Inductor framework with good heat dissipation effect
By designing a combined structure of the first and second frames, the problems of copper wire waste and heat generation when increasing the number of coil turns in the inductor are solved, resulting in an inductor frame with high permeability and heat dissipation, thus extending the product's service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-03-24
AI Technical Summary
Increasing the number of coil turns to improve the inductance of existing inductors leads to wasted copper wire, increased size, increased resistance, and excessive heat generation, affecting inductor performance and the normal operation of electronic products.
The design employs a first and second frame, with the bent end of the second frame protruding outward to form an arch, increasing magnetic permeability and reducing the amount of copper wire used. At the same time, heat dissipation holes and supports are opened on both to improve heat dissipation efficiency. Through a multi-layer stacked structure, the magnetic permeability and heat dissipation effect are improved without increasing the volume.
This technology improves permeability and heat dissipation without increasing inductor size, reduces copper wire usage, lowers DC resistance of copper wire, and extends product lifespan.
Smart Images
Figure CN224036202U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of inductance framework, especially an inductance framework with good heat dissipation effect. BACKGROUND
[0002] The inductor is a kind of element that can convert electrical energy into magnetic energy and store it, and its structure is similar to transformer, but only one winding, inductor has certain inductance, only hinders the change of current, when inductor is in the state of no current passing, circuit is connected, it will try to hinder current passing, and in the state of current passing, circuit is disconnected, it will try to maintain the invariance of current, inductor is also called choke, reactor or dynamic reactor;
[0003] The existing inductor has common defects, such as increasing the number of turns of coil will waste a large amount of copper wire, increase the volume of inductance, and does not conform to the design mainstream of electronic product, on the other hand, increasing the number of turns of coil will further increase the resistance value of copper number, the heat generation of inductance is too large when working, which affects the normal work of electronic product, and reduces inductance value, which affects inductance performance. SUMMARY
[0004] This part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the utility model name to avoid obscuring the purpose of this part, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.
[0005] To solve the problems proposed above, the utility model provides the following technical scheme:
[0006] An inductance framework with good heat dissipation effect includes first framework and;
[0007] The bent end of the second framework protrudes into the cavity, the second mounting end of the second framework is connected with the first mounting end of the first framework, the first framework and the second framework are both provided with heat dissipation holes, and both ends of the two are provided with supports, and a plurality of first frameworks are arranged on the second mounting end.
[0008] On the basis of the above technical scheme, the utility model can also be improved as follows.
[0009] As a preferred scheme of the inductance framework with good heat dissipation effect, wherein: the first mounting end is a gap with equal intervals on the side edge of the first framework.
[0010] As a preferred scheme of the inductance framework with good heat dissipation effect, wherein: the second mounting end is an adaptive slot with equal intervals on the thick block at both ends of the bent end.
[0011] As a preferred scheme of the inductance skeleton with good heat dissipation effect of the utility model, wherein: the gap divides the side into a plurality of inserts, the insert is sleeved in the adaptive slot.
[0012] As a preferred scheme of the inductance skeleton with good heat dissipation effect of the utility model, wherein: the gap divides the side into a plurality of inserts, the insert is sleeved in the adaptive slot.
[0013] As a preferred scheme of the inductance skeleton with good heat dissipation effect of the utility model, wherein: the gap divides the side into a plurality of inserts, the insert is sleeved in the adaptive slot.
[0014] As a preferred scheme of the inductance skeleton with good heat dissipation effect of the utility model, wherein: the gap divides the side into a plurality of inserts, the insert is sleeved in the adaptive slot.
[0015] As a preferred scheme of the inductance skeleton with good heat dissipation effect of the utility model, wherein: the gap divides the side into a plurality of inserts, the insert is sleeved in the adaptive slot.
