Heat dissipation device

Abstract

The utility model relates to the technical field of heat dissipation devices, and discloses a heat dissipation device which comprises a substrate and fins, and a cavity filled with a liquid cooling medium is formed in the substrate; a capillary structure is arranged in the cavity, and the capillary structure is immersed in the liquid cooling medium; the fins are arranged on the substrate; the fins are provided with a plurality of air penetrating faces and air blocking faces in the circumferential direction in a staggered mode in the direction perpendicular to the base plate. An air inducing assembly is arranged between the air penetrating face and the air blocking face. On the basis of reducing the weight of the heat dissipation device, the heat dissipation effect of the heat dissipation device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation devices, in particular to a heat dissipation device. BACKGROUND

[0002] As the key core equipment of the fifth generation mobile communication network, the 5G base station shoulders the heavy responsibility of wireless signal sending and receiving, and can provide high-speed, low-delay and large-capacity high-quality network connection for various terminals such as mobile phones and Internet of Things devices, and is an indispensable key infrastructure to realize the wide coverage and significant performance improvement of 5G network. However, in the daily operation process, due to the complex and heavy tasks such as high-frequency signal processing, large-scale MIMO antenna continuous operation and high-density calculation, the 5G base station will inevitably generate a large amount of heat.

[0003] At present, the 5G base station mainly relies on a heat dissipation device to realize the heat dissipation function. The existing heat dissipation device usually includes copper vc, heat-conducting pad, substrate and heat sink and other key components. Among them, the copper vc is carefully arranged on the side of the substrate close to the heat source. In order to ensure good heat conduction effect, heat-conducting paste is ingeniously arranged between the copper vc and the heat source, and heat-conducting pad is arranged between the copper vc and the substrate, and the heat sink is arranged on the side of the substrate away from the heat-conducting pad. Such layout aims to build an efficient heat dissipation channel to timely dissipate the heat generated by the operation of the base station, so as to ensure the stable operation of the base station.

[0004] However, it cannot be ignored that the existing substrate and heat sink have some design limitations. On the one hand, the substrate and the heat sink are made in one piece by casting, which makes the overall size of the heat sink larger, and thus the weight of the entire device is heavier, which not only brings inconvenience to transportation, installation and maintenance, but also may put higher requirements on the structural bearing capacity of the base station. On the other hand, the thickness of the heat sink is relatively large, which to some extent affects the heat conduction and dissipation effect, and it is difficult to meet the increasing demand for efficient heat dissipation of the 5G base station. CONTENT OF THE UTILITY MODEL

[0005] In order to reduce the weight of the heat dissipation device and improve the heat dissipation effect of the heat dissipation device, the present application provides a heat dissipation device.

[0006] The heat dissipation device provided by the present application adopts the following technical scheme:

[0007] A heat dissipation device, comprising a substrate and a fin, wherein:

[0008] The substrate is internally provided with a cavity filled with a liquid cooling medium;

[0009] The cavity is internally provided with a capillary structure, and the capillary structure is immersed in the liquid cooling medium;

[0010] The fin is arranged on the substrate;

[0011] The fin is arranged with a plurality of air passing surfaces and air blocking surfaces in a circumferential staggered manner along a direction perpendicular to the substrate;

[0012] An air guiding assembly is arranged between the air passing surface and the air blocking surface.

[0013] Optionally, the substrate comprises a first heat conducting plate and a second heat conducting plate, wherein:

[0014] The cavity is arranged between the first heat conducting plate and the second heat conducting plate.

[0015] Optionally, the fin comprises a plurality of heat dissipation plates;

[0016] A heat dissipation channel is formed between two adjacent heat dissipation plates;

[0017] The heat dissipation plate is arranged on the substrate close to the side edge of the substrate.

[0018] Optionally, the fin comprises an integrally formed heat dissipation fin;

[0019] The heat dissipation fin is arranged in a folded manner.

