Injection mold easy to dissipate heat

Abstract

The injection mold comprises a fixed mold base and a movable mold base, heat dissipation assemblies are installed on the side faces of the fixed mold base and the movable mold base, each heat dissipation assembly comprises a semiconductor chilling plate, and each semiconductor chilling plate comprises a hot end and a cold end. The heat dissipation assembly is of an external structure and is directly fixed to the outer side face of the fixed mold base and the outer side face of the movable mold base, the heat dissipation assembly is connected with the water cooling plate, the heat dissipation fin and the heat dissipation fan, and the cold end of the semiconductor refrigeration fin is connected with the cold conduction plate. The installation positions and the installation number of the heat dissipation assemblies can be selectively set according to actual use requirements, complex waterways are not formed in the fixed mold base and the movable mold base, the scaling phenomenon of the waterways in the mold is avoided, the mold is easy to produce and machine, the machining cost is low, and the heat dissipation assemblies of an external structure are beneficial to maintenance and replacement and convenient to overhaul.

Description

TECHNICAL FIELD

[0001] The utility model relates to injection mold technical field, concretely is an injection mold easy to radiate heat. BACKGROUND

[0002] Injection mold is the key tool for plastic product production, through the molten plastic injection into the mold cavity cooling forming. Injection mold is a kind of precision machinery device, by cavity, core, runner etc. Component constitutes, is used for batch production complex shape, accurate size plastic parts. The heat dissipation structure of injection mold is the core design element that influences production efficiency, product quality and mold life. Reasonable heat dissipation structure can accelerate molten plastic cooling solidification, reduces production cycle, avoids deformation, shrinkage and other defects caused by temperature unevenness simultaneously.

[0003] The existing heat dissipation mode of injection mold is mostly water cooling, needs to carry out complex waterway processing in the mold, waterway needs to avoid insert, threaded hole and other structures, leads to the waterway layout in complex mold being limited, increase the production cost of injection mold, and the poor water quality can lead to scale formation in the inner wall of waterway, and cleaning and maintenance are inconvenient. UTILITY MODEL CONTENT

[0004] The utility model aims at providing an injection mold easy to radiate heat to solve the problems in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: an injection mold easy to radiate heat, including fixed mold base and movable mold base, the side surface of fixed mold base and movable mold base is equipped with heat dissipation component, the heat dissipation component includes semiconductor refrigeration piece, the semiconductor refrigeration piece includes hot end and cold end, the hot end of semiconductor refrigeration piece is connected with water cooling plate, heat sink and cooling fan, and the cold end of semiconductor refrigeration piece is connected with cold plate.

[0006] Among them, the water cooling plate is attached to the hot end of semiconductor refrigeration piece.

[0007] Among them, one side of the water cooling plate is provided with water inlet, and the other side of the water cooling plate is provided with water return port, and the inside of the water cooling plate is provided with flow channel.

[0008] Among them, the flow channel is arranged as a serpentine structure, one end of the flow channel is connected with the water inlet, and the other end of the flow channel is connected with the water return port.

[0009] Among them, the cooling fan is fixedly installed on the heat sink through the mounting bracket, and the cooling fan and the mounting bracket are fixedly connected through screws, and the mounting bracket is provided with a notch.

[0010] Among them, the cold plate is provided with mounting hole.

[0011] The guide cold plate of the heat dissipation assembly is fixedly connected with the fixed mold base and the movable mold base through screws.

[0012] The cold end of the semiconductor refrigeration sheet is attached to the guide cold plate.

[0013] The fixed mold base is provided with a gate, and a cavity is formed between the fixed mold base and the movable mold base.

[0014] Compared with the prior art, the heat dissipation assembly of the utility model has the advantages that:

[0015] 1. The heat dissipation assembly of the utility model is of an external structure, is directly fixed on the outer side surface of the fixed mold base and the movable mold base, and the installation position and the number of the heat dissipation assembly can be selectively set according to actual use requirements, so that the complex water channel is not arranged in the fixed mold base and the movable mold base, the water channel fouling phenomenon in the mold is avoided, the production and processing of the mold are simple, the processing cost is low, and the heat dissipation assembly of the external structure is convenient to maintain and replace and is convenient to overhaul.

[0016] 2. The hot end of the semiconductor refrigeration sheet is connected with the water cooling plate, the heat dissipation fin and the heat dissipation fan, the water cooling plate is connected with cooling water to water-cool and dissipate heat of the hot end, the heat dissipation fin and the heat dissipation fan are used to air-cool and dissipate heat of the hot end, the water-cooling and air-cooling are combined to forcibly dissipate heat of the hot end of the semiconductor refrigeration sheet, the heat dissipation efficiency of the hot end of the semiconductor refrigeration sheet is improved, the refrigeration capacity of the cold end of the semiconductor refrigeration sheet is improved, and the heat dissipation effect of the injection mold is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a structural schematic view of the utility model;

[0018] Figure 2 It is a top view structural schematic view of the heat dissipation assembly of the utility model;

[0019] Figure 3 It is a bottom view structural schematic view of the heat dissipation assembly of the utility model;

[0020] Figure 4 It is an internal structural schematic view of the water cooling plate of the utility model.

