertical direction.

[0011] In some embodiments, the yaw adjusting assembly further includes a mounting seat and a first locking member, the mounting seat is arranged on the support seat and is arranged at intervals with the adjusting seat in a second direction; the first yaw adjusting column and the second yaw adjusting column are respectively correspondingly rotatably connected with one of the mounting seats, and are respectively correspondingly connected with one of the first locking members, and each of the first locking members is used for locking the corresponding first yaw adjusting column and the second yaw adjusting column relative to the corresponding mounting seat; and the second direction, the first direction and the vertical direction are arranged at angles with each other.

[0012] In some embodiments, the wafer loading machine further includes an angle limiting assembly arranged on the support seat; the angle limiting assembly includes at least two limiting blocks, and the at least two limiting blocks are separately arranged at two ends of the support seat in a first direction, and each of the limiting blocks is capable of abutting against the adjusting seat.

[0013] In some embodiments, the wafer loading machine further comprises a leveling assembly connected to the support base, the leveling assembly being configured to drive the support base to offset in a vertical direction.

[0014] In some embodiments, the assembly structure further comprises a locking structure detachably connected to the adjusting base and the support base, the locking structure being configured to lock the adjusting base to the support base.

[0015] In some embodiments, the adjusting base has a central axis, one of the adjusting base and the support base is provided with a guide hole, the guide hole is arranged in an arc shape around the central axis; the locking structure comprises a locking column, the locking column is arranged through the guide hole and connected to the other one of the adjusting base and the support base, the locking column is capable of abutting against an edge of the guide hole away from the other one.

[0016] The application further provides a wafer detection system, comprising a testing device, a conveying device and the wafer loading machine; the testing device is provided with a feeding channel, the wafer loading machine is arranged at the testing device and located at the feeding channel, the conveying device is arranged at the testing device and is configured to convey the wafer stored in the wafer loading machine from the feeding channel. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0018] Figure 1 A schematic view of a wafer loading machine according to an embodiment of the present application;

[0019] Figure 2 A partial schematic view of a wafer loading machine according to an embodiment of the present application;

[0020] Figure 3 A partial top view of a wafer loading machine according to an embodiment of the present application; Figure 2 A partial top view of a wafer loading machine according to an embodiment of the present application;

[0021] Figure 4 A top view of a wafer loading machine according to an embodiment of the present application;

[0022] Figure 5 A partial sectional view of A-A in the wafer loading machine according to an embodiment of the present application; Figure 4 A partial sectional view of A-A in the wafer loading machine according to an embodiment of the present application;

[0023] Figure 6 AFigure 4 partial cross-sectional view of the middle B-B;

[0024] Figure 7 for Figure 4 partial cross-sectional view of the middle C-C.

[0025] The drawings are as follows: 10, wafer loading platform; 11, loading support part; 12, loading assembly part; 13, fixed part; 20, assembly structure; 21, adjusting seat; 22, support seat; 30, pitch adjusting assembly; 31, pitch adjusting column; 32, adjusting boss; 40, yaw adjusting assembly; 41, first yaw adjusting column; 42, second yaw adjusting column; 43, mounting seat; 44, first locking piece; 45, fastener; 50, angle limiting assembly; 51, limiting block; 60, leveling assembly; 61, leveling column; 62, leveling boss; 70, locking structure; 71, locking column; 80, fixed structure; 201, guide hole; 211, first connecting arm; 212, second connecting arm; 2101, adjusting hole; 2201, leveling hole; 2102, yaw hole. DETAILED DESCRIPTION

[0026] In order to make the above objectives, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below in combination with the drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the present application. However, the present application can be implemented in many different ways other than those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0027] It should be noted that when a component is referred to as "fixed to" or "provided on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the specification of the present application are for illustrative purposes only and do not indicate the only implementation.

[0028] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0029] In the present application, unless specifically defined and limited otherwise, the first feature is "on", "under", "above" or "over" the second feature can be that the first feature is in direct contact with the second feature, or the first feature is indirectly in contact with the second feature through an intermediate medium. Moreover, the first feature is "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature is higher than the second feature in horizontal height. The first feature is "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature is lower than the second feature in horizontal height.