[0020] Optionally, the air guiding assembly comprises a flow dividing plate and an air guiding member, wherein:

[0021] The flow dividing plate is arranged in a V shape, and the opening of the flow dividing plate faces the air blocking surface;

[0022] The air inlet end of the air guiding member is arranged close to the end of the flow dividing plate;

[0023] The air inlet end of the air guiding member is arranged close to the air passing surface.

[0024] Optionally, the flow dividing plate comprises a first flow dividing plate and a second flow dividing plate, wherein:

[0025] The first flow dividing plate and the second flow dividing plate are arranged in an arc surface manner;

[0026] The arc centers of the first flow dividing plate and the second flow dividing plate are respectively located on the side of the first flow dividing plate and the second flow dividing plate away from the air blocking surface.

[0027] Optionally, the first flow dividing plate and the second flow dividing plate are arranged in an inclined manner;

[0028] The distance between the first flow dividing plate and the air blocking surface gradually increases along the direction from close to the substrate to away from the substrate.

[0029] Optionally, the air guiding member comprises an air guiding plate;

[0030] The air deflector is arranged in a V shape, and the opening of the air deflector is away from the air passing surface.

[0031] The air deflector comprises a first air deflector and a second air deflector, wherein:

[0032] The first air deflector and the second air deflector are both provided with grooves;

[0033] The opening of the groove faces the air passing surface.

[0034] Optionally, a plurality of flow guide strips are arranged on the side of the air deflector close to the air passing surface.

[0035] The plurality of flow guide strips are distributed along the length direction of the air passing surface.

[0036] The spacing between the flow guide strips and the air passing surface gradually decreases from the direction close to the air blocking surface to the direction away from the air blocking surface.

[0037] Optionally, the flow guide strips are arranged obliquely.

[0038] In summary, the present application includes at least one of the following beneficial technical effects:

[0039] 1. By optimizing the capillary structure inside the substrate and the use of phase change liquid, combined with the design of aluminum sheet fins, heat can be quickly and uniformly distributed and transferred to the fins. The high thermal conductivity of aluminum material (such as aluminum manganese alloy or aluminum magnesium silicon alloy) further improves the heat dissipation performance, which is about 2 times higher than the thermal conductivity of traditional castings, thereby significantly improving the heat dissipation efficiency;

[0040] 2. The fins are designed with aluminum sheets and fixed on the substrate by brazing. Compared with the integrated heat dissipation device, the use of the heat conduction layer is reduced, and the overall weight is also reduced. This design not only improves the heat dissipation effect, but also optimizes the portability and installation convenience of the device;

[0041] 3. Through the design of the air guide assembly (such as the splitter and the air guide), the airflow can be uniformly distributed to the heat dissipation channels of the fins, avoiding airflow turbulence or local overheating. In particular, in embodiments 2 to 4, through the synergistic effect of the splitter, the air guide and the flow guide strip, the contact area of the airflow and the fins is increased, further improving the heat dissipation effect and utilization rate of the fins. BRIEF DESCRIPTION OF DRAWINGS

[0042] Figure 1 is a schematic diagram of the overall structure of embodiment 1 of the present application.

[0043] Figure 2 is a schematic diagram of the air guide assembly in embodiment 2 of the present application.

[0044] Figure 3is a schematic diagram embodying the position of the guide strip in Embodiment 3 of the present application.

[0045] Figure 4 is a schematic diagram embodying the position of the air-permeable opening in Embodiment 4 of the present application.

[0046] Figure 5 is a schematic diagram embodying the fin structure in Embodiment 5 of the present application.

[0047] Figure 6 is a schematic diagram embodying the fin structure in Embodiment 6 of the present application.

