Solidification liquid cooling device

Abstract

The utility model relates to the technical field of solidification cooling, in particular to a solidification liquid cooling device. The solidification liquid cooling device comprises a carrying table, a first vacuum generator, a connecting pipe and a cold source, a plurality of liquid cooling holes are formed in the carrying table in the length direction at intervals, and the liquid cooling holes extend in the width direction of the carrying table and penetrate through the two ends of the carrying table in the width direction. A plurality of air holes are further formed in the upper surface of the carrying table and used for vacuum adsorption of products to be cooled. An air pipe of the first vacuum generator communicates with the multiple air holes. The ports, on the same side in the width direction of the carrying table, of every two adjacent liquid cooling holes are connected through a connecting pipe, so that the multiple liquid cooling holes are sequentially connected in series to form a liquid cooling channel. A liquid conveying pipe of the cold source is connected with an inlet of the liquid cooling channel, and a liquid return pipe of the cold source is connected with an outlet of the liquid cooling channel so as to supply cooling liquid to the liquid cooling channel. The liquid cooling holes are formed by machining the straight holes, and the multiple liquid cooling holes are sequentially connected in series through the connecting pipes to form the liquid cooling channel, so that the machining difficulty and cost of the liquid cooling channel are reduced, and the sealing performance is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to solidification cooling technical field especially relates to a solidification liquid cooling device. BACKGROUND

[0002] In the solidification phase of the wafer, ultraviolet (UV) solidification will make the temperature of the wafer surface gradually rise, so the UV solidification process of the wafer is usually carried out on the solidification liquid cooling device to accurately control the wafer surface temperature and ensure the solidification effect of the wafer.

[0003] In the existing solidification liquid cooling device, a liquid cooling channel in the shape of a back shape or S is excavated in the split type carrier, then the split type carrier is assembled, the wafer is adsorbed on the carrier by a vacuum adsorption method, and the cooling of the wafer is realized. The problem of the above-mentioned solidification liquid cooling device is that the shape of the liquid cooling channel is complex, and the processing cost is high. At the same time, the sealing performance of the liquid cooling channel is poor, and the risk of leakage of the cooling liquid is easy to occur. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a solidification liquid cooling device to reduce the processing difficulty and cost of the liquid cooling channel, improve the sealing performance of the liquid cooling channel, and avoid liquid leakage.

[0005] To achieve this purpose, the technical scheme adopted by the utility model is:

[0006] The solidification liquid cooling device comprises:

[0007] A carrier is provided with a plurality of liquid cooling holes along the length direction at intervals, the liquid cooling holes extend along the width direction of the carrier and penetrate through both ends of the width direction of the carrier, and a plurality of air holes are further provided on the upper surface of the carrier, the air holes are used for vacuum adsorbing the products to be cooled;

[0008] A first vacuum generator is provided, and the air pipe of the first vacuum generator is communicated with the plurality of air holes;

[0009] A connecting pipe is provided, and the ports of two adjacent liquid cooling holes on the same side of the width direction of the carrier are connected by the connecting pipe, so that the plurality of liquid cooling holes are sequentially connected to form a liquid cooling channel;

[0010] A cold source is provided, and the liquid inlet pipe of the cold source is connected with the inlet of the liquid cooling channel, and the liquid return pipe of the cold source is connected with the outlet of the liquid cooling channel, so as to supply the cooling liquid to the liquid cooling channel.

[0011] As an optional scheme, the solidification liquid cooling device further comprises:

[0012] A joint is provided on both ends of the connecting pipe, and the joint is tightly abutted on the corresponding end face of the carrier along the width direction at the same end of the carrier along the width direction.

[0013] A sealing member is arranged between the joint and the end surface of the carrier corresponding to the joint in the width direction.

[0014] Alternatively, the inlet and outlet of the liquid cooling channel are located at the same end of the carrier in the width direction, so that the liquid inlet pipe and the liquid return pipe are located at the same end of the carrier in the width direction.

[0015] Alternatively, the solidification liquid cooling device further comprises a material receiving mechanism, which comprises:

[0016] A lifting assembly is arranged below the carrier.

[0017] A suction rod is arranged in a through hole of the carrier in the height direction, and the lifting assembly is in transmission connection with the suction rod to lift the suction rod to a material receiving position or lower the suction rod to a material releasing position in the height direction of the carrier. When the suction rod is lifted to the material receiving position, the top end of the suction rod extends out of the through hole and receives the product. When the suction rod is lowered to the material releasing position, the top end of the suction rod is located in the through hole to release the product to the upper surface of the carrier.

[0018] Alternatively, the material receiving mechanism further comprises a second vacuum generator, and the air pipe of the second vacuum generator is connected with the suction rod, so that the suction rod can adsorb or release the product.

[0019] Alternatively, a rack is arranged below the carrier, and the lifting assembly is arranged on the rack.

[0020] The material receiving mechanism further comprises a support, the suction rod is mounted on the support, and the output end of the lifting assembly is connected with the support. One of the support and the rack is provided with a sliding block, and the other of the support and the rack is provided with a sliding rail, and the sliding rail is in sliding cooperation with the sliding block.