[0030] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by one skilled in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

[0031] Please refer to Figure 1 to Figure 4 An embodiment of the present application provides a wafer loading machine, which comprises a wafer loading platform 10, an assembly structure 20, a pitch adjusting assembly 30 and a yaw adjusting assembly 40. The assembly structure 20 comprises a support base 22 and an adjusting base 21 arranged on the support base 22, and the adjusting base 21 is connected with the wafer loading platform 10 to realize the assembly posture adjustment of the wafer loading platform 10 through the adjusting base 21. The pitch adjusting assembly 30 and the yaw adjusting assembly 40 are both connected with the adjusting base 21, the pitch adjusting assembly 30 is used to drive the adjusting base 21 to produce a displacement in the vertical direction relative to the support base 22, and the yaw adjusting assembly 40 is used to drive the adjusting base 21 to produce a displacement in the horizontal direction relative to the support base 22.

[0032] It can be understood that the support base 22 is connected with a target position for mounting the wafer loading platform 10, and the adjusting base 21 is connected with the wafer loading platform 10. In this process, since the pitch adjusting assembly 30 can drive the adjusting base 21 to produce a certain displacement in the vertical direction relative to the support base 22, for example, to produce a displacement upward in the vertical direction, so as to satisfy the pitch angle adjustment of the adjusting base 21; that is, to realize the levelness adjustment of the adjusting base 21, and then to satisfy the levelness adjustment of the wafer loading platform 10. At the same time, since the yaw adjusting assembly 40 drives the adjusting base 21 to produce a certain displacement in the horizontal direction relative to the support base 22, for example, to rotate clockwise or counterclockwise, so as to satisfy the yaw angle adjustment of the adjusting base 21 in the horizontal direction, and then to realize the yaw angle adjustment of the wafer loading platform 10 in the horizontal plane.

[0033] That is, the wafer loading machine provided by the embodiments of the present application can use the setting of the pitch adjusting assembly 30 and the yaw adjusting assembly 40 to realize the adjustment of the pitch angle in the vertical direction and the yaw angle in the horizontal direction of the adjusting seat 21, thereby realizing the adjustment of the assembly pose of the wafer loading platform 10, improving the alignment accuracy of the wafer loading platform 10 relative to the wafer transfer robot, and facilitating the stable placement of the wafer and the safety during the pick-and-place transfer.

[0034] Referring to Figure 1 and Figure 2 In some specific embodiments, the adjusting seat 21 includes a first connecting arm 211 and a second connecting arm 212, which are connected and arranged at an angle, and the first connecting arm 211 is connected with the wafer loading platform 10. The wafer loading platform 10 includes a loading support part 11, a loading assembly part 12 connected to the loading support part 11, and a fixing part 13 connected to the loading assembly part 12. The loading support part 11 is used to place the magazine and limit the magazine. The loading support part 11 is arranged at an angle with the loading assembly part 12, the bottom of the loading assembly part 12 is connected with the fixing part 13, the first connecting arm 211 is connected with the fixing part 13, and the assembly of the wafer loading platform 10 and the adjusting seat 21 is realized. The first connecting arm 211 and the second connecting arm 212 are arranged vertically.

[0035] In actual use, the wafer loading machine further includes a fixing structure 80, which connects the support seat 22 and the wafer loading platform 10 to realize the fastening of the two. Specifically, the fixing structure 80 is provided in plurality, for example, two, three, four, etc., and is arranged at intervals along the length direction (i.e., the X-axis direction) of the adjusting seat 21, so as to improve the connection reliability between the adjusting seat 21 and the wafer loading platform 10. Of course, the plurality of fixing structures 80 can be arranged at intervals along the Z-axis direction and the X-axis direction. Among them, the first connecting arm 211 can be provided with a threaded hole, the fixing part 13 of the aforementioned wafer loading platform 10 is provided with a round hole, and the fixing structure 80 adopts a bolt or a screw to be screwed with the threaded hole on the first connecting arm 211. Such a setting facilitates the assembly and disassembly of the adjusting seat 21 and the wafer loading platform 10.

[0036] The specific structure of the pitch adjusting assembly 30 and the yaw adjusting assembly 40 will be described in detail below.