[0048] Figure 7 is a schematic diagram embodying the flow distribution plate structure in Embodiment 7 of the present application

[0049] Explanation of Reference Signs:

[0050] 1, base plate; 11, first heat-conducting plate; 12, second heat-conducting plate; 2, fin; 21, heat dissipation channel; 22, air-permeable surface; 23, wind-blocking surface; 3, air guide assembly; 31, first flow distribution plate; 32, second flow distribution plate; 33, first air guide plate; 34, second air guide plate; 35, guide strip; 351, air-permeable opening. DETAILED DESCRIPTION

[0051] The following will be described in detail in combination with the accompanying Figures 1-6 The present application will be further described in detail.

[0052] The present application discloses a heat dissipation device.

[0053] Embodiment 1

[0054] A heat dissipation device comprises a base plate 1 and a fin 2. The fin 2 is prefabricated and formed, and then brazed on the base plate 1. The base plate 1 is internally provided with a cavity, and the cavity is internally provided with a capillary structure and filled with a cooling medium.

[0055] The base plate 1 is installed at a position close to a heat source of a 5G base station and in contact with the heat source. The heat source transmits heat to the base plate 1, and the base plate 1 cooperates with the cooling medium and the capillary structure to make the heat on the base plate 1 as evenly distributed as possible, so as to transmit the heat to the fin 2 as evenly as possible, thereby improving the utilization of the fin 2 and improving the heat dissipation effect. The fin 2 is made of aluminum sheet, thereby improving the heat dissipation efficiency on the basis of reducing the overall weight of the heat dissipation device.

[0056] The substrate 1 comprises a first heat-conducting plate 11 and a second heat-conducting plate 12, both of which are made of aluminum. The first heat-conducting plate 11 is provided with a heat-conducting groove on the side close to the second heat-conducting plate 12, and the inside of the heat-conducting groove is formed with capillary channels through aluminum powder sintering technology. The first heat-conducting plate 11 and the second heat-conducting plate 12 are fixedly connected through brazing technology, so as to form a cavity at the heat-conducting groove. After the first heat-conducting plate 11 and the second heat-conducting plate 12 are welded, a liquid cooling medium is poured into the cavity. In the embodiment of the present application, the liquid cooling medium is a phase-change liquid, so as to cooperate with the capillary structure to quickly absorb heat and transfer the heat to the fins 2. The fins 2 are installed on the side of the first heat-conducting plate 11 away from the second heat-conducting plate 12.

[0057] The implementation principle of the heat dissipation device in the embodiment 1 of the present application is as follows: the substrate 1 is welded to the base station through friction stir welding, the heat source contacts the second heat-conducting plate 12, the heat of the heat source is transferred to the second heat-conducting plate 12, and the heat is quickly and uniformly transferred to the first heat-conducting plate 11 through cooperation of the phase-change liquid and the capillary structure, so as to quickly and uniformly transfer the heat to the fins 2, so as to improve the utilization rate of the fins 2. Compared with the prior art, one heat-conducting layer is reduced, and at the same time, since the fins 2 are aluminum sheets, when the fins 2 are installed on the substrate 1, they are fixed on the substrate 1 through brazing, and compared with the heat dissipation device formed in one piece, the quality is lighter. The aluminum material is aluminum-manganese alloy or aluminum-magnesium-silicon alloy, and the heat conductivity coefficient is about twice that of traditional castings, so the heat dissipation performance is improved.

[0058] Embodiment 2

[0059] The difference between the embodiment 2 and the embodiment 1 of the present application is that the fins 2 are circumferentially staggered with a plurality of air-penetrating surfaces 22 and air-blocking surfaces 23 in the direction perpendicular to the substrate 1, and in the embodiment of the present application, the air-penetrating surfaces 22 and the air-blocking surfaces 23 are respectively provided with two. Adjacent two air-penetrating surfaces 22 and air-blocking surfaces 23 are provided with air guide assemblies 3. The fins 2 are provided with a plurality of heat dissipation channels 21, and the heat dissipation channels 21 penetrate the air-penetrating surfaces 22.