[0021] Alternatively, the material receiving mechanism comprises two sensors, and the two sensors are arranged on the rack in the height direction of the carrier and in communication connection with the lifting assembly.

[0022] The support is provided with a limiting piece configured to trigger the upper sensor when the suction rod is lifted to the material receiving position and to trigger the lower sensor when the suction rod is lowered to the material releasing position.

[0023] As an option, the carrier is provided with a plurality of longitudinal air passages spaced along the length direction of the carrier, and the longitudinal air passages extend along the width direction of the carrier.

[0024] The carrier is further provided with vertical air passages, and each longitudinal air passage is provided with a plurality of vertical air passages in communication, and the vertical air passages penetrate the upper surface of the carrier and form the air holes.

[0025] As an option, the carrier is provided with a transverse air passage along the width direction of the carrier, and the transverse air passage extends along the length direction of the carrier and is in communication with each longitudinal air passage; and the air pipe of the first vacuum generator is connected with the transverse air passage.

[0026] As an option, along the height direction of the carrier, the longitudinal air passage and the transverse air passage are both located above the liquid cooling hole.

[0027] The beneficial effects of the utility model are as follows:

[0028] The solidification liquid cooling device provided by the utility model, the carrier is provided with a plurality of liquid cooling holes along the width direction of the carrier, and the liquid cooling holes are formed in the carrier by machining straight holes; the liquid cooling holes are connected by connecting pipes in sequence to form a liquid cooling passage, that is, the liquid cooling passage is provided as a split scheme of the liquid cooling hole and the connecting pipe in a straight hole, so that the liquid cooling passage does not need to be excavated in a back shape or S shape inside the carrier, the machining difficulty and cost of the liquid cooling passage are reduced, the leakage of the cooling liquid in the liquid cooling passage is avoided, the sealing performance of the liquid cooling passage is improved, and the risk of liquid leakage is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is the first structure schematic view of the solidification liquid cooling device provided by the utility model embodiment;

[0030] Figure 2 is the front view of the carrier provided by the utility model embodiment;

[0031] Figure 3 is Figure 2 the sectional view of A-A direction in figure 1;

[0032] Figure 4 is Figure 2 the sectional view of B-B direction in figure 1;

[0033] Figure 5 is Figure 4 the local structure enlarged view of C in figure 1;

[0034] Figure 6 is the second structure schematic view of the solidification liquid cooling device provided by the utility model embodiment.

[0035] The names and numbers of the components in the figures are as follows:

[0036] 1, carrier; 11, liquid cooling hole; 12, longitudinal air duct; 13, vertical air duct; 130, air hole; 14, transverse air duct; 15, through hole; 2, connecting pipe; 3, joint; 4, suction rod; 5, rack; 6, support; 61, limiting piece; 7, sensor; 81, sliding block; 82, sliding rail; 91, infusion tube; 92, liquid return tube; 10, plug. DETAILED DESCRIPTION

[0037] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model will be further explained below in combination with the drawings and through specific embodiments. It can be understood that the specific embodiments described herein are only used to explain the utility model, not to limit the utility model. In addition, it needs to be explained that, in order to facilitate the description, only the parts related to the utility model are shown in the drawings, not all.

[0038] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0039] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0040] In the description of the embodiment, the terms "up", "down", "right", "left" and other orientation or position relationship are based on the orientation or position relationship shown in the drawings, only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0041] The technical scheme of the utility model is further illustrated below in combination with the drawings and through specific embodiments.

[0042] In the existing solidification liquid cooling device, a liquid cooling channel in a shape of a back shape or an S shape is excavated in a split type carrier, then the split type carrier is assembled, the wafer is adsorbed on the carrier by a vacuum adsorption mode, and the wafer is cooled. The existing solidification liquid cooling device has the following problems: the shape of the liquid cooling channel is complex, and the processing cost is high. Meanwhile, the sealing performance of the liquid cooling channel is poor, and the risk of leakage of the cooling liquid is prone to occur.