[0037] Referring to Figure 1 , Figure 2 , Figure 3 and Figure 5 , for example, the pitch adjusting assembly 30 includes a plurality of pitch adjusting columns 31, which are arranged at intervals along the circumference of the adjusting seat 21, and each pitch adjusting column 31 can be extended and retracted along its own axis relative to the adjusting seat 21 to drive the adjusting seat 21 to shift in the vertical direction. Among them, the vertical direction is the Z-axis direction.

[0038] Specifically, the adjusting seat 21 is connected to the upper surface of the support seat 22. Taking the rectangular cross-section of the second connecting arm 212 in the adjusting seat 21 as an example, pitch adjusting columns 31 are respectively provided at the four corners near the adjusting seat 21. The offset adjustment of the adjusting seat 21 in the Z-axis direction can be achieved by extending and retracting each pitch adjusting column 31 relative to the adjusting seat 21 relative to the Z-axis. For example, when each pitch adjusting column 31 moves downward relative to the adjusting seat 21 in the Z-axis direction, it drives the adjusting seat 21 to shift upward in the Z-axis direction; conversely, when each pitch adjusting column 31 moves upward relative to the adjusting seat 21 in the Z-axis direction, it drives the adjusting seat 21 to shift downward in the Z-axis direction. In this way, the pitch angle adjustment of the adjusting seat 21 relative to the support seat 22 can be achieved.

[0039] like Figure 5 As shown, in actual use, the adjusting seat 21 is provided with multiple adjusting holes 2101 arranged at intervals along its circumference. Each adjusting hole 2101 corresponds to a pitch adjusting column 31, and each pitch adjusting column 31 is threadedly connected to the hole wall of the corresponding adjusting hole 2101. When the pitch adjusting column 31 rotates around its own axis, it can drive the adjusting seat 21 to offset along the Z-axis. Each adjusting hole 2101 is arranged through the second connecting arm 212 in the adjusting seat 21 along its thickness direction. The end of each pitch adjusting column 31 facing away from the support seat 22 does not protrude from the edge of the corresponding adjusting hole 2101, reducing interference.

[0040] Further, the end of each pitch adjusting column 31 towards the support base 22 is provided with an adjusting boss 32, which can abut against the support base 22. That is, each pitch adjusting column 31 includes a threaded section and an adjusting boss 32 connected to the threaded section, and the threaded section is threadedly engaged with the hole wall of the adjusting hole 2101. For example, the pitch adjusting column 31 is rotated clockwise to move the pitch adjusting column 31 downwards along the Z-axis direction relative to the support base 22, thereby causing the adjusting boss 32 to abut against the upper surface of the support base 22. At this time, with the continuous rotation of the pitch adjusting column 31, the adjusting base 21 is lifted upwards along the Z-axis direction, and the end of the pitch adjusting column 31 away from the support base 22 increases in depth corresponding to the adjusting hole 2101; that is, the pitch adjusting column 31 is retracted relative to the adjusting base 21. Conversely, when the pitch adjusting column 31 is rotated counterclockwise, the adjusting base 21 is moved downwards along the Z-axis direction, and the pitch adjusting column 31 is moved upwards along the Z-axis direction relative to the adjusting base 21. When the pitch adjusting column 31 is rotated to the position where the adjusting boss 32 is located in the adjusting hole 2101, the lower surface of the adjusting base 21 is in contact with the upper surface of the support base 22, and the end of the pitch adjusting column 31 away from the support base 22 decreases in depth corresponding to the adjusting hole 2101; that is, the pitch adjusting column 31 is extended relative to the adjusting base 21. Here, only for example, the pitch adjusting column 31 can be rotated counterclockwise to lift the adjusting base 21 along the Z-axis direction, and rotated clockwise to lower the adjusting base 21 along the Z-axis direction.

[0041] Alternatively, one end of each pitch adjusting column 31 can be rotatably connected to the support base 22, and each pitch adjusting column 31 is threadedly engaged with the hole wall of the corresponding adjusting hole 2101. At this time, the rotation of the pitch adjusting column 31 relative to the support base 22 can also drive the adjusting base 21 to shift along the Z-axis direction. Alternatively, each pitch adjusting column 31 can be a pneumatic cylinder or a telescopic rod, as long as it can achieve the driving of the adjusting base 21 to shift along the Z-axis direction.

