Water-cooling heat dissipation display card
By designing a combination structure of heat dissipation plate, coolant tank and fan on the graphics card, the compatibility problem between the graphics card and water cooling kit is solved, achieving efficient heat dissipation and space saving for the graphics card.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-07
- Publication Date
- 2026-03-24
AI Technical Summary
Existing water cooling kits are not compatible with all graphics cards, and there is a problem with the mounting holes of the graphics card and the water cooling kit not matching, which makes it impossible to install the water cooling radiator and occupy computer case space.
Design a water-cooled graphics card that uses a combination structure of heat conduction plate, coolant tank, heat sink assembly and fan. The heat conduction plate on the motherboard of the graphics card is in contact with the CPU. Heat is transferred to the coolant tank through the heat conduction plate. The coolant absorbs heat and conducts it to the heat sink assembly through the heat conduction rod. The fan dissipates heat from the coolant tank to prevent the coolant from overheating.
It achieves efficient heat dissipation for the graphics card, eliminating the need for third-party water cooling kits and radiators, saving case space, and improving the overall heat dissipation capacity of the graphics card.
Smart Images
Figure CN224035860U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of display card, more specifically, relate to a water cooling heat dissipation display card. BACKGROUND
[0002] The display card full name display interface card, also called display adapter, is one of the most basic configuration, the most important accessory of computer, along with the computing ability of computer display card gradually strengthens, the power consumption of display card is bigger and bigger, the heat quantity is also bigger and bigger.
[0003] The existing water cooling kit mostly only has the help of third party organization to customize or says third party organization to sell some popular model display card's water cooling kit by opening mould, this makes the water cooling kit not all display cards can be adapted, part display card is used to install the hole site of water cooling kit, and after the installation of display card and the cold head in water cooling kit, still want to install water cooling row to the appropriate position, and the different of computer case, often due to the restriction of interface or water cooling pipe length, makes the display card after fixing, water cooling row can not be installed. UTILITY MODEL CONTENT
[0004] In view of the above-mentioned defects of prior art, provide a kind of water cooling heat dissipation display card.
[0005] The utility model solves the technical scheme that it adopts to its technical problem: a kind of water cooling heat dissipation display card, including display card mainboard, the heat conduction plate that is in abutment with the CPU of display card mainboard is provided on display card mainboard, cooling liquid tank is provided on the top surface of heat conduction plate, cooling liquid tank is provided with the fin group in the upper of display card mainboard on the opposite two side walls, each group of fin group is provided with heat conduction rod, heat conduction rod is inserted into cooling liquid tank, shell is provided on the upper of display card mainboard, fan is provided on shell and is used to the heat dissipation of cooling liquid tank.
[0006] As preferred, each group of fin group includes a plurality of fins, a plurality of fins are arranged at equal intervals, and the end of the heat conduction rod away from the cooling liquid tank penetrates through the plurality of fins of the corresponding fin group.
[0007] As preferred, a water outlet is provided on the cooling liquid tank, and a water valve is provided on the water outlet.
[0008] As preferred, a fin group is also provided on the top surface of the cooling liquid tank.
[0009] As preferred, the plurality of fin groups are integrally formed with the cooling liquid tank.
[0010] As preferred, a heat conduction medium is provided on the bottom surface of the heat conduction plate, and the heat conduction medium is used to contact the CPU of the display card mainboard and conduct heat to the heat conduction plate.
[0011] Preferably, the heat-conducting rod and the cooling liquid tank are made of aluminum alloy or copper alloy.
[0012] Preferably, the heat-conducting rod and the cooling liquid tank are welded.
[0013] The utility model discloses a heat-conducting plate, cooling liquid tank, heat-conducting rod, radiator group and fan are arranged on the heat-conducting plate, and the heat-conducting plate is arranged on the cooling liquid tank, and the heat-conducting rod is arranged on the radiator group. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is the whole front structure schematic diagram of the utility model embodiment;
[0015] Figure 2 It is the whole back structure schematic diagram of the utility model embodiment.