[0016] The utility model discloses a beneficial effect is: the second skeleton's bending end projects outward and forms the arch, this not only improves the anti-winding tension of whole skeleton, also allows reducing the thickness of second skeleton, thereby improves the heat dissipation effect, in addition, the design of projecting outward increases the volume of second skeleton, further improves the magnetic permeability, and the first skeleton is installed with second skeleton through a plurality of single thin superposition mode, like this can further increase the magnetic permeability under the condition of not expanding the volume of whole skeleton, and the multilayer superposition also helps to improve the heat dissipation effect, therefore, this inductance skeleton not only has strong support structure and higher magnetic permeability, but also can reduce the amount of copper wire while producing same magnetic guide value. ACCURATE DRAWINGS
[0017] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be briefly introduced to the drawing needed to be used in the embodiment description, obviously, the drawing in the following description is only some embodiments of the utility model, for the ordinary skilled person in the art, under the premise of not paying the creative labor, can also obtain other drawings according to these drawings. Among them:
[0018] Figure 1 It is the perspective view of the whole embodiment.
[0019] Figure 2 It is the perspective view of the first two skeletons of the embodiment.
[0020] Figure 3 It is the partial perspective view of the embodiment. Figure 1
[0021] Figure 4 It is the embodimentFigure 1 Partial 3D view.
[0022] Figure 5 This is a schematic diagram of the first and second skeletons assembly in this embodiment.
[0023] Figure 6 This is an example. Figure 5 Partial 3D view.
[0024] In the diagram; first frame 100, second frame 200, support 300;
[0025] First mounting end 101, side 101a, insert 101b, gap 101c, connecting block 101e, first heat dissipation hole 102;
[0026] Second mounting end 201, thick block 201a, adapter slot 201b, second heat dissipation hole 202, bending end 203. Detailed Implementation
[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0028] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.
[0029] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.
[0030] Example
[0031] Reference Figures 1 to 6 This is an embodiment of the present invention, which provides an inductor frame with good heat dissipation, including a first frame 100 and;
[0032] The bent end 203 of the second frame 200 protrudes from the cavity 400. The second mounting end 201 of the second frame 200 is connected to the first mounting end 101 of the first frame 100. Both the first frame 100 and the second frame 200 are provided with heat dissipation holes, and both ends of the first frame 100 are provided with brackets 300. Several first frames 100 are arranged at the second mounting end 201.
[0033] Specifically, the bending end 203 of the second skeleton 200 protrudes outward, and the surface thereof is an arc surface. When winding the coil, the bending end 203 of the second skeleton 200 bears the winding tension of the coil. Due to the curved characteristic of the arc surface, the tension acting on the arc surface can be uniformly distributed to the entire arc surface. Therefore, the thickness of the second skeleton 200 can be appropriately reduced to increase the surface heat dissipation efficiency.
[0034] Through the assembly form of the two second skeletons 200 and the two pairs of first skeletons 100, the first skeleton 100 can be arranged in a single sheet superimposed sheet shape on the second mounting end 201 of the second skeleton 200. Meanwhile, the heat dissipation grooves are arranged on the two skeletons at equal intervals to improve the heat dissipation efficiency. This not only improves the heat dissipation efficiency, but also increases the volume of the second skeleton 200 and increases the magnetic conductivity. Therefore, when the magnetic conductivity value reaches the set value, the number of turns of the copper wire is reduced, the copper consumption is reduced, the copper wire direct current impedance is reduced, the heat dissipation amount is reduced, and the product service life is prolonged.
[0035] Summary: The bending end 203 of the second skeleton protrudes outward to form an arch shape to improve the resistance of the copper wire to the winding tension of the overall skeleton. Therefore, the thickness of the second skeleton can be reduced to improve the heat dissipation effect. The outward protrusion can also increase the volume and increase the magnetic permeability. The first skeleton is arranged on the second skeleton in a plurality of single thin superimposed manner. While increasing the magnetic permeability, the volume of the overall skeleton is not expanded, and the heat dissipation effect is improved. Therefore, this inductor skeleton has a strong support structure and a strong magnetic permeability, which can produce the same magnetic conductivity value while reducing the amount of copper wire.
[0036] As shown in Figures 1-4 , Figure 6 , the first mounting end 101 is a gap 101c arranged at equal intervals on the side 101a of the first skeleton 100. The second mounting end 201 is an adaptive groove 201b arranged at equal intervals on the thick block 201a at both ends of the bending end 203. The gap 101c divides the side 101a into a plurality of insertion strips 101b. The insertion strip 101b is sleeved in the adaptive groove 201b. The gap 101c divides one first skeleton 100 at equal intervals.