[0021] In the drawing: 1, fixed mold base; 2, movable mold base; 3, heat dissipation assembly; 11, gate; 31, semiconductor refrigeration sheet; 32, water cooling plate; 33, heat dissipation fin; 34, heat dissipation fan; 35, guide cold plate; 36, mounting bracket; 311, hot end; 312, cold end; 321, water inlet; 322, water outlet; 323, flow channel; 351, mounting hole. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0023] Please refer to Figures 1-4 The utility model provides a kind of technical scheme: an injection mold easy to radiate heat, including fixed mould seat 1 and movable mould seat 2, fixed mould seat 1 and movable mould seat 2 The side surface of 2 is equipped with radiating assembly 3, and radiating assembly 3 includes semiconductor refrigerating fin 31, and semiconductor refrigerating fin 31 includes hot end 311 and cold end 312, and the hot end 311 of semiconductor refrigerating fin 31 is connected with water cooling plate 32, fin 33 and cooling fan 34, and the cold end 312 of semiconductor refrigerating fin 31 is connected with cold plate 35.

[0024] Radiating assembly 3 is external structure, is directly fixed on the outer side of fixed mould seat 1 and movable mould seat 2, and the installation position and the installation number of radiating assembly 3 can be selectively set according to actual use demand, without being set in fixed mould seat 1 and movable mould seat 2 Complex waterway is avoided to appear the phenomenon that waterway in mould scales, and the production and processing of mould are simple, and processing cost is lower, and the external structure of radiating assembly 3 is beneficial to maintenance and replacement, and convenient to overhaul.

[0025] Semiconductor refrigerating fin 31 is used to radiate heat to fixed mould seat 1 and movable mould seat 2, when current passes through semiconductor refrigerating fin 31, the cold end 312 of semiconductor refrigerating fin 31 absorbs heat, and the hot end 311 of semiconductor refrigerating fin 31 releases heat, and the cold end 312 of semiconductor refrigerating fin 31 refrigerates, and is contacted with mould seat by cold plate 35, to cool the mould seat, to realize the heat dissipation of mould.

[0026] The hot end 311 of semiconductor refrigerating fin 31 is connected with water cooling plate 32, fin 33 and cooling fan 34, cooling water is passed into water cooling plate 32 to water-cool the hot end 311, and fin 33 and cooling fan 34 are used to air-cool the hot end 311, and the water-cooling and air-cooling are combined to forcibly radiate the hot end 311 of semiconductor refrigerating fin 31, improve the heat dissipation efficiency of the hot end 311 of semiconductor refrigerating fin 31, to improve the refrigeration capacity of the cold end 312 of semiconductor refrigerating fin 31, and then improve the heat dissipation effect of injection mold.

[0027] Wherein, water cooling plate 32 is attached to the hot end 311 of semiconductor refrigerating fin 31, and the hot end 311 of semiconductor refrigerating fin 31 is water-cooled by water cooling plate 32.

[0028] The water cooling plate 32 is provided with a water inlet 321 on one side and a water return port 322 on the other side, and a flow channel 323 is formed in the water cooling plate 32.

[0029] The flow channel 323 is in a serpentine structure, which prolongs the flow time and improves the uniformity of the cooling water in the flow channel 323. One end of the flow channel 323 is connected to the water inlet 321, and the other end is connected to the water return port 322.

[0030] The water cooling plate 32 is connected to a cooling water supply system. The cooling water enters the water cooling plate 32 through the water inlet 321 and flows in the flow channel 323. In the process of flowing, the hot end 311 of the semiconductor refrigeration sheet 31 is water-cooled and heat-dissipated. The cooled cooling water flows back through the water return port 322 of the water cooling plate 32, realizing water cooling circulation.

[0031] The heat dissipation fan 34 is fixedly installed on the heat dissipation fin 33 through the mounting bracket 36. The heat dissipation fan 34 and the mounting bracket 36 are fixedly connected through screws. The mounting bracket 36 is provided with a slot.

[0032] The heat dissipation fin 33 conducts heat from the hot end 311 of the semiconductor refrigeration sheet 31 to the large-area fin through a high-thermal-conductivity material. The heat dissipation fan 34 accelerates air flow and improves heat exchange rate. The heat dissipation fin 33 expands the heat dissipation area. The heat dissipation fan 34 provides power. The combination of the two can break through the limit of natural convection and achieve high-efficiency heat dissipation.

