Microcomputer efficient heat dissipation structure
By constructing an efficient heat dissipation structure in the microcomputer and utilizing components such as heat dissipation vents, ventilation mesh, cooling fans, and exhaust fans, the problem of heat dissipation inside the microcomputer is solved, achieving efficient and stable heat dissipation and ensuring the stability and service life of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-03-27
AI Technical Summary
Existing microcomputers have limited internal space and tightly packed electronic components, making it difficult to dissipate heat effectively. This can lead to overheating, affecting equipment performance and stability, and may even cause short circuits, damage, and other malfunctions.
The system employs components such as brackets, pads, fixing plates, base plates, heat dissipation vents, ventilation mesh, cooling fans, and exhaust fans to construct an efficient heat dissipation structure. Heat is dissipated through the heat dissipation vents and ventilation mesh, the cooling fans guide hot air downwards, the exhaust fans accelerate the dissipation of hot air, and rubber pads and limit blocks help stabilize the structure and prevent wear and slippage.
It effectively improves the heat dissipation efficiency of microcomputers, prevents performance degradation or hardware damage caused by overheating, ensures stable operation of equipment for a long time, reduces the risk of slippage due to vibration, and maintains the stability of the internal structure.
Smart Images
Figure CN224052610U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to computer technical field more specifically, relate to a kind of microcomputer high-efficiency heat radiation structure. BACKGROUND
[0002] Microcomputer is a special category in computer, it is small and portable. Its internal use large-scale integrated circuit technology, electronic components are closely arranged, so as to realize the miniaturization of volume. In hardware composition, it also has central processing unit, memory, hard disk and other basic components, but the size of these components is more exquisite, and the layout is more compact. Due to its portability and practicality, microcomputer is widely used in daily office, education, mobile entertainment and other scenes, such as notebook computer, tablet computer belongs to microcomputer category, users can use them anytime and anywhere to process documents, browse web pages, watch videos and other operations.
[0003] However, the existing microcomputer has the following problems when in use:
[0004] Most of the microcomputers in actual use have the following problems: due to the extremely limited internal space of most microcomputers, electronic components are closely dependent, and there is almost no sufficient free space for heat dissipation layout. This makes it difficult to effectively discharge the large amount of heat generated by electronic components during device operation, and the heat continues to accumulate in the small internal space. With the passage of time, the high temperature will seriously affect the performance of electronic components, and is prone to short circuit, damage and other faults, which not only shortens the service life of the device, but also may cause data loss and other serious consequences. The natural temperature dissipation method is not effective in the face of such compact structure inside the microcomputer. Natural heat dissipation cannot effectively penetrate the closely arranged electronic components, and heat cannot be effectively exchanged inside. This undoubtedly greatly limits the use scene and stability of the microcomputer, so that it is difficult to maintain normal operation under long-time and high-intensity work load, which brings many inconveniences and potential risks to users.
[0005] The utility model can play the role of constructing high-efficiency heat dissipation system through heat dissipation port, ventilation net, heat dissipation fan and exhaust fan, quickly discharging heat, avoiding overheating of microcomputer, rubber pad and limiting block protecting hardware, the former buffering and preventing wear and tear, the latter maintaining structural stability, preventing components from falling off. UTILITY MODEL CONTENTS
[0006] The utility model aims to solve the technical problems in the above background art, and provides a microcomputer high-efficiency heat radiation structure.
[0007] To achieve the above object, the utility model provides the following technical scheme: A microcomputer high -efficient heat dissipation structure, include: support, both sides of the support upper end all are fixedly installed with backing plate, the bottom of the support both sides all are fixedly installed with fixed plate, the middle part of support is fixedly installed with bottom plate, a plurality of heat dissipation openings are seted up on the bottom plate, the inside of heat dissipation opening all is fixedly installed with ventilation net, the upper end of fixed plate is fixedly installed with a plurality of exhaust fan, the exhaust fan all sets up below heat dissipation opening both sides.
[0008] Further preferred scheme: The bottom plate is fixedly installed with the connecting plate, the bottom of the connecting plate is embedded with the heat dissipation fan, and the heat dissipation fan guides the hot air generated at the heat dissipation opening downward.
[0009] Further preferred scheme: The upper end of the backing plate is fixedly installed with the rubber pad, and the upper end of the rubber pad is provided with a heat dissipation groove.
[0010] Further preferred scheme: The upper end of the rubber pad is fixedly installed with the limiting block, and the limiting block is located on the outer side of the upper end of the two rubber pads.