[0042] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 6 , as another exemplary example, the adjusting base 21 has a central axis along the vertical direction. The yaw adjusting assembly 40 includes a first yaw adjusting column 41 and a second yaw adjusting column 42, which are respectively arranged at the two ends of the adjusting base 21 along a first direction. The first yaw adjusting column 41 and the second yaw adjusting column 42 can be retracted along their own axes relative to the adjusting base 21 to drive the adjusting base 21 to yaw around the central axis. The first direction is arranged at an angle to the vertical direction. The first direction is the X-axis direction. The central axis is located at the center of the second connecting arm 212 in the adjusting base 21.

[0043] For example, when the first yaw adjustment column 41 is retracted along its own axis relative to the adjustment seat 21, the second yaw adjustment column 42 is extended along its own axis relative to the adjustment seat 21, thereby causing the adjustment seat 21 to rotate counterclockwise about the central axis. Conversely, when the first yaw adjustment column 41 is extended along its own axis relative to the adjustment seat 21, the second yaw adjustment column 42 is retracted along its own axis relative to the adjustment seat 21, thereby causing the adjustment seat 21 to rotate clockwise about the central axis. That is, by using the cooperation of the first yaw adjustment column 41 and the second yaw adjustment column 42, the rotation of the adjustment seat 21 about the central axis is realized, and the wafer loading platform 10 is synchronously rotated by the adjustment seat 21, thereby realizing the adjustment of the yaw angle in the horizontal direction.

[0044] Please refer to Figure 2 , Figure 3 and Figure 6 , further, the yaw adjustment assembly 40 further comprises a mounting seat 43 and a first locking member 44, the mounting seat 43 is arranged on the support seat 22 and spaced apart from the adjustment seat 21 along a second direction. The first yaw adjustment column 41 and the second yaw adjustment column 42 are respectively rotatably connected to a mounting seat 43, and are respectively connected to a first locking member 44. Each first locking member 44 is used to lock the corresponding first yaw adjustment column 41 and second yaw adjustment column 42 relative to the corresponding mounting seat 43. Among them, the second direction, the first direction and the vertical direction are angularly arranged in pairs. The second direction is the Y-axis direction.

[0045] Among them, the mounting seat 43 is assembled relative to the support seat 22 through a fastener 45. The fastener 45 can be a screw, which facilitates the detachable connection of the mounting seat 43 and the support seat 22. Each mounting seat 43 can correspond to two fasteners 45, or can correspond to one fastener 45, as long as it can satisfy the reliable assembly of the mounting seat 43 relative to the support seat 22.

[0046] The first yaw adjustment column 41 and the second yaw adjustment column 42 each include an optical axis segment and a threaded segment, which are connected, and the optical axis segment is rotatably connected to the corresponding mounting seat 43. The adjustment seat 21 is provided with two yaw holes 2102 spaced apart along the X-axis direction, and the two threaded segments correspond to one yaw hole 2102 respectively and are threadedly engaged with the hole wall of the corresponding yaw hole 2102. When the first yaw adjustment column 41 and the second yaw adjustment column 42 are rotated about their own axes respectively, the adjustment seat 21 can be caused to rotate about the central axis by the threaded engagement, thereby realizing the adjustment of the yaw angle.

[0047] Among them, the depth of the threaded segment inserted into the yaw hole 2102 is less than the depth of the yaw hole 2102 itself, so as to ensure sufficient adjustment space. Figure 6For example, when the first deflection adjusting column 41 rotates around its axis to drive the adjusting seat 21 to move right, the depth of the first deflection adjusting column 41 inserted into the deflection hole 2102 increases, i.e. the first deflection adjusting column 41 retracts relative to the adjusting seat 21. Conversely, when the first deflection adjusting column 41 rotates around its axis to drive the adjusting seat 21 to move left, the depth of the first deflection adjusting column 41 inserted into the deflection hole 2102 decreases, i.e. the first deflection adjusting column 41 extends relative to the adjusting seat 21. The adjustment of the second deflection adjusting column 42 relative to the adjusting seat 21 is similar, and thus is not described here.

