High-efficiency heat dissipation fin

By using an all-copper substrate and heat pipe design, combined with forced convection cooling from the main and side cooling fans, the problem of insufficient heat dissipation efficiency in existing technologies has been solved, achieving stability and durability of the game console under high load operation.

CN224037694UActive Publication Date: 2026-03-24SIHUI HONGYI ELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-25
Publication Date
2026-03-24

AI Technical Summary

Technical Problem

The heat dissipation efficiency of existing heat sinks is not ideal, making it difficult to ensure that the game console remains stable under long-term high load operation.

Method used

The finned body features an all-copper substrate design, combined with heat pipes and through holes for uniform heat conduction. It is equipped with forced convection cooling from the main cooling fan and side cooling fans, and its durability is enhanced by a nickel-plated protective layer. The airflow path is optimized to improve heat dissipation efficiency.

Benefits of technology

It achieves rapid and even heat distribution and efficient heat dissipation, ensuring the stability of the game console under long-term high-load operation, extending the service life of the heat dissipation system and improving its durability.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224037694U_ABST
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Abstract

The utility model belongs to the technical field of heat dissipation fins, particularly relates to a high-efficiency heat dissipation fin, and aims to solve the problems that the heat dissipation efficiency of the conventional heat dissipation fin is not ideal enough, and a game console is difficult to keep stable under long-time high-load operation, and provides the following scheme: the high-efficiency heat dissipation fin comprises two groups of fin bodies, corresponding connecting plates are arranged at the two ends of each group of fin bodies, the same L-shaped mounting frame for stabilizing each group of fin bodies is fixedly arranged on the side edges of the two connecting plates, and the side end of each group of fin bodies is fixedly connected with the inner wall of the corresponding L-shaped mounting frame. When the heat dissipation device is used, through the design of the heat conduction pipe and the all-copper substrate, heat can be quickly and uniformly distributed to the whole heat dissipation fins, the local overheating phenomenon is avoided, and through the cooperation of the main cooling fan and the side cooling fans, air flow is remarkably enhanced, the heat dissipation efficiency is improved, and it is ensured that a game console is kept stable under long-time high-load operation.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation fin technical field especially relates to a high -efficient heat dissipation fin. BACKGROUND

[0002] The heat dissipation fin is widely used in various electronic equipment, such as CPU radiator, video card radiator etc. In keeping equipment high -efficient operation and prolonging service life, heat dissipation fin plays a vital role, and through optimizing the design and material selection of heat dissipation fin, the temperature of equipment can be effectively reduced, and the stability and performance of system are improved.

[0003] The heat dissipation fin is very important for game console, and when game console is under high load, the core components such as video card and processor will generate a large amount of heat, and if the heat dissipation is poor, these heat will cause the hardware performance to decline, and even cause system crash, but the heat dissipation efficiency of the heat dissipation fin is not ideal, and it is difficult to ensure that the game console remains stable under long time high load.

[0004] In view of the above problems, the utility model file proposes a kind of high-efficiency heat dissipation fin. INVENTION CONTENTS

[0005] The utility model provides a kind of high-efficiency heat dissipation fin, solve the shortcomings that the heat dissipation efficiency of current heat dissipation fin is not ideal in prior art, it is difficult to ensure that game console remains stable under long time high load.

[0006] The utility model provides the following technical scheme:

[0007] A kind of high-efficiency heat dissipation fin, comprising:

[0008] Two groups of fin bodies, the two ends of each group of fin bodies are provided with corresponding connecting plates, the side edges of two connecting plates are fixedly provided with a same L-shaped mounting bracket for stabilizing each group of fin bodies, the side ends of each group of fin bodies are fixedly connected with the inner wall of corresponding L-shaped mounting bracket, a plurality of heat pipes are arranged between two groups of fin bodies, the fin body is provided with a through hole for corresponding heat pipe to pass through, the top of the connecting plate is symmetrically fixedly provided with two connecting pieces, and the top of four connecting pieces is detachably provided with a same main cooling fan;

[0009] Cooling enhancement assembly, set on L-shaped mounting bracket, for improving the cooling efficiency of each group of fin bodies.

[0010] In a possible design, the cooling enhancement assembly includes a mounting plate fixedly arranged on the outer side of the L-shaped mounting bracket, a plurality of side cooling fans are detachably arranged on the inner wall of the mounting plate, and a plurality of fourth bolts for mounting corresponding side cooling fans are threadedly connected to the mounting plate.

