Industrial X-ray wafer detection mechanism

Abstract

The utility model discloses an industrial X-ray wafer detection mechanism, and relates to the technical field of wafer detection. The X-ray imaging device comprises a bottom frame, an X-ray source is fixedly installed in the bottom frame, a position moving mechanism is arranged on the top face of the bottom frame, and a platform is arranged on a movable portion of the position moving mechanism. According to the utility model, through cooperative work of the position moving mechanism and the rotating mechanism, movement and rotation of the wafer in the X direction and the Y direction can be realized, so that the X-ray source can comprehensively detect the wafer from different angles, thereby effectively detecting short-circuit and open-circuit conditions of an internal circuit of the wafer and welding quality; the X-ray detector and the X-ray source are correspondingly arranged, so that the projection of the X-ray after penetrating through the wafer can be quickly received, the efficient detection process is realized, the time and error of manual operation are reduced and reduced through automatic control, the detection efficiency and accuracy are improved, and the efficiency of the whole production process is favorably improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection technical field, concretely relates to an industrial X ray wafer detection mechanism. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer quality detection is an important link to ensure chip performance and reliability. In existing wafer detection technology, industrial cameras and other visual detection equipment are widely used for qualified detection of wafers. These devices mainly capture images of the wafer surface, use image processing algorithms to identify and analyze defects on the wafer surface, such as scratches, particle contamination, pattern defects, etc. However, these visual-based detection methods have certain limitations, especially when detecting short circuits and open circuits of internal circuits of wafers.

[0003] Since industrial cameras and other visual detection equipment can only detect defects on the surface of the wafer, the internal circuit structure of the wafer cannot be effectively detected, and defects such as short circuits and open circuits of the internal circuit of the wafer are often hidden inside the wafer and cannot be directly discovered by surface observation. These internal defects may cause performance degradation, functional failure, etc. of the chip during use, seriously affecting the reliability and service life of the chip.

[0004] Therefore, an industrial X ray wafer detection mechanism is proposed. SUMMARY

[0005] The purpose of the utility model is to solve the problems raised in the background art, and the utility model provides an industrial X ray wafer detection mechanism.

[0006] The utility model discloses a specific technical scheme to achieve the above purpose:

[0007] An industrial X ray wafer detection mechanism includes a bottom frame, an X ray source is fixedly installed inside the bottom frame, a position moving mechanism is arranged on the top surface of the bottom frame, and a movable part of the position moving mechanism is provided with a platform to move the wafer in X and Y directions through the position moving mechanism. A rotating mechanism is arranged on the platform, and a detection table is fixedly installed on the rotating part of the rotating mechanism. Two sets of fixing assemblies are arranged on the top surface of the detection table to fix the wafer through the two sets of fixing assemblies. An X ray detector is fixedly installed on the bottom frame through an L side frame.

[0008] Further, the position moving mechanism includes a first electric linear guide rail fixedly installed on the top surface of the bottom frame, and a movable frame is fixedly installed on the movable part of the first electric linear guide rail. A second electric linear guide rail is fixedly installed on the top surface of the movable frame, and the platform is fixedly installed above the second electric linear guide rail.

[0009] Further, the rotating mechanism comprises a motor mounting frame fixedly installed on the platform, the top surface of the motor mounting frame is fixedly connected with a speed reducer, the output end of the speed reducer is fixedly installed with a synchronous wheel, the top surface of the platform is rotatably installed with two groups of limiting wheels, the top surface of the platform is rotatably installed with an annular belt wheel, the synchronous wheel, the annular belt wheel and the two groups of limiting wheels are sleeved with a synchronous belt, and the detection table is fixedly installed on the top surface of the annular belt wheel.

[0010] Further, the fixing assembly comprises two groups of side plates fixedly installed on the top surface of the detection table and symmetrically arranged, the end surface of the side plate is fixedly installed with an electric push rod, the end of the electric push rod is fixedly installed with a clamping block, and the end surface of the clamping block is fixedly installed with a guide rod, and the guide rod and the side plate are movably inserted.

[0011] Further, the X-ray detector and the X-ray source are correspondingly arranged, and the X-ray detector is located directly above the X-ray source and the wafer.

[0012] Further, the other end of the clamping block is in a V-shaped opening structure, and when the wafer is fixed, the wafer is located in the V-shaped opening on the surface of the clamping block.

[0013] The beneficial effects of the utility model are as follows:

[0014] Through the cooperative work of the position moving mechanism and the rotating mechanism, the movement and rotation of the wafer in the X and Y directions can be realized, so that the X-ray source can comprehensively detect the wafer from different angles, thereby effectively detecting the short circuit, open circuit condition and welding quality of the internal circuit of the wafer.

