Structural component and electronic equipment

Abstract

The utility model provides a structural assembly and electronic equipment. The structural assembly comprises a first structural member, a second structural member and a colloid. The first structural part comprises a first bonding surface, the second structural part comprises a second bonding surface, and a first gap is formed between the first bonding surface and the second bonding surface. The first bonding face is provided with a first groove structure, the second bonding face is provided with a second groove structure, and a first groove body space defined by the first groove structure and a second groove body space defined by the second groove structure are communicated with the first gap to form a glue containing space. A first groove body space defined by the first groove structure and a second groove body space defined by the second groove structure are respectively communicated with the first gap to form a glue accommodating space. The glue containing space is filled with the glue, and a glue structure is formed in the first gap and the groove body space extending from the first gap to the two sides, so that the glue receiving area and the direction of the bonding grasping force are increased, and the bonding reliability and the yield of the electronic equipment are improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronics, and in particular, to a structural assembly and an electronic device. BACKGROUND

[0002] In the assembly of electronic devices, a process of glue bonding is usually involved. When the surfaces of two parts to be bonded are smooth, the glue penetrates into the gap and is squeezed together to form a glue body, and finally a shear force is formed in the vertical direction. However, the bonding force of the glue body structure relying on the shear force in the vertical direction is insufficient, and the plastic and metal are often separated when subjected to external force, thereby affecting the yield of the electronic device. CONTENT OF THE UTILITY MODEL

[0003] The present disclosure provides a structural assembly and an electronic device to solve the related technical problems.

[0004] According to a first aspect of the present disclosure, a structural assembly is provided, comprising: a first structural member, a second structural member, and a glue body.

[0005] The first structural member comprises a first bonding surface, and the second structural member comprises a second bonding surface; a first gap is provided between the first bonding surface and the second bonding surface;

[0006] The first bonding surface is provided with a first groove structure, and the second bonding surface is provided with a second groove structure; a first groove space surrounded by the first groove structure and a second groove space surrounded by the second groove structure are respectively in communication with the first gap to form a glue containing space; at least a part of the glue body is filled in the glue containing space to bond and fix the first structural member and the second structural member.

[0007] Optionally, in a direction perpendicular to the first bonding surface, a projection of the second groove structure on the first bonding surface at least partially coincides with the first groove structure.

[0008] Optionally, in a direction perpendicular to the first bonding surface, a projection of the second groove structure on the first bonding surface coincides with the first groove structure one-to-one.

[0009] Optionally, the first bonding surface and the second bonding surface are arranged in parallel to the thickness direction of the structural assembly; in the thickness direction of the structural assembly, the first bonding surface is provided with at least two first groove structures, and / or the second bonding surface is provided with at least two second groove structures.

[0010] Optionally, in the thickness direction of the structural assembly, the first groove structure and / or the second groove structure are arranged in an array.

[0011] Optionally, the first groove structure and / or the second groove structure comprises an undercut structure.

[0012] Optionally, the material of the first structural member comprises metal, and the material of the second structural member comprises plastic.

[0013] Optionally, the first bonding surface and the second bonding surface comprise a first direction parallel to the thickness direction of the structural assembly and a second direction perpendicular to the first direction.

[0014] The width of the first groove structure in the first direction is less than the length of the first groove structure in the second direction; and / or, the width of the second groove structure in the first direction is less than the length of the second groove structure in the second direction.

[0015] Optionally, in the thickness direction of the structural assembly, the first bonding surface comprises oppositely arranged first and second ends, and the second bonding surface comprises oppositely arranged third and fourth ends; the first groove structure is arranged with a first interval between the first and second ends, and the second groove structure is arranged with a second interval between the third and fourth ends.

[0016] According to a second aspect of the present disclosure, an electronic device is provided, which comprises any of the structural assemblies of the first aspect.

[0017] The technical solutions provided by the present disclosure can achieve at least the following beneficial effects:

[0018] The present disclosure provides a first groove structure on the first bonding surface of the first structural member, and a second groove structure on the second bonding surface of the second structural member. The first groove structure forms a first groove space, and the second groove structure forms a second groove space. The first and second groove spaces are in communication with the first gap to form a glue space. The glue space is filled with glue, and the glue forms a glue structure in the first gap and the groove spaces extending from the first gap to both sides. The glue structure increases the glue area and the direction of the bonding gripping force, which helps to improve the bonding reliability and the yield of the electronic device.

[0019] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present specification. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present specification and serve to explain the principles of the present specification together with the specification.

