Photovoltaic bypass module

Abstract

The utility model discloses a photovoltaic bypass module, which comprises a first conductor, a second conductor, a chip and a jumper wire, the side surfaces of the first conductor and the second conductor are oppositely arranged, one end of the first conductor close to the second conductor is a first end part, one end of the second conductor close to the first conductor is a second end part, a gap is formed between the first end part and the second end part; the first end part comprises a first extension part extending towards the direction of the second end part, and the second end part comprises a second extension part extending towards the direction of the first end part; the chip is arranged on the second extension part and is electrically connected with the second extension part; the jumper wire is arranged on the chip and is electrically connected with the chip, the jumper wire comprises a third extension part extending towards the direction of the first end part, and the third extension part is arranged on the first extension part and is electrically connected with the first extension part. The photovoltaic bypass module provided by the utility model is small in packaging size and low in manufacturing cost, and the maximum current allowed to pass through is larger.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar photovoltaic technical field especially relates to a photovoltaic bypass module. BACKGROUND

[0002] The photovoltaic bypass module is an important component in the photovoltaic module, and is mainly used for improving the reliability and efficiency of the photovoltaic system. When the current of a certain cell in the photovoltaic cell string is not matched due to shading, damage or performance degradation, the bypass module can provide a low-resistance bypass path for the cell, so that the current bypasses the faulty cell and continues to flow, thereby reducing the hot spot effect, protecting other normally working cells from damage, and maintaining the power generation efficiency of the entire photovoltaic module.

[0003] These modules usually contain one or more bypass diodes and conductors, which are designed to conduct under certain conditions to bypass the affected cell. In recent years, with the advancement of technology, the design of bypass modules has paid more and more attention to heat dissipation performance and miniaturization to meet the application requirements of high-power photovoltaic modules. At present, the distribution of diodes and conductors is as disclosed in the Chinese patent with publication number CN213212157U, the conductors are distributed on the left and right, the diode module is located between the two conductors, the chip is located on one of the conductors, and the jumper wire of the diode module is distributed on the left and right to connect the chip and the other conductor. This structure is simple in process and uniform in heat dissipation, but the width of the entire diode module will be relatively wide. If the jumper wire is made narrow, the creepage distance will not be enough, and at the same time, the stability of this design is not enough, and the diode module is easy to be broken.

[0004] The disclosure of the above background art content is only used to assist in understanding the concept and technical scheme of the utility model, which does not necessarily belong to the prior art of the present application, nor does it necessarily give technical teaching. In the absence of explicit evidence that the above content has been disclosed before the filing date of the present application, the above background art should not be used to evaluate the novelty and inventiveness of the present application. CONTENT OF THE UTILITY MODEL

[0005] The utility model aims at providing a photovoltaic bypass module, which has small packaging size, low manufacturing cost and larger maximum current allowed to pass.

[0006] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A photovoltaic bypass module, comprising a first conductor, a second conductor, a chip and a jumper wire, wherein:

[0008] The side surfaces of the first and second conductive bodies are oppositely arranged, one end of the first conductive body close to the second conductive body is a first end portion, one end of the second conductive body close to the first conductive body is a second end portion, and a gap is arranged between the first end portion and the second end portion;

[0009] The first end portion comprises a first extension portion extending towards the direction where the second end portion is located, and the second end portion comprises a second extension portion extending towards the direction where the first end portion is located;

[0010] The chip is arranged on the second extension portion and electrically connected with the second extension portion;

[0011] The jumper wire is arranged on the chip and electrically connected with the chip, and the jumper wire comprises a third extension portion extending towards the direction where the first end portion is located, and the third extension portion is arranged on the first extension portion and electrically connected with the first extension portion.

[0012] Further, any one of the above technical solutions or a combination of the above technical solutions, two sides of the first end portion are provided with first extension portions extending towards the direction where the second end portion is located, and a middle position of the second end portion is provided with a second extension portion extending towards the direction where the first end portion is located, and the second extension portion is arranged between the two first extension portions.

[0013] Two sides of the jumper wire comprise third extension portions extending towards the direction where the first end portion is located, and the two third extension portions are correspondingly arranged on the two first extension portions and electrically connected with the first extension portions.

[0014] Further, any one of the above technical solutions or a combination of the above technical solutions, further comprising a packaging body, and a packaging region of the packaging body comprises the first extension portion, the second extension portion, the chip and the jumper wire.

