Slide glass for packaging photoelectric device
By designing a combination structure of upper and lower pressure plates and positioning plates in the carrier for optoelectronic device packaging, the problem of low heat dissipation efficiency of the carrier is solved, a rapid heat dissipation effect is achieved, and the heat dissipation capability of the carrier is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-03-27
AI Technical Summary
The heat dissipation efficiency of existing optoelectronic device packaging carriers is relatively slow, mainly because the inner wall of the plastic package is made of plastic material, which results in poor thermal conductivity and makes it difficult to effectively dissipate the heat generated by the chip.
The design incorporates an assembly method for the substrate and the encapsulation body. This method utilizes upper and lower pressure plates distributed on the outer side of the substrate and symmetrically distributed positioning plates on the inner wall of the encapsulation body to form heat dissipation grooves. This enables rapid alignment and sliding installation of the substrate and the encapsulation body, while simultaneously using the pressure plates and positioning plates as heat conduction media for rapid heat dissipation.
This technology enables rapid heat dissipation of the carrier wafer used for optoelectronic device packaging, improves heat dissipation efficiency, and enhances the heat dissipation performance of the carrier wafer.
Smart Images
Figure CN224054713U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor device, concretely is photoelectric device package is with the carrier section. BACKGROUND
[0002] Photoelectric device package is with the carrier section is the key assembly in photoelectric device manufacturing process, and its main role is to provide mechanical support, electrical connection and protection photoelectric device;
[0003] The photoelectric device package with the carrier section provided in the prior art comprises a carrier body and a plastic package body, a clamping groove with a size matching that of the carrier body is formed in the plastic package body, and a buckle is fixed on the surface of the clamping groove; meanwhile, a buckle hole matching the buckle is formed in the carrier body.
[0004] When the carrier body and the plastic package body are assembled, the carrier body is inserted into the clamping groove formed in the plastic package body, and the buckle fixed on the surface of the clamping groove passes through the buckle hole formed in the carrier body, so that the carrier body and the plastic package body can be quickly aligned and installed.
[0005] This photoelectric device package with the carrier section is simple to manufacture and convenient to install, but has obvious problems and defects, for example, the carrier body and the inner wall of the plastic package body are directly pressed and contacted, when the chip arranged on the upper end of the carrier body is powered on, the heat generated by the chip is only conducted through the copper sheet itself due to the poor heat conduction efficiency of the plastic material of the inner wall of the plastic package body, thereby causing the photoelectric device package with the carrier section to have a slow heat dissipation efficiency.
[0006] In view of the problems in the above background art, the utility model aims to provide a photoelectric device package with the carrier section. SUMMARY
[0007] The utility model aims to provide a photoelectric device package with the carrier section to solve the problems in the above background art.
[0008] To achieve the above object, the utility model provides the following technical scheme:
[0009] The photoelectric device package with the carrier section comprises:
[0010] The carrier body and the plastic package body, wherein the chip is installed on the upper end of the carrier body.
[0011] The upper and lower pressure plates are distributed on the outer side of the slide body, and the mounting groove is formed in the plastic sealing body, and the size of the mounting groove is matched with the size of the slide body; and the positioning plates are symmetrically arranged on the inner wall of the mounting groove, and the positioning plates are divided into upper and lower positioning plates, and the upper positioning plate is uniformly provided with the heat dissipation holes, and the heat dissipation groove is formed between the upper and lower positioning plates.
[0012] As a further scheme of the utility model, the signal transmission end is formed at one end of the slide body, and the positioning pin is welded and fixed on one side of the signal transmission end formed at one end of the slide body, and the welding point is formed at the position where the one end of the positioning pin is welded and connected with the signal transmission end.
[0013] As a further scheme of the utility model, the signal contact end is installed at the other end opposite to the signal transmission end of the slide body, and the contact pressure plate is arranged on the upper and lower outer surfaces of the signal contact end; and the transmission pin is installed at one end of the plastic sealing body, and the transmission pin is integrally formed with the plastic sealing body, and the insertion slot is formed on the part of the transmission pin in the plastic sealing body.
[0014] Compared with the prior art, the utility model has the advantages that:
[0015] Compared with the current slide for photoelectric device packaging, the slide for photoelectric device packaging has the following advantages:
[0016] The original slide body and the plastic sealing body are assembled, the slide body is inserted into the clamping groove formed in the plastic sealing body, the buckle fixed on the surface of the clamping groove penetrates through the buckle hole formed in the slide body, and the slide body and the plastic sealing body are quickly aligned and installed.
[0017] Instead, the slide body is aligned and inserted into the mounting groove formed in the plastic sealing body during assembly of the slide body and the plastic sealing body, and is slid and displaced, so that the clamping groove formed by the upper and lower pressure plates is aligned and inserted into the upper positioning plate, and the lower pressure plate is slid and displaced in the heat dissipation groove formed between the upper and lower positioning plates.
[0018] In this way, the slide body and the plastic sealing body are quickly aligned and slid and displaced in the mounting groove formed in the slide body, and the slide body is used as a heat conducting medium when running after being electrified by the cooperation of the pressure plates and the positioning plates, so that the slide for photoelectric device packaging is quickly cooled after being electrified and running. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to make the technical problems, technical solutions and beneficial effects of the utility model clearer, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and not to limit the utility model.
[0020] Figure 1 The structure diagram of the carrier sheet for packaging the photoelectric device of the utility model embodiment.
[0021] Figure 2 The exploded view of the carrier sheet for packaging the photoelectric device of the utility model embodiment.
[0022] Figure 3 The side view of the carrier sheet body of the carrier sheet for packaging the photoelectric device of the utility model embodiment.