[0048] When the first deflection adjusting column 41 and the second deflection adjusting column 42 cooperate to adjust the deflection angle of the adjusting seat 21, the first deflection adjusting column 41 and the second deflection adjusting column 42 can be respectively locked relative to the corresponding mounting seat 43 by using the corresponding first locking member 44. The first locking member 44 can be a nut, so that the first deflection adjusting column 41 and the second deflection adjusting column 42 are respectively locked relative to the corresponding mounting seat 43 by screwing the nut. Figure 5 For example, when the first locking member 44 rotates to move right and press against the mounting seat 43, locking is achieved; conversely, when the first locking member 44 rotates to move left and move away from the mounting seat 43, unlocking is achieved, which facilitates the rotation of the first deflection adjusting column 41 and the second deflection adjusting column 42.

[0049] Alternatively, one of the first deflection adjusting column 41 and the second deflection adjusting column 42 can extend and retract relative to the adjusting seat 21 along its axis, and the other is hinged to the adjusting seat 21. For example, the first deflection adjusting column 41 extends and retracts relative to the adjusting seat 21, and the second deflection adjusting column 42 is hinged to the adjusting seat 21. At this time, the axis of the first deflection adjusting column 41 is arranged along the Y-axis direction and is threadedly connected to the adjusting seat 21 through the deflection hole 2102; and the axis of the second deflection adjusting column 42 is along the Z-axis direction, one end of the second deflection adjusting column 42 is connected to the support seat 22, and the other end is rotatably connected to the adjusting seat 21, and the axis of the second deflection adjusting column 42 serves as the central axis of the adjusting seat 21. When the first deflection adjusting column 41 rotates around its axis to drive the adjusting seat 21 to rotate around the axis of the second deflection adjusting column 42, the deflection angle adjustment is achieved.

[0050] It should be noted that the deflection referred to in the present application is fine adjustment.

[0051] Please continue to refer to Figure 1 to Figure 4Optionally, the wafer loading machine further comprises an angle limiting assembly 50 arranged on the support base 22, for limiting the deflection angle of the adjusting base 21, maintaining the fine adjustment of the adjusting base 21, and further maintaining the stability of the wafer loading platform 10 as a whole. The angle limiting assembly 50 comprises at least two limiting blocks 51, which are arranged at two ends of the support base 22 along the first direction, and each limiting block 51 can abut against the adjusting base 21. Taking two limiting blocks 51 as an example, the two limiting blocks 51 are arranged opposite and spaced apart along the X-axis direction. The cross section of the second connecting arm 212 of the adjusting base 21 is smaller than the cross section of the support base 22, so as to ensure that the support base 22 has sufficient space for installing the limiting blocks 51 and the mounting seat 43 mentioned above.

[0052] In some specific embodiments, each limiting block 51 is arranged in a cylindrical shape, so as to maintain smooth contact between the outer periphery of the limiting block 51 and the adjusting base 21, and reduce wear. Each limiting block 51 is rotatably connected to the support base 22 by a shaft, and the limiting block 51 is arranged eccentrically with respect to the corresponding shaft. The outer periphery of the two limiting blocks 51 abuts against the adjusting base 21, respectively. When the adjusting base 21 rotates around the central axis, the limiting blocks 51 can be driven to rotate by friction. Due to the eccentric arrangement of the limiting blocks 51 with respect to the corresponding shafts, the deflection angle adjustment of the adjusting base 21 is satisfied on the basis of maintaining the stability of the adjusting base 21. Figure 3 For example, each limiting block 51 has a thickening portion and a thinning portion with respect to the shaft. When the adjusting base 21 rotates clockwise around the central axis, the left limiting block 51 is driven to rotate counterclockwise, so that the thickening portion of the left limiting block 51 abuts and cooperates with the adjusting base 21; at the same time, the right limiting block 51 is also driven to rotate counterclockwise, so that the thinning portion of the right limiting block 51 abuts and cooperates with the adjusting base 21. Conversely, when the adjusting base 21 rotates counterclockwise around the central axis, both limiting blocks 51 are driven to rotate clockwise, and the thinning portion of the left limiting block 51 abuts and cooperates with the adjusting base 21, and the thickening portion of the right limiting block 51 abuts and cooperates with the adjusting base 21.

