Die bonder

Abstract

The utility model discloses a die bonder, which comprises a die bonding workbench, a loading mechanism, a material pushing device, a die bonding mechanism and a blue film tensioning device, and is characterized in that the loading mechanism is arranged at one side of the die bonding workbench and comprises a first lifting driving part, a translation driving part, a rack and a plurality of material boxes, and the material boxes are used for storing supports; the plurality of material boxes are all arranged on the rack and are distributed along a first direction, the first lifting driving part is used for driving the rack to lift, the translation driving part is used for driving the rack to move along the first direction, and the material pushing device is used for moving supports in the material boxes to the die bonding workbench. According to the die bonder, the plurality of material boxes are arranged on the loading mechanism, so that the loading quantity of the brackets is increased, the replacement frequency of the material boxes is reduced, and the die bonding working efficiency is improved. Wherein the translation driving part is used for driving the plurality of material boxes to move so as to switch different material boxes to be respectively aligned with the material pushing device, and the lifting driving part drives the material boxes to lift so as to enable the brackets in the material boxes to be sequentially aligned with the material pushing device.

Description

TECHNICAL FIELD

[0001] The utility model relates to die bonder technical field especially relates to die bonder. BACKGROUND

[0002] Die bonding is a kind of processing mode that forms electrical path by colloid to bond wafer in specified area of support, and the common die bonding mode is that support is conveyed from magazine to working position on die bonding workbench by feeding mechanism, first, dispensing mechanism is used to dispense the position of support needing to bond wafer, then die bonding welding head moves from original position to wafer suction position, wafer is placed on blue film, die bonding welding head returns to original position after picking up wafer, die bonding welding head moves from original position to die bonding position, and die bonding welding head fixes wafer on support, so it is a complete die bonding process.

[0003] The number of magazine used for storing support on the existing die bonder is usually one, and the replacement frequency of magazine is relatively high, which is not conducive to improving die bonding work efficiency. UTILITY MODEL CONTENTS

[0004] The utility model solves the technical problem that a kind of high-efficiency die bonder is provided.

[0005] In order to solve the above technical problem, the technical scheme adopted by the utility model is as follows: a die bonder, including die bonding workbench, loading mechanism, pushing device, die bonding mechanism and blue film tensioning device, the die bonding workbench is used to bear support, the die bonding mechanism is used to fix wafer on support, the blue film tensioning device is used to supply wafer for die bonding mechanism, the loading mechanism is arranged on one side of die bonding workbench, the loading mechanism includes first lifting drive part, translation drive part, rack and multiple magazines, the magazine is used to store support, multiple magazines are all arranged on rack and are distributed along first direction, the first lifting drive part is used to drive rack to lift, the translation drive part is used to drive rack to move along first direction to make magazine align with pushing device, and the pushing device is used to move support in magazine to die bonding workbench.

[0006] Further, it further includes first displacement mechanism, the first displacement mechanism is used to drive die bonding workbench to move, and first position recognition device is further arranged above die bonding workbench, and the first position recognition device is electrically connected with first displacement mechanism.

[0007] Further, it further includes second displacement mechanism, the second displacement mechanism is used to drive blue film tensioning device to move, and second position recognition device is arranged above blue film tensioning device, and the second position recognition device is electrically connected with second displacement mechanism.

[0008] Further, the blue film tensioning device comprises a mounting seat, a film expanding ring, a blue film carrier, a driven mechanism and a film expanding driving mechanism, the film expanding ring is mounted on the mounting seat, the blue film carrier is sleeved outside the film expanding ring, and the film expanding driving mechanism drives the blue film carrier to ascend and descend relative to the mounting seat through the driven mechanism.

[0009] Further, the driven mechanism comprises a lifting bolt and a driven wheel, the lifting bolt is fixedly connected with the blue film carrier, and the driven wheel is rotatably mounted on the mounting seat and threadedly matched with the lifting bolt.

[0010] Further, the blue film tensioning device is further provided with a rotary driving device, and the rotary driving device is used for driving the mounting seat to rotate.

