Production device of GPU (Graphics Processing Unit) immersed heat dissipation system

Abstract

The utility model belongs to the technical field of heat dissipation of electronic equipment, and discloses a production device of a GPU (Graphics Processing Unit) immersed heat dissipation system, which comprises splice plates and an oil pump system, each splice plate is a container which is formed by connecting at least two splice plates and is provided with an opening at the upper part, a plurality of server cases are connected in a box body, the outer surface of each splice plate is provided with a groove, and the oil pump system is arranged in the groove. According to the scheme, through the combined design of the aluminum spliced box body and the snakelike coil pipe, triple heat dissipation optimization is achieved, the snakelike cooling flow channel outside the box body greatly increases the heat dissipation area, and oil temperature is rapidly and evenly conducted in cooperation with the high heat conductivity of aluminum materials; the main oil pump and the secondary oil pump cooperatively work to form gradient circulation, the temperature difference in the box body is controlled within + / -1 DEG C, and uniform heat dissipation of each GPU is ensured; for a high-load GPU, heat dissipation of a hot spot area can be independently enhanced through the internal circulation oil pump, the problem of oil temperature layering in immersed heat dissipation is effectively solved, and the method is particularly suitable for long-term stable operation of the high-power GPU of a data center.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment heat dissipation technical field especially relates to a GPU immersion type heat dissipation system's production device. BACKGROUND

[0002] At present, AI technology develops rapidly, and the demand for computing power increases. Large language simulation training urgently needs high-power GPU chips. However, with the increase of computing power, the heat dissipation problem is becoming more and more serious. The traditional air cooling and liquid cooling cannot meet the demand of high-power GPU chip operation.

[0003] Immersion cooling is a new type of high-efficiency cooling technology. By immersing electronic devices such as servers in cooling oil with insulation and high heat capacity, the liquid covers the surface of the hardware to directly take away the heat, replacing the traditional air cooling or water cooling method, which has the advantages of high heat dissipation efficiency, low noise and low energy consumption, and is suitable for high-density computing scenarios such as data centers and edge computing.

[0004] However, in actual use, the heat generated by the server is conducted to the surrounding cooling oil, which makes the oil density decrease and naturally float up after being heated. The internal cooling oil forms a thermal convection cycle from bottom to top, causing the oil temperature to rise layer by layer, and the upper layer temperature is higher than the lower layer. This temperature increasing phenomenon will cause the heat dissipation condition of the upper server to deteriorate, and long-term operation in a high-temperature environment may cause performance degradation and stability deterioration of the device, and even shorten the service life. Therefore, it is necessary to optimize the oil flow design or introduce forced circulation means to solve the problem. UTILITY MODEL CONTENTS

[0005] The utility model intends to provide a GPU immersion type heat dissipation system production device to solve the problem in the above background technology. The aluminum splicing box body and the serpentine coil are combined to realize three times of heat dissipation optimization. The serpentine cooling flow channel outside the box greatly increases the heat dissipation area, and cooperates with the high thermal conductivity of aluminum material to quickly and uniformly conduct the oil temperature. The main oil pump and the secondary oil pump work together to form a gradient circulation, control the temperature difference in the box within ±1℃, and ensure uniform heat dissipation of each GPU. The internal circulation oil pump can individually strengthen the heat dissipation of the hot spot area for high-load GPU, effectively solving the oil temperature stratification problem in immersion cooling, and is especially suitable for long-term stable operation of high-power GPU in data centers.