[0015] Through the corresponding arrangement of the X-ray detector and the X-ray source, the projection of the X-ray after penetrating the wafer can be quickly received, the efficient detection process is realized, the time and error of manual operation are reduced through automatic control, the detection efficiency and accuracy are improved, and the efficiency of the whole production process is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 is the three-dimensional structure schematic diagram of the utility model;

[0017] Fig. 2 is the front view of the utility model;

[0018] Fig. 3 is the partial front view of the utility model;

[0019] Mark No. : 1, bottom frame; 2, X-ray source; 3, position moving mechanism; 301, first electric linear guide rail; 302, movable frame; 303, second electric linear guide rail; 4, platform; 5, rotating mechanism; 501, motor mounting frame; 502, electric motor; 503, synchronous wheel; 504, limit wheel; 505, ring pulley; 506, synchronous belt; 6, detection table; 7, fixing assembly; 701, side plate; 702, electric push rod; 703, clamping block; 704, guide rod; 8, X-ray detector. DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the following will be a clear and complete description of the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0022] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the embodiments of the present application, it should be noted that the directions or position relationships indicated by the terms "inner", "outer", "upper", etc. are based on the directions or position relationships shown in the drawings, or the directions or position relationships commonly placed when the product of the present application is used, which are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular direction, be constructed and operated in a particular direction, therefore, cannot be understood as a limitation on the present application.

[0024] As Figs. 1 to 3As shown, an industrial X-ray wafer detection mechanism includes a bottom frame 1, an X-ray source 2 fixedly installed inside the bottom frame 1, a position moving mechanism 3 arranged on the top surface of the bottom frame 1, and a platform 4 arranged on the movable part of the position moving mechanism 3, so as to move the wafer in the X and Y directions through the position moving mechanism 3. A rotating mechanism 5 is arranged on the platform 4, and a detection table 6 is fixedly installed on the rotating part of the rotating mechanism 5. Two sets of fixing assemblies 7 are arranged on the top surface of the detection table 6, so as to fix the wafer through the two sets of fixing assemblies 7. An X-ray detector 8 is fixedly installed on the bottom frame 1 through an L-shaped frame. More specifically, the wafer is clamped and fixed on the top surface of the detection table 6 through the fixing assemblies 7, so that the wafer is located above the output end of the X-ray source 2. The platform 4 and the wafer fixed on the detection table 6 are moved in the X and Y directions through the position moving mechanism 3. The wafer and the detection table 6 can be rotated through the rotating mechanism 5. The wafer can be comprehensively detected through the X-ray source 2. The X-ray detector 8 receives the projection of the X-ray passing through the object, so as to detect the welding condition of the wafer through the line, and the short circuit and open circuit conditions of the internal circuit of the wafer.

[0025] The position moving mechanism 3 includes a first electric linear guide rail 301 fixedly installed on the top surface of the bottom frame 1, a movable frame 302 fixedly installed on the movable part of the first electric linear guide rail 301, a second electric linear guide rail 303 fixedly installed on the top surface of the movable frame 302, and the platform 4 fixedly installed above the second electric linear guide rail 303. More specifically, the wafer on the movable frame 302, the second electric linear guide rail 303, the platform 4 and the detection table 6 can be moved in the X direction through the first electric linear guide rail 301. The wafer on the platform 4 and the detection table 6 can be moved in the Y direction through the second electric linear guide rail 303.

[0026] The rotating mechanism 5 includes a motor mounting frame 501 fixedly installed on the platform 4, an electric motor 502 fixedly connected to the top surface of the motor mounting frame 501 through a speed reducer, a synchronous pulley 503 fixedly installed on the output end of the speed reducer, two sets of limit pulleys 504 rotatably installed on the top surface of the platform 4, a ring belt pulley 505 rotatably installed on the top surface of the platform 4, a synchronous belt 506 sleeved on the synchronous pulley 503, the ring belt pulley 505 and the two sets of limit pulleys 504, and the detection table 6 fixedly installed on the top surface of the ring belt pulley 505. More specifically, the synchronous pulley 503 is driven to rotate through the electric motor 502 and the speed reducer. The ring belt pulley 505 is driven to rotate on the top surface of the platform 4 through the synchronous pulley 503 and the synchronous belt 506, so as to rotate the wafer. The synchronous belt 506 is limited through the limit pulleys 504.