[0060] Since the fins 2 mainly rely on air cooling, the flow direction of air flow is variable, and when the air flow contacts the air-blocking surfaces 23 of the fins 2, the fins 2 will block the air flow, reducing the utilization rate of the fins 2 and affecting the heat dissipation effect of the fins 2. Adjacent two air-penetrating surfaces 22 and air-blocking surfaces 23 are provided with air guide assemblies 3, and when the air flow hits the air-blocking surfaces 23, the air guide assemblies 3 guide the air flow to the air-penetrating surfaces 22, so as to increase the contact area of the air flow and the fins 2 and improve the heat dissipation effect of the fins 2.

[0061] The air guide assembly 3 comprises a flow dividing plate and an air guide piece. The flow dividing plate is located close to the air-blocking surface 23, and the air guide piece is located close to the air-penetrating surface 22.

[0062] The shunt plate is installed on the base plate 1 near one side of the fin 2, the shunt plate is V-shaped as a whole, and the opening of the shunt plate faces the wind shielding surface 23. When the airflow directly impacts the wind shielding surface 23, the shunt plate divides the airflow to the air guide, so as to guide the airflow to the air guide.

[0063] The air inlet end of the air guide is arranged near the end of the shunt plate, and the air inlet end of the air guide is arranged near the air passing surface 22. After the airflow is guided to the air guide, the air guide guides the airflow to the air passing surface 22, so that the airflow passes through the fin 2, and the contact area of the airflow and the fin 2 is increased.

[0064] The shunt plate includes a first shunt plate 31 and a second shunt plate 32, and the first shunt plate 31 and the second shunt plate 32 are arranged in an arc surface, and the arc centers of the first shunt plate 31 and the second shunt plate 32 are located on the sides of the first shunt plate 31 and the second shunt plate 32 away from the wind shielding surface 23. The first shunt plate 31 and the second shunt plate 32 cooperate to divide the airflow, so as to guide the airflow to the air guide.

[0065] The first shunt plate 31 and the second shunt plate 32 are both arranged in an inclined manner, and the distance between the first shunt plate 31 and the wind shielding surface 23 gradually increases in the direction from the base plate 1 to the base plate 1. When the airflow passes through the shunt plate, the inclined first shunt plate 31 and the second shunt plate 32 guide the airflow to the direction close to the base plate 1.

[0066] The air guide includes an air guide plate and a flow guide strip 35.

[0067] The air guide plate is V-shaped, and the opening of the air guide plate is away from the air passing surface 22. The air guide plate includes a first air guide plate 33 and a second air guide plate 34, and the first air guide plate 33 and the second air guide plate 34 are both arranged in an arc surface, and the arc centers of the first air guide plate 33 and the second air guide plate 34 are respectively close to the air passing surface 22. The flow guide strip 35 is installed on the side of the air guide plate close to the air passing surface 22, and a plurality of flow guide strips 35 are arranged along the length direction of the air guide plate.

[0068] After the airflow flows to the air guide plate through the shunt plate, the air guide plate and the flow guide strip 35 cooperate to relatively uniformly distribute the airflow on the air passing surface 22, so as to maximize the contact area of the airflow and the fin 2, and improve the heat dissipation effect of the fin 2.

[0069] The distance between the flow guide strip 35 and the air passing surface 22 gradually decreases in the direction from the wind shielding surface 23 to the wind shielding surface 23, so that when the airflow flows along the length direction of the air guide plate, the flow guide strip 35 guides the airflow to the air passing surface 22, and the contact area of the airflow and the fin 2 is increased as much as possible.

[0070] The spacing between the flow guide strip 35 and the air passing surface 22 gradually decreases from the side close to the air blocking surface 23 to the side far from the air blocking surface 23, so that the air flow is gradually guided to the air passing surface 22 in the process of flowing, and the air flow is uniformly distributed.

[0071] The flow guide strips 35 on the opposite air deflectors are staggered, so as to reduce the possibility of air flow collision.

[0072] The side of the air deflector close to the air passing surface 22 is provided with a groove, and the groove center is located on the side close to the air passing surface 22. When the air flow passes through the air deflector, the air deflector converges the air flow.

