Integrated circuit board structure

Abstract

The utility model relates to the technical field of integrated circuits, and discloses an integrated circuit board structure, which comprises a fixedly installed protective shell, the inner side of the fixedly installed protective shell is fixedly connected with bottom guide rods which are distributed at equal intervals, and the top of each bottom guide rod is provided with a damping assembly. A first fixed mounting plate is fixedly connected to the top surface of the damping assembly, a fixed mounting assembly is arranged on the top surface of the first fixed mounting plate, a sealing protection assembly is arranged at the top of the fixed mounting protection shell, and heat dissipation assemblies are arranged on the left side and the right side of the first fixed mounting plate; according to the utility model, through the cooperation between the damping assembly and the fixed installation assembly, when external equipment falls off or is impacted, through the effect of the damping assembly, the situation that the integrated circuit board is loosened and damaged due to the fact that fixing screws in the fixed installation assembly are loosened due to vibration is avoided; and the internal closed space is ensured, and meanwhile, rapid heat dissipation is realized.

Description

TECHNICAL FIELD

[0001] The utility model relates to integrated circuit technical field, concretely is an integrated circuit board structure. BACKGROUND

[0002] Integrated circuit board is a carrier of loading integrated circuit, adopts semiconductor manufacturing process, makes many transistors and resistor, capacitor and other components on a small monocrystalline silicon piece, and according to multilayer wiring or tunnel wiring method, the component is combined into complete electronic circuit. At present, integrated circuit board is packaged in the upper and lower shell of combination, and the two shells are installed and fixed by screw, when some portable equipment falls to the ground, the shell internal circuit board may be fixed loose due to the collision between the equipment and the bottom surface, leading to the fixed motion of the circuit board in the shell, causing the internal circuit board to drop out when opening, so that the circuit board is damaged, and improvement is needed, therefore we provide an integrated circuit board structure. UTILIT Y MODEL CONTENT

[0003] (I) technical problem solved

[0004] In view of the defects of the prior art, the utility model provides an integrated circuit board structure, which solves the above problems.

[0005] (II) technical scheme

[0006] In order to realize the above purpose, the utility model provides the following technical scheme:

[0007] An integrated circuit board structure, comprising a fixed installation protective shell, the inner side of the fixed installation protective shell is fixedly connected with equidistantly distributed bottom guide rods, the top of the bottom guide rod is provided with a damping assembly, the top surface of the damping assembly is fixedly connected with a first fixed installation plate, the top surface of the first fixed installation plate is provided with a fixed installation assembly, the top of the fixed installation protective shell is provided with a sealing protection assembly, and the left and right sides of the first fixed installation plate are provided with heat dissipation assemblies.

[0008] Preferably, the left and right sides of the fixed installation protective shell are provided with heat dissipation installation grooves, and the top surface of the fixed installation protective shell is provided with equidistantly distributed screw grooves.

[0009] Preferably, the damping assembly comprises a damping spring, a bottom guide rod and a bottom guide sleeve, the bottom of the first fixed installation plate is fixedly connected with equidistantly distributed bottom guide sleeves, the bottom inner side of the bottom guide sleeve is slidably connected with a bottom guide rod, the inner bottom surface of the fixed installation protective shell is fixedly connected with equidistantly distributed damping springs, and the top surface of the damping spring is fixedly connected with the first fixed installation plate.

[0010] Preferably, the fixed mounting assembly comprises a positioning annular table, a fixed threaded rod, a protective buffer plate, a second fixed mounting plate and a fixed nut, the top surface of the first fixed mounting plate is fixedly connected with the positioning annular table, the top surface of the first fixed mounting plate is fixedly connected with the fixed threaded rods which are equidistantly distributed, the top surface of the first fixed mounting plate is fixedly connected with the integrated circuit board, the outer side of the fixed threaded rod is slidably connected with the second fixed mounting plate, the bottom surface of the second fixed mounting plate is fixedly connected with the protective buffer plate, and the top surface of the fixed threaded rod is threadedly connected with the fixed nut.

[0011] Preferably, the sealing protection assembly comprises a top sealing cover plate and fixed connection screws, the top surface of the fixed mounting protective shell is fixedly connected with the top sealing cover plate, the top of the top sealing cover plate is provided with the mounting threaded holes which are equidistantly distributed, the inner side of the mounting threaded hole is threadedly connected with the fixed connection screw, and the inner side of the threaded groove is threadedly connected with the fixed connection screw.

