LED lamp bead capable of preventing conductive adhesive from being separated

Abstract

The utility model discloses an LED lamp bead capable of preventing conductive adhesive separation, which comprises an LED support, an LED wafer and a lead frame, the lead frame is fixedly connected to the lower end of the LED support, the lead frame is provided with an electroplating area at the bottom of an inner cavity of the LED support, the electroplating area is provided with grid grooves distributed in a grid shape, the LED wafer is installed in the inner cavity of the LED support, and the LED wafer is installed in the inner cavity of the LED support. And the bottom of the LED wafer is connected with the grid groove of the lead frame through a conductive adhesive. The lead frame is simple in structure and reasonable in design, and the grid grooves are arranged on the electroplating area of the lead frame, so that the contact area between the conductive adhesive and the lead frame can be increased, the binding force between the lead frame and the conductive adhesive is improved, and the service life of the lead frame is prolonged. The situation that the LED wafer and the lead frame are cracked and separated when the LED lamp bead is used in a harsh environment and in an experiment stage can be avoided, and the LED lamp bead is prevented from open circuit failure.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED technical field more particularly, it is a kind of LED lamp bead that can prevent conductive glue separation. BACKGROUND

[0002] LED light source has the characteristics of using low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no environmental pollution, multi-color light emission, etc., and has been widely used. Among them, the existing LED light source can include insulating support, LED wafer and lead frame and other components, such as patent authorized announcement No. CN 203733849 U, a kind of LED lighting light source with anti-sulfuration function, the LED wafer is fixed on the bearing base of lead frame by conductive glue, the structure of the LED lighting light source is airtight, has anti-sulfuration function, however, the plating layer on the lead frame of such LED light source is relatively smooth or simple, which causes the LED wafer and lead frame to crack and separate in harsh use environment and experimental stage, resulting in open-circuit failure of LED light source. SUMMARY

[0003] The utility model aims at overcoming the above-mentioned defects in the prior art, and provides an LED lamp bead which is designed with grid grooves and can prevent conductive glue separation.

[0004] To achieve the above-mentioned purpose, the utility model provides an LED lamp bead which can prevent conductive glue separation, comprising an LED support, an LED wafer and a lead frame, the lead frame is fixedly connected to the lower end of the LED support, the lead frame is provided with a plating area at the bottom position of the inner cavity of the LED support, the plating area is provided with grid grooves which are distributed in a grid shape, the LED wafer is installed in the inner cavity of the LED support, and the bottom of the LED wafer is connected to the grid grooves of the lead frame through conductive glue.

[0005] Preferably, in the above technical solution, the LED support is a PLCC support.

[0006] Preferably, in the above technical solution, the lead frame is a silver-plated lead frame.

[0007] Preferably, in the above technical solution, the lead frame comprises a first pin portion and a second pin portion, one end of the first pin portion and the second pin portion is located inside the LED support, the other end of the first pin portion and the second pin portion respectively extends out of both sides of the LED support, and the plating area and the grid grooves are located on the second pin portion.

[0008] Preferably, in the technical scheme above, the LED wafer is connected with the first pin part and the second pin part respectively through connecting lines.

[0009] Preferably, in the technical scheme above, the inner cavity of the LED support is filled with LED protective glue.

[0010] Preferably, in the technical scheme above, the LED protective glue is heat-conducting silica gel.

[0011] Preferably, in the technical scheme above, the conductive glue is conductive silver glue.

[0012] Compared with the prior art, the LED lamp bead provided by the present application has the beneficial effects that:

[0013] The LED lamp bead has the advantages of simple structure, reasonable design, and the like. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0015] Figure 1 is a structural schematic diagram of the LED lamp bead capable of preventing the conductive glue from separating provided by the embodiment of the present application;

[0016] Figure 2 is a sectional view of the LED lamp bead capable of preventing the conductive glue from separating provided by the embodiment of the present application. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical scheme in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0018] Please refer to Figure 1 andFigure 2 The embodiment of the utility model provides a LED lamp pearl can prevent conductive glue separation, including LED support 1, lead frame 2 and LED wafer 3 and other components, below combining the drawing to the various component parts of this embodiment are explained in detail.

[0019] In this embodiment, LED support 1 can preferably be set as PLCC support.

[0020] As Figure 2 Indicated, lead frame 2 is fixedly connected at the lower end of LED support 1, and the lead frame 2 can be preferably set as silver-plated lead frame, and the lead frame 2 is provided with an electroplated area at the bottom position of the inner cavity of the LED support 1.

[0021] Specifically, the lead frame 2 can include a first pin portion 21 and a second pin portion 22, one end of the first pin portion 21 and the second pin portion 22 is located inside the LED support 1, and the other end of the first pin portion 21 and the second pin portion 22 respectively extends out of both sides of the LED support 1.

[0022] As Figure 1 And Figure 2 Indicated, the electroplated area of the lead frame 2 can be located on the second pin portion 22, and the electroplated area can be provided with a grid-shaped distribution of grid grooves 20.

[0023] Specific installation, LED wafer 3 is installed in the inner cavity of the LED support 1, and the bottom of the LED wafer 3 can be connected to the grid groove 20 of the lead frame 2 through the conductive glue 4. Preferably, the conductive glue can be preferably set as conductive silver glue.

[0024] As Figure 1 And Figure 2 Indicated, the LED wafer 3 can be connected to the first pin portion 21 and the second pin portion 22 respectively through the connecting wire 5 (such as gold wire or copper wire).

[0025] As Figure 2 Indicated, the inner cavity of the LED support 1 is filled with LED protective glue 6, wherein the LED protective glue 6 can be preferably set as heat-conducting silicone.

[0026] In summary, the utility model has the advantages of simple structure, reasonable design, grid-shaped distribution of grid grooves on the electroplated area of the lead frame, which can increase the contact area of the conductive glue and the lead frame, improve the bonding force between the lead frame and the conductive glue, avoid the cracking and separation between the LED wafer and the lead frame in harsh use environment and experimental stage, and prevent the open-circuit failure of the LED lamp pearl.

[0027] The above embodiment is the preferred embodiment of the present application, but the embodiment of the present application is not limited by the above embodiment, and any change, modification, replacement, combination, simplification made without departing from the spirit and principle of the present application should be an equivalent replacement mode, and all are included in the protection scope of the present application.

Claims

1. An LED bead that prevents conductive adhesive separation, characterized in that: The LED support, LED wafer and lead frame are included, the lead frame is fixedly connected at the lower end of the LED support, the lead frame is provided with a plating area at the bottom position of the inner cavity of the LED support, the plating area is provided with grid grooves distributed in a grid shape, the LED wafer is installed in the inner cavity of the LED support, and the bottom of the LED wafer is connected with the grid grooves of the lead frame through conductive glue.

2. The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 1, wherein: The LED support is arranged as a PLCC support.

3. The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 1, wherein: The lead frame is arranged as a silver-plated lead frame.

4. The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 1, wherein: The lead frame includes first pin portions and second pin portions, one end of the first pin portions and the second pin portions is located in the interior of the LED support, the other end of the first pin portions and the second pin portions respectively extends out of the two sides of the LED support, and the plating area and the grid grooves are located on the second pin portions.

5. The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 4, characterized in that: The LED wafer is connected with the first pin portions and the second pin portions through connecting lines respectively.

6. The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 1, wherein: The inner cavity of the LED support is filled with LED protective glue.

7. The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 6, characterized in that: The LED protective glue is arranged as heat-conducting silica gel. 8.The LED lamp bead capable of preventing the conductive adhesive from separating according to claim 1, wherein: The conductive glue is arranged as conductive silver glue.

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