Protective cover for semiconductor

Abstract

The utility model discloses a protective cover for a semiconductor. The protective cover for the semiconductor comprises a top plate and a side plate. At least one through hole is formed in the top plate and allows an electric wire connected with the PCB to penetrate through, and the electric wire extending out of the hidden cavity from the through hole is connected with external equipment. One end of the side plate is connected with the periphery of the top plate, the top plate and the side plate jointly form a hidden cavity, the end, away from the top plate, of the side plate of the protective cover for the semiconductor is connected with the PCB, the semiconductor is installed on the side face, facing the protective cover for the semiconductor, of the PCB, the semiconductor is located in the hidden cavity, and an installation groove is formed in the side, back to the semiconductor, of the top plate. A through hole is formed in the bottom wall of a mounting groove formed by penetrating through the top plate, the external equipment comprises an assembling part and an equipment main body, the equipment main body is mounted on the assembling part, and the external equipment is assembled with the protective cover for the semiconductor in a manner that the assembling part is inserted into the mounting groove.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially relates to a protective cover for semiconductor. BACKGROUND

[0002] The integrated circuit is composed of a semiconductor chip and a PCB board, and the semiconductor chip is welded on the PCB board. Due to long-term use of the integrated circuit, the welding PIN pin foot between the semiconductor chip and the PCB board is prone to moisture oxidation, which can cause unstable signals of the integrated circuit, and in severe cases, can also cause short circuit of adjacent PIN pin feet, thereby causing the integrated circuit to be burned out. SUMMARY

[0003] To solve the above technical problems and achieve at least one advantage of the utility model, the utility model provides a protective cover for semiconductor, the protective cover for semiconductor includes:

[0004] A top plate forms at least one through hole, the through hole allows the wire connected with the PCB board to pass through, and the wire of the hidden cavity extending from the through hole is connected with an external device;

[0005] A side plate, one end of the side plate is connected with the periphery of the top plate, and the top plate and the side plate jointly form a hidden cavity, one end of the side plate of the protective cover for semiconductor away from the top plate is connected with the PCB board, the PCB board is installed with a semiconductor on one side of the protective cover for semiconductor, the semiconductor is located in the hidden cavity, one side of the top plate away from the semiconductor forms a mounting groove, the bottom wall of the mounting groove formed through the top plate forms the through hole, the external device includes an assembly part and a device main body, the device main body is installed on the assembly part, and the external device is assembled with the protective cover for semiconductor in a mode that the assembly part is plugged into the mounting groove.

[0006] According to an embodiment of the utility model, one end of the side plate away from the top plate forms an assembly structure, the PCB board forms a mounting structure, the assembly structure is detachably installed on the mounting structure, and the protective cover for semiconductor is connected with the PCB board through assembly of the assembly structure and the mounting structure.

[0007] According to an embodiment of the utility model, one side of the top plate away from the semiconductor forms one mounting groove, the mounting groove formed by the top plate is in a non-circular shape, and the external device is provided with one assembly part.

[0008] According to an embodiment of the utility model, the shape of the mounting groove formed by the top plate is in an elliptical shape or a polygonal shape.

[0009] According to the utility model one embodiment, the top plate forms a plurality of mounting grooves on the side away from the semiconductor, and the external device is provided with a plurality of assembly parts which are respectively inserted into the mounting grooves.

[0010] According to the utility model one embodiment, the top plate forms a first stop convex edge on the side wall of the mounting groove, and the outer wall of the assembly part forms a first abutting structure, the first stop convex edge and / or the first abutting structure can be elastically deformed under pressure and restored after the pressure is removed, the assembly part is inserted into the mounting groove, and the first stop convex edge and the first abutting structure are clamped, when the assembly part moves towards the direction of being separated from the mounting groove, the first stop convex edge and the first abutting structure abut each other.

[0011] According to the utility model one embodiment, part of the bottom wall of the mounting groove formed by the top plate is upwardly protruded to form a limiting part, the limiting part forms the through hole, the assembly part forms a channel, the assembly part is inserted into the mounting groove, and the limiting part is inserted into the channel.

[0012] According to the utility model one embodiment, the limiting part forms a second stop convex edge on the side of the side wall of the mounting groove, the inner wall of the channel formed by the assembly part forms a second abutting structure, the second stop convex edge and / or the second abutting structure can be elastically deformed under pressure and restored after the pressure is removed, the assembly part is inserted into the mounting groove, and the first stop convex edge and the first abutting structure are clamped, the second stop convex edge and the second abutting structure are clamped, when the assembly part moves towards the direction of being separated from the mounting groove, the second stop convex edge and the second abutting structure abut each other.