[0073] The implementation principle of the heat dissipation device of the embodiment 2 is that when the air flow hits the flow distribution plate, the first flow distribution plate 31 and the second flow distribution plate 32 cooperatively guide the air flow to the adjacent air deflector. In the process of the air flow flowing on the air deflector, the flow guide strip 35 gradually guides the air flow to the air passing surface 22, so as to uniformly distribute the air flow. In order to reduce the possibility of turbulence of the air flow passing through the fin 2, the flow guide strips 35 on the opposite air deflectors are staggered, so as to uniformly guide the air flow to the inside of the heat dissipation channel 21, and improve the heat dissipation effect of the fin 2.

[0074] Embodiment 3

[0075] The difference between the embodiment 3 and the embodiment 2 is that the flow guide strips 35 on the two opposite air deflectors correspond to each other, and the flow guide strips 35 are inclined.

[0076] The implementation principle of the heat dissipation device of the embodiment 3 is that when the air flow passes through the air deflector, the flow guide strip 35 guides the air flow to the inside of the heat dissipation channel 21. The flow guide strips 35 on the opposite air deflectors guide the air flow to the positions close to and far from the base plate 1 of the heat dissipation channel 21 respectively, so as to further increase the contact area of the air flow and the fin 2, and reduce the possibility of turbulence of the air flow in the same heat dissipation channel 21.

[0077] Embodiment 4

[0078] The difference between the embodiment 4 and the embodiment 2 is that the flow guide strip 35 is provided with an air passing opening 351, the air passing opening 351 on the flow guide strip 35 gradually decreases from the side close to the air blocking surface 23 to the side far from the air blocking surface 23, and the center line of the air passing opening 351 is first parallel.

[0079] The implementation principle of the heat dissipation device of the embodiment 4 is that when the air flow passes through the flow guide strip 35, the air flow hitting the flow guide strip 35 guides the air flow to the inside of the heat dissipation channel 21. Since the size of the air passing opening 351 gradually decreases, the air flow gradually hits the flow guide strip 35, so as to disperse the air flow to the inside of the heat dissipation channel 21.

[0080] Embodiment 5

[0081] The difference between the embodiment 5 and the embodiment 2 of the present application is that the fin 2 comprises a plurality of heat dissipation plates, the heat dissipation plates and the substrate 1 are vertically arranged, and the adjacent two heat dissipation plates are arranged in parallel, and the heat dissipation channel 21 is formed between the adjacent two heat dissipation plates.

[0082] The implementation principle of the heat dissipation device in the embodiment 5 of the present application is that the heat dissipation plates are prefabricated and formed, and when the heat dissipation plates are installed on the substrate 1, the distance between the adjacent two heat dissipation plates can be adjusted according to the size requirement of the heat dissipation channel 21, so as to improve the convenience of adjusting the size of the heat dissipation channel 21.

[0083] Embodiment 6

[0084] The difference between the embodiment 6 and the embodiment 5 of the present application is that the fin 2 is integrally folded and formed, and the bending part of the fin 2 is arranged at a right angle, and the adjacent two vertical parts form the heat dissipation channel 21.

[0085] The implementation principle of the heat dissipation device in the embodiment 6 of the present application is that when the fin 2 is brazed on the substrate 1, the folded and formed heat dissipation plates and the substrate 1 have a larger contact surface, so as to improve the stability of the brazed fin 2.

[0086] Embodiment 7

[0087] The difference between the embodiment 7 and the embodiment 2 of the present application is that the flow distribution plate is arranged in an arc shape, the flow distribution plate is provided with two plates, the fin is located between the two flow distribution plates, and the air guide member is provided with only one and is located at the middle position of the two flow distribution plates and is close to the end part of the flow distribution plate. Since the airflow is generally driven by the chimney effect caused by the rising of hot air to flow cold air, in order to avoid the conflict of the airflow in the vertical direction and improve the flow speed of the airflow in the vertical direction, the air guide member is arranged at the lowermost position.