[0006] To achieve the above purpose, the utility model provides the following technical scheme:

[0007] The utility model provides a production device of GPU immersion heat dissipation system, including splicing board and oil pump system, the splicing board is arranged into the upper opening container connected by at least two splicing boards, and the inside of box body is connected with a plurality of server case, the outer surface of splicing board is equipped with the groove, the outside copper pipe is connected in the groove, and the outside copper pipe of a plurality of splicing board is communicated and forms cooling flow channel, the oil pump system includes main oil pump, secondary oil pump and a plurality of inner circulating oil pump, and the main oil pump and secondary oil pump are communicated with main oil cylinder and secondary oil cylinder respectively, the first oil inlet and first oil outlet are connected with the outer end of splicing board respectively, the main oil pump is communicated with main oil cylinder through pipeline at first oil inlet, and the electromagnetic valve is connected on the first oil outlet, and the both ends of outside copper pipe are connected with second oil inlet and second oil outlet respectively, and the secondary oil pump forms circulation flow channel through pipeline between second oil inlet, secondary oil cylinder and second oil outlet.

[0008] Preferably, the number of splicing boards is five, and the material of the splicing boards is aluminum.

[0009] Preferably, the external copper pipe is in a serpentine shape covering the surface of the splicing board, and the shape of the external copper pipe matches the inner cavity of the groove.

[0010] Preferably, the server case is arranged in an inverted state, the interfaces on the outside of the server case are located at one end thereof facing upward, and the inside of the server case is connected with a radiator.

[0011] Preferably, the inner circulating oil pump is connected to the outer end of the splicing board, and the inner circulating oil pump is connected with an inner circulating pipeline, the oil inlet end of the inner circulating pipeline extends into the inner cavity of the splicing board, the oil outlet end of the inner circulating pipeline extends through the server case and to the upper side of the server case, and the part of the inner circulating pipeline in the inner cavity of the server case penetrates the radiator.

[0012] Compared with the prior art, the technical scheme has the following beneficial effects:

[0013] The aluminum splicing box body and the serpentine coil are combined to realize triple heat dissipation optimization, the serpentine cooling flow channel on the outside of the box body greatly increases the heat dissipation area, the high thermal conductivity of aluminum material enables rapid and uniform conduction of oil temperature, the main oil pump and the secondary oil pump work cooperatively to form gradient circulation, the temperature difference in the box body is controlled within ±1°C, and uniform heat dissipation of each GPU is ensured, the inner circulating oil pump can be used to individually strengthen heat dissipation of the hotspot area for high-load GPUs, the oil temperature stratification problem in the immersion heat dissipation is effectively solved, and the utility model is particularly suitable for long-term stable operation of high-power GPUs in data centers. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 The overall structure schematic view is provided for the utility model;

[0015] Figure 2 The first explosion structure schematic view provided by the utility model;

[0016] Figure 3 The second explosion structure schematic view provided by the utility model;

[0017] Figure 4 The server case internal structure schematic view provided by the utility model.

[0018] The figure mark: 1, splice board; 2, server case; 3, external copper pipe; 4, second oil inlet; 5, second oil outlet; 6, radiator; 7, internal circulation oil pump; 8, internal circulation pipeline; 9, first oil inlet; 10, first oil outlet. DETAILED DESCRIPTION

[0019] The utility model will be further explained in detail in connection with the drawings and implementation:

[0020] As Figures 1-2 The production device of a GPU immersion type heat dissipation system shown in the figure, including splice board 1 and oil pump system, splice board 1 is set to the container of upper opening connected by at least two splice boards, and multiple server cases 2 are connected in the box body, the outer surface of splice board 1 is provided with groove, and external copper pipe 3 is connected in the groove, multiple external copper pipes 3 outside splice board 1 are communicated to form cooling flow channel, and oil pump system includes main oil pump, secondary oil pump and multiple internal circulation oil pumps 7, main oil pump and secondary oil pump are communicated with main oil cylinder and secondary oil cylinder respectively, and the outer end of splice board 1 is connected with first oil inlet 9 and first oil outlet 10 respectively, main oil pump is communicated with first oil inlet 9 and main oil cylinder through pipeline, electromagnetic valve is connected on first oil outlet 10, and the both ends of external copper pipe 3 are connected with second oil inlet 4 and second oil outlet 5 respectively, and secondary oil pump forms circulation flow channel between second oil inlet 4, secondary oil cylinder and second oil outlet 5 through pipeline.