[0012] Preferably, the heat dissipation assembly comprises a heat dissipation plate and internal heat conduction fins, the left and right sides of the first fixed mounting plate are fixedly connected with the internal heat conduction fins which are equidistantly distributed, the inner side of the heat dissipation mounting groove is fixedly connected with the heat dissipation plate, the left side of the heat dissipation plate is provided with the heat dissipation holes which are equidistantly distributed and penetrate through the right side, and the left side of the internal heat conduction fin is fixedly connected with the heat dissipation plate.

[0013] (Three) beneficial effects

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] The utility model discloses through the cooperation between shock attenuation component and fixed mounting assembly, when external equipment falls or is impacted, through the effect of shock attenuation component, avoid the vibration and make the fixed screw in fixed mounting assembly inside loose, cause integrated circuit board loose and lead to damage, and through the effect of heat dissipation assembly, guarantee the internal airtight space to have quick heat dissipation simultaneously, avoid the internal temperature and be too high and lead to integrated circuit damage. ACCURACY OF DRAWINGS

[0016] Figure 1 It is whole structure schematic diagram of the utility model;

[0017] Figure 2 It is whole structure split schematic diagram of the utility model;

[0018] Figure 3 It is whole structure cross section schematic diagram of the utility model;

[0019] Figure 4The utility model discloses a part structure shock attenuation fixed assembly structure schematic diagram. In the drawing: 1, fixed installation protection shell, 2, top sealing cover plate, 3, fixed connection screw, 4, installation screw hole, 5, heat dissipation plate, 6, heat dissipation hole, 7, internal heat conduction piece, 8, integrated circuit board, 9, positioning ring table, 10, heat dissipation installation slot, 11, shock attenuation spring, 12, bottom guide rod, 13, screw groove, 14, bottom guide sleeve, 15, first fixed mounting plate, 16, fixed screw rod, 17, protection buffer board, 18, second fixed mounting plate, 19, fixed nut. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative labor are within the protection scope of the utility model.

[0021] Please refer to Figures 1-4 The utility model provides a technical scheme,

[0022] A kind of integrated circuit board structure, including fixed installation protection shell 1, the inside fixed connection of fixed installation protection shell 1 has equidistantly distributed bottom guide rod 12, the top of bottom guide rod 12 is provided with shock attenuation assembly, the top surface of shock attenuation assembly is fixedly connected with first fixed mounting plate 15, the top surface of first fixed mounting plate 15 is provided with fixed installation assembly, the top of fixed installation protection shell 1 is provided with sealing protection assembly, and the left and right sides of first fixed mounting plate 15 are provided with heat dissipation assembly.

[0023] Further, the left and right sides of fixed installation protection shell 1 are provided with heat dissipation installation slot 10, and the top surface of fixed installation protection shell 1 is provided with equidistantly distributed screw groove 13.

[0024] Furthermore, the shock absorption assembly includes shock-absorbing springs 11, bottom guide rods 12, and bottom guide sleeves 14. The bottom of the first fixed mounting plate 15 is fixedly connected to equally spaced bottom guide sleeves 14. The bottom inner side of the bottom guide sleeves 14 is slidably connected to the bottom guide rods 12. The inner bottom surface of the fixed mounting protective housing 1 is fixedly connected to equally spaced shock-absorbing springs 11, and the top surface of the shock-absorbing springs 11 is fixedly connected to the first fixed mounting plate 15. Through the action of the shock absorption assembly, when external equipment falls or is impacted, the impact force is transmitted to the fixed mounting protective housing 1. Due to the bottom of the first fixed mounting plate 15... The bottom guide sleeve 14 is slidably connected to the bottom guide rod 12. When the shock-absorbing spring 11 is compressed or stretched, the bottom guide sleeve 14 slides along the bottom guide rod 12, which restricts the horizontal displacement of the first fixed mounting plate 15, so that it can only move in the vertical direction. This ensures the stability of the movement of the first fixed mounting plate 15 during the shock absorption process. At the same time, the shock-absorbing spring 11 on the bottom surface inside the fixed mounting protective shell 1 undergoes elastic deformation, absorbing and buffering the impact force, preventing the vibration from being directly transmitted to the integrated circuit board 8, and preventing the fixing screws inside the fixed mounting assembly from loosening due to vibration, thereby protecting the integrated circuit board 8 from damage.