[0011] Further, the film expanding driving mechanism comprises a first rotary driving piece, a driving wheel, an oscillating plate and a second rotary driving piece, the oscillating plate is rotatably mounted on the mounting seat, the driving wheel is rotatably mounted on the oscillating plate, the first rotary driving piece is used for driving the driving wheel to rotate, and the second rotary driving piece is used for driving the oscillating plate to oscillate so that the driving wheel is in contact with or separated from the driven mechanism.

[0012] Further, the die bonding mechanism comprises a die bonding swing arm, a second lifting driving piece and a third rotary driving piece, the second lifting driving piece is used for driving the die bonding swing arm to ascend and descend, the third rotary driving piece is used for driving the die bonding swing arm to rotate, and the die bonding swing arm is provided with a suction nozzle used for adsorbing a wafer.

[0013] Further, a dispensing mechanism is arranged above the die bonding workbench, and the dispensing mechanism is used for dispensing glue for the support.

[0014] Further, the first lifting driving piece and / or the translation driving piece are a linear module or a linear motor.

[0015] The die bonder has the advantages that: a plurality of material boxes are arranged on the loading mechanism, so that the loading quantity of the support is increased, the replacement frequency of the material box is reduced, and the die bonding work efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 FIG. 1 is a schematic structural view of the die bonder of the embodiment one of the utility model;

[0017] Fig. 2 FIG. 3 is a schematic structural view of the die bonding mechanism in the die bonder of the embodiment one of the utility model;

[0018] Fig. 3 FIG. 4 is a schematic structural view of the blue film tensioning mechanism in the die bonder of the embodiment one of the utility model.

[0019] Explanation of reference numerals:

[0020] 1. die bonding workbench;

[0021] 2. loading mechanism; 21. first lifting driving part; 22. translation driving part; 23. rack; 24. magazine;

[0022] 3. pushing device;

[0023] 4. first displacement mechanism; 41. first position recognition device;

[0024] 5. die bonding mechanism; 51. die bonding swing arm; 52. second lifting driving part; 53. third rotation driving part; 54. suction nozzle;

[0025] 6. blue film tensioning device; 61. mounting seat; 62. film expanding ring; 63. blue film carrier; 64. driven mechanism; 641. lifting bolt; 642. driven wheel; 65. film expanding driving mechanism; 651. first rotation driving part; 652. driving wheel; 653. swing plate; 654. second rotation driving part; 66. rotation driving device;

[0026] 7. second displacement mechanism; 71. second position recognition device;

[0027] 8. dispensing mechanism. DETAILED DESCRIPTION

[0028] To make the technical content of the present application, the purposes and effects achieved more clear, the following will be described in detail in combination with the embodiments and the accompanying drawings.

[0029] Please refer to Figs. 1 to 3 , the die bonder comprises a die bonding workbench 1, a loading mechanism 2, a pushing device 3, a die bonding mechanism 5 and a blue film tensioning device 6, the die bonding workbench 1 is used for bearing a support, the die bonding mechanism 5 is used for fixing a wafer to the support, the blue film tensioning device 6 is used for supplying the wafer for the die bonding mechanism 5, the loading mechanism 2 is arranged on one side of the die bonding workbench 1, the loading mechanism 2 comprises a first lifting driving part 21, a translation driving part 22, a rack 23 and a plurality of magazines 24, the magazine 24 is used for storing the support, the plurality of magazines 24 are arranged on the rack 23 and distributed along a first direction, the first lifting driving part 21 is used for driving the rack 23 to lift, the translation driving part 22 is used for driving the rack 23 to move along the first direction so as to align the magazine 24 with the pushing device 3, and the pushing device 3 is used for moving the support in the magazine 24 to the die bonding workbench 1.

[0030] The beneficial effects of the utility model lie in that the die bonder is provided with a plurality of material boxes 24 on the loading mechanism 2, thereby increasing the loading quantity of the support, reducing the replacement frequency of the material box 24, and being beneficial to improving the die bonding work efficiency.

[0031] Further, the first displacement mechanism 4 is used for driving the die bonding workbench 1 to move, and the first position recognition device 41 is arranged above the die bonding workbench 1 and is electrically connected with the first displacement mechanism 4.