[0021] The immersion type heat dissipation is a new type of high-efficiency cooling technology, by directly immersing electronic equipment such as server in cooling oil with insulation and high heat capacity, using liquid to cover the surface of hardware to directly take away heat, replacing traditional air cooling or water cooling mode, with the advantages of high heat dissipation efficiency, low noise, small energy consumption etc., but in the actual use process, the cooling oil forms the heat convection circulation from bottom to top, which can cause the oil temperature to rise layer by layer, and this temperature increment phenomenon can cause the heat dissipation condition of upper layer server to be poor, and long-term operation in high temperature environment can cause the performance of equipment to decline, stability to be poor, and even shorten the service life.

[0022] In the scheme, the user can introduce the cooling oil in the main oil cylinder into the inside of the splice plate 1 through the first oil inlet 9 by starting the main oil pump, the cooling oil injection temperature is set at 35°, the electromagnetic valve is installed on the first oil outlet 10 in a closed state, and after the splice plate 1 is filled with cooling oil, complete immersion of all server cases 2 can be realized, so that the heat of the server case 2 is transferred to the cooling oil, and the temperature of the server case 2 is lowered. With the progress of the cooling process, the cooling oil in the splice plate 1 gradually appears temperature difference, resulting in a decrease in heat dissipation efficiency. At this time, the user can inject the cooling oil in the secondary oil cylinder into the external copper pipe 3 through the second oil inlet 4 by starting the secondary oil pump. The cooling oil circulates in the external copper pipe 3 on the plurality of splice plates, and finally returns to the secondary oil pump through the second oil outlet 5 to realize circulation. The cooling oil flowing in the external copper pipe 3 can absorb the heat of the cooling oil in the splice plate 1, realize the cooling of the cooling oil in the splice plate 1, maintain its heat dissipation effect, and at the same time, transfer the heat of the upper cooling oil in the splice plate 1 to the lower layer, reduce the temperature difference of the cooling oil in the splice plate 1, and after a period of time, the temperature of the cooling oil in the entire splice plate 1 is maintained at a temperature difference of +-1° from bottom to top, ensuring the uniform heat dissipation of the server case 2 as a whole and improving the stability of the GPU operation.

[0023] The number of splice plates is five, and the material of the splice plate is aluminum.

[0024] In the scheme, the aluminum box body becomes an ideal choice for the GPU immersion cooling system due to its excellent heat conductivity, lightweight characteristics and corrosion resistance, which can efficiently conduct heat and is easy to process and manufacture.

[0025] The external copper pipe 3 is in a snake shape and covers the surface of the splice plate, and the shape of the external copper pipe 3 matches the shape of the groove inner cavity.

[0026] In the scheme, the external copper pipe 3 arranged in a snake shape can cover as much area of the surface of the splice plate 1 as possible. By greatly increasing the heat dissipation surface area and combining the high thermal conductivity of aluminum material, the heat of the cooling oil in the splice plate 1 can be quickly conducted to the external copper pipe 3. At the same time, the snake-shaped flow channel prolongs the residence time of the cooling oil in the external copper pipe 3, which, combined with convection, can achieve gradient step-by-step cooling, significantly enhancing the heat dissipation effect.

[0027] The server case 2 is set in an inverted state, and the interfaces on the outside of the server case 2 are located at one end thereof facing upward, and the inside of the server case 2 is connected with a radiator 6.

[0028] In the scheme, the placement of the server case 2 is convenient for maintenance and insertion of fiber optic lines. The GPU outer end is connected with a radiator 6, and the setting of the radiator 6 can increase the heat dissipation area of the GPU and the cooling liquid, thereby realizing more efficient heat conduction.