[0011] Further preferred scheme: The outer side of the fixed plate is provided with the filter screen, and the filter screen is fixedly installed on the front and back sides of the support.
[0012] Further preferred scheme: The exhaust fan guides the hot air at the bottom of the support to the front and back sides.
[0013] Beneficial effects:
[0014] 1. By setting the rubber pad and the limiting block, the rubber pad is located on the upper end of the backing plate, plays a buffering role, avoids abrasion caused by direct contact between the bottom of the microcomputer and the backing plate, the heat dissipation groove provided on the upper end of the rubber pad increases the air flow area, assists the heat generated by the components, the limiting block is fixed on the outer side of the upper end of the rubber pad, plays a positioning role on the microcomputer components placed on the rubber pad, prevents the components from sliding randomly in the horizontal direction, maintains the relative stability of the internal structure of the microcomputer, prevents the components from falling due to vibration and the like, reduces the damage risk caused by accidental falling of the components, also standardizes the air flow path around the components, cooperates with the heat dissipation groove, further improves the heat dissipation efficiency, and the two work together to help the entire heat dissipation structure operate efficiently and stably.
[0015] 2. By being provided with a heat dissipation opening, a ventilation net, a heat dissipation fan and an exhaust fan, the heat dissipation opening is arranged on the bottom plate to provide a heat dissipation channel for the heat generated by the operation of the microcomputer; the ventilation net is installed inside the heat dissipation opening, which can prevent foreign matters such as dust and sundries from entering, and can also ensure that the heat is smoothly dissipated and the air freely circulates to maintain the neatness of the internal environment; the heat dissipation fan is installed on the connecting plate below the bottom plate, and the downward airflow generated during operation can guide the hot air at the heat dissipation opening downward to quickly gather the heat; the exhaust fan is arranged on the fixed plate below the heat dissipation opening, and the hot air dissipated downward from the heat dissipation opening is accelerated to be discharged to the front and rear sides during operation, thereby enhancing the air circulation speed and accelerating the heat dissipation speed, and the heat dissipation efficiency is improved in all directions to ensure that the microcomputer maintains a low temperature during operation, avoids performance degradation or hardware damage caused by overheating, and ensures stable and efficient operation of the equipment;
[0016] 3. As described above, the microcomputer high-efficiency heat dissipation structure is provided with a heat dissipation opening, a ventilation net, a heat dissipation fan, a rubber pad, a limiting block and an exhaust fan, etc., the heat dissipation opening serves as a basic channel for heat dissipation, and the ventilation net inside ensures smooth exchange of heat and air while preventing invasion of foreign matters such as dust and sundries, thereby maintaining the cleanliness of the internal environment; the heat dissipation fan guides the hot air at the heat dissipation opening downward to quickly gather the heat, and the exhaust fan accelerates the hot air to be discharged to the front and rear sides, thereby greatly enhancing the air circulation speed and accelerating the heat dissipation; the rubber pad not only buffers the direct contact between the microcomputer and the pad plate to avoid abrasion, but also increases the air circulation area through the heat dissipation grooves arranged therein to assist the heat dissipation of the auxiliary components; the limiting block prevents the components from sliding in the horizontal direction to maintain the stability of the internal structure of the equipment and prevent the components from being damaged due to vibration and sliding, thereby improving the heat dissipation efficiency in all directions, effectively avoiding performance degradation or hardware damage of the microcomputer caused by overheating, and ensuring stable and efficient operation of the equipment for a long time. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model.
[0018] Figure 2 It is a schematic diagram of the heat dissipation frame structure of the utility model.
[0019] Figure 3 It is a schematic diagram of the heat dissipation bottom structure of the bottom plate of the utility model.
[0020] Figure 4 It is a schematic diagram of the exhaust fan structure of the utility model.
[0021] Figures 1-4 1, support; 101, bottom plate; 102, heat dissipation opening; 103, ventilation net; 104, connecting plate; 105, heat dissipation fan; 2, pad plate; 201, rubber pad; 202, heat dissipation groove; 203, limiting block; 3, fixed plate; 301, exhaust fan; 302, filter screen. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings of the embodiments of the utility model. Figures 1-4 The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings of the embodiments of the utility model.
