Fast and stable silicon wafer channel changing device

Abstract

The utility model discloses a rapid and stable silicon wafer channel changing device, which comprises a bottom plate, a notch is arranged on the bottom plate, a cylinder mounting plate is mounted in the notch, one side of the cylinder mounting plate is detachably connected with a jacking cylinder, the jacking cylinder comprises a plurality of piston rods, the tops of the piston rods are connected with a top plate, and the top plate is detachably connected with the cylinder mounting plate. A jacking frame is detachably connected to the top plate, a cross beam is detachably connected to the top of the jacking frame, slope supporting plates are detachably connected to the two ends of the cross beam, a vertical beam is detachably connected to the portion, between the slope supporting plates on the two sides, of the cross beam, and slopes correspondingly matched with the slope supporting plates are arranged on the two sides of the top face of the vertical beam respectively. The inclined planes on the two sides are matched with the slopes on the slope supporting plates on the two sides to form a V-shaped containing groove for limiting horizontal displacement of the silicon wafers, the silicon wafers are fixed in the V-shaped containing groove under the influence of gravity, and the silicon wafer positioning device has the advantages of preventing the silicon wafers from deviating and being accurate in positioning.

Description

TECHNICAL FIELD

[0001] The utility model relates to solar silicon wafer cell production technical field, concretely is a kind of quick stable silicon wafer lane changing device. BACKGROUND

[0002] In the solar silicon wafer cell production process, the automatic transmission of silicon wafer is one of key links, in sorting or detection and other processes, silicon wafer usually needs to be transverse in the conveying line Lane, the existing lane changing mode usually uses jacking transverse mechanism, first by jacking device the silicon wafer is lifted off conveying line, then it is translated to target position by transverse device.

[0003] However, in the jacking process, the silicon wafer placed in parallel can slide or deviate due to inertia, and the silicon wafer is not completely centered after jacking, and misplacement can occur when transverse, even collision with the guide structure, resulting in a great risk of fragmentation.

[0004] Therefore, it is necessary to design a quick stable silicon wafer lane changing device to prevent the silicon wafer from deviating and positioning accurately. INVENTION CONTENTS

[0005] The utility model aims at providing a kind of quick stable silicon wafer lane changing device to solve the problems raised in the above background.

[0006] To solve the above technical problems, the utility model provides the following technical scheme: a kind of quick stable silicon wafer lane changing device, including bottom plate, the bottom plate is provided with notch, the notch is installed with cylinder mounting plate, one side of the cylinder mounting plate is detachably connected with jacking cylinder, the jacking cylinder includes several piston rods, the piston rod top is connected with top plate, the top plate is detachably connected with jacking frame, the jacking frame top is detachably connected with crossbeam, the crossbeam both ends are detachably connected with inclined slope supporting plate, the crossbeam is detachably connected with vertical beam between the inclined slope supporting plate on both sides, the vertical beam top surface both sides are respectively provided with the inclined surface corresponding with the inclined slope supporting plate cooperation, the inclined surface cooperation both sides the slope on the inclined slope supporting plate forms the V-shaped placement groove that limits the horizontal displacement of silicon wafer, silicon wafer is fixed in the V-shaped placement groove under the influence of gravity.

[0007] According to the above technical scheme, the jacking cylinder is a multi-piston parallel structure, and the piston rods are synchronized to jacking motion.

[0008] According to the above technical scheme, the jacking cylinder is detachably connected with at least two speed regulating valves on one side, the speed regulating valve is provided with pneumatic quick connector for connecting with external gas supply pipe, and at least two magnetic switches are embedded in the side of the jacking cylinder away from the cylinder mounting plate for feeding the stroke position of the piston rod.

[0009] According to the technical scheme, the piston rod is sleeved with a limiting plate between the top plate and the jacking cylinder for preventing the piston rod from shaking.

[0010] According to the technical scheme, the bottom plate is provided with a plurality of threaded holes for connecting and fixing external equipment.