[0015] The packaging body comprises a first packaging portion, a second packaging portion and a third packaging portion, the first packaging portion is configured to package the chip and a region where the second extension portion is located;

[0016] The second and third packaging portions are connected with the first packaging portion respectively, and the second and third packaging portions are configured to package a region where one first extension portion is located respectively.

[0017] Further, any one of the above technical solutions or a combination of the above technical solutions, the second and third packaging portions extend towards the direction where the first end portion is located relative to the first packaging portion; or,

[0018] The second and third encapsulating portions extend towards the second end portion relative to the first encapsulating portion; or

[0019] The second and third encapsulating portions extend towards the first end portion relative to the first encapsulating portion on one side, and extend towards the second end portion relative to the first encapsulating portion on the other side.

[0020] Further, any one of the above technical solutions or a combination of the above technical solutions, a gap between the second extending portion and the first end portion is configured as a first threading hole, a first welding area is arranged on the first conductive body, the first threading hole is configured to pass through a first bus bar, and the first welding area is configured to be welded with the first bus bar.

[0021] A second threading hole is arranged on the second conductive body, a second welding area is arranged on the second conductive body, the second threading hole is configured to pass through a second bus bar, and the second welding area is configured to be welded with the second bus bar.

[0022] Further, any one of the above technical solutions or a combination of the above technical solutions, the first threading hole and the second threading hole are arranged on two sides of the encapsulating body.

[0023] An encapsulating area of the encapsulating body includes a part of the first threading hole and / or a part of the second threading hole.

[0024] Further, any one of the above technical solutions or a combination of the above technical solutions, the first threading hole and the second threading hole are arranged on two sides of the encapsulating body.

[0025] The encapsulating area of the encapsulating body includes a part of the first threading hole, and the encapsulating area of the encapsulating body does not exceed a side edge of the second threading hole close to the first end portion.

[0026] Further, any one of the above technical solutions or a combination of the above technical solutions, the first extending portion and / or the second extending portion are provided with an anti-pulling structure, and an encapsulating area of the encapsulating body includes the anti-pulling structure.

[0027] The anti-pulling structure includes a groove recessed towards a width direction of the photovoltaic bypass module and / or a protruding structure protruded towards the width direction of the photovoltaic bypass module.

[0028] Further, any one of the above technical solutions or a combination of the above technical solutions, a lower surface of the jumper is provided with a protruding block, and the protruding block is connected with an upper surface of the chip; and / or,

[0029] One or more first water channels are formed on the upper and / or lower surfaces of the first conductor; and / or,

[0030] The upper and / or lower surface of the second conductor is provided with one or more second water channels; and / or,

[0031] It also includes a package body configured to encapsulate a portion of the first conductor, a portion of the second conductor, a second end, a chip, and a jumper. The package body's encapsulation area includes the first extension, the second extension, the chip, and the jumper.

[0032] Furthermore, in accordance with any or a combination of the aforementioned technical solutions, the protrusion is provided with a through hole.

[0033] The beneficial effects of the technical solution provided by this utility model are as follows:

[0034] a. This utility model sets the opposite ends of the first conductor and the second conductor into a concave-convex mating structure including a first extension and a second extension, and sets the jumper for connecting the two conductors into a corresponding concave-convex structure. By using irregularly shaped jumpers to connect the two conductors, the creepage distance between the two conductors can be increased, thereby allowing a larger maximum current to pass through, and also improving the heat dissipation performance of the product.

[0035] b. The photovoltaic bypass module proposed in this utility model can reduce the width of the jumper and the package by changing the conventional rectangular package to an irregular structure that matches the first extension and the second extension. At the same time, the package has a structure that is narrow in the middle and wide on both sides, and the jumper is matched with the structure of the two conductors. The middle part and the two sides of the jumper extend in the direction of different conductors, which can save materials and improve the stability and heat dissipation of the entire module. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 A top view schematic diagram of an unencapsulated photovoltaic bypass module provided as an exemplary embodiment of the present invention;

[0038] Figure 2 An exploded view of an unencapsulated photovoltaic bypass module from a first angle, provided as an exemplary embodiment of the present invention;

[0039] Figure 3 An exploded schematic view of a second angle of an unpackaged photovoltaic bypass module is provided for one example embodiment of the present application;

[0040] Figure 4 A top view schematic view of a packaged photovoltaic bypass module is provided for one example embodiment of the present application;

[0041] Figure 5 A side view schematic view of a photovoltaic bypass module without a flow channel is provided for one example embodiment of the present application;

[0042] Figure 6 A side view schematic view of a photovoltaic bypass module with a flow channel is provided for one example embodiment of the present application.

