Radiating fin structure

Abstract

The utility model provides a heat dissipation fin structure which comprises a first heat dissipation plate and a second heat dissipation plate, and the first heat dissipation plate and the second heat dissipation plate are welded and fixed at the edge to define a cooling cavity. The first heat dissipation plate and the second heat dissipation plate are arranged at intervals on one side of the edge to form a heat dissipation opening, the heat dissipation opening communicates with the cooling cavity, and the side where the heat dissipation opening is located is a butt joint edge side; a butt joint part is arranged on the butt joint edge side and used for being welded and fixed to a cover shell of the radiator. The problems that in the prior art, due to the fact that the cooling fins and the cover shell of the radiator are integrally formed, the forming process requirement is high, and the manufacturing cost is high are solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of VC heat sink, more particularly to a heat dissipation fin structure. BACKGROUND

[0002] With the performance improvement of electronic devices, the data processing operation ability is getting stronger and stronger, and the heat generated by operation is also more and more. Vapor chamber (VC) is widely used as a heat sink in high-power or high-integration electronic products. When cooling electronic devices, vapor chamber has the advantages of low space requirement, large contact area and fast thermal response. Therefore, it can be applied to heat sinks to reduce thermal diffusion resistance and hot spots.

[0003] The existing heat dissipation fins of vapor chamber (VC heat sink) are usually integrally formed with the cover shell of the heat sink, for example, in the patent of a VC heat sink with publication number CN217303681U, the heat dissipation fins are arranged in parallel and connected vertically on the first surface of the heat dissipation base, and the structure is also integrally formed. However, for structures that need to set up heat dissipation channels in the heat dissipation fins, the integrally forming process requires high requirements and has high manufacturing cost.

[0004] Therefore, the prior art still needs to be improved and developed. CONTENT OF THE INVENTION

[0005] The purpose of the present application is to provide a heat dissipation fin structure, which solves the problem of high forming process requirement and high manufacturing cost caused by the integrally formed way of the heat dissipation fin and the cover shell of the heat sink in the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present application is:

[0007] On the one hand, the present application provides a heat dissipation fin structure, comprising: a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate are welded and fixed at the edges to form a cooling cavity;

[0008] The first heat dissipation plate and the second heat dissipation plate are arranged at intervals on one side of the edge to form a heat dissipation opening, the heat dissipation opening communicates with the cooling cavity, and the side where the heat dissipation opening is located is the butt joint edge side;

[0009] The butt joint edge side is provided with a butt joint part, and the butt joint part is used for welding and fixing on the cover shell of the heat sink.

[0010] In an optional embodiment, the first heat dissipation plate comprises:

[0011] A heat dissipation plate body is arranged at intervals with the second heat dissipation plate to form a cooling cavity;

[0012] A connecting flange is arranged around the heat dissipation plate body in a semi-encircling manner.

[0013] The connecting part between the connecting flange and the heat dissipation plate body forms a step, and the connecting flange is welded and fixed on the second heat dissipation plate;

[0014] The butt joint part is located at the butt joint edge side of the heat dissipation plate body and is connected with the connecting flange.

[0015] In an optional embodiment, the butt joint part comprises: butt joint bosses formed at both ends of the butt joint edge, the outer surface of the butt joint boss is flush with the outer surface of the first heat dissipation plate, and a step is formed between the butt joint boss and the connecting flange.

[0016] In an optional embodiment, the heat dissipation plate body, the connecting flange and the butt joint boss are integrally stamped and formed.

[0017] In an optional embodiment, the second heat dissipation plate is a flat plate, and the edge of the flat plate is welded with the connecting flange.

[0018] In an optional embodiment, the inner wall of the first heat dissipation plate or the inner wall of the second heat dissipation plate is provided with a plurality of support columns;

[0019] The support columns are located in the cooling cavity to limit and support the first heat dissipation plate and the second heat dissipation plate.

[0020] In an optional embodiment, when the support columns are arranged on the inner wall of the first heat dissipation plate, the outer wall of the first heat dissipation plate forms a concave hole at a position corresponding to the support column;

[0021] When the support columns are arranged on the inner wall of the second heat dissipation plate, the outer wall of the second heat dissipation plate forms a concave hole at a position corresponding to the support column.