[0023] Please refer to Figures 1-4 In the embodiments of the utility model, a microcomputer efficient heat dissipation structure comprises a support 1, the left and right sides of the upper end of the support 1 are fixedly installed with a pad 2, the front and back sides of the bottom of the support 1 are fixedly installed with a fixed plate 3, the middle part of the support 1 is fixedly installed with a bottom plate 101, a plurality of heat dissipation openings 102 are formed in the bottom plate 101, a ventilation net 103 is fixedly installed inside each heat dissipation opening 102, a plurality of exhaust fans 301 are fixedly installed on the upper end of the fixed plate 3, the exhaust fans 301 are arranged on the front and back sides below the heat dissipation openings 102, a connecting plate 104 is fixedly installed below the bottom plate 101, a heat dissipation fan 105 is embeddedly installed at the bottom of the connecting plate 104, the heat dissipation fan 105 guides the hot air generated at the heat dissipation openings 102 downward, rubber pads 201 are fixedly installed on the upper end of the pad 2, heat dissipation grooves 202 are formed in the middle part of the upper end of the rubber pads 201,
[0024] The support 1 is a support frame of the overall structure, the pad 2 on the left and right sides of the upper end of the support 1 is used for bearing the bottom of the microcomputer, that is, the notebook computer, and the bottom plate 101 in the middle part provides an installation basis for other heat dissipation components, the heat generated by the operation of the microcomputer is first dissipated outward through the plurality of heat dissipation openings 102 formed in the bottom plate 101, the ventilation net 103 fixedly installed inside each heat dissipation opening 102 can prevent foreign matters from entering on one hand and does not affect the heat dissipation and air circulation on the other hand, the connecting plate 104 fixedly installed below the bottom plate 101 is embeddedly installed with the heat dissipation fan 105, the heat dissipation fan 105 generates downward air flow when working, concentrates the hot air generated at the heat dissipation openings 102 downward, and cooperates with the exhaust fan 301 to make the hot air more efficiently discharged from the overall structure, further improves the heat dissipation effect, the plurality of exhaust fans 301 installed on the upper end of the fixed plate 3 are arranged on the front and back sides below the heat dissipation openings 102, the exhaust fans 301 accelerate the discharge of the hot air dissipated downward from the heat dissipation openings 102 when working, enhance the circulation of air, and accelerate the discharge speed of heat, the rubber pad 201 on the upper end of the pad 2 not only can play a buffering role to protect the microcomputer components placed thereon, but also can increase the air circulation area of the heat dissipation grooves 202 formed in the middle part of the upper end thereof to assist the heat dissipation of the components.
[0025] In the embodiment of the utility model, the upper end of the rubber pad 201 is fixedly installed with a limiting block 203, the limiting block 203 is located at the outer side of the upper end of the two rubber pads 201 respectively, the limiting block 203 is fixed at the outer side of the upper end of the rubber pad 201, and the limiting block 203 can play a positioning role on the microcomputer components placed on the rubber pad 201; when the components are placed on the rubber pad 201, the limiting block 203 can prevent the components from sliding randomly in the horizontal direction, ensure that the components are stably placed at a specific position, help maintain the relative stability of the internal structure of the microcomputer, prevent the components from sliding off the rubber pad 201 due to vibration and other reasons, play a certain protection role on the components, reduce the damage risk caused by accidental sliding of the components, limit the components in a specific area by the limiting block 203, regulate the flow path of the air around the components to a certain extent, and the reasonable air flow path helps to more effectively take away the heat generated by the components, and the auxiliary heat dissipation groove 202 further improves the heat dissipation efficiency.
[0026] In the embodiment of the utility model, the outer side of the fixed plate 3 is provided with a filter screen 302, the filter screen 302 is fixedly installed on the front and rear sides of the support 1, the exhaust fan 301 guides the hot air at the bottom of the support 1 to the front and rear sides, the filter screen 302 provided on the outer side of the fixed plate 3 is fixed on the front and rear sides of the support 1, and the main role is to filter air; when the exhaust fan 301 guides the hot air at the bottom of the support 1 to the front and rear sides and discharges, the filter screen 302 can block dust, hair and other foreign matters from entering the exhaust fan 301 and the entire heat dissipation structure, which not only can prevent the performance of the exhaust fan 301 from being affected due to dust accumulation and prolong the service life of the exhaust fan 301, but also can avoid the accumulation of foreign matters in the heat dissipation structure and affect the normal work of other components, the exhaust fan 301 can accelerate the heat generated by the microcomputer to the front and rear sides, in the process, the filter screen 302 filters the discharged air, at the same time, the heat dissipation fan 105 guides the hot air at the heat dissipation port 102 downward, cooperates with the exhaust fan 301, and ensures that the heat can be efficiently discharged, the rubber pad 201 and the heat dissipation groove 202 and the limiting block 203 assist the components in heat dissipation and stable placement, and jointly form an efficient and stable microcomputer heat dissipation structure.
