PCB electroplating floating frame
By increasing the height of the floating frame side plate and optimizing the position of the through holes, the problem of uneven copper thickness of the plated parts was solved, resulting in higher copper thickness uniformity and circuit board yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-08
- Publication Date
- 2026-03-24
AI Technical Summary
The existing PCB electroplating floating frame causes a large difference in copper thickness between the upper and lower parts of the plated part, which affects the yield of the circuit board and the etching quality.
By increasing the height of the uprights on both sides of the floating frame to 22-24cm and setting through holes in the area from the top surface of the side plates to a distance of 7-8cm from the top surface, the position and distribution of the through holes are optimized, thereby increasing the shielding area of the high-potential region and distributing the electric lines more evenly.
The problem of extremely different copper thickness at the top and bottom of the plated parts has been improved, and the copper thickness uniformity has been improved to ≤9μm, thus improving the yield of circuit boards.
Smart Images
Figure CN224037578U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a circuit board processing equipment technical field, concretely relates to a PCB electroplating float frame. BACKGROUND
[0002] In the PCB circuit board manufacturing process, the need of different levels of conduction and subsequent hardware and other parts plug-in, first need to drill on the substrate, then in the electroplating process through the chemical catalytic reduction method on the hole wall and surface of the base material (including resin and glass fiber) deposit a layer of copper to make it have conductivity, then after electroplating thickening, realize the electrical interconnection between layers, and can improve the mechanical strength and current carrying capacity as the through hole, reduce the risk of heating and open circuit.
[0003] The uniformity of copper thickness in the electroplating copper process has a great influence on the subsequent circuit etching, which determines whether the line width and line spacing after circuit etching meet the customer's demand and whether it affects the customer's functional problems. During electroplating, the plated metal is connected to the anode, the plated part is connected to the cathode, and the electrolyte solution of the plated metal ion is connected between the anode and the cathode. The plated part is fixed by the electroplating float frame and immersed in the electrolyte solution. Because the electric field lines are concentrated at the edge in the electroplating process, the electric power line distribution density is high, especially the electric power line distribution is dense at the position away from the pinch point, while the electric power line distribution is less at the opposite side of the pinch point, resulting in that the copper thickness at the pinch point position decreases from the pinch point position to the opposite side of the pinch point. Therefore, the copper thickness at the opposite side of the pinch point (the bottom of the float frame) is thin. In the prior art, a plurality of through holes are arranged in the lower part of the side plates on both sides of the electroplating float frame for adjusting the distribution of the electric power line. However, the height of the side plates of the float frame is about 15 cm, and the high potential area at the bottom is insufficiently shielded. After adjusting the electric power line through the through holes of the side plates, the copper thickness at the lower end of the plated part is too thick, the copper thickness of the upper and lower parts of the plated part is greatly different, there is a problem of extreme difference, the line width and line spacing size of different areas of the plate after etching are different, and even there are quality problems such as incomplete etching, which affects the overall yield of the product.
[0004] Therefore, it is necessary to provide a new float frame structure to solve the above technical problems. UTILITY MODEL CONTENTS
[0005] The technical problem to be solved by the utility model is to provide a PCB electroplating float frame, which increases the height of the side plates on both sides of the float frame and optimizes the positions of the through holes on the side plates, so as to improve the shielding area of the high potential area of the float frame and the uniformity of the copper plating of the circuit board.
[0006] The technical scheme of the utility model is as follows:
[0007] The PCB electroplating floating frame comprises a first fixed plate and a second fixed plate arranged oppositely, a connecting beam connecting the first fixed plate and the second fixed plate, a first side plate and a second side plate distributed on both sides of the connecting beam, and a plurality of connecting blocks symmetrically distributed on both sides of the connecting beam for clamping and fixing a plating piece, one end of the connecting block is connected with the first side plate or the second side plate, and the other end is connected with the connecting beam, the height of the first side plate and the second side plate is 22-24 cm, an opening area is arranged on the first side plate and the second side plate, a plurality of through holes are arranged in the opening area, and the opening area is located in a region from the top surface of the first side plate and the second side plate to a distance of 7-8 cm from the top surface.