[0011] In a possible design, the top of each of the two main cooling fans is detachably provided with a corresponding hollow cover plate, and two second bolts are symmetrically and threadedly connected on the hollow cover plate for fixing the hollow cover plate to the top of the base frame of the main cooling fan.

[0012] In a possible design, a first bolt for mounting other components is symmetrically and threadedly connected on the L-shaped mounting frame, and a third bolt for fixing the corresponding connecting plate is threadedly connected in the mounting hole at each corner of the base frame.

[0013] In a possible design, a plurality of indentations are equidistantly arranged on the fan blade rotatably arranged at the center of the base frame.

[0014] In a possible design, the entire copper substrate surface of the fin body is covered with a protective layer for improving the durability of the fin body through a nickel plating process.

[0015] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application.

[0016] The working principle and use process of the technical solution are as follows:

[0017] When the game console is running at high load, the heat generated by the core components such as the graphics card and the processor is quickly conducted to the two groups of fin bodies through the heat pipes, the heat pipes are arranged through the two groups of fin bodies, and are fixed through the through holes on the fin bodies, so that the heat can be evenly distributed to the entire heat dissipation fin, the fin body adopts a full copper substrate, and copper has excellent heat conduction performance, so that the heat can be quickly conducted from the heat pipe to the surface of the fin body.

[0018] The main cooling fan is detachably arranged on the top of the connecting plate through the four connecting plates, a plurality of indentations are equidistantly arranged on the fan blade of the main cooling fan, the indentations can increase the turbulence of air flow and improve the heat dissipation efficiency, when the main cooling fan operates, the air flow around the fin body is accelerated through forced convection, so that more heat is taken away and the heat dissipation is accelerated, the side cooling fan in the cooling enhancement assembly is detachably arranged on the outer side of the L-shaped mounting frame through the mounting plate, and the side cooling fan blows to the fin body from the side when the side cooling fan operates, so as to further enhance the heat dissipation effect.

[0019] The present application has the following beneficial effects:

[0020] The present application has the following beneficial effects:

[0021] The nickel-plated protective layer covering the surface of the full copper substrate improves the durability and corrosion resistance of the heat dissipation fin; the detachable main cooling fan and side cooling fan are convenient to clean and maintain, prolonging the service life of the heat dissipation system; the concave mark design on the hollow cover plate and fan blade optimizes the airflow path, reduces air resistance, and improves the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A three-dimensional structure schematic diagram of the high-efficiency heat dissipation fin provided by the embodiment of the utility model;

[0023] Figure 2 A structure schematic diagram of the high-efficiency heat dissipation fin after the heat conduction pipe is removed provided by the embodiment of the utility model;

[0024] Figure 3 A partial disassembly structure schematic diagram of the high-efficiency heat dissipation fin provided by the embodiment of the utility model;

[0025] Figure 4 A fin body partial cross-section structure schematic diagram of the high-efficiency heat dissipation fin provided by the embodiment of the utility model.

[0026] The drawings are as follows: 1, fin body; 2, connecting plate; 3, heat conduction pipe; 4, L-shaped mounting frame; 5, first bolt; 6, connecting sheet; 7, main cooling fan; 8, hollow cover plate; 9, second bolt; 10, base frame; 11, mounting hole; 12, third bolt; 13, fan blade; 14, concave mark; 15, mounting plate; 16, side cooling fan; 17, fourth bolt; 18, through hole; 19, full copper substrate; 20, protective layer. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0028] In the description of the utility model, it should be understood that the terms "opening", "upper", "middle", "length", "inner" and the like indicate the orientation or positional relationship, which are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the utility model.

[0029] In order to keep the following description of the embodiments of the utility model clear and concise, the utility model omits the detailed description of known functions and known components.

[0030] Embodiment One

[0031] Please refer to Figures 1-3 A high-efficiency heat dissipation fin is used in the field of heat dissipation fins, comprising:

[0032] Two groups of fin bodies 1 are provided with connecting plates 2 at both ends of each group of fin bodies 1, and the side edges of the connecting plates 2 are fixedly provided with an L-shaped mounting bracket 4 for stabilizing each group of fin bodies 1. The side ends of the fin bodies 1 are connected with the inner wall of the L-shaped mounting bracket 4 by welding or other fixing methods to ensure the stability of the structure. A plurality of heat pipes 3 are arranged through the two groups of fin bodies 1, and the heat pipes 3 are used for efficient heat transfer. The fin bodies 1 are provided with through holes 18 for the heat pipes 3 to pass through. In addition, the top of each connecting plate 2 is symmetrically fixed with two connecting pieces 6, and the four connecting pieces 6 jointly support and detachably install a main cooling fan 7 for active cooling, which is a CR-3000E model.