[0022] In an optional embodiment, the plurality of support columns are arranged in multiple rows in a direction away from the heat dissipation opening, and the support columns in adjacent two rows are arranged in a staggered manner.

[0023] In an optional embodiment, a hydrophobic coating is arranged on the inner wall of the cooling cavity.

[0024] In an optional embodiment, the interval distance between the first heat dissipation plate and the second heat dissipation plate is 0.5-1mm.

[0025] The heat dissipation fin structure provided by the application has at least the following beneficial effects: the first heat dissipation plate and the second heat dissipation plate are fixed by welding at the edges to enclose a cooling cavity, so that a channel is formed inside the heat dissipation fin, the heat dissipation opening formed on one side of the edge of the heat dissipation fin is in communication with the cooling cavity, and the butt joint part arranged on the side is used for welding and fixing on the cover shell of the heat dissipation device. In this way, the heat dissipation plates on both sides can be fixed by welding to enclose a hollow channel, so that the sealing stability of the cooling cavity is ensured and leakage is less likely to occur. In addition, the butt joint part is welded with the cover shell of the heat dissipation device, so that the plurality of heat dissipation fin structures can be stably fixed on the cover shell. In the process of producing the heat dissipation fin structure with the cooling cavity, the welding method is adopted, the process requirement is reduced, the processing of the hollow heat dissipation fin structure is simpler, the practicality is stronger, and the production cost is saved. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0027] Figure 1 A structural schematic diagram of a heat dissipation fin structure provided by an embodiment of the application;

[0028] Figure 2 A sectional view of a heat dissipation fin structure provided by an embodiment of the application;

[0029] Figure 3 An exploded view of a heat dissipation fin structure provided by an embodiment of the application;

[0030] Figure 4 A sectional view of a heat dissipation fin structure provided by an embodiment of the application from another perspective;

[0031] Figure 5 A sectional view of a heat dissipation fin structure provided by an embodiment of the application from another perspective; Figure 4

[0032] In the drawings, various reference signs represent:

[0033] 100, first heat dissipation plate; 110, heat dissipation plate body; 120, connecting stop edge; 130, butt joint part; 131, butt joint boss; 140, support column; 141, inner recess hole; 200, second heat dissipation plate; 300, cooling cavity; 310, heat dissipation opening. DETAILED DESCRIPTION

[0034] ​In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application and not to limit the present application.

[0035] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or position based on the orientation or position shown in the drawings, and are only for the convenience of description, and cannot be understood as a limitation on the technical solutions. The terms "first", "second" are only for the purpose of convenient description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0036] As shown in Figure 1 , Figure 2 , the present embodiment proposes a heat dissipation fin structure for connecting to the cover shell of a heat sink, thereby forming a 3D VC heat sink (vapor chamber). The heat dissipation fin structure mainly includes a first heat dissipation plate 100 and a second heat dissipation plate 200. For the convenience of structure description, the first heat dissipation plate 100 and the second heat dissipation plate 200 can both adopt a square structure, the first heat dissipation plate 100 and the second heat dissipation plate 200 are welded and fixed at the edges to enclose a cooling cavity 300, the first heat dissipation plate 100 and the second heat dissipation plate 200 are arranged at an interval at one side of the edge to form a heat dissipation opening 310, the heat dissipation opening 310 communicates with the cooling cavity 300, and the side where the heat dissipation opening 310 is located is the butt joint edge side, and the butt joint edge side is provided with a butt joint portion 130, and the butt joint portion 130 is used for being welded and fixed to the cover shell of the heat sink. In the specific structure, the square first heat dissipation plate 100 and the square second heat dissipation plate 200 can be aligned and welded and fixed at the edges, and the butt joint edge side is the lower side of the heat dissipation fin structure, for example, the lower side of the heat dissipation fin structure forms the heat dissipation opening 310, the outer side of the heat dissipation opening 310 is the butt joint portion 130, and therefore the butt joint portion 130 at the lower side is welded to the cover shell of the heat sink, so that the heat dissipation opening 310 communicates with the cover shell, when a plurality of heat dissipation fin structures are all welded and fixed to the cover shell to form a part of the heat sink, and then connected to the bottom plate of the heat sink, the main structure of the VC heat sink can be formed. During heat dissipation, the cooling medium in the heat sink is vaporized by heat and enters the cooling cavity 300 to contact the inner walls of the first heat dissipation plate 100 and the second heat dissipation plate 200 to conduct heat, so that the cooling medium is condensed into liquid and returns to the heat sink.

