Controller

Abstract

The utility model discloses a controller, and the controller comprises a circuit board which is provided with a first surface and a second surface which are opposite to each other; the intelligent power module is located on the first surface of the circuit board; the power factor correction module comprises an insulated gate bipolar transistor and a fast recovery diode, and the power factor correction module is located on the first surface of the circuit board; the rectifier bridge is located on the first surface of the circuit board; wherein at least two of the intelligent power module, the power factor correction module and the rectifier bridge adopt surface-mounted packaging and are located on the same side of the first surface of the circuit board, the controller further comprises a radiator, and the radiator is connected with the upper surface of the surface-mounted packaging located on the same side. By adopting surface-mounted packaging and arranging the surface-mounted packaging and the surface-mounted packaging on the same side of the circuit board, the surface-mounted packaging and the surface-mounted packaging can share the same radiator, so that the performance and the reliability of a product are improved, and the production efficiency and the product quality are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to air conditioner electrical appliance related technical field more particularly, relate to a kind of air conditioner controller. BACKGROUND

[0002] In modern air conditioning system, air conditioner outdoor unit controller as core component, to the stable operation and performance of air conditioner plays a key role.The installation and connection process of many key electronic devices on its electric control board directly affect production efficiency and product quality.

[0003] At present, intelligent power module, insulated gate bipolar transistor, fast recovery diode and rectifier bridge on the electric control board of traditional air conditioner outdoor unit are all in the form of straight insertion packaging.These straight insertion packaged devices need to be supported and fixed by support frame.During the processing of electric control board, these straight insertion packaged devices need to be inserted into circuit board one by one by manual, and then welding process is completed by wave soldering.

[0004] However, this traditional process has significant drawbacks.On the one hand, this process involves high degree of manual participation, which requires more manpower, not only increases production cost, but also limits the improvement of production efficiency to some extent.On the other hand, since the operator directly contacts these straight insertion packaged devices during operation, and these devices are sensitive to static electricity, there is inevitably a certain risk of static breakdown.Once static breakdown occurs, the device will be damaged, thereby affecting the performance and quality of the entire air conditioner outdoor unit controller, increasing the product failure rate, and causing economic loss to the production enterprise.

[0005] Therefore, it is urgent to develop a new air conditioner outdoor unit controller structure to solve the problems faced by the above-mentioned traditional controller and improve production efficiency and product quality. CONTENT OF UTILITY MODEL

[0006] In view of the above problems, the purpose of the utility model is to provide an air conditioner controller to improve the performance and reliability of the product, improve the production efficiency and product quality.

[0007] The utility model provides a kind of controller, comprising: circuit board, with opposite first surface and second surface;Intelligent power module, located in the first surface of circuit board;Power factor correction module, including insulated gate bipolar transistor and fast recovery diode, power factor correction module is located in the first surface of circuit board;Rectifier bridge, located in the first surface of circuit board;Wherein, at least two of intelligent power module, power factor correction module and rectifier bridge are in the form of surface mount package and located in the first surface of circuit board, and the controller further includes radiator, and the upper surface of surface mount package located on the same side is connected with radiator.

[0008] Optionally, the circuit board comprises four sides, and the smart power modules comprise a compressor smart power module and a fan smart power module.

[0009] Optionally, the compressor smart power module, the fan smart power module, the power factor correction module and the rectifier bridge are all in the same side of the first surface of the circuit board.

[0010] Optionally, the upper surfaces of the packages of the compressor smart power module, the fan smart power module, the power factor correction module and the rectifier bridge are flush and are all connected to the same heat sink.

[0011] Optionally, the compressor smart power module, the power factor correction module and the rectifier bridge are all in the same side of the first surface of the circuit board, and the fan smart power module is in the other side corner of the first surface of the circuit board.

[0012] Optionally, the upper surfaces of the packages of the compressor smart power module, the power factor correction module and the rectifier bridge are flush and are connected to the first heat sink, and the fan smart power module is connected to the second heat sink.

[0013] Optionally, the insulated gate bipolar transistor and the fast recovery diode are discrete chip components.

[0014] Optionally, the power factor correction module is a chip component that encapsulates the insulated gate bipolar transistor and the fast recovery diode.

[0015] Optionally, the controller further comprises a box body corresponding to the circuit board, the box body comprises a bottom surface and a side surface surrounding the bottom surface and being perpendicular to the bottom surface, and the edge of the circuit board is connected to the side surface of the box body so that the second surface of the circuit board is suspended above the bottom surface of the box body.

[0016] Optionally, the box body further comprises a support rib perpendicular to the bottom surface of the box body, and the support rib is used to support the circuit board.

