High-precision photoetching machine with automatic calibration function

Abstract

The utility model relates to the technical field of photoetching machines, and provides a high-precision photoetching machine with an automatic calibration function, which comprises a photoetching machine main body, a light source system, a projection objective system, a wafer table, an automatic calibration system and a control system. According to the high-precision photoetching machine with the automatic calibration function, through the synergistic effect and meticulous design of all the parts, the high-precision photoetching machine not only has stability and reliability in structure, but also realizes high-precision control and flexible adjustment of the photoetching process in function. The device can adapt to different photoetching requirements and working scenes, and the photoetching quality, efficiency and adaptability are greatly improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of photoetching machine, concretely relates to a high-precision photoetching machine with automatic calibration function. BACKGROUND

[0002] Photoetching machine is one of the most critical devices in the field of semiconductor manufacturing, and its performance directly determines the manufacturing precision and quality of chips. With the continuous development of semiconductor technology, the precision and performance requirements of photoetching machine are also getting higher and higher.

[0003] In current semiconductor manufacturing, the importance of photoetching machine is self-evident. However, the existing photoetching machine still has some shortcomings in practical application. For example, the existing photoetching machine light source system may have the problem of insufficient light source stability, which leads to insufficient stability of light wavelength and intensity in the photoetching process, affecting the photoetching quality.

[0004] In terms of projection objective system, the arrangement and focusing ability of lens group in the existing photoetching machine may be limited, making it difficult to achieve high-precision focusing and imaging of light, thereby limiting the clarity and precision of the pattern formed on the wafer.

[0005] The movement precision and flexibility of wafer table are also a problem. The existing wafer table may not be accurate enough in horizontal movement, or not flexible enough in photoetching operation on different areas of the wafer, affecting the comprehensiveness and efficiency of photoetching.

[0006] In addition, the existing photoetching machine also has certain defects in the aspect of automatic calibration function. The accuracy of position calibration may not be high enough, resulting in errors in the position of each component and affecting the precision of photoetching; the precision and timeliness of focal length calibration may not be sufficient, making it difficult to guarantee the imaging quality; the control of exposure amount may not be accurate enough, unable to meet different photoetching demands, limiting the adaptability of photoetching machine.

[0007] In terms of control system, the existing photoetching machine control system may have deficiencies in data processing and communication ability, unable to achieve efficient coordination and precise control of each component, affecting the overall performance of photoetching machine.

[0008] Therefore, the present application proposes a high-precision photoetching machine with automatic calibration function to solve the above problems. UTILITY MODEL CONTENT

[0009] In order to overcome the defects of the prior art, the purpose of the utility model is to provide a high-precision photoetching machine with automatic calibration function.

[0010] In order to achieve the above purpose, the technical scheme of the utility model is as follows: a high-precision photoetching machine with automatic calibration function, comprising:

[0011] A photoetching machine body, which is a housing of the whole device;

[0012] A light source system, which is installed on the top of the photoetching machine body;

[0013] A projection objective system, which is arranged in the middle of the photoetching machine body, and comprises a plurality of lens groups arranged in sequence from top to bottom;

[0014] A wafer table, which is arranged at the bottom inside the photoetching machine body, and is provided with an x-y axial electric guide rail at the bottom;

[0015] An automatic calibration system, which is installed inside the photoetching machine body, and comprises a position calibration module, a focal length calibration module and an exposure amount calibration module, wherein the position calibration module is installed on the rear and two side inner walls inside the photoetching machine body, the focal length calibration module is installed below the projection objective system, and the exposure amount calibration module is installed on the front side of the light source system;

[0016] A control system, which is arranged outside the photoetching machine body and on the right side.

[0017] Preferably, the position calibration module comprises a plurality of position sensors, which are distributed on the left and right and rear inner walls inside the photoetching machine body.

[0018] Preferably, the focal length calibration module comprises a focal length sensor and an electric focusing driver, wherein the focal length sensor of the focal length calibration module is installed below the projection objective system, and the electric focusing driver is connected with the projection objective system.

[0019] Preferably, the light intensity sensor of the exposure amount calibration module is installed on the front side of the light source system, the exposure amount adjusting mechanism is connected with the light source system, and the exposure amount adjusting mechanism comprises a diaphragm adjuster and a light source power adjuster.

[0020] Preferably, the control system comprises a central processing unit, a memory and a communication module, and is connected with the light source system, the projection objective system, the wafer table and the automatic calibration system, wherein the central processing unit, the memory and the communication module are arranged in sequence.