[0013] According to the utility model one embodiment, the top plate is downwardly inclined from the periphery to the middle part, and the top plate is in the form of the middle part being low and the periphery being high.

[0014] According to the utility model one embodiment, the middle part of the top plate forms a liquid accumulation groove. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 The use scene diagram of the protective cover for the semiconductor is shown.

[0016] Figure 2 The use scene diagram of the protective cover for the semiconductor is shown. Figure 1 The cross-sectional view under the angle of state one is shown.

[0017] Figure 3 The use scene diagram of the protective cover for the semiconductor is shown. Figure 2 The enlarged view of the structure of middle A part is shown.

[0018] Figure 4The use scene diagram of another state of the protective cover for semiconductor is shown.

[0019] Figure 5 The use scene diagram of another state of the protective cover for semiconductor is shown. Figure 4 The structure amplification view of B part in the middle.

[0020] Figure 6 The structure schematic diagram of the protective cover for semiconductor in one embodiment of the utility model is shown.

[0021] Figure 7 The structure schematic diagram of the protective cover for semiconductor in another embodiment of the utility model is shown.

[0022] Figure 8 The structure schematic diagram of the protective cover for semiconductor in another embodiment of the utility model is shown. DETAILED DESCRIPTION

[0023] The following description is provided to enable any person skilled in the art to make and use the present application. The preferred embodiments in the following description are only examples and the other obvious variants can be thought by those skilled in the art. The basic principles defined in the following description can be applied to other embodiments, variants, improvements, equivalents and other technical solutions without departing from the spirit and scope of the present application.

[0024] Those skilled in the art should understand that in the disclosure of the present application, the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the above terms cannot be understood as a limitation of the present application.

[0025] It can be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element can be one, and in another embodiment, the number of the element can be multiple, and the term "one" cannot be understood as a limitation on the number.

[0026] Reference Figures 1 to 8 The protective cover for semiconductor according to a preferred embodiment of the present application will be described in detail below.

[0027] The protective cover for semiconductor includes a top plate 10 and a side plate 20. One end of the side plate 20 is connected with the peripheral edge of the top plate 10, and the top plate 10 and the side plate 20 jointly form a hidden cavity 1001. The side plate 20 of the protective cover for semiconductor is connected with a PCB board 900 at one end away from the top plate 10, the PCB board 900 is installed with a semiconductor 800 towards one side of the protective cover for semiconductor, the semiconductor 800 is located in the hidden cavity 1001, and then the protective cover for semiconductor protects the semiconductor 800 from dust, liquid and other objects entering the hidden cavity 1001 to interfere with the semiconductor 800.

[0028] As an example, the top plate 10 and the side plate 20 are integrally formed.

[0029] In a preferred embodiment, one end of the side plate 20 away from the top plate 10 forms a fitting structure 21, the PCB board 900 forms a mounting structure 910, and the fitting structure 21 is detachably mounted on the mounting structure 910. The protective cover for semiconductor is connected with the PCB board 900 by fitting the fitting structure 21 and the mounting structure 910. It is worth mentioning that glue is coated between the fitting structure 21 and the mounting structure 910, and the fitting structure 21 and the mounting structure 910 are fitted and adhered by glue at the same time, so as to enhance the connection strength and sealing performance between the protective cover for semiconductor and the PCB board 900.

[0030] In an example, the fitting structure 21 is implemented as a protruding edge formed on the outer wall of one end of the side plate 20 away from the top plate 10, and the mounting structure 910 is implemented as a clamping groove. The protective cover for semiconductor is fitted with the PCB board 900 in a way that the protruding edge is clamped in the clamping groove.

[0031] In another example, the fitting structure 21 is implemented as a clamping groove formed on one end of the side plate 20 away from the top plate 10, and the mounting structure 910 is implemented as a protruding strip. The PCB board 900 is fitted with the protective cover for semiconductor in a way that the protruding strip is clamped in the clamping groove.

[0032] As a preference, the top plate 10 forms at least one through hole 101, which allows the electric wire 700 connected with the PCB board 900 to pass through, so that the electric wire 700 extending out of the hidden cavity 1001 through the through hole 101 is connected with an external device 600.