[0017] Optionally, the side surface of the box body further comprises a support column, the box body is connected to the heat sink through the support column, and the top surface of the support column is not higher than the upper surface of the chip component.

[0018] Optionally, the upper surfaces of the chip components are flush, the heat sink has a flat bottom surface, and the upper surfaces of the chip components are connected to the bottom surface of the heat sink.

[0019] Optionally, the upper surfaces of the chip components are different in height, the bottom surface of the heat sink has a concave-convex structure corresponding thereto, and the upper surfaces of the chip components are connected to the bottom surface of the heat sink.

[0020] Optionally, the heat sink comprises at least one of an air-cooled heat sink, a liquid-cooled heat sink or a refrigerant-cooled heat sink.

[0021] Optionally, the heat sink includes a base plate and heat dissipation fins located above the base plate.

[0022] Optionally, the heat dissipation fins include at least one of straight and wavy shapes.

[0023] Optionally, at least a portion of the upper surface of the smart power module, the power factor correction module, and the rectifier bridge is also coated with thermal grease.

[0024] According to the controller provided by this utility model, the original through-hole packaged components are replaced with surface mount packages, and the original fast recovery diode and insulated gate bipolar transistor are integrated into the power factor correction module, thereby realizing the miniaturization of the device.

[0025] Furthermore, the controller employs surface mount packaging, allowing for machine-based surface mounting and reflow soldering, reducing manual labor and preventing electrostatic discharge (ESD) damage to the components caused by personnel carrying static electricity. Surface mount packaging also saves circuit board space; placing the components on the same side of the circuit board allows them to share a common heatsink, saving material costs associated with multiple heatsinks and reducing assembly steps, thus improving production efficiency. Attached Figure Description

[0026] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0027] Figure 1 A schematic diagram of an existing air conditioner controller circuit board is shown;

[0028] Figure 2 A schematic diagram of the controller circuit board according to an embodiment of the present invention is shown;

[0029] Figure 3 A side view of the controller according to an embodiment of the present invention is shown;

[0030] Figure 4a and Figure 4b A three-dimensional schematic diagram and a pin arrangement schematic diagram of the compressor intelligent power module in the controller of this utility model embodiment are shown respectively;

[0031] Figure 5a and Figure 5b The top view and perspective view of the power factor correction module in the controller of this utility model embodiment are shown respectively;

[0032] Figure 6 A perspective view of another power factor correction module in the controller of this utility model embodiment is shown. Figure 7a and Figure 7bThe top view and the perspective view of the rectifier bridge in the controller of the embodiment of the utility model are shown respectively. DETAILED DESCRIPTION

[0033] The utility model will be described in more detail below with reference to the drawings. For the sake of clarity, the various parts of the drawings are not drawn to scale. Furthermore, certain known parts can not be shown. In the following, numerous specific details of the utility model are described, but as a person skilled in the art can understand, the utility model can be implemented without these specific details.

[0034] The utility model can be presented in various forms, and some examples will be described below.

[0035] Figure 1 The schematic diagram of the existing air conditioner controller circuit board is shown; the circuit board 100 is provided with a fan power control module 101, a compressor power control module 102, a fast recovery diode 104, an insulated gate bipolar transistor 105 and a rectifier bridge 106, wherein the above-mentioned electrical elements on the circuit board 100 are all straight insertion type package design, need supporting frame 103 to support and fix, ensure the stability of each device on the circuit board 100.

[0036] Further, since multiple straight insertion type packaged components are used, when assembling, the corresponding components need to be inserted into the circuit board by hand, and then soldered by wave soldering, which consumes a lot of labor, and the operator may have static electricity and need to directly contact these devices, which may cause the device to be electrostatically punctured.

[0037] Figure 2 The schematic diagram of the controller circuit board of the embodiment of the utility model is shown; the circuit board 200 is provided with a first intelligent power control module 202, a second intelligent power control module 203, a power factor correction module 204 and a rectifier bridge 205, in this embodiment, the first intelligent power control module 202, the second intelligent power control module 203, the power factor correction module 204 and the rectifier bridge 205 for example all adopt patch type package, not only can save supporting frame, when assembling components and circuit board 200, machine equipment can be used for mounting, welding is carried out through reflow soldering, reduces manual work, avoids the risk that the device is electrostatically punctured by the static electricity carried by the operator.

[0038] Further, the first intelligent power control module 202, the second intelligent power control module 203, the power factor correction module 204 and the rectifier bridge 205 are all arranged on the left side of the circuit board 200, so that multiple components can share the same heat sink, when the top surfaces of multiple components are at the same height, a single larger heat sink can be used to cover and connect all the components, to enhance the heat dissipation capacity.