[0021] Preferably, the plurality of lens groups are arranged in sequence from top to bottom.

[0022] The photoetching machine has the following beneficial effects:

[0023] The photoetching machine body provides protection and support for the internal components, and guarantees the stability and reliability of the whole device.

[0024] The light source system can provide stable light source, and ensure that the photoetching process has continuous and suitable light, which is beneficial to improve the photoetching quality.

[0025] The sequential arrangement of multiple lens groups in the projection objective system can realize accurate focusing and imaging of light rays, thereby enabling the formation of high-definition and high-precision patterns on the wafer.

[0026] The motorized guide rail at the bottom of the wafer table enables accurate movement of the wafer table, facilitating photolithography on different areas of the wafer and improving the comprehensiveness and flexibility of photolithography.

[0027] The position calibration module in the automatic calibration system utilizes multiple position sensors to monitor position information in real time, ensuring the accuracy of the positions of various components and thereby improving the accuracy of photolithography; the focal length calibration module can finely adjust the focal length to ensure that the imaging quality is always in good condition; the exposure amount calibration module can accurately control the exposure amount to meet different photolithography needs, further improving the adaptability and quality of photolithography.

[0028] The central processor, memory, and communication module in the control system cooperate with each other to efficiently process and store data, ensuring effective communication and coordinated work between various components and realizing precise and intelligent control of the photolithography machine.

[0029] In summary, this high-precision photolithography machine with automatic calibration function, through the synergistic effect and careful design of its various parts, not only has stability and reliability in structure, but also realizes highly precise control and flexible adjustment of the photolithography process in function. It can adapt to different photolithography needs and working scenarios, greatly improving the quality, efficiency, and adaptability of photolithography. It has very important significance and value in high-tech fields such as semiconductor manufacturing and in promoting the development and technological progress of related industries. BRIEF DESCRIPTION OF DRAWINGS

[0030] In the drawings:

[0031] Figure 1 is a structural schematic diagram of the utility model;

[0032] Figure 2 is a structural schematic diagram of the light source system, projection objective system, wafer table, and automatic calibration system structure of the utility model;

[0033] Figure 3 is a structural schematic diagram of the exposure amount calibration module of the utility model;

[0034] Figure 4 is a structural schematic diagram of the wafer table and the x-y axial motorized guide rail below of the utility model;

[0035] Figure 5 is a structural schematic diagram of the control system of the utility model;

[0036] BRIEF DESCRIPTION OF DRAWINGS:

[0037] 1, photoetching machine main body; 2, light source system; 3, projection objective system; 4, wafer table; 5, automatic calibration system; 6, control system;

[0038] 11, sealing cover;

[0039] 21, laser light source;

[0040] 31, lens group;

[0041] 41, x-y axis electric guide rail;

[0042] 51, position calibration module; 52, focal length calibration module; 53, exposure amount calibration module;

[0043] 511, position sensor;

[0044] 521, focal length sensor; 522, electric focusing driver;

[0045] 531, light intensity sensor; 532, exposure amount adjusting mechanism

[0046] 5321, diaphragm adjuster; 5322, light source power adjuster;

[0047] 61, central processing unit; 62, memory; 63, communication module. DETAILED DESCRIPTION

[0048] The utility model will be combined with the drawings and examples to make further detailed description, obviously, the described example is only a part of the utility model example, rather than all examples. In the case of no conflict, the example in the application and the features in the example can be combined with each other. Based on the example in the utility model, all other examples obtained by the ordinary skill in the art without creative labor belong to the scope of the utility model protection.

[0049] It should be noted that if the utility model example has involved directionality indication (such as up, down, left, right, front, back, etc.), the directionality indication is only used to explain the relative position relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), if the specific posture changes, then the directionality indication also changes accordingly.

[0050] In addition, the plurality of refers to two or more. In addition, the technical solutions of each example can be combined with each other, but it must be based on the realization of the ordinary skill in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, also not in the protection scope required by the utility model.

[0051] Please refer to the drawings in the description Figures 1-5The utility model provides a kind of high-precision photoetch machine with automatic calibration function, with the following specific structure and component parts:

[0052] The photoetch machine main body 1 of the photoetch machine is as the stable and reliable shell of the whole device, provides solid protection and support for internal components.In the top of photoetch machine main body 1, light source system 2 is installed, which can emit light of specific wavelength and intensity, to provide stable light source for photoetch process.