[0043] Wherein, the reference signs include: 1-first conductor, 11-first extension, 111-groove, 12-first threading hole, 13-first welding area, 14-first flow channel, 2-second conductor, 21-second extension, 22-second threading hole, 211-protruding structure, 23-second welding area, 24-second flow channel, 3-chip, 4-jumper, 41-third extension, 42-protruding block, 421-through hole, 43-bending structure, 5-encapsulating body, 51-first encapsulating part, 52-second encapsulating part, 53-third encapsulating part. DETAILED DESCRIPTION

[0044] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by the person skilled in the art without making creative efforts should belong to the protection scope of the present application.

[0045] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, device, product or equipment including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or equipment.

[0046] In one embodiment of this utility model, a photovoltaic bypass module is provided, see [link to relevant documentation]. Figures 1 to 6 The photovoltaic bypass module includes a first conductor 1, a second conductor 2, a chip 3, a jumper 4, and a package 5.

[0047] The first conductor 1 and the second conductor 2 are arranged with their sides facing each other. The end of the first conductor 1 that is closer to the second conductor 2 is the first end, and the end of the second conductor 2 that is closer to the first conductor 1 is the second end. A gap is provided between the first end and the second end, that is, the first conductor 1 and the second conductor 2 do not contact each other, and an insulating gap is provided between them.

[0048] The first end portion includes a first extension portion 11 extending in the direction of the second end portion, and the second end portion includes a second extension portion 21 extending in the direction of the first end portion.

[0049] The chip 3 is disposed on the second extension 21 and electrically connected to the second extension 21. Preferably, the lower surface of the chip 3 is welded to the upper surface of the second extension 21 and electrically connected thereto.

[0050] The jumper 4 is disposed on the chip 3 and is electrically and soldered to the chip 3. The jumper 4 includes a third extension 41 extending in the direction of the first end, the third extension 41 being disposed on the first extension 11 and electrically and soldered to the first extension 11.

[0051] The package 5 is configured to encapsulate a portion of the first conductor 1, a portion of the second conductor 2, a second end, a chip 3, and a jumper 4. The encapsulation area of ​​the package 5 includes the first extension 11, the second extension 21, the chip 3, and the jumper 4.

[0052] In this embodiment, by setting the opposing ends of the first conductor 1 and the second conductor 2 to a concave-convex fit structure, and by setting the jumper 4 for connecting the two conductors to a corresponding concave-convex structure and connecting the two conductors front and back (along the photovoltaic bypass module), the creepage distance between the two conductors can be increased. Taking conductor 2 as an example, see [link to example]. Figure 1 The size that can be increased is Figure 2 The medium-sized d-section allows for an increase in the maximum current that can be passed through, and also improves the heat dissipation performance of the product. In addition, the photovoltaic bypass module proposed in this application can reduce the width of jumpers and the package, while the plastic package has a structure that is narrow in the middle and wide on both sides, which saves materials and improves the stability of the entire module.

[0053] In one embodiment of the utility model, a photovoltaic bypass module is provided, referring to Figure 5 And Figure 6 In the embodiment, the first end portion is provided with a first extension portion 11 extending to the direction of the second end portion, and the second end portion is provided with a second extension portion 21 extending to the direction of the first end portion, and the second extension portion 21 is arranged between the two first extension portions 11.

[0054] Referring to Figures 1 to 3 The jumper 4 is provided with a third extension portion 41 extending to the direction of the first end portion on both sides, and the two third extension portions 41 are arranged on the two first extension portions 11 correspondingly and are electrically connected with the first extension portions 11.

[0055] Referring to Figure 4 The encapsulating body 5 includes a first encapsulating portion 51, a second encapsulating portion 52 and a third encapsulating portion 53, the first encapsulating portion 51 is configured to encapsulate the chip 3 and the region where the second extension portion 21 is located. The second encapsulating portion 52 and the third encapsulating portion 53 are connected with the first encapsulating portion 51 respectively, and the second encapsulating portion 52 and the third encapsulating portion 53 are configured to encapsulate the region where one first extension portion 11 is located respectively.

[0056] In the embodiment, one side of the second encapsulating portion 52 and the third encapsulating portion 53 extends to the direction of the first end portion relative to the first encapsulating portion 51, and the other side of the second encapsulating portion 52 and the third encapsulating portion 53 extends to the direction of the second end portion relative to the first encapsulating portion 51. That is, the encapsulating body 5 composed of the first encapsulating portion 51, the second encapsulating portion 52 and the third encapsulating portion 53 is in the shape of H in the embodiment.