[0053] Please continue to refer to Figure 1 to Figure 4 In actual use, the assembly structure 20 further comprises a locking structure 70, which is detachably connected to the adjusting base 21 and the support base 22, for locking the adjusting base 21 relative to the support base 22. That is, by arranging the locking structure 70, the adjusting base 21 can be locked relative to the support base 22 after being adjusted in place, so as to satisfy the stable fixation of the adjusting base 21, and further ensure the stability of the wafer loading platform 10.

[0054] Further, one of the adjusting seat 21 and the supporting seat 22 is provided with a guide hole 201, which is arranged in an arc shape around the central axis. The locking structure 70 includes a locking column 71, which is arranged through the guide hole 201 and connected to the other one of the adjusting seat 21 and the supporting seat 22, and the locking column 71 can be pressed against the edge of the guide hole 201 away from the other one.

[0055] Taking the adjusting seat 21 provided with the guide hole 201 as an example, the locking column 71 is threadedly connected to the supporting seat 22 through the guide hole 201. When it is needed to adjust the position of the adjusting seat 21 relative to the supporting seat 22, the locking column 71 can be loosened. When the yaw angle is adjusted, the guide hole 201 is arranged in an arc shape, so that the adjustment of the adjusting seat 21 can be reduced. When the adjusting seat 21 is yawed, the locking hole moves relative to the guide hole 201, which can also guide the yaw of the adjusting seat 21. At the same time, when the pitch angle is adjusted, the adjusting seat 21 moves along the axial direction of the locking column 71, so as to realize the movement guidance through the cooperation between the hole wall of the guide hole 201 and the locking column 71.

[0056] In some specific embodiments, the first yaw adjusting column 41 and the second yaw adjusting column 42 are both threadedly connected to the adjusting seat 21. The guide hole 201 is provided with two guide holes, which are arranged opposite and spaced apart along the X-axis direction, and each guide hole 201 is arranged away from the corresponding yaw hole 2102, so as to reduce the interference between the locking column 71 and the first yaw adjusting column 41 and the second yaw adjusting column 42.

[0057] Alternatively, the locking structure 70 can also be a buckle structure. When it is needed to adjust the position of the adjusting seat 21, the locking structure 70 is unlocked; after being adjusted to the position, the adjusting seat 21 and the supporting seat 22 can be locked by the locking structure 70.

[0058] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 7 In still some optional embodiments, the wafer loading machine further includes a leveling assembly 60 connected to the supporting seat 22, which is used to drive the supporting seat 22 to produce an offset in the vertical direction. That is, the pitch angle adjustment of the supporting seat 22 in the vertical direction can also be realized by the arrangement of the leveling assembly 60, so as to realize the pitch angle adjustment of the wafer loading machine relative to the target position.

[0059] Further, the leveling assembly 60 comprises a plurality of leveling columns 61 arranged circumferentially along the support base 22, the support base 22 is provided with a plurality of leveling holes 2201 arranged circumferentially along the support base 22, and each leveling hole 2201 is correspondingly provided with a leveling column 61. The leveling column 61 can move along the axis thereof relative to the support base 22 to drive the support base 22 to offset along the Z-axis direction, so as to realize the pitch angle adjustment. Wherein, each leveling column 61 comprises a threaded section and a leveling boss 62 connected to the threaded section, and the abutment of the leveling boss 62 relative to the target position is used to realize the lifting of the support base 22. That is, the structure of each leveling column 61 is the same as that of the aforementioned adjustment column, and the adjustment mode is also the same, so this will not be described again.

[0060] In some specific embodiments, each pitch adjustment column 31 and each leveling column 61 is provided with an operation hole for tool clamping, and the cross section of the operation hole is hexagonal.

[0061] As shown in Figure 1 to Figure 4 It is shown that another embodiment of the present application provides a wafer detection system, which comprises a testing device, a carrying device and the wafer loading machine. The testing device is provided with a feeding channel, and the wafer loading machine is arranged at the testing device and located at the feeding channel. The carrying device is arranged at the testing device and is used to carry the wafer stored in the wafer loading machine from the feeding channel. Due to the arrangement of the aforementioned pitch adjustment assembly 30, yaw adjustment assembly 40 and leveling assembly 60, it is convenient to adjust the assembly pose of the wafer loading platform 10 relative to the testing device, which is more conducive to adapting to the alignment position of the carrying device, improves the alignment accuracy, and is conducive to the stable taking and placing of the wafer by the carrying device.