[0027] Working principle: support 1 as a whole structure of the support frame, the upper end of the left and right sides of the pad 2 bearing the bottom of the microcomputer (notebook computer), for its stable support, at the same time, the rubber pad 201 on the pad 2 plays a buffering role, avoiding the wear and tear caused by the direct contact between the bottom of the computer and the pad 2, the limiting block 203 on the rubber pad 201 plays a positioning role for the computer components, preventing the components from sliding randomly in the horizontal direction, maintaining the relative stability of the internal structure of the microcomputer, and preventing the components from falling due to vibration and other reasons, playing a protective role, the heat generated by the operation of the microcomputer is first dissipated outward through the several heat dissipation openings 102 on the middle bottom plate 101 of the support 1, the ventilation net 103 fixedly installed inside each heat dissipation opening 102 can prevent foreign matter from entering while ensuring that heat dissipation and air circulation are not affected, the connecting plate 104 fixedly installed below the bottom plate 101 is embedded with a heat dissipation fan 105, the heat dissipation fan 105 generates downward airflow when working, which concentrates the hot air generated at the heat dissipation opening 102 downward, laying the foundation for subsequent efficient heat dissipation, the several exhaust fans 301 installed on the upper end of the fixed plate 3 are arranged on the front and rear sides below the heat dissipation opening 102, the exhaust fan 301 accelerates the hot air dissipated downward from the heat dissipation opening 102 to guide it out to the front and rear sides when working, enhancing air circulation and accelerating the speed of heat dissipation, the filter screen 302 arranged on the outer side of the fixed plate 3 is fixed on the front and rear sides of the support 1, when the exhaust fan 301 guides the hot air out to the front and rear sides, the filter screen 302 can block dust, hair and other foreign matter from entering the exhaust fan 301 and the entire heat dissipation structure, preventing the exhaust fan 301 from being affected by the performance due to dust accumulation, and preventing foreign matter from accumulating in the heat dissipation structure to affect the work of other components, the heat dissipation groove 202 opened in the upper end of the rubber pad 201 increases the air circulation area, and the limiting block 203 regulates the air flow path around the components, both of which assist in dissipating the heat generated by the components, further improving the heat dissipation efficiency, under the cooperative work of the heat dissipation fan 105 and the exhaust fan 301, it ensures that the heat can be efficiently discharged, and each component cooperates to form a high-efficiency and stable microcomputer heat dissipation structure.
Claims
1. A microcomputer high-efficiency heat dissipation structure, comprising: Support (1), both sides of the upper end of the support (1) are fixedly installed with a base plate (2), the bottom of the support (1) is fixedly installed with a fixed plate (3), characterized in that: the middle of the support (1) is fixedly installed with a bottom plate (101), a plurality of heat dissipation openings (102) are formed in the bottom plate (101), a ventilation net (103) is fixedly installed in each heat dissipation opening (102), a plurality of exhaust fans (301) are fixedly installed on the upper end of the fixed plate (3), and the exhaust fans (301) are arranged below the heat dissipation openings (102) on the front and rear sides.
2. The microcomputer high-efficiency heat dissipation structure according to claim 1, characterized by comprising: A connecting plate (104) is fixedly installed below the bottom plate (101), a heat dissipation fan (105) is embeddedly installed at the bottom of the connecting plate (104), and the heat dissipation fan (105) guides the hot air generated at the heat dissipation openings (102) downward.
3. The microcomputer high-efficiency heat dissipation structure according to claim 1, characterized by comprising: Rubber pads (201) are fixedly installed on the upper end of the base plate (2), and heat dissipation grooves (202) are formed in the upper end of each rubber pad (201).
4. The microcomputer high-efficiency heat dissipation structure according to claim 3, characterized by: Limiting blocks (203) are fixedly installed on the upper end of each rubber pad (201), and the limiting blocks (203) are respectively located on the outer sides of the upper ends of the two rubber pads (201).
5. The microcomputer high-efficiency heat dissipation structure according to claim 1, characterized by comprising: The outer sides of the fixed plates (3) are provided with filter screens (302), and the filter screens (302) are fixedly installed on the front and rear sides of the support (1).
6. The microcomputer high-efficiency heat dissipation structure according to claim 1, characterized by: The exhaust fans (301) guide the hot air at the bottom of the support (1) to the front and rear sides.