[0033] In order to improve the cooling efficiency, a cooling enhancement assembly is installed on the L-shaped mounting bracket 4. Specifically, a mounting plate 15 is fixedly arranged on the outer side of the L-shaped mounting bracket 4, and a plurality of side cooling fans 16 are detachably installed on the inner wall of the mounting plate 15. The side cooling fans 16 are firmly fixed on the mounting plate 15 by the fourth bolts 17. The purpose of this design is to enhance the cooling effect from multiple angles and accelerate the flow of air around the fin bodies 1, thereby improving the cooling efficiency.

[0034] In order to protect and guide the airflow of the main cooling fan 7, a hollow cover plate 8 is detachably installed on the top of the two main cooling fans 7. The hollow cover plate 8 is fixedly connected with the top of the base frame 10 of the main cooling fan 7 by the second bolts 9, which not only maintains the permeability of the airflow, but also increases the safety of the structure. In order to improve the aerodynamic performance of the fan blades 13, a plurality of indentations 14 are arranged at equal intervals on the fan blades 13, which helps to increase the turbulence of air flow and improve the cooling efficiency.

[0035] The first bolts 5 are arranged on the L-shaped mounting bracket 4 to facilitate the installation of the entire heat dissipation fin assembly into the heat dissipation system of the game console. At the same time, the third bolts 12 are arranged in the mounting holes 11 at the four corners of the base frame 10 to fix the base frame 10 with the connecting pieces 6, ensuring the stable installation of the main cooling fan 7.

[0036] Embodiment Two

[0037] Improvements are made on the basis of Embodiment One:

[0038] Please refer to Figure 4In order to improve the durability and corrosion resistance of the fin body 1, a protective layer 20 is covered on the surface of the full copper substrate 19 of the fin body 1 by a nickel plating process, which not only enhances the service life of the fin body 1, but also ensures that the good heat conduction performance is not affected.

[0039] However, as known to those skilled in the art, the working principle and wiring method of the main cooling fan 7 and the side cooling fan 16 are common, which belong to conventional means or common general knowledge, and will not be described here. Those skilled in the art can make any selection or arrangement according to their needs or convenience.

[0040] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present application, which should be covered within the protection scope of the present application. In the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A high-efficiency heat-dissipating fin, characterized in that, The application relates to a heat dissipation device. Two groups of fin bodies (1) are arranged, each group of the fin bodies (1) is provided with corresponding connecting plates (2) at two ends, side edges of the two connecting plates (2) are fixedly provided with L-shaped mounting racks (4) for stabilizing the same group of fin bodies (1), side ends of each group of the fin bodies (1) are fixedly connected with inner walls of corresponding L-shaped mounting racks (4), a plurality of heat conduction pipes (3) are arranged between the two groups of the fin bodies (1), the fin bodies (1) are provided with through holes (18) for the heat conduction pipes (3) to pass through, the top of the connecting plate (2) is symmetrically fixedly provided with two connecting plates (6), the top of the four connecting plates (6) is detachably provided with a main cooling fan (7). The cooling enhancement assembly is arranged on the L-shaped mounting rack (4) and is used for improving the cooling efficiency of each group of the fin bodies (1).

2. The high efficiency heat dissipating fin according to claim 1, wherein, The cooling enhancement assembly comprises a mounting plate (15) fixedly arranged on the outer side of the L-shaped mounting rack (4), a plurality of side cooling fans (16) are detachably arranged on the inner wall of the mounting plate (15), and the mounting plate (15) is screw-connected with a plurality of fourth bolts (17) for mounting the corresponding side cooling fans (16).

3. The high efficiency heat dissipating fin according to claim 1, wherein, The top of the two main cooling fans (7) is detachably provided with corresponding hollow cover plates (8), the hollow cover plates (8) are symmetrically screw-connected with two second bolts (9) for fixing the top of the base frames (10) of the main cooling fans (7).

4. The high efficiency heat dissipating fin according to claim 3, wherein, The L-shaped mounting rack (4) is symmetrically screw-connected with first bolts (5) for mounting other components, and third bolts (12) for fixing corresponding connecting plates (6) are screw-connected in mounting holes (11) at four corners of the base frame (10).

5. The high efficiency heat dissipating fin according to claim 4, wherein, A plurality of concaves (14) are equidistantly arranged on the fan blades (13) rotatably arranged in the center of the base frame (10).

6. The high efficiency heat dissipating fin according to claim 1, wherein, The surface of a full-copper substrate (19) of the fin body (1) is covered with a protective layer (20) for improving the durability through a nickel plating process.