[0057] In the embodiment, the gap between the second extension portion 21 and the first end portion is configured as a first threading hole 12, so that the threading hole does not need to be processed on the first conductor 1, and the product manufacturing cost can be reduced. The first conductor 1 is provided with a first welding area 13, the first threading hole 12 is configured to pass through the first bus bar, and the first welding area 13 is configured to be welded and connected with the first bus bar.

[0058] The second conductor 2 is provided with a second threading hole 22, and the second conductor 2 is provided with a second welding area 23, the second threading hole 22 is configured to pass through the second bus bar, and the second welding area 23 is configured to be welded and connected with the second bus bar.

[0059] The first threading hole 12 and the second threading hole 22 are arranged on both sides of the middle part of the package 5. The packaging area of the package 5 includes the part of the first threading hole 12 and / or the part of the second threading hole 22. The packaging area of the package 5 includes the part of the first threading hole 12, and the packaging area of the package 5 does not exceed the side edge of the second threading hole 22 close to the first end.

[0060] The middle part of the jumper wire 4 is provided with an upward bending structure 43, the lower surface of the bending structure 43 is provided with a protrusion 42, the protrusion 42 is connected with the upper surface of the chip 3, a through hole 421 is arranged on the protrusion 42, the through hole 421 can improve the welding performance between the jumper wire and the second conductor and improve the firmness of the package of the jumper wire by the package.

[0061] In the embodiment, the first extension part 11 and the second extension part 12 are also provided with anti-pulling-off structures, and the packaging area of the package 5 includes the anti-pulling-off structures. The anti-pulling-off structures include grooves recessed in the width direction of the photovoltaic bypass module and / or protruding structures protruding in the width direction of the photovoltaic bypass module.

[0062] Preferably, the anti-pulling-off structures are arranged on both the first extension part 11 and the second extension part 21, and the anti-pulling-off structures on the two parts of the first extension part 11 and the second extension part 21 are correspondingly arranged. For example, as shown in Figure 5 The anti-pulling-off structure on the first extension part 11 is a groove 111, the anti-pulling-off structure on the second extension part 21 is a protruding structure 211, and the groove 111 and the protruding structure 211 are oppositely arranged. More preferably, the number of the groove 111 and the protruding structure 211 is multiple, and multiple groups of anti-pulling-off structures are arranged along the length direction of the photovoltaic bypass module.

[0063] It should be noted that the anti-pulling-off structure is not limited to this structure, and can also be other related matching special-shaped structures. Specifically, only the first extension part 11 and the second extension part 21 are oppositely arranged with the convex-concave matching structure or the tooth-shaped matching structure along the second direction, and after being packaged by the packaging glue, on the one hand, the contact area of the side edges of the first extension part 11 and the second extension part 21 with the glue and the heat dissipation area of the negative electrode are increased. In addition, since the first extension part 11 and the second extension part 21 are filled with glue, the convex-concave matching structure / wavy structure increases the resistance and pulling force of the glue, which can effectively achieve the anti-pulling-off effect.

[0064] In the embodiment, as shown in Figure 6As shown, the upper and / or lower surfaces of the first conductor 1 are provided with one or more first water channels 14; the upper and / or lower surfaces of the second conductor 2 are provided with one or more second water channels 24. Preferably, the multiple first / second water channels are wavy. In other embodiments, the first conductor 1 and the second conductor 2 may not be provided with water channels, such as... Figure 5 As shown.

[0065] In another embodiment of this utility model, unlike the “I” shape of the encapsulation body 5 in the above embodiment, the encapsulation body 5 in this embodiment is “]” shaped, that is, the second encapsulation part 52 and the third encapsulation part 53 both extend relative to the first encapsulation part 51 in the direction of the first end.

[0066] In another embodiment of this utility model, unlike the "I" or "]" shaped encapsulation body 5 described in the above embodiments, in this embodiment, the encapsulation body 5 is "[" shaped, and the second encapsulation part 52 and the third encapsulation part 53 both extend relative to the first encapsulation part 51 in the direction of the second end.