[0033] Further, the top plate 10 forms a mounting groove 102 on the side facing away from the semiconductor 800. The external device 600 includes a fitting portion 610 and a device main body 620 mounted to the fitting portion 610. The external device 600 is assembled with the protective cover for the semiconductor in such a manner that the fitting portion 610 is inserted into the mounting groove 102.

[0034] It is worth mentioning that the top plate 10 forms an inner wall of the mounting groove 102, and glue is coated between the inner wall of the mounting groove 102 and the fitting portion 610. When the external device 600 is inserted into the mounting groove 102, the external device 600 and the top plate 10 are adhered by the glue, so as to enhance the connection strength between the protective cover for the semiconductor and the external device 600.

[0035] In an embodiment, the top plate 10 forms a mounting groove 102 on the side facing away from the semiconductor 800. The mounting groove 102 formed by the top plate 10 is in a non-circular shape. The external device 600 is provided with a fitting portion 610. In this way, under the restriction of the inner wall of the mounting groove 102 formed by the top plate 10, the external device 600 is prevented from rotating relative to the top plate 10, so as to improve the stability of the connection between the protective cover for the semiconductor and the external device 600.

[0036] For example, the mounting groove 102 formed by the top plate 10 can be in an elliptical shape or a polygonal shape.

[0037] In another embodiment, the top plate 10 forms a plurality of mounting grooves 102 on the side facing away from the semiconductor 800. The external device 600 is provided with a plurality of fitting portions 610, and each fitting portion 610 is inserted into a mounting groove 102. Compared with the previous embodiment, the shape of the mounting groove 102 is not limited in this embodiment. Under the joint restriction of the inner walls of the plurality of mounting grooves 102 formed by the top plate 10, the external device 600 is prevented from rotating relative to the top plate 10, so as to improve the stability of the connection between the protective cover for the semiconductor and the external device 600.

[0038] Preferably, the bottom wall of the mounting groove 102 formed by the top plate 10 forms the through hole 101. In this way, the electric wire 700 extending out of the hidden cavity 1001 from the through hole 101 is connected with the external device 600 through the fitting portion 610.

[0039] In an example, the electric wire 700 is connected with the fitting portion 610, so as to connect the electric wire 700 with the external device 600.

[0040] As a deformation example, the assembly part 610 forms a channel 6101, and the electric wire 700 extending out of the hidden cavity 1001 from the through hole 101 passes through the channel 6101 formed by the assembly part 610 to connect the electric wire 700 with the external device 600.

[0041] Preferably, the top plate 10 forms a first stop convex 11 on the side wall of the mounting groove 102. The outer wall of the assembly part 610 forms a first abutting structure 611, and the first stop convex 11 and / or the first abutting structure 611 can elastically deform under pressure and recover after the pressure is removed. The assembly part 610 is inserted into the mounting groove 102, and the first stop convex 11 and the first abutting structure 611 are clamped. When the assembly part 610 moves towards the direction of being separated from the mounting groove 102, the first stop convex 11 and the first abutting structure 611 abut against each other, and the first stop convex 11 and the first abutting structure 611 cooperatively prevent the assembly part 610 from being separated from the mounting groove 102, so that the assembly part 610 is firmly assembled with the top plate 10.

[0042] Further, part of the bottom wall of the mounting groove 102 formed by the top plate 10 is upwardly protruded to form a limiting part 12, and the limiting part 12 forms the through hole 101. When the assembly part 610 forms the channel 6101, the assembly part 610 is inserted into the mounting groove 102, and the limiting part 12 is inserted into the channel 6101.

[0043] Preferably, the limiting part 12 forms a second stop convex 13 towards one side of the side wall of the mounting groove 102, and the inner wall of the channel 6101 formed by the assembly part 610 forms a second abutting structure 612. The second stop convex 13 and / or the second abutting structure 612 can elastically deform under pressure and recover after the pressure is removed. The assembly part 610 is inserted into the mounting groove 102, and the first stop convex 11 and the first abutting structure 611 are clamped, and the second stop convex 13 and the second abutting structure 612 are clamped. When the assembly part 610 moves towards the direction of being separated from the mounting groove 102, the second stop convex 13 and the second abutting structure 612 abut against each other, and the first stop convex 11 and the second stop convex 13 jointly limit the assembly part 610 to prevent the assembly part 610 from being separated from the mounting groove 102, thereby improving the firmness of the connection between the external device 600 and the top plate 10.