[0021] Figure 1 is a schematic view of the cross-sectional structure of a structural assembly in an exemplary embodiment of the present disclosure;

[0022] Figure 2 Fig. 1 is a partial cross-sectional structural schematic view of a first structural member in one example embodiment of the present disclosure;

[0023] Figure 3 Fig. 2 is a partial cross-sectional structural schematic view of a second structural member in one example embodiment of the present disclosure;

[0024] Figure 4 Fig. 3 is a structural schematic view of a colloid in one example embodiment of the present disclosure.

[0025] Reference Signs:

[0026] Structural assembly 1;

[0027] First structural member 11; first recess structure 111; first bonding surface 112;

[0028] Second structural member 12; second recess structure 121; second bonding surface 122;

[0029] Colloid 13; first gap 14. DETAILED DESCRIPTION

[0030] The example embodiments will now be described in detail with reference to the drawings. When the description below refers to attachments, assemblies, devices, elements, components, or the like, it will be understood that when there is a depiction of an attachment or several possible attachments, then those attachments can be carried out with both or either or any combination of the depicted possible attachments. This will also hold true for any other term used for describing any device or element. The following detailed description is of example embodiments and is not intended to represent all embodiments in accordance with this description. Rather, the following description is intended only to be illustrative of some embodiments in accordance with this description.

[0031] The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. Unless otherwise defined, technical and scientific terms used in this specification and the appended claims should have the meaning commonly understood by one of ordinary skill in the art to which this disclosure belongs. The use of the terms "first", "second", and "like" in this specification and the appended claims are not meant to denote any sort of order, quantity, or importance, but are merely used to distinguish one element from another. Also, the use of the terms "a" or "an" are not meant to denote a quantity of one, but rather a quantity of one or more. "Plural" or "a plurality" means two or more. Unless otherwise indicated, the terms "front", "back", "up", "down", and the like in this specification and the appended claims are used for convenience and are not intended to denote a particular position or spatial orientation. The terms "comprises", "comprising", "includes", "including" and the like are meant to be interpreted as specifying a presence of stated elements or features rather than an exclusivity such that other elements or features are necessarily excluded. The terms "connected" and "coupled" and the like are meant to denote a direct or indirect connection or coupling between elements or features.

[0032] The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. The singular forms "a", "an" and "the" used in this specification and the appended claims are intended to include plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0033] In the assembly of electronic devices, a process of glue bonding is usually involved. When the surfaces of two parts to be bonded are smooth, the glue penetrates into the gap and is squeezed together to form a glue body, and finally a shear force is formed in the vertical direction. However, the bonding force of the glue body structure relying on the shear force in the vertical direction is insufficient, and the plastic and metal often separate when subjected to external force, thereby affecting the yield of electronic devices.

[0034] The present disclosure provides a structural assembly. Figure 1 is a schematic view of a cross-sectional structure of a structural assembly in an exemplary embodiment of the present disclosure, Figure 2 is a schematic view of a partial cross-sectional structure of a first structural member in an exemplary embodiment of the present disclosure, Figure 3 is a schematic view of a partial cross-sectional structure of a second structural member in an exemplary embodiment of the present disclosure, and Figures 1-3As shown, the structural assembly 1 comprises a first structural member 11, a second structural member 12 and a glue body 13. The first structural member 11 comprises a first bonding surface 111, the second structural member 12 comprises a second bonding surface 121, and a first gap 14 is provided between the first bonding surface 111 and the second bonding surface 121. The first bonding surface 111 is provided with a first groove structure 112, and the second bonding surface 121 is provided with a second groove structure 122. A first groove space surrounded by the first groove structure 112 and a second groove space surrounded by the second groove structure 122 are respectively in communication with the first gap 14 to form a glue-containing space. At least a portion of the glue body 13 is filled in the glue-containing space to bond and fix the first structural member 11 and the second structural member 12.

[0035] In the above embodiment, the first bonding surface 111 of the first structural member 11 is provided with the first groove structure 112, and the second bonding surface 121 of the second structural member 12 is provided with the second groove structure 122. The first groove space surrounded by the first groove structure 112 and the second groove space surrounded by the second groove structure 122 are respectively in communication with the first gap 14 to form a glue-containing space. The glue body 13 is filled in the glue-containing space, and the glue body 13 structure is formed in the first gap 14 and the groove space extending from the first gap 14 to both sides. The glue area and the bonding gripping force are increased in the direction, which helps to improve the bonding reliability and the yield of electronic devices.

[0036] In the above embodiment, the arrangement mode of the first groove structure 112 and the second groove structure 122 can have various forms.

[0037] In some embodiments, in a direction perpendicular to the first bonding surface 111, the projection of the second groove structure 122 on the first bonding surface 111 at least partially coincides with the first groove structure 112, so that at least a portion of the glue body 13 formed in the first groove structure 112 and the glue body 13 formed in the second groove structure 122 can form a corresponding positional relationship on both sides of the first gap 14, optimize the stress distribution, and improve the bonding reliability.