[0037] AsFigure 1 、 Figure 2 、 Figure 3 As shown in FIG. 1, FIG. 2, and FIG. 3, the heat dissipation fin structure of the embodiment is formed by welding and fixing the first heat dissipation plate 100 and the second heat dissipation plate 200 at the edges to enclose the cooling cavity 300, so that the heat dissipation fin is internally formed with a channel. The heat dissipation opening 310 is formed at one side of the edge of the heat dissipation fin, and the heat dissipation opening 310 is in communication with the cooling cavity 300. The butt joint 130 is arranged at the side, and the butt joint 130 is used for welding and fixing on the cover shell of the heat dissipation device. In this way, the heat dissipation plates on both sides can be fixed by welding to enclose the hollow channel, so as to ensure the sealing stability of the cooling cavity 300 and prevent leakage. The butt joint 130 is welded with the cover shell of the heat dissipation device, so as to ensure that the plurality of heat dissipation fin structures can be stably fixed on the cover shell. In the process of producing the heat dissipation fin structure with the cooling cavity 300, the welding method is adopted, the process requirement is reduced, the processing of the hollow heat dissipation fin structure is simpler, the practicability is stronger, and the production cost is saved.

[0038] As shown in FIG. 1, FIG. 2, and FIG. 3, the heat dissipation fin structure of the embodiment is formed by welding and fixing the first heat dissipation plate 100 and the second heat dissipation plate 200 at the edges to enclose the cooling cavity 300, so that the heat dissipation fin is internally formed with a channel. The heat dissipation opening 310 is formed at one side of the edge of the heat dissipation fin, and the heat dissipation opening 310 is in communication with the cooling cavity 300. The butt joint 130 is arranged at the side, and the butt joint 130 is used for welding and fixing on the cover shell of the heat dissipation device. In this way, the heat dissipation plates on both sides can be fixed by welding to enclose the hollow channel, so as to ensure the sealing stability of the cooling cavity 300 and prevent leakage. The butt joint 130 is welded with the cover shell of the heat dissipation device, so as to ensure that the plurality of heat dissipation fin structures can be stably fixed on the cover shell. In the process of producing the heat dissipation fin structure with the cooling cavity 300, the welding method is adopted, the process requirement is reduced, the processing of the hollow heat dissipation fin structure is simpler, the practicability is stronger, and the production cost is saved. Figure 2 、 Figure 3 As shown in FIG. 1, FIG. 2, and FIG. 3, the heat dissipation fin structure of the embodiment is formed by welding and fixing the first heat dissipation plate 100 and the second heat dissipation plate 200 at the edges to enclose the cooling cavity 300, so that the heat dissipation fin is internally formed with a channel. The heat dissipation opening 310 is formed at one side of the edge of the heat dissipation fin, and the heat dissipation opening 310 is in communication with the cooling cavity 300. The butt joint 130 is arranged at the side, and the butt joint 130 is used for welding and fixing on the cover shell of the heat dissipation device. In this way, the heat dissipation plates on both sides can be fixed by welding to enclose the hollow channel, so as to ensure the sealing stability of the cooling cavity 300 and prevent leakage. The butt joint 130 is welded with the cover shell of the heat dissipation device, so as to ensure that the plurality of heat dissipation fin structures can be stably fixed on the cover shell. In the process of producing the heat dissipation fin structure with the cooling cavity 300, the welding method is adopted, the process requirement is reduced, the processing of the hollow heat dissipation fin structure is simpler, the practicability is stronger, and the production cost is saved.