[0062] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description simple, all possible combinations of the technical features in the above-mentioned embodiments are not described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0063] The above-mentioned embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as the limitation of the patent application scope. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A wafer loader, characterized in that, include: Wafer loading platform (10); The assembly structure (20) includes a support base (22) and an adjustment base (21) disposed on the support base (22), the adjustment base (21) being connected to the wafer loading platform (10); Pitch adjustment assembly (30), connected to the adjustment seat (21), is used to drive the adjustment seat (21) to generate an offset in the vertical direction relative to the support seat (22); A yaw adjustment assembly (40) is connected to the adjustment seat (21) and is used to drive the adjustment seat (21) to generate an offset in the horizontal direction relative to the support seat (22).

2. The wafer loader according to claim 1, characterized in that, The pitch adjustment assembly (30) includes a plurality of pitch adjustment columns (31), which are arranged circumferentially at intervals along the adjustment seat (21). Each pitch adjustment column (31) can extend or retract relative to the adjustment seat (21) along its own axis to drive the adjustment seat (21) to shift in the vertical direction.

3. The wafer loader according to claim 2, characterized in that, The adjustment seat (21) is provided with a plurality of adjustment holes (2101) arranged at intervals along its circumference. Each adjustment hole (2101) is equipped with a pitch adjustment column (31). Each pitch adjustment column (31) has an adjustment boss (32) protruding from its end facing the support seat (22). The adjustment boss (32) can abut against the support seat (22).

4. The wafer loader according to claim 1, characterized in that, The adjusting seat (21) has a central axis along the vertical direction; the yaw adjustment assembly (40) includes a first yaw adjustment column (41) and a second yaw adjustment column (42), which are respectively disposed at both ends of the adjusting seat (21) along the first direction; At least one of the first yaw adjustment column (41) and the second yaw adjustment column (42) can extend and retract relative to the adjustment seat (21) along its own axis to drive the adjustment seat (21) to yaw about the central axis; The first direction is set at an angle to the vertical direction.

5. The wafer loader according to claim 4, characterized in that, The yaw adjustment assembly (40) further includes a mounting base (43) and a first locking member (44). The mounting base (43) is disposed on the support base (22) and is spaced apart from the adjustment base (21) along a second direction. The first yaw adjustment column (41) and the second yaw adjustment column (42) are respectively rotatably connected to a mounting base (43) and respectively connected to a first locking member (44). Each first locking member (44) is used to lock the corresponding first yaw adjustment column (41) and the second yaw adjustment column (42) relative to their respective mounting base (43). The second direction, the first direction, and the vertical direction are set at angles to each other.

6. The wafer loader according to claim 1, characterized in that, The wafer loader also includes an angle limiting component (50) disposed on the support base (22); The angle limiting component (50) includes at least two limiting blocks (51), which are respectively disposed at both ends of the support base (22) along the first direction, and each limiting block (51) can abut against the adjusting base (21).

7. The wafer loader according to any one of claims 1 to 6, characterized in that, The wafer loader also includes a leveling component (60) connected to the support base (22), the leveling component (60) being used to drive the support base (22) to generate an offset in the vertical direction.

8. The wafer loader according to any one of claims 1 to 6, characterized in that, The assembly structure (20) further includes a locking structure (70), which is detachably connected to the adjusting seat (21) and the supporting seat (22) for locking the adjusting seat (21) to the supporting seat (22).

9. The wafer loader according to claim 8, characterized in that, The adjusting seat (21) has a central axis, and one of the adjusting seat (21) and the support seat (22) is provided with a guide hole (201), which is arranged in an arc around the central axis; The locking structure (70) includes a locking post (71) that passes through the guide hole (201) and is connected to the other of the adjusting seat (21) and the support seat (22). The locking post (71) is capable of pressing against the edge of the guide hole (201) away from the other.

10. A wafer inspection system, characterized in that, include: The testing device is equipped with a feeding channel; The wafer loader according to any one of claims 1 to 9 is disposed in the testing device and located at the feeding channel; A transport device, located in the testing device, is used to transport the wafers stored in the wafer loader from the feeding channel.

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