[0067] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0068] The above description is only a specific embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A photovoltaic bypass module, characterized in that, It includes a first conductor (1), a second conductor (2), a chip (3), and a jumper (4), wherein: The sides of the first conductor (1) and the second conductor (2) are arranged opposite each other. The end of the first conductor (1) closer to the second conductor (2) is the first end, and the end of the second conductor (2) closer to the first conductor (1) is the second end. A gap is provided between the first end and the second end. The first end portion includes a first extension portion (11) extending in the direction of the second end portion, and the second end portion includes a second extension portion (21) extending in the direction of the first end portion; The chip (3) is disposed on the second extension (21) and electrically connected to the second extension (21); The jumper (4) is disposed on the chip (3) and electrically connected to the chip (3). The jumper (4) includes a third extension (41) extending in the direction of the first end. The third extension (41) is disposed on the first extension (11) and electrically connected to the first extension (11).

2. The photovoltaic bypass module according to claim 1, characterized in that, The first end has a first extension (11) extending in the direction of the second end on both sides, and the second end has a second extension (21) extending in the direction of the first end at the middle position, and the second extension (21) is disposed between the two first extensions (11). The jumper (4) includes a third extension (41) on both sides extending in the direction of the first end. The two third extensions (41) are correspondingly disposed on the two first extensions (11) and electrically connected to the first extensions (11).

3. The photovoltaic bypass module according to claim 2, characterized in that, It also includes a package (5), the package area of ​​which includes the first extension (11), the second extension (21), the chip (3) and the jumper (4); The package (5) includes a first package (51), a second package (52) and a third package (53), wherein the first package (51) is configured to package the area where the chip (3) and the second extension (21) are located; The second encapsulation portion (52) and the third encapsulation portion (53) are respectively connected to the first encapsulation portion (51), and the second encapsulation portion (52) and the third encapsulation portion (53) are respectively configured to encapsulate an area where the first extension portion (11) is located.

4. The photovoltaic bypass module according to claim 3, characterized in that, Both the second encapsulation portion (52) and the third encapsulation portion (53) extend relative to the first encapsulation portion (51) in the direction of the first end; or, Both the second encapsulation portion (52) and the third encapsulation portion (53) extend relative to the first encapsulation portion (51) in the direction of the second end; or, One side of the second encapsulation portion (52) and the third encapsulation portion (53) extends relative to the first encapsulation portion (51) in the direction of the first end, and the other side of the second encapsulation portion (52) and the third encapsulation portion (53) extends relative to the first encapsulation portion (51) in the direction of the second end.

5. The photovoltaic bypass module according to claim 3, characterized in that, The gap between the second extension (21) and the first end is configured as a first through hole (12), and a first welding area (13) is provided on the first conductor (1). The first through hole (12) is configured to allow the first busbar to pass through, and the first welding area (13) is configured to be welded to the first busbar. The second conductor (2) is provided with a second through hole (22) and a second welding area (23). The second through hole (22) is configured to allow the second busbar to pass through, and the second welding area (23) is configured to be welded to the second busbar.

6. The photovoltaic bypass module according to claim 5, characterized in that, The first wire hole (12) and the second wire hole (22) are disposed on both sides of the package (5); The encapsulation area of ​​the package (5) includes a portion of the first wire hole (12) and / or a portion of the second wire hole (22).

7. The photovoltaic bypass module according to claim 5, characterized in that, The first wire hole (12) and the second wire hole (22) are disposed on both sides of the package (5); The encapsulation area of ​​the package (5) includes a portion of the first through hole (12), and the encapsulation area of ​​the package (5) does not exceed the side of the second through hole (22) near the first end.

8. The photovoltaic bypass module according to claim 3, characterized in that, The first extension (11) and / or the second extension (21) are provided with an anti-pull-out structure, and the encapsulation area of ​​the package (5) includes the anti-pull-out structure; The anti-pull-out structure includes a groove recessed in the width direction of the photovoltaic bypass module and / or a protruding structure protruding in the width direction of the photovoltaic bypass module.

9. The photovoltaic bypass module according to claim 1, characterized in that, The lower surface of the jumper (4) is provided with a bump (42), which abuts against the upper surface of the chip (3); and / or, The upper and / or lower surfaces of the first conductor (1) are provided with one or more first water channels (14); and / or, The upper and / or lower surfaces of the second conductor (2) are provided with one or more second water channels (24); and / or, It also includes a package (5), the package area of ​​which includes the first extension (11), the second extension (21), the chip (3) and the jumper (4).

10. The photovoltaic bypass module according to claim 9, characterized in that, The protrusion (42) is provided with a through hole (421).

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