[0016] Reference signs: 1, video card mainboard, 2, heat-conducting plate, 3, cooling liquid tank, 4, radiator, 5, heat-conducting rod, 6, shell, 7, fan, 8, water valve. DETAILED DESCRIPTION
[0017] In order to make the utility model embodiment's purpose, technical scheme and advantage more clear, below will combine the technical scheme in the utility model embodiment to be clear, complete to be described, obviously, the described embodiment is the part embodiment of the utility model, instead of all embodiments. Based on the embodiment of the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the protection scope of the utility model, and in addition, the direction language mentioned in the utility model, for example, "up", "down", "front", "back", "left", "right", "inside", "outside" etc. are only reference attached drawing direction, and the direction language used is to better, more clearly illustrate and understand the utility model, and is not instructive or implied that the utility model must have the orientation, therefore can not be understood as the restriction of the utility model.
[0018] The utility model embodiment such as Figures 1 to 2As shown in the middle, a water-cooled heat dissipation graphics card, including the graphics card mainboard, the graphics card mainboard 1 is provided with the heat conduction plate 2 which is in contact with the CPU of the graphics card mainboard 1, the heat conduction plate 2 is made of copper alloy material, the copper alloy has good heat conductivity and does not rust, the top surface of the heat conduction plate 2 is provided with the cooling liquid tank 3, the cooling liquid in the cooling liquid tank 3 is distilled water or special water cooling liquid, such as EKWB, Mayhems and other manufacturers of premixed water cooling liquid, the opposite two side walls of the cooling liquid tank 3 are provided with the fin group above the graphics card mainboard 1, two groups of fin groups are arranged on the left and right side walls of the cooling liquid tank 3, the CPU of the graphics card mainboard 1 is close to the right side of the top surface of the graphics card mainboard 1, at this time, the right side of the fin group is shorter than the left side of the fin group, each of the fin groups is provided with the heat conduction rod 5, the heat conduction rod 5 penetrates into the cooling liquid tank 3, the graphics card mainboard 1 is provided with the shell 6 above the cooling liquid tank 3, the shell 6 is provided with the fan 7 which is used for dissipating heat for the cooling liquid tank 3, preferably, the fan 7 is provided with two, two fans 7 are respectively located above the cooling liquid tank 3 and above the left side of the fin group, two fans 7 respectively improve the heat dissipation capacity of the cooling liquid tank 3 and the left side of the fin group, so as to avoid the cooling liquid in the cooling liquid tank 3 being too high in temperature, maintain the heat dissipation capacity of the graphics card, at the same time, two fans 7 can also dissipate heat for the heat of other positions of the graphics card mainboard 1, improve the overall heat dissipation capacity of the graphics card.
[0019] The heat of the graphics card mainboard 1 is transmitted to the cooling liquid tank 3 through the heat conduction plate 2, the cooling liquid in the cooling liquid tank 3 absorbs heat to cool the graphics card mainboard 1, at the same time, the heat conduction rod 5 conducts the heat of the cooling liquid to the fin group, the fan 7 dissipates heat for the cooling liquid tank 3, through the fin group and the fan 7, the cooling liquid in the cooling liquid tank 3 is prevented from being overheated, so as to ensure the heat dissipation effect of the graphics card, at the same time, the air volume of the fan 7 blowing to the position outside the cooling liquid tank 3 also plays a role in heat dissipation, the graphics card does not need to install the water cooling kit of the third party organization, and does not need to additionally install the water cooling row and the water cooling pipe, so as to save the internal space of the computer case.
[0020] Further improvement, as shown in Figure 1 and Figure 2 Each of the fin groups comprises a plurality of fins 4, a plurality of the fins 4 are arranged at equal intervals, the fins 4 extend in the left and right directions, a plurality of the fins 4 are arranged at equal intervals in the front and back directions, at this time, the fins 4 on the right side are shorter than the fins 4 on the left side, one end of the heat conduction rod 5 away from the cooling liquid tank 3 penetrates through a plurality of the fins 4 of the corresponding fin group, preferably, the heat conduction rod 5 is provided with three, two heat conduction rods 5 are respectively located on the left and right sides of the left side of the fin group, at the same time, two heat conduction rods 5 respectively penetrate into the cooling liquid tank 3 from the front and back side walls of the cooling liquid tank 3, the remaining one heat conduction rod 5 is located on the right side of the fin group, through the three heat conduction rods 3, the ability of the cooling liquid to conduct heat to the fin group is improved.