[0039] As shown in FIG. 1, FIG. 2, and FIG. 3, the heat dissipation fin structure of the embodiment is formed by welding and fixing the first heat dissipation plate 100 and the second heat dissipation plate 200 at the edges to enclose the cooling cavity 300, so that the heat dissipation fin is internally formed with a channel. The heat dissipation opening 310 is formed at one side of the edge of the heat dissipation fin, and the heat dissipation opening 310 is in communication with the cooling cavity 300. The butt joint 130 is arranged at the side, and the butt joint 130 is used for welding and fixing on the cover shell of the heat dissipation device. In this way, the heat dissipation plates on both sides can be fixed by welding to enclose the hollow channel, so as to ensure the sealing stability of the cooling cavity 300 and prevent leakage. The butt joint 130 is welded with the cover shell of the heat dissipation device, so as to ensure that the plurality of heat dissipation fin structures can be stably fixed on the cover shell. In the process of producing the heat dissipation fin structure with the cooling cavity 300, the welding method is adopted, the process requirement is reduced, the processing of the hollow heat dissipation fin structure is simpler, the practicability is stronger, and the production cost is saved. Figure 1 、 Figure 2 、 Figure 4As shown, further, the docking portion 130 of the present embodiment specifically includes docking bosses 131 formed at both ends of the docking edge, the outer surface of the docking bosses 131 is flush with the outer surface of the first heat dissipation plate 100, and a step is formed between the docking bosses 131 and the connecting flange 120. In the specific structure, taking the up-down direction of the heat dissipation fin structure as the height direction, the direction opposite to the first heat dissipation plate 100 and the second heat dissipation plate 200 as the thickness direction, and the direction perpendicular to the height direction and the thickness direction as the length direction of the docking bosses 131 on the first heat dissipation plate 100, the docking bosses 131 are located at both ends of the length direction of the first heat dissipation plate 100. Since the outer surface of the docking bosses 131 is flush with the outer surface of the first heat dissipation plate 100, the surface of the entire first heat dissipation plate 100 and the lower side (the docking edge side) of the second heat dissipation plate 200 and the area with the docking bosses 131 at the same height are also the docking portion 130, and the connection with the cover shell is made through this area, the welding area is increased, and the structural stability is ensured.

[0040] As shown in Figure 1 , Figure 2 , Figure 4 As shown, further, the heat dissipation plate body 110, the connecting flange 120, and the docking boss 131 of the present embodiment are integrally stamped and formed. The heat dissipation plate body 110, the connecting flange 120, and the docking boss 131 are formed by sheet metal processing of a flat plate, and a side block is formed on one side of the docking boss 131 to block the length direction of the heat dissipation opening 310. In this way, the production efficiency is improved, and the production process is optimized.

[0041] As shown in Figure 2 , Figure 3 , Figure 4 As shown, further, the second heat dissipation plate 200 of the present embodiment is a flat plate, and the edge of the flat plate is welded with the connecting flange 120. The second heat dissipation plate 200 can directly adopt a square flat plate structure, and the outer shape contour of the second heat dissipation plate 200 matches the outer shape contour of the first heat dissipation plate 100, and can be set as an equal structure. In this way, the first flat plate can be directly obtained by shearing, and the structure is simple, so that the structure of the entire heat dissipation fin is optimized, and production is more convenient.

[0042] As shown in Figure 2 , Figure 4 , Figure 5As shown, further, the inner wall of the first heat dissipation plate 100 or the inner wall of the second heat dissipation plate 200 is provided with a plurality of support columns 140, which are located in the cooling cavity 300 to limit and support the first heat dissipation plate 100 and the second heat dissipation plate 200. In the specific structure, taking the case where the support columns 140 are provided on the inner wall of the first heat dissipation plate 100 as an example, the plurality of support columns 140 extend in the thickness direction towards the second heat dissipation plate 200, and the end portions thereof abut against the inner wall of the second heat dissipation plate 200. Since the inner surface of the cooling cavity 300 is used for heat dissipation, it is required to have a large area, and therefore the large space of the entire cooling cavity 300 leads to a structure that is prone to collapse, especially during the welding process, which can cause welding deformation, so that the size of the entire heat dissipation fin structure cannot be stabilized, and therefore the first heat dissipation plate 100 and the second heat dissipation plate 200 are supported by the plurality of support columns 140, so that the spacing relationship therebetween can be kept stable, avoiding the problem of collapse caused by the excessive size of the cooling cavity 300.

[0043] As shown in Figure 2 , Figure 4 , Figure 5 As shown, further, when the support columns 140 are provided on the inner wall of the first heat dissipation plate 100, the outer wall of the first heat dissipation plate 100 forms a concave hole 141 at a position corresponding to the support columns 140. When the support columns 140 are provided on the inner wall of the second heat dissipation plate 200, the outer wall of the second heat dissipation plate 200 forms a concave hole 141 at a position corresponding to the support columns 140. The concave hole 141 makes the support columns 140 have a hollow structure. In the specific structure, the concave hole 141 is formed on the outer surface of the heat dissipation plate, so that the concave hole 141 can be directly punched in the form of sheet metal, and at the same time, the support columns 140 are formed by protruding from the inner surface of the heat dissipation plate. Not only is the processing simpler, but the concave hole 141 also increases the contact area with air, reduces the thickness of the support columns 140, and the support columns 140 also participate in heat exchange to dissipate heat, improving the heat dissipation efficiency.

