Distributed cabinet temperature layer airflow control device

By using a distributed cabinet temperature and airflow control device to monitor and adjust fan speed in real time, the problem of inaccurate local temperature control in traditional heat dissipation methods is solved, thus improving the operational stability and reliability of the equipment.

CN224037691UActive Publication Date: 2026-03-24XIAN DAIYUN ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

Traditional heat dissipation methods struggle to achieve precise control of localized temperatures within the server rack, leading to excessively high or low temperatures that affect the stability and reliability of equipment operation.

Method used

A distributed rack temperature and airflow control device is adopted, which monitors the local temperature in real time through a temperature sensing module and adjusts the fan speed or the operating status of other heat dissipation equipment according to the temperature data to achieve precise control of the local temperature inside the rack.

Benefits of technology

This effectively avoids the problem of excessively high or low local temperatures, improving the operational stability and reliability of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of cabinet temperature control, and provides a distributed cabinet temperature layer airflow control device which comprises a cabinet body, a cabinet door is installed on the outer side wall of the cabinet body, a supporting frame is installed on the inner side wall of the cabinet body, and multiple sets of data cabinets are arranged in the middle of the supporting frame. The temperature control mechanism is arranged at the top of the data cabinet, the temperature control mechanism comprises a fan main body, the fan main body is arranged at the top of the data cabinet, a plurality of fan blades are embedded in the inner side of the fan main body, and a plurality of temperature sensing modules are arranged at the bottom of the fan main body; according to the device, the local temperature in the cabinet is monitored in real time through the inductor, and the control module accurately adjusts the rotating speed of the fan or the running state of other heat dissipation equipment according to temperature data, so that accurate control over the local temperature in the cabinet is achieved. The problem that the local temperature is too high or too low in a traditional heat dissipation mode is effectively avoided, and the operation stability and reliability of equipment are improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a cabinet temperature control technical field, concretely is a kind of distributed cabinet temperature layer airflow control device. BACKGROUND

[0002] In the closed space such as electronic equipment cabinet or data center, due to equipment intensive, power is big, often a large amount of heat is generated. The effective emission of these heat is crucial to ensure the normal operation of equipment, prolong the life of equipment and improve the stability of overall system. The traditional heat dissipation mode usually adopts overall ventilation or air conditioning refrigeration method, but these methods often have problems such as high energy consumption, low heat dissipation efficiency and difficult to realize local precise temperature control.

[0003] Specifically, the overall ventilation mode is usually through the fan or vent of import and export of cabinet or data center, air exchange is carried out using natural wind pressure or forced wind pressure to achieve the purpose of heat dissipation. However, this way is often difficult to realize the precise control of local temperature inside cabinet, because air flow path and flow rate are difficult to accurately control, leading to the situation that local temperature is too high or too low occurs from time to time.

[0004] Therefore, the technical personnel in the prior art propose a kind of distributed cabinet temperature layer airflow control device to solve the problems raised in the background art. INVENTION CONTENTS

[0005] In order to solve the above technical problems, the utility model provides a kind of distributed cabinet temperature layer airflow control device, can monitor the local temperature inside cabinet in real time, and adjusts the operating state of heat dissipation equipment according to actual temperature condition, to achieve energy-saving, flexible and reliable heat dissipation effect.

[0006] A kind of distributed cabinet temperature layer airflow control device, including cabinet main body, cabinet door is installed on the outer side wall of the cabinet main body, support frame is installed on the inner side wall of the cabinet main body, the middle part of the support frame is provided with multiple data cabinets;

[0007] Temperature control mechanism, the temperature control mechanism is arranged at the top of data cabinet, the temperature control mechanism includes fan main body, the fan main body is arranged at the top of data cabinet, multiple fan blades are embedded in the inner side of the fan main body, multiple temperature sensing modules are arranged at the bottom of the fan main body, multiple temperature sensing modules and the outer side of multiple fan blades are further provided with control module.

[0008] Preferably, limiting mechanism, the limiting mechanism includes limiting slot, the limiting slot is opened in the inner side of data cabinet, multiple support springs are fixedly connected to the inner side of the limiting slot, multiple limiting sliding blocks are further slidably connected to the inner side of multiple limiting slots.

[0009] Preferably, one end of the supporting spring away from the limiting groove is also fixedly connected with the limiting sliding block, and the inner side of the data cabinet is provided with a limiting sliding groove.

[0010] Preferably, the bottom end of the fan body is fixedly connected with a plurality of limiting sliding rods, and the plurality of limiting sliding rods are also slidingly connected with the inner side wall of the limiting sliding groove for limiting the fan body.

[0011] Compared with the prior art, the utility model has the advantages of:

[0012] 1、The device monitors the local temperature inside the cabinet in real time through the inductor, and the control module accurately adjusts the rotating speed of the fan or the operation state of other heat dissipation equipment according to the temperature data, so as to realize accurate control of the local temperature inside the cabinet. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0014] Figure 2 It is a three-dimensional structure schematic view of the utility model Figure 1 It is a structure schematic view of the supporting frame and the data cabinet;

[0015] Figure 3 It is a structure schematic view of the supporting frame and the data cabinet; Figure 2 It is an explosion structure schematic view of the data cabinet;

[0016] Figure 4 It is a structure schematic view of the supporting frame and the data cabinet; Figure 3 It is a structure schematic view of the supporting frame and the data cabinet;

[0017] In the drawing: 1, cabinet main body; 2, cabinet door; 3, supporting frame; 4, data cabinet; 5, limiting groove; 6, supporting spring; 7, limiting sliding block; 8, connecting rod; 9, limiting sliding groove; 10, limiting sliding rod; 11, fan body; 12, fan blade; 13, temperature sensing module. DETAILED DESCRIPTION

[0018] The embodiments of the utility model will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but cannot be used to limit the scope of the utility model.