[0011] According to the technical scheme, the slope surface of the slope supporting plate and the inclined surface are both coated with a polyurethane coating.

[0012] According to the technical scheme, the cross beam is provided with a connecting hole, and the vertical beam and the slope supporting plate are connected to the cross beam through the connecting hole.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] (1) The jacking cylinder with the multi-piston parallel structure is provided, and at least three synchronously moving piston rods work cooperatively, so that the stability and balance of the silicon wafer jacking process are significantly improved, and the problems of unbalanced load and shaking in the jacking process of the traditional piston cylinder are solved.

[0015] (2) The V-shaped placing groove structure is provided, the V-shaped structure for positioning and clamping the silicon wafer is formed by the precise cooperation of the vertical beam inclined surface and the slope supporting plate, and the stable placement can be realized by gravity, the sliding or deviation of the silicon wafer due to inertia is avoided, the silicon wafer is positioned, and the collision with other components during horizontal movement is avoided, so that the silicon wafer is not broken. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute a limitation to the utility model. In the drawings:

[0017] Figure 1 It is a structure composition schematic view of the utility model;

[0018] Figure 2 It is an isometric schematic view of the utility model;

[0019] In the figure: 10, bottom plate; 11, notch; 12, cylinder mounting plate; 13, threaded hole; 20, jacking cylinder; 21, piston rod; 22, speed regulating valve; 23, pneumatic quick plug interface; 24, magnetic switch; 25, limiting plate; 30, top plate; 31, jacking frame; 32, cross beam; 33, slope supporting plate; 34, vertical beam; 35, inclined surface; 36, V-shaped placing groove. DETAILED DESCRIPTION

[0020] In order for the personnel in the art to better understand the scheme of the present application, the scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor shall belong to the scope of protection of the present application.

[0021] The technical scheme of the present application provides a rapid and stable silicon wafer lane changing device, which comprises a bottom plate 10, a notch 11 is arranged on the bottom plate 10, a cylinder mounting plate 12 is installed on the notch 11, a jacking cylinder 20 is detachably connected to one side of the cylinder mounting plate 12, the jacking cylinder 20 comprises a plurality of piston rods 21, a top plate 30 is connected to the top of the piston rod 21, the top plate 30 is detachably connected to a jacking frame 31, the jacking frame 31 is detachably connected to a cross beam 32 at the top, the cross beam 32 is detachably connected to a slope supporting plate 33 at both ends, the cross beam 32 is detachably connected to a vertical beam 34 between the two slope supporting plates 33, and a slope 35 corresponding to the slope supporting plate 33 is arranged on both sides of the top surface of the vertical beam 34. The two side slopes 35 cooperate with the slopes on the two side slope supporting plates 33 to form a V-shaped placing groove 36 for limiting the horizontal displacement of the silicon wafer, and the silicon wafer is fixed in the V-shaped placing groove 36 under the influence of gravity.

[0022] Through the technical scheme, the jacking cylinder 20 pushes the piston rod 21 to make the top plate 30 and the jacking frame 31 rise or fall, thereby driving the cross beam 32 connected with the jacking frame 31 to rise or fall, and further driving the V-shaped placing groove 36 composed of the slope supporting plate 33 and the vertical beam 34 to rise or fall, thereby realizing the upward and downward transportation of the silicon wafer. The V-shaped placing groove 36 composed of the slopes 35 of the slope supporting plate 33 and the vertical beam 34 effectively fixes the silicon wafer by using the action of gravity, can accurately limit the horizontal displacement of the silicon wafer, makes the position of the silicon wafer accurate during jacking, and lays a foundation for subsequent lane changing operation.

[0023] Further, the jacking cylinder 20 is a multi-piston parallel structure, and the plurality of piston rods 21 synchronously perform jacking movement.