[0023] In the figure: 1-positioning pin, 2-welding point, 3-signal transmission end, 4-carrier sheet body, 5-chip, 6-mounting groove, 7-plastic package, 8-transmission pin, 9-upper pressing plate, 10-lower pressing plate, 11-signal contact end, 12-contact pressing sheet, 13-upper positioning plate, 14-radiating hole, 15-radiating groove, 16-lower positioning plate. DETAILED DESCRIPTION
[0024] In order to make the technical problems, technical solutions and beneficial effects of the utility model clearer, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and not to limit the utility model.
[0025] EMBODIMENT
[0026] Please refer to Figure 1 , Figure 2 and Figure 3 The carrier sheet for packaging the photoelectric device provided in the utility model embodiment comprises:
[0027] The chip 5 is installed on the upper end of the carrier body 4 and is used to control the normal operation state of the entire photoelectric device packaging carrier after being powered on. The signal transmission end 3 is formed at one end of the carrier body 4, and the positioning pin 1 is welded and fixed on one side of the signal transmission end 3. The welding point 2 is formed at the position where the one end of the positioning pin 1 is welded and connected with the signal transmission end 3. The positioning pin 1 welded and fixed at one end of the signal transmission end 3 is used to perform signal transmission of the photoelectric device packaging carrier and support the entire photoelectric device packaging carrier, so that there is a gap between the photoelectric device packaging carrier and the installation position, which is used to realize rapid ventilation and heat dissipation of the running photoelectric device packaging carrier. Moreover, the positioning pin 1 is welded with the signal transmission end 3, which avoids being directly integrated and molded with the signal transmission end 3, so that the bending phenomenon of the photoelectric device packaging carrier during transportation can be effectively avoided.
[0028] The carrier body 4 is distributed with a pressing plate, which is distributed in an up-down manner on the outer side of the carrier body 4 and is respectively an upper pressing plate 9 and a lower pressing plate 10. The plastic sealing body 7 is internally formed with an installation groove 6, and the size of the installation groove 6 formed in the plastic sealing body 7 is matched with the size of the carrier body 4. The installation groove 6 is internally and symmetrically distributed with a positioning plate, which is divided into an upper positioning plate 13 and a lower positioning plate 16. The upper positioning plate 13 is uniformly distributed with a heat dissipation hole 14 on the surface, and the heat dissipation groove 15 is formed between the upper positioning plate 13 and the lower positioning plate 16.
[0029] When the carrier body 4 and the plastic sealing body 7 are assembled, the carrier body 4 is inserted into the installation groove 6 formed in the plastic sealing body 7, and then is slid and displaced, so that the clamping groove formed by the upper pressing plate 9 and the lower pressing plate 10 is inserted into the upper positioning plate 13, and the lower pressing plate 10 is slid and displaced in the heat dissipation groove 15 formed between the upper positioning plate 13 and the lower positioning plate 16.
[0030] Through the cooperation of the upper and lower pressing plates and the upper and lower positioning plates, the carrier body 4 and the installation groove 6 formed in the plastic sealing body 7 can be quickly and slidably installed and displaced, and the carrier body 4 can be used as a heat conduction medium when being powered on and running, so as to realize rapid heat dissipation of the photoelectric device packaging carrier after being powered on and running.
[0031] Please refer to Figure 2 and Figure 3In an embodiment of the present application, the signal contact end 11 is installed at one end of the slide body 4 opposite to the signal transmission end 3, and the contact pressing pieces 12 are installed on the upper and lower outer surfaces of the signal contact end 11.
[0032] When the slide body 4 is assembled in the plastic package body 7, the signal contact end 11 installed at one end of the slide body 4 is inserted into the slot formed in the transmission pin 8, and the contact pressing pieces 12 installed on the upper and lower outer surfaces of the signal contact end 11 are in extrusion contact with the inner wall of the slot, so that the electrical connection between the signal contact end 11 and the transmission pin 8 is realized, and the entire photoelectric device packaging slide can realize signal transmission through the transmission pin 8.
[0033] In the description of the present application, unless otherwise explicitly defined and limited, the terms "installation", "connection" and "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0034] The above is only a preferred embodiment of the present application, and is not intended to limit the present application, and any modification, equivalent replacement and improvement within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims
1. A carrier sheet for encapsulating optoelectronic devices, comprising: The chip body (4) and the plastic sealing body (7), wherein the chip body (4) is provided with a chip (5) at the upper end; characterized in that: The chip body (4) is provided with a pressing plate on the outer side, which is arranged in an up-down manner on the outer side of the chip body (4) and comprises an upper pressing plate (9) and a lower pressing plate (10); The plastic sealing body (7) is internally provided with an installation groove (6) which is adapted in size to the chip body (4); and the inner wall of the installation groove (6) is symmetrically provided with a positioning plate, which comprises an upper positioning plate (13) and a lower positioning plate (16); the surface of the upper positioning plate (13) is uniformly provided with a heat dissipation hole (14); and a heat dissipation groove (15) is formed between the upper positioning plate (13) and the lower positioning plate (16).
2. The slide for encapsulating optoelectronic devices according to claim 1, wherein: The chip body (4) is provided with a signal transmission end (3) at one end; the signal transmission end (3) is provided with a positioning pin (1) at one side; and the positioning pin (1) is welded at one end to the signal transmission end (3) to form a welding point (2).
3. The slide for encapsulating optoelectronic devices according to claim 2, wherein: The chip body (4) is provided with a signal contact end (11) at the opposite end of the signal transmission end (3); the signal contact end (11) is provided with a contact pressing plate (12) on the upper and lower outer surfaces; and the plastic sealing body (7) is provided with a transmission pin (8) at one end; the transmission pin (8) is integrally formed with the plastic sealing body (7); and the transmission pin (8) is provided with a slot at the part inside the plastic sealing body (7).