[0019] As shown in the drawings Figure 1 to the drawings Figure 4 As shown in the drawings:

[0020] Example one: according to Figures 1-4The utility model provides a kind of distributed cabinet temperature layer airflow control device, including cabinet main body 1, the outside wall of cabinet main body 1 is equipped with cabinet door 2, the inner side wall of cabinet main body 1 is equipped with support frame 3, the middle part of support frame 3 is equipped with multiple data cabinets 4;

[0021] Temperature control mechanism, the temperature control mechanism is arranged at the top of data cabinet 4, the temperature control mechanism includes fan main body 11, the fan main body 11 is arranged at the top of data cabinet 4, the inside of fan main body 11 is embedded with multiple fan blades 12, the bottom of fan main body 11 is equipped with multiple temperature sensing modules 13, multiple temperature sensing modules 13 and the outside of multiple fan blades 12 are also provided with control module;Limiting mechanism, the limiting mechanism includes limiting groove 5, the inside of data cabinet 4 is equipped with multiple limiting grooves 5, the inside of limiting groove 5 is fixedly connected with multiple support springs 6, the inside of multiple limiting grooves 5 is also slidably connected with multiple limiting sliding blocks 7, the end of support spring 6 away from limiting groove 5 is also fixedly connected with limiting sliding block 7, the inside of data cabinet 4 is equipped with limiting sliding slot 9, the bottom end of fan main body 11 is fixedly connected with multiple limiting sliding rods 10, multiple limiting sliding rods 10 are also slidably connected to the inner wall of limiting sliding slot 9 for limiting fan main body 11, the device monitors the local temperature inside the cabinet in real time through inductor, and control module accurately adjusts the rotating speed of fan or the operating state of other heat dissipation equipment according to temperature data, to realize the accurate control of local temperature inside the cabinet.This effectively avoids the problem of local temperature being too high or too low in traditional heat dissipation mode, improves the operation stability and reliability of equipment.

[0022] Working principle: when needing to use the device, first pull two connecting rods 8, make two connecting rods 8 move backward with limiting sliding block 7, then insert limiting sliding rod 10 into limiting sliding slot 9, slide backward by the guidance of limiting sliding slot 9, release connecting rod 8 when fan main body 11 slides to position, make support spring 6 act on limiting sliding block 7, make limiting sliding block 7 re-close and limit limiting sliding rod 10, limit fan main body 11 to the top of data cabinet 4, detect the local temperature of data cabinet 4 through temperature sensing module 13, transmit to control module when temperature is too high, control module controls corresponding fan blade 12 to work, and carries out corresponding local cooling.

[0023] All standard parts used in this invention can be purchased from the market, and irregularly shaped parts can be customized according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are mature technologies in the prior art. The machinery, parts, and equipment all use conventional models in the prior art, and the circuit connections also use conventional connection methods in the prior art, which will not be detailed here. Any content not described in detail in this specification belongs to the prior art known to those skilled in the art.

[0024] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. Furthermore, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples, without contradiction

[0028] The present application discloses the embodiments in the drawings, only relate to the structure involved in the embodiments of the present application, other structures can refer to the usual design, in the case of no conflict, the same embodiment and different embodiments of the present application can be combined with each other.

[0029] Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some of the technical features, and any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A distributed cabinet temperature layer airflow control apparatus, characterized by: Including the cabinet machine main body (1), the outer side wall of the cabinet machine main body (1) is installed with the cabinet door (2), the inner side wall of the cabinet machine main body (1) is installed with the support frame (3), the middle part of the support frame (3) is provided with multiple groups of data cabinets (4); Temperature control mechanism, the temperature control mechanism is arranged at the top of the data cabinet (4), the temperature control mechanism includes the fan body (11), the fan body (11) is arranged at the top of the data cabinet (4), the inner side of the fan body (11) is embedded with multiple fan blades (12), the bottom of the fan body (11) is provided with multiple temperature sensing modules (13), multiple temperature sensing modules (13) and multiple fan blades (12) outside are also provided with control module.

2. A distributed cabinet temperature airflow control apparatus as recited in claim 1, wherein: Limiting mechanism, the limiting mechanism includes a plurality of limiting grooves (5) that are formed in the inner side of the data cabinet (4), the inner side of the limiting groove (5) is fixedly connected with a plurality of supporting springs (6), and the inner side of the plurality of limiting grooves (5) is also slidably connected with a plurality of limiting sliding blocks (7).

3. A distributed cabinet temperature airflow control apparatus as recited in claim 2, wherein: The end of the supporting spring (6) away from the limiting groove (5) is also fixedly connected with the limiting sliding block (7), and the inner side of the data cabinet (4) is provided with a limiting sliding groove (9).

4. A distributed cabinet temperature airflow control apparatus as recited in claim 3, wherein: The bottom end of the fan body (11) is fixedly connected with a plurality of limiting sliding rods (10), and the inner side wall of the limiting sliding groove (9) is also slidably connected with a plurality of limiting sliding rods (10) for limiting the fan body (11).