[0044] As shown in Figure 1 , Figure 3 As shown, further, the plurality of support columns 140 of the present embodiment are arranged in multiple rows in the direction away from the heat dissipation opening 310, and the support columns 140 in adjacent two rows are arranged in a staggered manner. In the specific structure, the support columns 140 are arranged in multiple rows in the height direction of the heat dissipation fin structure. In each row of support columns 140, a plurality of support columns 140 are arranged at intervals. The plurality of support columns 140 are distributed on the surface of the heat dissipation plate, so that the stress on the heat dissipation plate is more uniform, and the surface of the heat dissipation plate can be supported at each position to ensure a relatively large bearing capacity, ensuring the stability of the structure.

[0045] Further, the inner wall of the cooling cavity 300 of the embodiment is provided with a hydrophobic coating. In the specific structure, since the cooling medium condenses into liquid on the inner wall of the cooling cavity 300 to achieve rapid diffusion and transmission of heat, the inner wall of the cooling cavity 300 needs to quickly return the liquid downward to the bottom, and the hydrophobic coating can make the condensed liquid quickly flow downward to avoid accumulation on the inner wall, thereby improving the heat dissipation efficiency.

[0046] As shown in Figure 2 , Figure 5 Further, the interval distance between the first heat dissipation plate 100 and the second heat dissipation plate 200 of the embodiment is 0.5-1mm. In the specific structure, when the interval distance of the cooling cavity 300 in the thickness direction is too large, the thickness of the heat dissipation fin is large, which can cause less heat dissipation fin to be installed on the entire heat sink, and the heat dissipation effect is not optimized well. When the interval distance of the cooling cavity 300 in the thickness direction is too large, the thickness of the heat dissipation fin is small, and liquid water droplets can easily cause liquid sealing to the heat dissipation opening 310 during the flowing process, and the heat dissipation effect is not good. Therefore, through theoretical research and experimental verification, when the interval distance between the first heat dissipation plate 100 and the second heat dissipation plate 200 is 0.5-1mm, the heat dissipation efficiency is in the optimal range. For example, the interval distance of 0.6mm is used in the embodiment to produce a heat sink product, which has excellent heat dissipation efficiency.

[0047] In summary, the heat dissipation fin structure provided in the application can be fixed by welding the heat dissipation plates on both sides to form a hollow channel, which ensures the sealing stability of the cooling cavity 300 and is not easy to leak. Moreover, the butt joint part 130 and the cover shell of the heat sink are welded to ensure that multiple heat dissipation fin structures can be stably fixed on the cover shell. In the process of producing the heat dissipation fin structure with the cooling cavity 300, the welding method is used to reduce the process requirements, make the processing of the hollow heat dissipation fin structure simpler, more practical, and save the production cost.

[0048] The above only describes the preferred embodiments of the application and should not be used to limit the application. Any modifications, equivalent replacements and improvements made within the spirit and principle of the application should be included in the protection range of the application.

Claims

1. A heat dissipation fin structure, characterized by, The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device.

2. The heat dissipating fin structure of claim 1, wherein, The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device.

3. The heat dissipating fin structure of claim 2, wherein, The application relates to a heat dissipation device.

4. The heat spreading fin structure of claim 3, wherein, The application relates to a heat dissipation device.

5. The heat dissipating fin structure of claim 3, wherein, The application relates to a heat dissipation device.

6. The heat spreading fin structure of claim 1, wherein, The application relates to a heat dissipation device. The application relates to a heat dissipation device.

7. The heat dissipating fin structure of claim 6, wherein, The application relates to a heat dissipation device. The application relates to a heat dissipation device.

8. The heat dissipating fin structure of claim 6, wherein, The application relates to a heat dissipation device.

9. The heat dissipating fin structure of any one of claims 1-8, wherein, The application relates to a heat dissipation device.

10. The heat dissipating fin structure of claim 9, wherein, The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. The application relates to a heat dissipation device. 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