[0039] Another embodiment (not provided with drawings), the compressor intelligent power module, the power factor correction module and the rectifier bridge are all in the same side of the first surface of the circuit board, and the fan intelligent power module is located at the other side corner of the first surface of the circuit board. The upper surfaces of the packages of the compressor intelligent power module, the power factor correction module and the rectifier bridge are flush and connected with the first heat sink, and the fan intelligent power module is connected with the second heat sink.

[0040] The insulated gate bipolar transistor and the fast recovery diode are respectively discrete patch type packaged components.

[0041] The power factor correction module can also be a patch type packaged component which encapsulates the insulated gate bipolar transistor and the fast recovery diode.

[0042] Figure 3 A side view of the controller of the embodiment of the utility model is shown; the controller comprises a box body 304, a circuit board 200 and a heat sink 301, wherein the circuit board 200 is as shown in the drawing, a plurality of components are arranged on the circuit board 200, comprising a first intelligent power control module 202, a second intelligent power control module 203, a power factor correction module 204 and a rectifier bridge 205, the rectifier bridge 205 is in the same side of the first surface of the circuit board 200, and the fan intelligent power module is located at the other side corner of the first surface of the circuit board 200. Figure 2 Figure 3 ​The above components are, for example, attached to the upper surface of the circuit board 200, the box 304 includes a bottom surface and side edges perpendicular to the bottom surface, the edges of the circuit board 200 are provided with connecting holes, and the circuit board 200 is connected and fixed to the side edges of the box 304 through screws 305, so that the circuit board 200 is suspended above the bottom surface of the box 304. Further, the middle area of the bottom surface of the box 304 is also provided with two support ribs 306, the top ends of the support ribs 306 are in contact with the lower surface of the circuit board 200 to support the circuit board 200 and prevent the circuit board 200 from deforming. Further, the top edge area of the side edges of the box 304 is, for example, also provided with four support columns 303, the height of the support columns 303 is not higher than the top surface of the above-mentioned surface-mounted components, and the bottom plate edge of the heat sink 301 is connected to the support columns 303 through screws, and the lower surface of the bottom plate of the heat sink 301 is tightly attached to the upper surfaces of the first intelligent power control module 202, the second intelligent power control module 203, the power factor correction module 204 and the rectifier bridge 205 for heat dissipation. Further, a small amount of heat dissipation silicone grease can be coated on the upper surfaces of the surface-mounted components to make them more tightly attached to the heat sink 301, so as to obtain better electrical and thermal capacity. The heat sink 301 in the figure is a passive air-cooled heat sink, and a plurality of wave-shaped heat dissipation fins are arranged on the bottom plate thereof. Of course, the heat dissipation fins can also be linear, and the heat sink 301 can also include a fan and the like. Further, the heat sink can also be a liquid-cooled or air-conditioning refrigerant heat sink and the like. The upper surfaces of the surface-mounted packages are flush, the heat sink has a flat bottom surface, and the upper surfaces of the surface-mounted packages are connected to the bottom surface of the heat sink.

[0043] Another embodiment (not provided with an attached drawing) is that the upper surfaces of the surface-mounted packages have different heights, and the bottom surface of the heat sink has a corresponding concave-convex structure, and the upper surfaces of the surface-mounted packages are connected to the bottom surface of the heat sink.

[0044] The controller of this embodiment is, for example, a controller of an air conditioner outdoor unit, as shown in Figure 4a and Figure 4b The compressor intelligent power control module 203 is, for example, used for controlling the power of an air compressor, and the compressor intelligent power control module 203, for example, includes 26 pins, all of which are designed as surface-mounted pins and support reflow soldering.

[0045] Referring to Figure 5a and Figure 5b The power factor correction module 204, for example, includes 5 pins, one side has G pins and E pins, and the opposite side is provided with A pins, C pins and K pins. The power factor correction module 204 is packaged with fast recovery diodes and insulated gate bipolar transistors. Figure 6 Another packaging of the power factor correction module 204 is shown, as Figure 6As shown, the power factor correction module 204, for example, includes 4 pins, one side having a G pin and an input pin, the other side having an E pin and an output pin, and a fast recovery diode and an insulated gate bipolar transistor internally packaged and connected inside the plastic package.

[0046] Referring to Figure 7a and Figure 7b As shown, the rectifier bridge 205 includes 4 pins, one side having a + pin and a - pin, and the other side provided with two AC pins.

[0047] After the above-mentioned patch-type packaged components are mounted on the circuit board 200, the upper surfaces thereof should be at the same height and coplanar so as to be connected with the same heat sink 301.