[0038] For example, in a direction perpendicular to the first bonding surface 111, the projection of the second groove structure 122 on the first bonding surface 111 coincides with the first groove structure 112 one by one. That is, on both sides of the first gap 14, the glue body 13 formed in the first groove structure 112 and the glue body 13 formed in the second groove structure 122 correspond one by one, and together with the glue body 13 formed in the first gap 14, form a dumbbell-shaped structure as shown, which helps to further optimize the stress distribution and improve the bonding reliability. Figure 4

[0039] ​In other embodiments, in the direction perpendicular to the first bonding surface 111, the projections of the second groove structures 122 on the first bonding surface 111 and the first groove structures 112 on the first bonding surface 111 can be staggered to increase the direction of the bonding grip force by the colloid 13 formed by the staggered first groove structures 112 and the second groove structures 122, and to obtain the bonding effect in multiple lateral directions.

[0040] Alternatively, in the direction perpendicular to the first bonding surface 111, the projections of the two adjacent second groove structures 122 on the first bonding surface 111 can be adjacent, and / or the projections of the two adjacent first groove structures 112 on the first bonding surface 111 can be adjacent, to obtain the bonding effect as expected on both sides of the first gap 14.

[0041] In the above embodiments, Figure 1 The dashed arrow in the middle can represent the thickness direction of the structural assembly 1, the first bonding surface 111 and the second bonding surface 121 are arranged parallel to the thickness direction of the structural assembly 1, and in the thickness direction of the structural assembly 1, the first bonding surface 111 is provided with at least two first groove structures 112, and / or the second bonding surface 121 is provided with at least two second groove structures 122. By arranging at least two first groove structures 112 and / or at least two second groove structures 122 in the thickness direction of the structural assembly 1, at least two branch structures of the colloid 13 arranged in the thickness direction of the structural assembly 1 can be obtained, which helps to improve the bonding area, the direction of the bonding grip force, and the bonding reliability.

[0042] It should be noted that in the thickness direction of the structural assembly 1, the first groove structure 112 and / or the second groove structure 122 can be arranged in an array to improve the processing convenience and the stress uniformity after the colloid 13 is formed.

[0043] In some embodiments, the first groove structure 112 and / or the second groove structure 122 can be a reverse buckle structure, and the size of the branch structure of the colloid 13 formed in the reverse buckle structure at the opening of the reverse buckle structure is smaller than the size of the bottom of the reverse buckle structure, so that the colloid 13 can be prevented from being detached from the first structural member 11 and / or the second structural member 12, and the colloid effect is improved.

[0044] In other embodiments, the first groove structure 112 and / or the second groove structure 122 can be a columnar structure with the same cross section to simplify the processing process.

[0045] It should be noted that the shapes of the first groove structure 112 and the second groove structure 122 can be the same or different, and can be set according to the specific structure requirements of the colloid 13.

[0046] In the above embodiments, the first structural member 11 can be made of metal, and the second structural member 12 can be made of plastic. Alternatively, the first structural member 11 can be made of ceramic, alloy, plastic, etc., and the second structural member 12 can be made of metal, ceramic, alloy, etc.

[0047] When the first structural member 11 is made of metal and the second structural member 12 is made of plastic, the first groove structure 112 can be formed by machining, and the second groove structure 122 can be formed by injection molding.

[0048] In the embodiments of the present disclosure, the structural assembly 1 can be a middle frame structure of an electronic device, the first structural member 11 can serve as a shell structure of the middle frame, and the second structural member 12 can serve as an internal structure of the middle frame. In other embodiments, the structural assembly 1 can also be other structural assemblies of an electronic device, and the present disclosure does not limit this.

[0049] In some embodiments, the first bonding surface 111 and the second bonding surface 121 include a first direction parallel to the thickness direction of the structural assembly 1 and a second direction perpendicular to the first direction. The width of the first groove structure 112 in the first direction is less than the length of the first groove structure 112 in the second direction, and / or the width of the second groove structure 122 in the first direction is less than the length of the second groove structure 122 in the second direction. The strip-shaped adhesive 13 structure formed in the first groove structure 112 and / or the second groove structure 122 can improve the bonding reliability.

[0050] In some embodiments, in the thickness direction of the structural assembly 1, the first bonding surface 111 includes oppositely arranged first and second ends, and the second bonding surface 121 includes oppositely arranged third and fourth ends. The first groove structure 112 is provided with a first interval between the first and second ends, respectively, and the second groove structure 122 is provided with a second interval between the third and fourth ends, respectively. The first interval between the first groove structure 112 and the first and second ends can avoid the functional interference of the first groove structure 112 to the first structural member 11, and improve the bonding effect of the adhesive 13. Similarly, the first interval between the second groove structure 122 and the third and fourth ends can avoid the functional interference of the second groove structure 122 to the second structural member 12, and improve the bonding effect of the adhesive 13.