[0032] According to the above description, the first displacement mechanism 4 drives the die bonding workbench 1 to move according to the recognition result of the first position recognition device 41, so that the die bonding position on the die bonding workbench 1 moves to the preset die bonding station, and the displacement compensation of the die bonding workbench 1 is beneficial to simplifying the driving structure of the die bonding mechanism 5, improving the operation speed of the die bonding mechanism 5, and shortening the stroke of the die bonding mechanism 5, thereby improving the die bonding efficiency.

[0033] Further, the second displacement mechanism 7 is used for driving the blue film tensioning device 6 to move, and the second position recognition device 71 is arranged above the blue film tensioning device 6 and is electrically connected with the second displacement mechanism 7.

[0034] According to the above description, the second displacement mechanism 7 drives the blue film tensioning device 6 to move according to the recognition result of the second position recognition device 71, so that the wafer at different positions on the blue film tensioning device 6 moves to the feeding station, and the displacement compensation of the blue film tensioning device 6 is beneficial to simplifying the driving structure of the die bonding mechanism 5, improving the operation speed of the die bonding mechanism 5, and shortening the stroke of the die bonding mechanism 5, thereby improving the die bonding efficiency.

[0035] Further, the blue film tensioning device 6 comprises a mounting seat 61, a film expanding ring 62, a blue film carrier 63, a driven mechanism 64 and a film expanding driving mechanism 65, the film expanding ring 62 is mounted on the mounting seat 61, the blue film carrier 63 is sleeved on the outer periphery of the film expanding ring 62, and the film expanding driving mechanism 65 drives the blue film carrier 63 to ascend and descend relative to the mounting seat 61 through the driven mechanism 64.

[0036] According to the above description, after the blue film carrier 63 fixes the blue film ring, the film expanding driving mechanism 65 drives the blue film carrier 63 to descend, the blue film on the blue film ring is extruded by the top edge of the film expanding ring 62 and is thereby tensioned, so that the lateral and longitudinal spacings of the wafers on the blue film are expanded, and the die bonding mechanism 5 is facilitated to pick up a single wafer.

[0037] Further, the driven mechanism 64 comprises a lifting screw 641 and a driven wheel 642, the lifting screw 641 is fixedly connected with the blue film carrier 63, and the driven wheel 642 is rotatably installed on the mounting seat 61 and threadedly cooperates with the lifting screw 641.

[0038] As described above, the rotation of the driven wheel 642 can drive the lifting screw 641 to axially lift the blue film carrier 63 along the screw thread of the lifting screw 641.

[0039] In other possible embodiments, the driven mechanism 24 can be provided as a gear and rack structure or a worm and gear structure.

[0040] Further, the blue film tensioning device 6 is further provided with a rotary driving device 66, which is used to drive the mounting seat 61 to rotate.

[0041] As described above, the rotation of the mounting seat 61 driven by the rotary driving device 66 can correct the angle of the blue film ring on the blue film carrier 63, so as to align the angle of the wafer on the blue film, so as to accurately fix the wafer to the support.

[0042] Further, the film expanding driving mechanism 65 comprises a first rotary driving member, a driving wheel 652, a swing plate 653 and a second rotary driving member, the swing plate 653 is rotatably installed on the mounting seat 61, the driving wheel 652 is rotatably installed on the swing plate 653, the first rotary driving member is used to drive the driving wheel 652 to rotate, and the second rotary driving member is used to drive the swing plate 653 to swing so as to make the driving wheel 652 contact or separate from the driven mechanism 64.

[0043] As described above, when the driving wheel 652 on the swing plate 653 driven by the second rotary driving member 654 contacts the driven mechanism 64, the first rotary driving member 651 provides power for the driven mechanism 64 through the driving wheel 652, and when the blue film tensioning is completed, the second rotary driving member 654 drives the driving wheel 652 on the swing plate 653 to separate from the driven mechanism 64, so that the mounting seat 61 can perform a rotary motion.

[0044] Further, the die bonding mechanism 5 comprises a die bonding swing arm 51, a second lifting driving member 52 and a third rotary driving member 53, the second lifting driving member 52 is used to drive the die bonding swing arm 51 to lift, and the third rotary driving member 53 is used to drive the die bonding swing arm 51 to rotate, and the die bonding swing arm 51 is provided with a suction nozzle 54 for adsorbing a wafer.