[0048] According to the controller provided by the utility model, the original straight insertion type packaged component is replaced by the patch-type packaging, and the original fast recovery diode and insulated gate bipolar transistor are packaged and integrated in the power factor correction module, realizing the miniaturization of the component.

[0049] Further, the controller adopting the patch-type packaging can be pasted and reflow soldered by machine, reducing the number of manual workers and avoiding that the component is electrostatically broken down due to static electricity of personnel. Moreover, the patch-type packaging can save the area of the circuit board occupied by the component, and the patch-type packaging arranged on the same side of the circuit board can share the same heat sink for heat dissipation, which not only saves the material cost of setting multiple heat sinks and the like, but also saves the corresponding assembly process, improving the production efficiency.

[0050] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without limitation, an element preceded by "comprises... a" does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0051] In accordance with the embodiments of the present application as described above, these embodiments do not describe all the details, nor limit the present application to only the specific embodiments described. Obviously, many modifications and variations are possible in light of the above teachings. The description of these embodiments was chosen and described in order to provide the best illustration of the principles of the application and its practical application, and to thereby enable one of ordinary skill in the art to utilize the application and with modifications as appropriate for the particular use contemplated. The present application is thus not intended to be limited to the particular embodiments described and is only limited by the scope of the appended claims and equivalents thereof.

Claims

1. A controller characterized by comprising: include: A circuit board having opposing first and second surfaces; The intelligent power module is located on the first surface of the circuit board; A power factor correction module, including an insulated gate bipolar transistor and a fast recovery diode, is located on a first surface of the circuit board; The rectifier bridge is located on the first surface of the circuit board; In this circuit, at least two of the intelligent power module, the power factor correction module, and the rectifier bridge are surface-mount packages and located on the first surface of the circuit board. The controller also includes a heat sink connected to the upper surface of the surface-mount package located on the same side.

2. The controller of claim 1, wherein, The circuit board includes four sides, and the intelligent power module includes a compressor intelligent power module and a fan intelligent power module.

3. The controller of claim 2, wherein, The compressor intelligent power module, the fan intelligent power module, the power factor correction module, and the rectifier bridge are all surface-mount packages and are located on the same side of the first surface of the circuit board.

4. The controller of claim 3, wherein, The upper surfaces of the packages of the compressor intelligent power module, the fan intelligent power module, the power factor correction module, and the rectifier bridge are flush and all connected to the same heat sink.

5. The controller of claim 2, wherein, The compressor intelligent power module, the power factor correction module, and the rectifier bridge are all surface-mount packages and are located on the same side of the first surface of the circuit board, while the fan intelligent power module is located on the other side corner of the first surface of the circuit board.

6. The controller of claim 5, wherein, The upper surfaces of the packages of the compressor intelligent power module, the power factor correction module, and the rectifier bridge are flush with each other and connected to the first heat sink, while the fan intelligent power module is connected to the second heat sink.

7. The controller of claim 1, wherein, The insulated gate bipolar transistor and the fast recovery diode are discrete surface-mount packaged components.

8. The controller of claim 1, wherein, The power factor correction module is a surface-mount packaged component that encapsulates the insulated gate bipolar transistor and the fast recovery diode.

9. The controller of claim 2, wherein, It also includes a housing corresponding to the circuit board, the housing including a bottom surface and a side surface surrounding the bottom surface and perpendicular to the bottom surface, the edge of the circuit board being connected to the side surface of the housing so that the second surface of the circuit board is suspended above the bottom surface of the housing.

10. The controller of claim 9, wherein, The box also includes a support rib, which is perpendicular to the bottom surface of the box and is used to support the circuit board.

11. The controller of claim 9, wherein, The side of the housing also includes a support column, and the housing is connected to the heat sink through the support column. The top surface of the support column is not higher than the upper surface of the surface mount package.

12. The controller of claim 11, wherein, The surface mount package has a flush upper surface, and the heat sink has a flat bottom surface. The upper surface of the surface mount package is connected to the bottom surface of the heat sink.

13. The controller of claim 12, wherein, The surface mount packages have different heights on their upper surfaces, and the bottom surface of the heat sink has a corresponding concave-convex structure. The upper surface of each surface mount package is connected to the bottom surface of the heat sink.

14. The controller of claim 11, wherein, The radiator includes at least one of air-cooled radiator, liquid-cooled radiator, or refrigerant radiator.

15. The controller of claim 11, wherein, The radiator includes a base plate and heat dissipation fins located above the base plate.

16. The controller of claim 15, wherein, The heat dissipation fins include at least one of straight and wavy shapes.

17. The controller of claim 15, wherein, At least a portion of the upper surfaces of the intelligent power module, the power factor correction module, and the rectifier bridge are also coated with thermal grease.

Images