[0051] The present disclosure further provides an electronic device including the above structural assembly 1.

[0052] The first recess structure 112 is arranged on the first bonding surface 111 of the first structural member 11, and the second recess structure 122 is arranged on the second bonding surface 121 of the second structural member 12. The first groove space surrounded by the first recess structure 112 and the second groove space surrounded by the second recess structure 122 are respectively communicated with the first gap 14 to form a glue space. The glue 13 is filled in the glue space, and the glue 13 structure is formed in the first gap 14 and the groove space extending from the first gap 14 to both sides, so that the glue area and the bonding force are increased in the direction, which is helpful to improve the bonding reliability and the yield of the electronic device.

[0053] In the embodiments of the present disclosure, the structural assembly 1 can be a middle frame structure of an electronic device, the first structural member 11 can be used as a shell structure of the middle frame, and the second structural member 12 can be used as an internal structure of the middle frame. In other embodiments, the structural assembly 1 can also be other structural assemblies of the electronic device, and the present disclosure is not limited thereto.

[0054] It should be noted that the electronic device can be a mobile phone, a tablet computer, a wearable device, a vehicle-mounted terminal, a medical terminal, etc.

[0055] The above description is only the preferred embodiments of the present disclosure, and does not limit the present disclosure in any form. Although the present disclosure has been disclosed as the above preferred embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make some changes or modifications to the above disclosed technical contents without departing from the scope of the technical solution of the present disclosure, and any simple modification, equivalent change and modification of the above embodiments according to the technical essence of the present disclosure are still within the scope of the present disclosure.

Claims

1. A structural assembly, characterized by, The structure assembly (1) comprises: a first structural member (11), a second structural member (12) and a glue body (13); the first structural member (11) comprises a first bonding surface (111), and the second structural member (12) comprises a second bonding surface (121); a first gap (14) is arranged between the first bonding surface (111) and the second bonding surface (121); the first bonding surface (111) is provided with a first groove structure (112), and the second bonding surface (121) is provided with a second groove structure (122); a first groove space surrounded by the first groove structure (112) and a second groove space surrounded by the second groove structure (122) are in communication with the first gap (14) to form a glue containing space; at least a part of the glue body (13) is filled in the glue containing space, so that the first structural member (11) and the second structural member (12) are bonded and fixed.

2. The structural assembly of claim 1, wherein, In a direction perpendicular to the first bonding surface (111), a projection of the second groove structure (122) on the first bonding surface (111) at least partially coincides with the first groove structure (112).

3. The structural assembly of claim 2, wherein, In a direction perpendicular to the first bonding surface (111), a projection of the second groove structure (122) on the first bonding surface (111) one-to-one corresponds to the first groove structure (112).

4. The structural assembly of claim 1, wherein, The first bonding surface (111) and the second bonding surface (121) are arranged in parallel to a thickness direction of the structure assembly (1); in the thickness direction of the structure assembly (1), the first bonding surface (111) is provided with at least two first groove structures (112), and / or the second bonding surface (121) is provided with at least two second groove structures (122).

5. The structural assembly of claim 4, wherein, In the thickness direction of the structure assembly (1), the first groove structure (112) and / or the second groove structure (122) are arranged in an array.

6. The structural assembly of claim 1, wherein, The first groove structure (112) and / or the second groove structure (122) comprise an inverted buckle structure.

7. The structural assembly of claim 1, wherein, The material of the first structural member (11) comprises metal, and the material of the second structural member (12) comprises plastic.

8. The structural assembly of claim 1, wherein, The first bonding surface (111) and the second bonding surface (121) comprise a first direction parallel to the thickness direction of the structure assembly (1) and a second direction perpendicular to the first direction; a width of the first groove structure (112) in the first direction is less than a length of the first groove structure (112) in the second direction; and / or, a width of the second groove structure (122) in the first direction is less than a length of the second groove structure (122) in the second direction.

9. The structural assembly of claim 1, wherein, In the thickness direction of the structure assembly (1), the first bonding surface (111) comprises oppositely arranged first and second ends, and the second bonding surface (121) comprises oppositely arranged third and fourth ends; the first groove structure (112) is arranged with a first interval between the first and second ends, respectively, and the second groove structure (122) is arranged with a second interval between the third and fourth ends, respectively.

10. An electronic device, comprising: A structural assembly (1) as claimed in any of claims 1-9.

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