[0045] As can be known from the above description, the third rotary driving member 53 drives the flip chip swing arm 51 to swing, so that the flip chip swing arm 51 is quickly reciprocated between the blue film tensioning device 6 and the flip chip workbench 1, and compared with a linear driving device, the speed of moving the suction nozzle 54 is faster, which is more conducive to improving the flip chip efficiency; the second lifting driving member 52 drives the flip chip swing arm 51 to move the suction nozzle 54 to be close to or away from the blue film tensioning device 6 and the flip chip workbench 1, so as to accurately take and place the wafer.

[0046] In other possible embodiments, the suction nozzle 54 can be driven by a horizontally arranged linear motor cooperating with a vertically arranged linear motor.

[0047] Further, the flip chip workbench 1 is provided with a dispensing mechanism 8 above, and the dispensing mechanism 8 is used for dispensing for the support.

[0048] As can be known from the above description, the support can be dispensed on the flip chip machine, and then the wafer is fixed to the corresponding dispensing position, without the need of additionally setting a dispensing machine, which is conducive to shortening the production line and reducing the support transportation time.

[0049] Further, the first lifting driving member 21 and / or the translation driving member 22 are linear modules or linear motors.

[0050] As can be known from the above description, the types of the first lifting driving member 21 and the translation driving member 22 can be selected according to different production conditions or use needs, and the first lifting driving member 21 and / or the translation driving member 22 can be modified from commercially available standard parts.

[0051] Please refer to Fig. 1 Fig. 3 The preferred embodiment of the utility model discloses a flip chip machine, which comprises a flip chip workbench 1, a loading mechanism 2, a pushing device 3, a flip chip mechanism 5 and a blue film tensioning device 6, the flip chip workbench 1 is used for bearing a support, the flip chip mechanism 5 is used for fixing a wafer on the support, the blue film tensioning device 6 is used for supplying the wafer for the flip chip mechanism 5, the loading mechanism 2 is arranged on one side of the flip chip workbench 1, the loading mechanism 2 comprises a first lifting driving member 21, a translation driving member 22, a rack 23 and a plurality of magazine boxes 24, the magazine box 24 is used for storing the support, the plurality of magazine boxes 24 are all arranged on the rack 23 and are distributed along a first direction, the first lifting driving member 21 is used for driving the rack 23 to lift, the translation driving member 22 is used for driving the rack 23 to move along the first direction so that the magazine box 24 is aligned with the pushing device 3, and the pushing device 3 is used for moving the support in the magazine box 24 to the flip chip workbench 1.

[0052] In the embodiment, the die bonding mechanism 5 and the blue film tensioning device 6 are sequentially arranged on one side of the die bonding workbench 1 along a first direction, and the loading mechanism 2 and the pushing device 3 are sequentially arranged on one side of the die bonding workbench 1 along a second direction perpendicular to the first direction. The inside of the blue film tensioning device 6 is further provided with a thimble assembly, which is used to abut against the blue film to make part of the chips on the blue film protrude upward, so as to facilitate the die bonding mechanism 5 to pick up the chips. The pushing device 3 comprises a push rod and a push rod driving assembly, and the push rod driving assembly is a motor-driven belt transmission device, which is used to drive the push rod to reciprocate and thereby push the supports in the material box 24. The number of the material boxes 24 is three. The first lifting driving member 21 and the translation driving member 22 are both linear modules. In other embodiments, the number of the material boxes 24 can be two, four or more. The first lifting driving member 21 or the translation driving member 22 can be a linear motor.

[0053] The die bonder further comprises a first displacement mechanism 4, which is used to drive the die bonding workbench 1 to move. The die bonding workbench 1 is further provided with a first position recognition device 41 above it, which is electrically connected with the first displacement mechanism 4. In the embodiment, the first displacement mechanism 4 is an electric XY-axis displacement platform, and the first position recognition device 41 comprises a CCD camera and a control module for processing the recognition signal of the CCD camera. In other embodiments, the first displacement mechanism 4 can be composed of a plurality of cross-arranged linear motors.