[0033] The cooling guide plate 35 is provided with mounting holes 351. A plurality of mounting holes 351 form mounting positions. The cooling guide plate 35 is installed and fixed through the mounting holes 351, and the heat dissipation assembly 3 is installed and fixed on the outer side of the mold base.

[0034] The cooling guide plate 35 of the heat dissipation assembly 3 is fixedly connected to the fixed mold base 1 and the movable mold base 2 through screws. The connection method is simple, and the heat dissipation assembly 3 is convenient to assemble and disassemble.

[0035] The cooling guide plate 35 is attached to the cold end 312 of the semiconductor refrigeration sheet 31. The cooling guide plate 35 increases the contact area of the cold end 312 of the semiconductor refrigeration sheet 31, improving the heat dissipation effect.

[0036] The fixed mold base 1 is provided with a gate 11. The fixed mold base 1 and the movable mold base 2 form a mold cavity. The molten material enters the flow channel through the gate 11, and then enters the mold cavity through the flow channel, and finally solidifies and forms in the mold cavity.

[0037] Working principle: in use, the heat dissipation assembly 3 is installed on the side of the fixed mold base 1 and the movable mold base 2, the installation position and the number of the heat dissipation assembly 3 can be selectively set according to the actual use demand, the molten material enters the flow channel through the gate 11, then enters the cavity through the flow channel, and finally solidifies and forms in the cavity, when the mold is cooled, the current passes through the semiconductor refrigeration piece 31, the cold end 312 of the semiconductor refrigeration piece 31 absorbs heat, the hot end 311 of the semiconductor refrigeration piece 31 releases heat, the cold end 312 of the semiconductor refrigeration piece 31 refrigerates, the mold base is cooled through the cold plate 35, the mold base is cooled, so that the mold is cooled, the hot end 311 of the semiconductor refrigeration piece 31 is connected with the water cooling plate 32, the heat dissipation fin 33 and the heat dissipation fan 34, the water cooling plate 32 is connected with cooling water to water-cool and cool the hot end 311, the heat dissipation fin 33 and the heat dissipation fan 34 air-cool and cool the hot end 311, the water-cooling and air-cooling are combined to forcibly cool the hot end 311 of the semiconductor refrigeration piece 31, the heat dissipation efficiency of the hot end 311 of the semiconductor refrigeration piece 31 is improved, the refrigeration capacity of the cold end 312 of the semiconductor refrigeration piece 31 is improved, and the cooling effect of the injection mold is improved.

[0038] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. An injection mold easy to dissipate heat, comprising a fixed mold base (1) and a movable mold base (2), characterized in that: The side surface of the fixed mold base (1) and the movable mold base (2) is provided with a heat dissipation assembly (3), the heat dissipation assembly (3) comprises a semiconductor refrigeration sheet (31), the semiconductor refrigeration sheet (31) comprises a hot end (311) and a cold end (312), the hot end (311) of the semiconductor refrigeration sheet (31) is connected with a water cooling plate (32), a heat dissipation fin (33) and a heat dissipation fan (34), and the cold end (312) of the semiconductor refrigeration sheet (31) is connected with a cold conducting plate (35).

2. The injection mold of claim 1, wherein: The water cooling plate (32) is attached to the hot end (311) of the semiconductor refrigeration sheet (31).

3. The injection mold of claim 1, wherein: One side of the water cooling plate (32) is provided with a water inlet (321), and the other side of the water cooling plate (32) is provided with a water return port (322), and the inside of the water cooling plate (32) is provided with a flow channel (323).

4. The injection mold of claim 3, wherein: The flow channel (323) is in a serpentine structure, one end of the flow channel (323) is connected with the water inlet (321), and the other end of the flow channel (323) is connected with the water return port (322).

5. The injection mold of claim 1, wherein: The heat dissipation fan (34) is fixedly installed on the heat dissipation fin (33) through a mounting frame (36), the heat dissipation fan (34) and the mounting frame (36) are fixedly connected through screws, and the mounting frame (36) is provided with a notch.

6. The injection mold of claim 1, wherein: The cold conducting plate (35) is provided with a mounting hole (351).

7. The injection mold of claim 1, wherein: The cold conducting plate (35) of the heat dissipation assembly (3) is fixedly connected with the fixed mold base (1) and the movable mold base (2) through screws.

8. The injection mold of claim 1, wherein: The cold conducting plate (35) is attached to the cold end (312) of the semiconductor refrigeration sheet (31).

9. The injection mold of claim 1, wherein: The fixed mold base (1) is provided with a gate (11), and a cavity is formed between the fixed mold base (1) and the movable mold base (2).

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