[0053] The projection objective system 3 in the middle of photoetch machine main body 1 contains multiple lens groups 31 closely arranged from top to bottom, which work cooperatively to accurately focus and image the light emitted by light source, ensuring clear and accurate patterns on wafer.

[0054] Wafer table 4 is set in the bottom of photoetch machine main body 1, which is a platform for placing wafer.x-y axis electric guide rail 41 installed at the bottom of wafer table 4 can realize accurate movement of wafer table 4 in horizontal direction, so as to perform photoetch operation on different areas of wafer.

[0055] The automatic calibration system 5 installed inside photoetch machine main body 1 plays a key role.A plurality of position sensors 511 in position calibration module 51 monitor the position information of each component inside photoetch machine in real time by being distributed on the inner walls of left and right and rear of photoetch machine main body 1, to ensure the accuracy and stability of its position;focus sensor 521 of focal length calibration module 52 is installed near the lower side of projection objective system 3, which can accurately perceive focal length change, and electric focusing driver 522 connected therewith can finely adjust the focal length of projection objective system 3 according to the feedback of sensor, to ensure imaging quality;light intensity sensor 531 of exposure amount calibration module 53 is installed in front of light source system 2, for real-time detection of light intensity of light source;diaphragm adjuster 5321 and light source power adjuster 5322 in exposure amount adjusting mechanism 532 can respectively adjust diaphragm size and light source power to accurately control exposure amount, so as to adapt to different photoetch requirements.

[0056] Control system 6 is located at the right side of photoetch machine main body 1, and central processing unit 61 as the core is responsible for processing and calculating the data of each component;memory 62 is used for storing relevant data and programs;communication module 63 ensures effective communication and data transmission between control system 6 and other components.Control system 6 is closely connected with light source system 2, projection objective system 3, wafer table 4 and automatic calibration system 5, to realize accurate control and coordination of the whole photoetch machine working process.

[0057] The above merely describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0058] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0059] Furthermore, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the present specification is described in this way only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be properly combined to form other embodiments that those skilled in the art can understand.

Claims

1. A high-precision lithography machine with automatic calibration function, characterized in that, include: The main body of the lithography machine (1) is the outer shell of the entire device; The light source system (2) is installed on top of the lithography machine body (1); The projection lens system (3) is located in the middle of the lithography machine body (1). The projection lens system (3) includes multiple lens groups (31) arranged from top to bottom. A wafer stage (4) is set at the bottom of the lithography machine body (1), and an xy-axis electric guide rail (41) is installed at the bottom of the wafer stage (4); An automatic calibration system (5) is installed inside the lithography machine body (1). The automatic calibration system (5) includes a position calibration module (51), a focal length calibration module (52), and an exposure calibration module (53). The position calibration module (51) is installed on the rear and side inner walls inside the lithography machine body (1). The focal length calibration module (52) is installed below the projection lens system (3). The exposure calibration module (53) is installed in front of the light source system (2). The control system (6) is located on the right side outside the lithography machine body (1).

2. A high-precision lithography machine with automatic calibration function according to claim 1, characterized in that, The position calibration module (51) includes multiple position sensors (511), which are distributed on the left, right and rear inner walls of the lithography machine body (1).

3. A high-precision lithography machine with automatic calibration function according to claim 1, characterized in that, The focal length calibration module (52) includes a focal length sensor (521) and an electric focusing driver (522). The focal length sensor (521) of the focal length calibration module (52) is installed below the projection lens system (3), and the electric focusing driver (522) is connected to the projection lens system (3).

4. A high-precision lithography machine with automatic calibration function according to claim 1, characterized in that, The light intensity sensor (531) of the exposure calibration module (53) is installed on the front side of the light source system (2), and the exposure adjustment mechanism (532) is connected to the light source system (2). The exposure adjustment mechanism (532) includes an aperture adjuster (5321) and a light source power adjuster (5322).

5. A high-precision lithography machine with automatic calibration function according to claim 1, characterized in that, The control system (6) includes a central processing unit (61), a memory (62) and a communication module (63). The control system (6) is connected to the light source system (2), the projection lens system (3), the wafer stage (4) and the automatic calibration system (5). The central processing unit (61), the memory (62) and the communication module (63) are arranged in sequence.

6. A high-precision lithography machine with automatic calibration function according to claim 1, characterized in that, Several of the lens groups (31) are arranged from top to bottom.

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