[0025] Furthermore, the fixed installation assembly includes a positioning ring platform 9, a fixing threaded rod 16, a protective buffer plate 17, a second fixed installation plate 18, and a fixing nut 19. The positioning ring platform 9 is fixedly connected to the top surface of the first fixed installation plate 15, and the fixing threaded rods 16 are fixedly connected to the top surface of the first fixed installation plate 15 at equal intervals. An integrated circuit board 8 is fixedly connected to the top surface of the first fixed installation plate 15. The second fixed installation plate 18 is slidably connected to the outer side of the fixing threaded rod 16. The protective buffer plate 17 is fixedly connected to the bottom surface of the second fixed installation plate 18, and the fixing nut 19 is threadedly connected to the top surface of the fixing threaded rod 16. Through the action of the fixed installation assembly, the integrated circuit board 8 is fixedly connected to the positioning ring platform 9. The integrated circuit board 8 is fixed to the top surface of the first fixed mounting plate 15. The positioning ring platform 9 on the top surface of the first fixed mounting plate 15 provides initial positioning for the integrated circuit board 8, ensuring its accurate installation position. The equidistantly distributed fixing threaded rods 16 on the top surface of the first fixed mounting plate 15 pass through the second fixed mounting plate 18. The protective buffer plate 17 is fixed to the bottom surface of the second fixed mounting plate 18, which plays the role of buffering and protecting the integrated circuit board 8. Finally, by threading the fixing nuts 19 on the top surface of the fixing threaded rods 16, the second fixed mounting plate 18, the integrated circuit board 8 and the protective buffer plate 17 are tightly fixed together to ensure that the integrated circuit board 8 remains stable during normal use.

[0026] Furthermore, the sealing and protection assembly includes a top sealing cover plate 2 and a fixing screw 3. The top sealing cover plate 2 is fixedly connected to the top surface of the fixed installation protective housing 1. The top of the top sealing cover plate 2 has equally spaced mounting threaded holes 4. The fixing screw 3 is threadedly connected to the inner side of the mounting threaded holes 4 and the fixing screw 3 is threadedly connected to the inner side of the threaded groove 13. Through the function of the sealing and protection assembly, dust, moisture and other impurities are effectively prevented from entering the interior of the fixed installation protective housing 1, providing a clean and dry working environment for the integrated circuit board 8, avoiding problems such as short circuits caused by impurities, and extending the service life of the integrated circuit board 8.

[0027] Furthermore, the heat dissipation assembly includes a heat sink 5 and internal heat-conducting sheets 7. The left and right sides of the first fixed mounting plate 15 are fixedly connected with equidistantly distributed internal heat-conducting sheets 7. The heat sink 5 is fixedly connected to the inner side of the heat dissipation mounting groove 10. The left side of the heat sink 5 has heat dissipation holes 6 that penetrate the right side and are equidistantly distributed. The left side of the internal heat-conducting sheets 7 is fixedly connected to the heat sink 5. Through the action of the heat dissipation assembly, the heat generated by the integrated circuit board 8 when it is working is conducted to the heat sink 5 through the internal heat-conducting sheets 7 on the left and right sides of the first fixed mounting plate 15. The heat sink 5 is fixed in the heat dissipation mounting groove 10. The left side of the heat sink 5 has heat dissipation holes 6 that penetrate the right side and are equidistantly distributed, which increases the heat dissipation area and improves the heat dissipation efficiency. The heat is dissipated to the external environment through the heat dissipation holes 6, thereby ensuring that while a sealed space is formed inside the fixed mounting protective shell 1, the heat generated by the integrated circuit board 8 can be dissipated quickly and effectively, avoiding damage to the integrated circuit due to excessive internal temperature.