[0054] The die bonder further comprises a second displacement mechanism 7, which is used to drive the blue film tensioning device 6 to move. The blue film tensioning device 6 is provided with a second position recognition device 71 above it, which is electrically connected with the second displacement mechanism 7. A base is fixedly connected below the blue film tensioning device 6, and the blue film tensioning mechanism is drivingly connected with the second displacement mechanism 7 through the base. In the embodiment, the second displacement mechanism 7 is an electric XY-axis displacement platform, and the second position recognition device 71 comprises a CCD camera and a control module for processing the recognition signal of the CCD camera. In other embodiments, the second displacement mechanism 7 can be composed of a plurality of cross-arranged linear motors.

[0055] The blue film tensioning device 6 comprises a mounting seat 61, a film expanding ring 62, a blue film carrier 63, a driven mechanism 64 and a film expanding driving mechanism 65. The film expanding ring 62 is mounted on the mounting seat 61, and the blue film carrier 63 is sleeved on the outer periphery of the film expanding ring 62. The blue film carrier 63 abuts against the top surface of the film expanding ring, so that the bottom surface of the blue film in the middle of the film expanding ring is pressed against the film expanding ring 62. The film expanding driving mechanism 65 drives the blue film carrier 63 to ascend and descend relative to the mounting seat 61 through the driven mechanism 64.

[0056] The driven mechanism 64 comprises a lifting bolt 641 fixedly connected with the blue film carrier 63 and a driven wheel 642 rotatably mounted on the mounting seat 61 and threadedly matched with the lifting bolt 641. In the embodiment, the lifting bolt 641 and the driven wheel 642 are correspondingly arranged and both have a plurality of quantities, and the plurality of driven wheels 642 are uniformly distributed around the circumference of the film expanding ring 62. The plurality of driven wheels 642 are synchronously rotated through a synchronous belt. The driven wheel 642 is coaxially arranged with the lifting bolt 641, and the axial direction of the thread of the lifting bolt 641 is vertical. In other embodiments, the lifting bolt 641 and the driven wheel 642 can be provided as one; the driven mechanism 64 can be provided as a gear and rack structure or a worm and gear structure, etc.

[0057] The blue film tensioning device 6 is further provided with a rotary driving device 66 for driving the mounting seat 61 to rotate. Specifically, the rotary driving device 66 is electrically connected with the second position recognition device 71, and the rotary driving device 66 drives the mounting seat 61 to rotate according to the recognition result of the second position recognition device 71. In the embodiment, the rotary driving device 66 is a motor-driven belt transmission structure, and the rotary driving device 66 is mounted on the base of the blue film tensioning device 6. In other embodiments, the rotary driving device 66 can be provided as a motor-driven gear set structure.

[0058] The film expanding driving mechanism 65 comprises a first rotary driving member, a driving wheel 652, an oscillating plate 653 and a second rotary driving member. The oscillating plate 653 is rotatably mounted on the mounting seat 61, the driving wheel 652 is rotatably mounted on the oscillating plate 653, the first rotary driving member is used for driving the driving wheel 652 to rotate, and the second rotary driving member is used for driving the oscillating plate 653 to oscillate so as to make the driving wheel 652 contact or separate from the driven mechanism 64. In the embodiment, one end of the oscillating plate 653 is rotatably connected to the base of the blue film tensioning device 6. The second rotary driving member 654 is a linear cylinder, which is fixedly mounted on the base of the blue film tensioning device 6, and the piston rod end thereof is rotatably connected with the oscillating plate 653. The first rotary driving member 651 is a motor, which is mounted on the oscillating plate 653 and drives the driving wheel 652 to rotate through a synchronous belt. The driving wheel 652 is a bevel gear, and at least one driven bevel gear is arranged on the driven wheel 642 of the driven mechanism 64 and engaged with the driving wheel 652. In other embodiments, the second rotary driving member 654 can be provided as a motor; it is also feasible that the first rotary driving member 651 drives the driving wheel 652 to rotate through a gear.

[0059] The die bonding mechanism 5 comprises a die bonding swing arm 51, a second lifting driving member 52 and a third rotating driving member 53, the second lifting driving member 52 is used for driving the die bonding swing arm 51 to lift, the third rotating driving member 53 is used for driving the die bonding swing arm 51 to rotate, and a suction nozzle 54 for adsorbing a wafer is arranged on the die bonding swing arm 51.