[0008] Further, the aperture of the through hole is 8-12 mm.
[0009] Further, the through holes on the first side plate and the second side plate are distributed in 2-3 layers in the transverse direction respectively.
[0010] Further, the through holes on the first side plate and the second side plate are distributed in the form of oblique lines in the longitudinal direction.
[0011] Further, the longitudinal spacing between two adjacent layers of through holes is 25-40 mm.
[0012] Further, the transverse spacing between two adjacent through holes in each layer is 40-60 mm.
[0013] Further, the connecting blocks on both sides of the connecting beam form a V-shaped structure, and the included angle between the inclined edge of the connecting block and the bottom surface thereof is 45°.
[0014] Compared with the prior art, the PCB electroplating floating frame has the beneficial effects that:
[0015] The height of the two side plates of the floating frame is increased to 22-24 cm, and the through holes for adjusting the distribution of power lines are arranged in the region from the top surface of the two side plates to a distance of 7.5-8 cm from the top surface, so that the shielding area of the high potential region of the floating frame is increased, the copper thickness on the surface of the plating piece is more uniform, the problem of copper thickness difference between the upper end and the lower end of the plating piece is greatly improved, and the yield of the circuit board is improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0017] Figure 1 is a structural schematic diagram of the PCB electroplating floating frame of the present application.
[0018] Figure 2 is Figure 1 is a structural schematic view of the first side plate / second side plate in the PCB plating float frame. DETAILED DESCRIPTION
[0019] In order to better understand the technical solutions in the embodiments of the present application by those skilled in the art, and to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application are further described below.
[0020] It should be noted that the description of these embodiments is used to help understand the present application, but does not constitute a limitation on the present application. In addition, the technical features involved in each embodiment of the present application described below can be combined with each other as long as they do not conflict with each other.
[0021] Please refer to Figure 1 and Figure 2 , wherein Figure 1 is a structural schematic view of the PCB plating float frame of the present application; Figure 2 is Figure 1 a structural schematic view of the first side plate / second side plate in the PCB plating float frame. The PCB plating float frame of the present application comprises a first fixed plate 1 and a second fixed plate 2 arranged oppositely, a connecting beam 3 connecting the first fixed plate 1 and the second fixed plate 2, a first side plate 4 and a second side plate 5 distributed on both sides of the connecting beam 3, a plurality of connecting blocks 6, and a connecting plate 7 for connecting the plurality of connecting blocks 6.
[0022] In this embodiment, the plurality of connecting blocks 6 are symmetrically distributed on both sides of the connecting beam 3, one end of which is connected with the first side plate 4 or the second side plate 5, and the other end of which is connected with the connecting beam 3. The connecting block 6 not only serves to connect and fix the first side plate 4 and the second side plate 5, but also serves to fix the plating piece, i.e. the circuit board, so that it does not shake during the plating process. In this embodiment, the connecting blocks on both sides of the connecting beam form a V-shaped type, and the V-shaped groove constitutes a containing groove 8. The bottom of the plating piece is vertically placed into the corresponding containing groove 8 and is clamped and fixed by the connecting block 6. Since the connecting blocks on both sides of the connecting beam form a V-shaped type, the side edge of the corresponding connecting block for clamping and fixing the circuit board is an inclined edge, preferably, the included angle between the inclined edge of the connecting block and its bottom surface is 45°, which can prevent the circuit board from scratching the board surface when it is inserted into the float frame or inserted outside the float frame, resulting in the scrap of the circuit board. The reason is that if the inclination angle is too small, the board will be inserted outside the float frame due to inaccurate positioning caused by bending of the board, and if the inclination angle is too large, it cannot play a role in fixing and storing the board.