[0037] The gap 101c divides the entire first skeleton 100 into a plurality of thin skeletons. The entire skeleton is composed of a solid connecting block 101e and a gap 101c, like a heat dissipation fin. This facilitates the processing of the first skeleton 100 and facilitates the installation of the first skeleton 100 in the adaptive groove 201b of the thick block 201a of the second skeleton 200.
[0038] As shown in Figure 1 , Figure 2As shown, the heat dissipation grooves formed on the first and second skeletons are, the heat dissipation holes formed on the first skeleton 100 are first heat dissipation holes 102, and the heat dissipation holes formed on the second skeleton 200 are second heat dissipation holes 202;
[0039] As shown, the bracket 300 is sleeved on both ends of the first and second skeletons 100 and 200, grooves are formed on the bracket 300 to facilitate clamping of the two ends of the first and second skeletons, and the grooves can be fixed by applying glue. When installing, first, the two first skeletons 100 are sleeved on the two second skeletons 200, then one bracket 300 is sleeved on one end of the first and second skeletons, and finally the other bracket 300 is installed on the other end of the two to form a complete inductor skeleton. Figure 1 Figure 5 As shown, the bracket 300 is sleeved on both ends of the first and second skeletons 100 and 200, grooves are formed on the bracket 300 to facilitate clamping of the two ends of the first and second skeletons, and the grooves can be fixed by applying glue. When installing, first, the two first skeletons 100 are sleeved on the two second skeletons 200, then one bracket 300 is sleeved on one end of the first and second skeletons, and finally the other bracket 300 is installed on the other end of the two to form a complete inductor skeleton.
[0040] Importantly, it should be noted that the constructions and arrangements of the present application shown in the various exemplary embodiments are merely illustrative. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter described in this application. For example, elements shown as integrally formed can be constructed of multiple parts or elements, the position of elements can be reversed or otherwise varied, and the nature or number of elements or positions can be altered or varied. Accordingly, all such modifications are intended to be included within the scope of the present application. The order or sequence of any process or method steps can be changed or re-sequenced without departing from the scope of the application. In the claims, any "means plus function" clause is intended to cover the structures described herein as performing the recited functionality, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes, and omissions can be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present application. Accordingly, the present application is not limited to particular embodiments described, but extends to various modifications that nevertheless fall within the scope of the appended claims.
[0041] Furthermore, in an effort to provide a concise description of exemplary embodiments, all features of an actual implementation can not be described (i.e., those unrelated to the best mode of practicing the present application currently contemplated).
[0042] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not limiting. Although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or replaced equivalently without departing from the spirit and scope of the technical solutions of the present application, and they should be covered in the scope of the claims of the present application.
Claims
1. An inductor frame with good heat dissipation, characterized in that: Including the first skeleton (100) and; The bent end (203) of the second frame (200) protrudes from the cavity (400). The second mounting end (201) of the second frame (200) is connected to the first mounting end (101) of the first frame (100). Both the first frame (100) and the second frame (200) are provided with heat dissipation holes, and both ends of the two are provided with brackets (300). Several first frames (100) are arranged at the second mounting end (201).
2. The inductor frame with good heat dissipation as described in claim 1, characterized in that: The first mounting end (101) is a gap (101c) that is equally spaced on the side (101a) of the first frame (100).
3. The inductor frame with good heat dissipation as described in claim 2, characterized in that: The second mounting end (201) is an adapter groove (201b) that is equally spaced on the thick blocks (201a) at both ends of the bent end (203).
4. The inductor frame with good heat dissipation as described in claim 3, characterized in that: The gaps (101c) divide the side (101a) into a number of inserts (101b), which are fitted into the adapter grooves (201b).
5. The inductor frame with good heat dissipation as described in claim 2, characterized in that: The gap (101c) divides one of the first skeletons (100) into equal intervals.
6. The inductor frame with good heat dissipation as described in claim 1, characterized in that: The heat dissipation hole opened on the first frame (100) is the first heat dissipation hole (102).
7. The inductor frame with good heat dissipation as described in claim 1, characterized in that: The heat dissipation holes opened on the second frame (200) are the second heat dissipation holes (202).
8. The inductor frame with good heat dissipation as described in claim 1, characterized in that: The bracket (300) is sleeved on both ends of the first frame (100) and the second frame (200).