[0060] A dispensing mechanism 8 is arranged above the die bonding workbench 1, and the dispensing mechanism 8 is used for dispensing glue for the support. The dispensing device comprises a dispensing head, a dispensing driving mechanism and a glue supply device, the dispensing driving mechanism is used for driving the dispensing head, and the glue supply device is used for supplying glue to the dispensing head. In the embodiment, the dispensing driving mechanism is a swing arm driven by a motor.

[0061] In summary, the die bonder provided by the utility model increases the loading quantity of the support by arranging multiple material boxes on the loading mechanism, reduces the replacement frequency of the material boxes, and is beneficial to improving the die bonding work efficiency. The translation driving member is used for driving the multiple material boxes to move so as to switch different material boxes to be aligned with the material pushing device, the lifting driving member drives the material boxes to lift so as to make the supports in the material boxes be sequentially aligned with the material pushing device, and the material pushing device is convenient to push the supports to the die bonding workbench.

[0062] The above is only an embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent transformation, direct or indirect application in the related technical field by using the content of the utility model specification and drawings is also included in the patent protection range of the utility model.

Claims

1. A die bonder characterized by: The device comprises a die bonding workbench, a loading mechanism, a pushing device, a die bonding mechanism and a blue film tensioning device, the die bonding workbench is used for bearing a support, the die bonding mechanism is used for fixing a wafer to the support, the blue film tensioning device is used for supplying the wafer for the die bonding mechanism, the loading mechanism is arranged on one side of the die bonding workbench, the loading mechanism comprises a first lifting driving element, a translation driving element, a rack and a plurality of boxes, the boxes are used for storing supports, the plurality of boxes are arranged on the rack and distributed along a first direction, the first lifting driving element is used for driving the rack to lift, the translation driving element is used for driving the rack to move along the first direction so as to align the boxes with the pushing device, and the pushing device is used for moving the supports in the boxes to the die bonding workbench.

2. The die bonder of claim 1, wherein: The device further comprises a first displacement mechanism, the first displacement mechanism is used for driving the die bonding workbench to move, and a first position recognition device is further arranged above the die bonding workbench and electrically connected with the first displacement mechanism.

3. The die bonder of claim 1, wherein: The device further comprises a second displacement mechanism, the second displacement mechanism is used for driving the blue film tensioning device to move, and a second position recognition device is arranged above the blue film tensioning device and electrically connected with the second displacement mechanism.

4. The die bonder of claim 1, wherein: The blue film tensioning device comprises a mounting seat, a film expanding ring, a blue film carrier, a driven mechanism and a film expanding driving mechanism, the film expanding ring is mounted on the mounting seat, the blue film carrier is sleeved on the outer periphery of the film expanding ring, and the film expanding driving mechanism drives the blue film carrier to lift relative to the mounting seat through the driven mechanism.

5. The die bonder of claim 4, wherein: The driven mechanism comprises a lifting bolt and a driven wheel, the lifting bolt is fixedly connected with the blue film carrier, and the driven wheel is rotatably mounted on the mounting seat and threadedly matched with the lifting bolt.

6. The die bonder of claim 4, wherein: A rotary driving device is further arranged on the blue film tensioning device, and the rotary driving device is used for driving the mounting seat to rotate.

7. The die bonder of claim 6, wherein: The film expanding driving mechanism comprises a first rotary driving element, a driving wheel, a swing plate and a second rotary driving element, the swing plate is rotatably mounted on the mounting seat, the driving wheel is rotatably mounted on the swing plate, the first rotary driving element is used for driving the driving wheel to rotate, and the second rotary driving element is used for driving the swing plate to swing so as to make the driving wheel contact or separate from the driven mechanism.

8. The die bonder of claim 1, wherein: The die bonding mechanism comprises a die bonding swing arm, a second lifting driving element and a third rotary driving element, the second lifting driving element is used for driving the die bonding swing arm to lift, the third rotary driving element is used for driving the die bonding swing arm to rotate, and a suction nozzle for adsorbing the wafer is arranged on the die bonding swing arm.

9. The die bonder of claim 1, wherein: A dispensing mechanism is arranged above the die bonding workbench, and the dispensing mechanism is used for dispensing glue for the support.

10. The die bonder of claim 1, wherein: The first lifting driving element and / or the translation driving element is a linear module or a linear motor.

Images