[0028] Working principle: The integrated circuit board 8 is fixed to the top surface of the first fixed mounting plate 15. The positioning ring platform 9 on the top surface of the first fixed mounting plate 15 provides initial positioning for the integrated circuit board 8, ensuring its accurate installation position. The equidistantly distributed fixing threaded rods 16 on the top surface of the first fixed mounting plate 15 pass through the second fixed mounting plate 18. The protective buffer plate 17 is fixed to the bottom surface of the second fixed mounting plate 18, playing a role in buffering and protecting the integrated circuit board 8. Finally, by threading the fixing nuts 19 on the top surface of the fixing threaded rods 16, the second fixed mounting plate 18, the integrated circuit board 8, and the protective buffer plate 17 are tightly fixed together, ensuring that the integrated circuit board 8 remains stable during normal use. When external equipment is dropped or impacted, the impact force is transmitted to the fixed mounting protective shell 1. Since the bottom guide sleeve 14 at the bottom of the first fixed mounting plate 15 is slidably connected to the bottom guide rod 12, when the shock-absorbing spring 11 is compressed or stretched, the bottom guide sleeve 14 slides along the bottom guide rod 12, restricting the horizontal displacement of the first fixed mounting plate 15, so that it can only move in the vertical direction, ensuring the first... The stability of the fixed mounting plate 15 during movement is ensured. Simultaneously, the shock-absorbing spring 11 on the bottom surface of the fixed mounting protective housing 1 undergoes elastic deformation, absorbing and buffering impact forces to prevent vibration from being directly transmitted to the integrated circuit board 8. This prevents the fixing screws inside the fixed mounting assembly from loosening due to vibration, thus protecting the integrated circuit board 8 from damage. Meanwhile, the top sealing cover 2 is fixed to the top surface of the fixed mounting protective housing 1. The fixing screw 3 passes through the mounting threaded hole 4 of the top sealing cover 2 and is threaded into the threaded groove 13 on the top surface of the fixed mounting protective housing 1, achieving a tight fixation. Simultaneously, the heat generated by the integrated circuit board 8 during operation is conducted to the heat dissipation plate 5 through the internal heat-conducting plates 7 on the left and right sides of the first fixed mounting plate 15. The heat dissipation plate 5 is fixed within the heat dissipation mounting groove 10, and its left side has heat dissipation holes 6 evenly distributed through the right side, increasing the heat dissipation area and improving heat dissipation efficiency. Heat is dissipated to the external environment through the heat dissipation holes 6, ensuring that while a sealed space is formed inside the fixed mounting protective housing 1, the heat generated by the integrated circuit board 8 can be quickly and effectively dissipated, preventing excessive internal temperature from damaging the integrated circuit. Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit board structure, comprising a fixedly mounted protective housing (1), characterized in that: The inner side of the fixed installation protective shell (1) is fixedly connected with equidistantly distributed bottom guide rods (12). The top of the bottom guide rods (12) is provided with a shock-absorbing component. The top surface of the shock-absorbing component is fixedly connected with a first fixed mounting plate (15). The top surface of the first fixed mounting plate (15) is provided with a fixed mounting component. The top of the fixed installation protective shell (1) is provided with a sealing protection component. The left and right sides of the first fixed mounting plate (15) are provided with heat dissipation components.

2. The integrated circuit board structure according to claim 1, characterized in that: The fixed installation protective shell (1) has heat dissipation mounting grooves (10) on its left and right sides, and the fixed installation protective shell (1) has equally spaced threaded grooves (13) on its top surface.

3. The integrated circuit board structure according to claim 1, characterized in that: The shock absorption assembly includes a shock absorption spring (11), a bottom guide rod (12), and a bottom guide sleeve (14). The bottom of the first fixed mounting plate (15) is fixedly connected with equidistantly distributed bottom guide sleeves (14). The bottom inner side of the bottom guide sleeve (14) is slidably connected with the bottom guide rod (12). The bottom surface of the fixed mounting protective shell (1) is fixedly connected with equidistantly distributed shock absorption springs (11). The top surface of the shock absorption springs (11) is fixedly connected with the first fixed mounting plate (15).

4. The integrated circuit board structure according to claim 3, characterized in that: The fixed mounting assembly includes a positioning ring platform (9), a fixed threaded rod (16), a protective buffer plate (17), a second fixed mounting plate (18), and a fixing nut (19). The positioning ring platform (9) is fixedly connected to the top surface of the first fixed mounting plate (15). The fixed threaded rods (16) are fixedly connected to the top surface of the first fixed mounting plate (15) at equal intervals. An integrated circuit board (8) is fixedly connected to the top surface of the first fixed mounting plate (15). The second fixed mounting plate (18) is slidably connected to the outer side of the fixed threaded rod (16). The protective buffer plate (17) is fixedly connected to the bottom surface of the second fixed mounting plate (18). The fixing nut (19) is threadedly connected to the top surface of the fixed threaded rod (16).

5. An integrated circuit board structure according to claim 2, characterized in that: The sealing and protection assembly includes a top sealing cover plate (2) and a fixing screw (3). The top surface of the fixed installation protective shell (1) is fixedly connected to the top sealing cover plate (2). The top of the top sealing cover plate (2) is provided with equally spaced installation threaded holes (4). The inner side of the installation threaded holes (4) is threaded with the fixing screw (3). The inner side of the threaded groove (13) is threaded with the fixing screw (3).

6. The integrated circuit board structure according to claim 2, characterized in that: The heat dissipation assembly includes a heat dissipation plate (5) and an internal heat-conducting sheet (7). The left and right sides of the first fixed mounting plate (15) are fixedly connected with the internal heat-conducting sheets (7) distributed at equal intervals. The heat dissipation mounting groove (10) is fixedly connected with the heat dissipation plate (5). The left side of the heat dissipation plate (5) is provided with heat dissipation holes (6) that penetrate the right side and are distributed at equal intervals. The left side of the internal heat-conducting sheet (7) is fixedly connected with the heat dissipation plate (5).

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