[0029] AsFigures 3-4 As shown, the inner circulating oil pump 7 is connected to the outer end of the splice plate 1, and the inner circulating oil pump 7 is connected with the inner circulating pipeline 8, the oil inlet end of the inner circulating pipeline 8 extends into the inner cavity of the splice plate 1, the oil outlet end of the inner circulating pipeline 8 penetrates through the server case 2 and extends to the upper side of the server case 2, and the part of the inner circulating pipeline 8 in the inner cavity of the server case 2 penetrates through the radiator 6.

[0030] The scheme takes into account that the GPU loads in each server case 2 are not the same, and the GPU with higher load heats up faster. In order to individually cool the GPU that heats up faster, the scheme sets multiple inner circulating oil pumps 7 in the oil pump system. When the system shows that the temperature in a certain server case 2 is too high, in order to quickly reduce the GPU temperature in the server case 2, the user can start the inner circulating oil pump 7 corresponding to the side of the server case 2. Through the start of the inner circulating oil pump 7, the oil inlet end of the inner circulating pipeline 8 sucks the cooling liquid in the splice plate 1, and then introduces it into the inside of the server case 2 and finally discharges it from the upper side of the server case 2. Such circulation can accelerate the flow speed of the cooling oil in the server case 2, especially the inner circulating pipeline 8 penetrates through the radiator 6, which can further promote the heat of the GPU in the radiator 6 to be discharged, thereby ensuring that the temperatures of multiple GPUs are consistent, and promoting the device to operate stably and efficiently as a whole.

[0031] The above is only an embodiment of the present application, and the specific technical solutions and / or common knowledge of characteristics in the scheme are not described in detail here. It should be noted that for those skilled in the art, without departing from the technical scheme of the present application, a number of modifications and improvements can be made, which should also be considered as the protection scope of the present application, and these will not affect the effect and practicality of the present application. The protection scope of the present application should be subject to the content of its claims, and the specific implementation mode and the like in the specification can be used to explain the content of the claims.

Claims

1. An apparatus for producing a GPU immersion heat dissipation system, characterized by, The application relates to a server cabinet. The oil pump system comprises a main oil pump, a secondary oil pump and a plurality of internal circulation oil pumps (7), the main oil pump and the secondary oil pump are communicated with a main oil cylinder and a secondary oil cylinder respectively, a first oil inlet (9) and a first oil outlet (10) are connected to the outer end of the splicing plate (1), the first oil inlet (9) is communicated with the main oil cylinder through a pipeline, an electromagnetic valve is connected to the first oil outlet (10), the two ends of the external copper pipe (3) are connected with a second oil inlet (4) and a second oil outlet (5), and the secondary oil pump forms a circulating flow channel through a pipeline between the second oil inlet (4), the secondary oil cylinder and the second oil outlet (5). The number of the splicing plates is five, and the material of the splicing plates is aluminum.

2. The production device of a GPU immersion heat dissipation system according to claim 1, wherein: The external copper pipe (3) is in a serpentine shape and covers the surface of the splicing plate, and the external copper pipe (3) is matched with the shape of the inner cavity of the groove.

3. The production device of a GPU immersion heat dissipation system according to claim 1, wherein: The server cabinet (2) is arranged in an upside-down shape, the interfaces on the outer side of the server cabinet (2) are located at one end of the server cabinet (2) which faces upward, and a radiator (6) is connected to the inner side of the server cabinet (2).

4. The production device of a GPU immersion heat dissipation system according to claim 1, wherein: The internal circulation oil pump (7) is connected to the outer end of the splicing plate (1), an internal circulation pipeline (8) is connected to the internal circulation oil pump (7), the oil inlet end of the internal circulation pipeline (8) extends into the inner cavity of the splicing plate (1), the oil outlet end of the internal circulation pipeline (8) penetrates through the server cabinet (2) and extends to the upper side of the server cabinet (2), and the part of the internal circulation pipeline (8) in the inner cavity of the server cabinet (2) penetrates through the radiator (6).

5. The apparatus of claim 4, wherein: ​

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