[0088] The implementation principle of the heat dissipation device in the embodiment 7 of the present application is that when the airflow in the air flows through the wind blocking surface, the flow distribution plate guides the airflow to the air guide member. Since the air guide member is located at the lowermost position after the fin is installed, the airflow is guided to the air guide member at this time, and passes through the fin in the direction from bottom to top, so as to heat the fin. At the same time, due to the effect of the chimney effect, the external airflow further passes through the fin from bottom to top, so as to further improve the heat dissipation effect of the fin and reduce the possibility of turbulence caused by the conflict of the airflow in the vertical direction.

[0089] The above are the preferred embodiments of the present application, which do not limit the protection scope of the present application, so that: any equivalent changes made according to the structure, shape, principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A heat dissipating device characterized by: The heat sink comprises a substrate (1) and fins (2), wherein: The substrate (1) is internally provided with a cavity filled with a liquid cooling medium; The cavity is internally provided with a capillary structure, and the capillary structure is immersed in the liquid cooling medium; The fins (2) are arranged on the substrate (1); The fins (2) are circumferentially staggered with a plurality of air passing surfaces (22) and air blocking surfaces (23) in a direction perpendicular to the substrate (1); The air passing surface (22) and the air blocking surface (23) are provided with an air guide assembly (3).

2. The heat sink of claim 1, wherein: The substrate (1) comprises a first heat-conducting plate (11) and a second heat-conducting plate (12), wherein: The cavity is arranged between the first heat-conducting plate (11) and the second heat-conducting plate (12).

3. The heat sink of claim 1, wherein: The fins (2) comprise a plurality of heat dissipation plates; The heat dissipation channels (21) are formed between adjacent two heat dissipation plates; The heat dissipation plates are arranged on the substrate (1) near the side edges of the substrate (1).

4. The heat sink of claim 1, wherein: The fins (2) comprise integrally formed heat dissipation fins; The heat dissipation fins are arranged in a folded shape.

5. The heat sink of claim 1, wherein: The air guide assembly (3) comprises a flow dividing plate and an air guide piece, wherein: The flow dividing plate is arranged in a V shape, and the opening of the flow dividing plate faces the air blocking surface (23); The air inlet end of the air guide piece is arranged near the end of the flow dividing plate; The air inlet end of the air guide piece is arranged near the air passing surface (22).

6. The heat sink of claim 5, wherein: The flow dividing plate comprises a first flow dividing plate (31) and a second flow dividing plate (32), wherein: The first flow dividing plate (31) and the second flow dividing plate (32) are arranged in an arc shape; The arc centers of the first flow dividing plate (31) and the second flow dividing plate (32) are respectively located on the sides of the first flow dividing plate (31) and the second flow dividing plate (32) away from the air blocking surface (23).

7. The heat sink of claim 6, wherein: The first flow dividing plate (31) and the second flow dividing plate (32) are both arranged in an inclined manner; The distance between the first flow dividing plate (31) and the air blocking surface (23) gradually increases in a direction from the substrate (1) to away from the substrate (1).

8. The heat sink of claim 5, wherein: The air guide piece comprises an air guide plate; The air guide plate is arranged in a V shape, and the opening of the air guide plate is away from the air passing surface (22); The air guide plate comprises a first air guide plate (33) and a second air guide plate (34), wherein: The first air guide plate (33) and the second air guide plate (34) are both provided with grooves; The openings of the grooves face the air passing surface (22).

9. The heat sink of claim 8, wherein: The side of the air guide plate near the air passing surface (22) is provided with a plurality of flow guide strips (35). A plurality of the flow guide strips (35) are distributed along the length direction of the air passing surface (22); The spacing between the flow guide strip (35) and the air passing surface (22) gradually decreases in the direction from close to the air blocking surface (23) to away from the air blocking surface (23).

10. The heat dissipation device according to claim 9, characterized in that: The flow guide strip (35) is obliquely arranged.

Images