[0021] Further improvement, as shown in Figure 1 The cooling liquid tank 3 is provided with a water outlet, and the water valve 8 is arranged on the water outlet. The cooling liquid in the cooling liquid tank 3 is replaced through the water valve 8.
[0022] Further improvement, as shown in Figure 1 And Figure 2 The top surface of the cooling liquid tank 3 is also provided with a heat dissipation fin group, which further improves the heat dissipation capacity of the cooling liquid tank 3, ensures that the cooling liquid is at a lower temperature, and ensures the heat dissipation capacity of the graphics card.
[0023] Further improvement, as shown in Figure 1 And Figure 2 The plurality of heat dissipation fin groups are integrally formed with the cooling liquid tank 3, so as to avoid the gap between the heat dissipation fin 4 of the heat dissipation fin group and the cooling liquid tank 3, and avoid the influence of the gap on the heat dissipation capacity.
[0024] Further improvement, as shown in Figure 1 And Figure 2 The bottom surface of the heat conduction plate 2 is provided with a heat conduction medium, which is used to contact the CPU of the graphics card mainboard 1 and conduct heat to the heat conduction plate 2. The heat conduction medium is any one of heat conduction silica gel sheet, heat conduction silicone grease or heat conduction sticker. The heat conduction medium fills the small gap between the CPU of the graphics card mainboard 1 and the heat conduction plate 2, reduces the air heat resistance, improves the heat conduction efficiency, and is insulated to avoid the short circuit of the graphics card mainboard 1.
[0025] Further improvement, as shown in Figure 1 And Figure 2 The heat conduction rod 5 and the cooling liquid tank 3 are made of aluminum alloy or copper alloy, which has good heat conduction and does not rust.
[0026] Further improvement, as shown in Figure 1 And Figure 2 Figure 1 Figure 2 The heat conduction rod 5 and the cooling liquid tank 3 are welded and connected, so as to be sealed and prevent the cooling liquid in the cooling liquid tank 3 from leaking.
[0027] It should be understood that those skilled in the art can make improvements or changes according to the above description, and all these improvements and changes shall belong to the protection scope of the appended claims of the utility model.
Claims
1. A water-cooled graphics card, comprising a graphics card motherboard, characterized in that, The graphics card motherboard has a heat-conducting plate that abuts against the CPU of the graphics card motherboard; a coolant tank is provided on the top surface of the heat-conducting plate; heat sinks are provided on the two opposite side walls of the coolant tank, located above the graphics card motherboard; each heat sink group is provided with a heat-conducting rod; the heat-conducting rod extends into the coolant tank; a shell is provided on the graphics card motherboard, located above the coolant tank; a fan for cooling the coolant tank is provided on the shell.
2. The water-cooled graphics card according to claim 1, characterized in that, Each heat sink group includes multiple heat sinks; the multiple heat sinks are arranged at equal intervals; the end of the heat-conducting rod away from the coolant tank passes through multiple heat sinks of the corresponding heat sink group.
3. A water-cooled graphics card according to claim 1, characterized in that, The coolant tank is provided with a water outlet; a water valve is provided with the water outlet.
4. A water-cooled graphics card according to claim 1, characterized in that, The top surface of the coolant tank is also equipped with a heat sink assembly.
5. A water-cooled graphics card according to claim 4, characterized in that, The multiple heat sink assemblies are integrally formed with the coolant tank.
6. A water-cooled graphics card according to claim 1, characterized in that, A heat-conducting medium is provided on the bottom surface of the heat-conducting plate. The heat-conducting medium is used to contact the CPU of the graphics card motherboard and conduct heat to the heat-conducting plate.
7. A water-cooled graphics card according to claim 1, characterized in that, Both the heat-conducting rod and the coolant tank are made of aluminum alloy or copper alloy.
8. A water-cooled graphics card according to claim 7, characterized in that, The heat-conducting rod is welded to the coolant tank.