[0027] The fixing assembly 7 comprises two groups of side plates 701 symmetrically arranged and fixedly installed on the top surface of the detection table 6, and the end surface of the side plate 701 is fixedly installed with an electric push rod 702, the end of the electric push rod 702 is fixedly installed with a clamping block 703, and the end surface of the clamping block 703 is fixedly installed with a guide rod 704, and the guide rod 704 and the side plate 701 are movably inserted. More specifically, the detection table 6 is placed on the wafer, and the clamping block 703 is driven to move laterally by the electric push rod 702, wherein the two groups of electric push rods 702 are synchronously arranged and extended, and the clamping block 703 is moved laterally by the two groups of electric push rods 702 to approach each other, so that the wafer is clamped and fixed by the clamping block 703.

[0028] The X-ray detector 8 and the X-ray source 2 are correspondingly arranged, and the X-ray detector 8 is located directly above the X-ray source 2 and the wafer. More specifically, the X-ray detector 8 and the X-ray source 2 are correspondingly arranged, so that the projection of the X-ray passing through the object can be received by the X-ray detector 8.

[0029] The other end of the clamping block 703 is in a V-shaped opening structure, and when the wafer is fixed, the wafer is located in the V-shaped opening on the surface of the clamping block 703. More specifically, the wafer on the top surface of the detection table 6 can be fixed by the V-shaped opening on the surface of the clamping block 703.

[0030] In summary: through the fixing assembly 7, the wafer is clamped and fixed on the top surface of the detection table 6, so that the wafer is located above the output end of the X-ray source 2, and through the position moving mechanism 3, the platform 4 and the wafer fixed on the detection table 6 are moved in the X and Y directions, and the detection table 6 and the wafer on the top surface thereof can be rotated by the rotating mechanism 5, so that the wafer can be comprehensively detected by the X-ray source 2, and the projection of the X-ray passing through the object can be received by the X-ray detector 8, so that the welding condition of the wire of the wafer and the short circuit and open circuit condition of the internal circuit of the wafer are detected.

[0031] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The protection scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An industrial X-ray wafer inspection mechanism, characterized by, The utility model relates to a kind of X-ray detection device, including bottom frame (1), the inside fixed mounting of the bottom frame (1) is equipped with X-ray source (2), the top surface of the bottom frame (1) is provided with position moving mechanism (3), and the movable part of position moving mechanism (3) is provided with platform (4), to realize the movement of wafer in X, Y direction by position moving mechanism (3), rotating mechanism (5) is provided on the platform (4), and detection table (6) is fixedly installed on the rotating part of rotating mechanism (5), the top surface of detection table (6) is provided with two groups of fixed components (7), to be fixed by two groups of fixed components (7) to wafer, X-ray detector (8) is fixedly installed on the bottom frame (1) by L side frame.

2. The industrial X-ray wafer inspection mechanism of claim 1, wherein, The position moving mechanism (3) includes a first electric linear guide rail (301) fixedly installed on the top surface of the bottom frame (1), and a movable frame (302) is fixedly installed on the movable part of the first electric linear guide rail (301), a second electric linear guide rail (303) is fixedly installed on the top surface of the movable frame (302), and the platform (4) is fixedly installed above the second electric linear guide rail (303).

3. The industrial X-ray wafer inspection mechanism of claim 1, wherein, The rotating mechanism (5) includes a motor mounting bracket (501) fixedly installed on the platform (4), and an electric motor (502) is fixedly connected to the top surface of the motor mounting bracket (501) through a speed reducer, a synchronous pulley (503) is fixedly installed on the output end of the speed reducer, two sets of limit wheels (504) are rotatably installed on the top surface of the platform (4), an annular pulley (505) is rotatably installed on the top surface of the platform (4), a synchronous belt (506) is sleeved on the synchronous pulley (503), the annular pulley (505) and the two sets of limit wheels (504), and the detection table (6) is fixedly installed on the top surface of the annular pulley (505).

4. The industrial X-ray wafer inspection mechanism of claim 1, wherein, The fixed component (7) includes two sets of side plates (701) fixedly installed on the top surface of the detection table (6) in a symmetrical manner, an electric push rod (702) is fixedly installed on the end surface of the side plate (701), a clamping block (703) is fixedly installed on the end of the electric push rod (702), a guide rod (704) is fixedly installed on the end surface of the clamping block (703), and the guide rod (704) and the side plate (701) are movably connected.

5. The industrial X-ray wafer inspection mechanism of claim 1, wherein, The X-ray detector (8) and the X-ray source (2) are correspondingly arranged, and the X-ray detector (8) is located directly above the X-ray source (2) and the wafer.

6. The industrial X-ray wafer inspection mechanism of claim 4, wherein, The other end of the clamping block (703) is in a V-shaped opening structure, and when the wafer is fixed, the wafer is located in the V-shaped opening on the surface of the clamping block (703).

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