[0024] Through the technical scheme, the jacking cylinder 20 with a multi-piston parallel structure can provide uniform and stable jacking force, so that the plurality of piston rods 21 move synchronously, and the top plate 30 and the jacking frame 31 stably rise or fall. This makes the cross beam 32, the slope supporting plate 33 and the vertical beam 34 connected with the jacking frame 31 stably perform lifting action, avoids displacement, falling and other situations of the silicon wafer during jacking due to shaking and tilting, and guarantees the stability of the silicon wafer during lane changing.

[0025] Further, at least two speed regulating valves 22 are detachably connected to the jacking cylinder 20, the speed regulating valve 22 is provided with a pneumatic quick connector 23 for connecting with an external gas supply pipe, and at least two magnetic switches 24 for feeding back the stroke position of the piston rod 21 are embedded in the side of the jacking cylinder 20 away from the cylinder mounting plate 12.

[0026] By the technical scheme, the speed regulating valve 22 is provided, and cooperates with the pneumatic quick connector 23 to conveniently connect the external gas supply pipeline, so that the air inlet and air outlet speed of the jacking cylinder 20 can be flexibly adjusted, and the jacking speed of the jacking cylinder 20 can be quickly and stably adjusted according to the specific process requirements of the silicon wafer lane change;

[0027] The magnetic switch 24 can monitor and feed back the stroke position of the piston rod 21 in real time, when the piston rod 21 moves to the preset position, the magnetic switch 24 sends a signal to the control system, and the control system accurately judges the position state of the piston rod 21 according to the signal, which helps to ensure that the silicon wafer can accurately reach the target position during the jacking and lowering process, and avoids the collision between the silicon wafer and other components due to the stroke error.

[0028] Further, the piston rod 21 is sleeved with a limiting plate 25 between the top plate 30 and the jacking cylinder 20 for preventing the piston rod 21 from shaking;

[0029] By the technical scheme, the limiting plate 25 can effectively prevent the displacement of the piston rod 21, and improve the stability of the equipment.

[0030] Further, a plurality of threaded holes 13 for connecting and fixing with external equipment are arranged on the bottom plate 10;

[0031] By the technical scheme, the threaded holes 13 arranged on the bottom plate 10 enable the lane changing device to be conveniently connected and fixed with external equipment of different types and different specifications.

[0032] Further, the slope surface of the slope supporting plate 33 and the surface of the inclined surface 35 are coated with a polyurethane coating;

[0033] By the technical scheme, the polyurethane coating increases the friction between the silicon wafer and the slope surface and the inclined surface 35, so that even if the device is subjected to a certain external impact or vibration during the lane changing action such as jacking and translation, the silicon wafer can be stably fixed in the V-shaped placing groove 36 and is not easy to slide or displace.

[0034] Further, connecting holes are formed in the cross beam 32, and the vertical beam 34 and the slope supporting plate 33 are connected to the cross beam 32 through the connecting holes;

[0035] Through the technical scheme, the connecting hole can be connected with the bolt, the bolt connection can provide reliable fastening force, the cross beam 32, the vertical beam 34 and the inclined supporting plate 33 are tightly combined into a whole, and when the device needs to be debugged, maintained or replaced, the corresponding part can be quickly disassembled by screwing off the bolt.

[0036] Working principle: when the silicon wafer needs to be switched, the silicon wafer is transported from the conveying line to the V-shaped placing groove 36, the silicon wafer is fixed in the V-shaped placing groove 36 under the action of gravity, an external air source supplies air to the jacking cylinder 20 through the pneumatic quick connector 23, the air flow is adjusted through the speed regulating valve 22, the piston rod 21 of the multi-piston parallel structure is synchronously extended, the piston rod 21 pushes the top plate 30 to vertically rise, the whole lifting frame 31 drives the cross beam 32 to rise, the limiting plate 25 effectively prevents the displacement and shaking of the piston rod 21, the magnetic switch 24 monitors the stroke position of the piston rod 21 in real time, and the accuracy of the lifting height is ensured; when the magnetic switch 24 detects an abnormal position, feedback is immediately fed back to the control system, the control system automatically cuts off the air source, and the silicon wafer is prevented from being damaged by overshoot;