[0044] Further, the top plate 10 is inclined downward from the periphery to the middle part, so that the top plate 10 has a shape of low middle part and high periphery. In this way, when liquid drops on the upper surface of the top plate 10, the liquid is then gathered to the middle part under the action of gravity to be collected, so as to prevent the liquid from flowing from the upper surface of the top plate 10 to the PCB board 900.

[0045] Preferably, the middle part of the top plate 10 forms a liquid storage groove 103 to expand the space for storing liquid.

[0046] It is worth mentioning that the middle part of the top plate 10 is closer to the PCB board 900 and the semiconductor 800 than the periphery. In this way, the heat generated by the PCB board 900 and the semiconductor 800 when operating can dry the liquid falling in the liquid storage groove 103, and at the same time achieve the effect of cooling the PCB board 900 and the semiconductor 800.

[0047] It should be understood by those skilled in the art that the above description and the embodiments of the utility model shown in the drawings are only examples and do not limit the utility model. The advantages of the utility model have been fully and effectively realized. The function and structural principle of the utility model have been shown and explained in the embodiments, and the embodiments of the utility model can be any deformation or modification without departing from the principle.

Claims

1. A protective cover for a semiconductor, characterized by, The protective cover for semiconductor includes: a top plate forming at least one through hole allowing an electric wire connected with a PCB to pass through; a side plate having one end connected with the periphery of the top plate and forming a hidden cavity together with the top plate, the electric wire extending from the through hole to the hidden cavity being connected with an external device, the side plate of the protective cover for semiconductor being connected with the PCB at the end away from the top plate, the PCB being installed with a semiconductor on one side of the protective cover for semiconductor, the semiconductor being located in the hidden cavity, the side of the top plate away from the semiconductor forming an installation slot, the bottom wall of the installation slot formed through the top plate forming the through hole, the external device including a fitting part and a device main body, the device main body being installed on the fitting part, the external device being assembled with the protective cover for semiconductor in a manner that the fitting part is inserted into the installation slot.

2. The protective cover for a semiconductor as claimed in claim 1, wherein The end of the side plate away from the top plate forms a fitting structure, the PCB forms an installation structure, the fitting structure being detachably installed on the installation structure, the protective cover for semiconductor being connected with the PCB through the assembly of the fitting structure and the installation structure.

3. The protective cover for a semiconductor as claimed in claim 2, wherein The side of the top plate away from the semiconductor forms one installation slot, the installation slot formed by the top plate being non-circular, the external device being provided with one fitting part.

4. The protective cover for a semiconductor as claimed in claim 3, wherein The installation slot formed by the top plate is in the shape of an ellipse or a polygon.

5. The protective cover for a semiconductor as claimed in claim 2, wherein The side of the top plate away from the semiconductor forms a plurality of installation slots, the external device being provided with a plurality of fitting parts, each fitting part being inserted into one installation slot.

6. The protective cover for a semiconductor as claimed in claim 4 or 5, wherein The top plate forms a first stop convex edge on the side wall of the installation slot, the outer wall of the fitting part forming a first abutting structure, the first stop convex edge and / or the first abutting structure being capable of elastically deforming under pressure and recovering after the pressure is removed, the fitting part being inserted into the installation slot and the first stop convex edge and the first abutting structure being clamped, the first stop convex edge and the first abutting structure abutting each other when the fitting part moves away from the installation slot.

7. The protective cover for a semiconductor as claimed in claim 6, wherein Part of the bottom wall of the installation slot formed by the top plate is raised upward to form a limiting part, the limiting part forming the through hole, the fitting part forming a channel, the fitting part being inserted into the installation slot and the limiting part being inserted into the channel.

8. The protective cover for a semiconductor as claimed in claim 7, wherein The limiting part forms a second stop convex edge on the side wall of the installation slot, the inner wall of the channel formed by the fitting part forming a second abutting structure, the second stop convex edge and / or the second abutting structure being capable of elastically deforming under pressure and recovering after the pressure is removed, the fitting part being inserted into the installation slot and the first stop convex edge and the first abutting structure being clamped, the second stop convex edge and the second abutting structure being clamped, the second stop convex edge and the second abutting structure abutting each other when the fitting part moves away from the installation slot.

9. The protective cover for a semiconductor as claimed in claim 8, wherein, The top plate is inclined downward from the periphery to the middle part, and the top plate is in a form of middle part low and periphery high.

10. The protective cover for a semiconductor as recited in claim 8, wherein, The middle part of the top plate forms a liquid pool.

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