[0023] On the same side of the connecting beam 3, two adjacent connecting blocks 6 are connected by a connecting plate 7, and the height of the connecting plate 7 is lower than the height of the first side plate or the second side plate, the connecting plate 7 is used for strengthening the stability of the connecting block 6, and the current series flow of the bottom of the electroplating tank can be realized.
[0024] The first side plate 4 and the second side plate 5 have a certain spacing with the connecting beam 3, and the spacing is equal. The first side plate 4 and the second side plate 5 are provided with an opening area 9, and a plurality of through holes 10 are arranged in the opening area 9, which are used for adjusting the distribution of power lines.
[0025] In the utility model, the height of the first side plate 4 and the second side plate 5 is 22-24cm, the opening area 9 is located in the area from the top surface of the first side plate and the second side plate to the distance of 7-8cm from the top surface, and the height of the side plate below the opening area is 14-17cm, and the area is a closed area. Compared with the existing side plate structure, the shielding area of the floating frame high potential area is increased, so that the uniformity of the copper thickness of the plated part surface can be improved. Preferably, the opening area 9 is located in the area from the top surface of the first side plate and the second side plate to the distance of 7.5cm from the top surface.
[0026] Specifically, the through holes 10 on the first side plate 4 and the second side plate 5 are distributed in 2-3 layers in the transverse direction respectively, and the through holes 10 are distributed in the form of inclined lines in the longitudinal direction. Preferably, in the utility model, the aperture of the through hole 10 is 8-12mm, more preferably 10mm; the longitudinal spacing of adjacent two layers of through holes is 25-40mm, and the transverse spacing of adjacent two through holes in each layer is 40-60mm.
[0027] It should be noted that the spacing of the adjacent two through holes refers to the distance between the centers of the adjacent two through holes.
[0028] The PCB electroplating floating frame provided by the utility model can greatly improve the copper thickness extreme difference problem of the upper and lower ends of the plated part. Through testing, the copper thickness extreme difference of the plated part surface is ≤9μm, which is within the control standard of ≤10μm of the copper uniformity. Therefore, the PCB electroplating floating frame of the utility model can effectively avoid the scrap rate caused by uneven line etching, and improve the yield of the circuit board.
[0029] The embodiments of the utility model are described in detail above, but the utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, replacements and modifications of these embodiments without departing from the principles and spirits of the utility model still fall within the protection scope of the utility model.
Claims
1. A PCB electroplating floating frame, characterized in that, It includes a first fixed plate and a second fixed plate arranged opposite to each other, a connecting beam connecting the first fixed plate and the second fixed plate, a first side plate and a second side plate distributed on both sides of the connecting beam, and a plurality of connecting blocks symmetrically distributed on both sides of the connecting beam for clamping and fixing the plated parts. One end of each connecting block is connected to the first side plate or the second side plate, and the other end is connected to the connecting beam. The height of the first side plate and the second side plate is 22-24cm. The first side plate and the second side plate are provided with an opening area, and the opening area is provided with a plurality of through holes. The opening area is located in the area from the top surface of the first side plate and the second side plate to a distance of 7-8cm from the top surface.
2. The PCB electroplating floating frame according to claim 1, characterized in that, The diameter of the through hole is 8-12 mm.
3. The PCB electroplating floating frame according to claim 1 or 2, characterized in that, The through holes on the first and second side plates are distributed in 2-3 layers in the transverse direction.
4. The PCB electroplating floating frame according to claim 3, characterized in that, The through holes on the first and second side plates are distributed diagonally in the longitudinal direction.
5. The PCB electroplating floating frame according to claim 4, characterized in that, The longitudinal spacing between two adjacent through holes is 25-40mm.
6. The PCB electroplating floating frame according to claim 3, characterized in that, The lateral spacing between two adjacent through holes in each layer is 40-60mm.
7. The PCB electroplating floating frame according to claim 1, characterized in that, The connecting blocks on both sides of the connecting beam form a V-shape, and the angle between the hypotenuse of the connecting block and its bottom surface is 45°.