[0037] When the cross beam 32 rises, the inclined supporting plates 33 at both ends and the vertical beam 34 in the middle rise synchronously, when the silicon wafer is lifted to a predetermined height, the silicon wafer is transported from the V-shaped placing groove 36 to the transverse moving part, after the switching operation is completed, the jacking cylinder 20 is exhausted, and the piston rod 21 drives the whole lifting mechanism to reset stably.

[0038] In the description of the utility model, it is to be explained that, the orientation or position relation of the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or position relation shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and is not indicative or suggestive of the device or element indicated must have a specific orientation and a specific orientation configuration and operation, therefore, it cannot be understood as a limitation on the utility model;The terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicative or suggestive of relative importance, in addition, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected;It can be mechanical connection, or electrical connection;It can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements. For ordinary skilled persons in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0039] In the description of the utility model, the description of reference term "an embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are contained in at least one embodiment or example of the utility model. In the utility model, the illustrative representation of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable way. In addition, the person skilled in the art can combine the different embodiments or examples described in the utility model and the features of the different embodiments or examples without mutual contradiction.

[0040] Although the embodiments of the utility model have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A fast and stable silicon wafer lane changing device comprising a base plate (10), characterized in that: The bottom plate (10) is provided with a notch (11), the notch (11) is mounted with a cylinder mounting plate (12), one side of the cylinder mounting plate (12) is detachably connected with a jacking cylinder (20), the jacking cylinder (20) comprises a plurality of piston rods (21), the top of the piston rod (21) is connected with a top plate (30), the top plate (30) is detachably connected with a jacking frame (31), the top of the jacking frame (31) is detachably connected with a cross beam (32), the both ends of the cross beam (32) are detachably connected with a slope supporting plate (33), the cross beam (32) is detachably connected with a vertical beam (34) between the slope supporting plates (33) on both sides, the top surface of the vertical beam (34) is provided with a slope (35) corresponding to the slope supporting plate (33) on both sides, the slopes (35) on both sides form a V-shaped placing groove (36) limiting the horizontal displacement of the silicon wafer together with the slopes on the slope supporting plates (33) on both sides, and the silicon wafer is fixed in the V-shaped placing groove (36) under the action of gravity.

2. The quick stabilizing silicon wafer lane changing device according to claim 1, wherein: The jacking cylinder (20) is a multi-piston parallel structure, and a plurality of piston rods (21) perform synchronous jacking movement.

3. The quick stabilizing silicon wafer lane changing device according to claim 1, wherein: At least two speed regulating valves (22) are detachably connected with one side of the jacking cylinder (20), the speed regulating valves (22) are provided with pneumatic quick plug interfaces (23) for connecting with external gas supply pipes, and at least two magnetic switches (24) for feeding back the stroke positions of the piston rods (21) are embedded in the side of the jacking cylinder (20) away from the cylinder mounting plate (12).

4. The quick stabilizing silicon wafer lane changing device of claim 1, wherein: The piston rod (21) is sleeved with a limiting plate (25) between the top plate (30) and the jacking cylinder (20) to prevent the piston rod (21) from shaking.

5. The quick stabilizing silicon wafer lane changing device of claim 1, wherein: A plurality of threaded holes (13) for connecting and fixing with external equipment are arranged on the bottom plate (10).

6. The quick stabilizing silicon wafer lane changing device of claim 1, wherein: The slope surface of the slope supporting plate (33) and the surface of the slope (35) are both coated with a polyurethane coating.

7. The quick stabilizing silicon wafer lane changing device of claim 1, wherein: Connecting holes are formed in the cross beam (32), and the vertical beam (34) and the slope supporting plate (33) are connected to the cross beam (32) through the connecting holes.

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