[0043] To solve the above problems, as shown in the Figures 1-3 The solidification liquid cooling device includes a carrier 1, a first vacuum generator, a connecting pipe 2 and a cooling source. A plurality of liquid cooling holes 11 are arranged in the carrier 1 along the length direction (the left-right direction in the drawing) at intervals. The liquid cooling holes 11 extend along the width direction (the front-rear direction in the drawing) of the carrier 1 and penetrate through both ends of the carrier 1 in the width direction. A plurality of air holes 130 are also arranged on the upper surface of the carrier 1. The air holes 130 are used for vacuum adsorption of the product to be cooled. The air pipe of the first vacuum generator is in communication with the plurality of air holes 130. The ports of the adjacent two liquid cooling holes 11 on the same side of the carrier 1 in the width direction are connected by the connecting pipe 2, so that the plurality of liquid cooling holes 11 are sequentially connected in series to form a liquid cooling channel. The liquid supply pipe 91 of the cooling source is connected to the inlet of the liquid cooling channel, and the liquid return pipe 92 of the cooling source is connected to the outlet of the liquid cooling channel, so as to supply the cooling liquid to the liquid cooling channel. The carrier 1 adsorbs the product to be cooled by the air holes 130, and the cooling source supplies the cooling liquid to the liquid cooling channel to cool the product. The liquid cooling holes 11 extend along the width direction of the carrier 1, and the liquid cooling holes 11 are formed in the carrier 1 by processing straight holes. The plurality of liquid cooling holes 11 are sequentially connected in series by the connecting pipe 2 to form the liquid cooling channel. That is, the liquid cooling channel is arranged in a split type scheme of the straight hole liquid cooling hole 11 and the connecting pipe 2. The liquid cooling channel does not need to be excavated in the carrier 1 in a shape of a back shape or an S shape, thereby reducing the processing difficulty and cost of the liquid cooling channel. Meanwhile, the risk of leakage of the cooling liquid in the liquid cooling channel is avoided, the sealing performance of the liquid cooling channel is improved, and the risk of leakage is avoided.

[0044] In the present embodiment, the product can be a wafer or other articles. The cooling liquid of the present embodiment is cooling water, which is cheap and easy to obtain. Of course, the cooling liquid can also be other cooling media capable of flowing. The cooling source supplies the cooling liquid to the liquid cooling channel through the liquid supply pipe 91, and the cooling liquid cools the product carried on the upper surface of the carrier 1. The cooling water with the temperature increased after heat exchange flows back to the cooling source through the liquid return pipe 92. The cooling source cools the cooling water and then supplies it to the liquid cooling channel again, thereby realizing the function of circulating cooling. Since the cooling source is a prior art, the structure and working process of the cooling source will not be described again.

[0045] Further, the solidification liquid cooling device further comprises a joint 3 and a sealing member (not shown in the figure). The two ends of the connecting pipe 2 are respectively provided with the joint 3. The joint 3 is abutted against the corresponding end surface of the platform 1 along the width direction at the same end of the platform 1 along the width direction. The joint 3 and the corresponding end surface of the platform 1 along the width direction are clamped with the sealing member at the same end of the platform 1 along the width direction. By arranging the joint 3 and the sealing member, the sealing assembly of the connecting pipe 2 and the corresponding liquid cooling hole 11 is realized, so as to avoid the leakage of the cooling liquid at the connecting position of the connecting pipe 2 and the liquid cooling hole 11, and the sealing performance of the liquid cooling channel is improved.

[0046] Specifically, the connecting pipe 2 is a U-shaped elbow pipe, and the outer periphery of the two ends of the U-shaped elbow pipe is provided with external threads to enable the U-shaped elbow pipe to be screwed with the joint 3. The joint 3 is provided with a sealing groove at one end in the axial direction, and the sealing member is arranged in the sealing groove. After the connecting pipe 2 is connected with the ports of the two adjacent liquid cooling holes 11 at the same end, the joint 3 at the two ends of the U-shaped elbow pipe is screwed until the joint 3 is abutted against the front end or the rear end of the platform 1 to clamp the sealing member, so as to realize the sealing assembly of the joint 3. In addition, the connecting pipe 2, the liquid delivery pipe 91 and the liquid return pipe 92 are all made of high-temperature-resistant materials, such as stainless steel and the like, so as to avoid the cracking of the pipes after being heated.

[0047] As shown in Figure 1 , the inlet and the outlet of the liquid cooling channel are both located at the same end of the platform 1 along the width direction, so that the liquid delivery pipe 91 and the liquid return pipe 92 are both located at the same end of the platform 1 along the width direction. Since the liquid delivery pipe 91 and the liquid return pipe 92 are both located at the front side of the platform 1, the assembly of the liquid delivery pipe 91 and the liquid return pipe 92 is facilitated, the space occupied by the liquid delivery pipe 91 and the liquid return pipe 92 along the width direction of the platform 1 is reduced, and the compactness of the solidification liquid cooling device is improved. Specifically, the liquid cooling hole 11 at the rightmost side of the platform 1 is the first liquid cooling hole 11, and the liquid cooling hole 11 at the leftmost side of the platform 1 is the last liquid cooling hole 11. The liquid delivery pipe 91 is connected with the front port of the first liquid cooling hole 11, and the liquid return pipe 92 is connected with the front port of the last liquid cooling hole 11. The joint 3 and the sealing member are arranged at the connecting position of the liquid delivery pipe 91 and the first liquid cooling hole 11 and at the connecting position of the liquid return pipe 92 and the last liquid cooling hole 11, so as to ensure that the liquid delivery pipe 91 and the liquid return pipe 92 are respectively connected with the liquid cooling channel in a sealed manner, and the leakage of the cooling liquid is avoided.

[0048] As shown in Figure 1 , the upper surface of the platform 1 is arranged with a plurality of air holes 130 in an array. The first vacuum generator provides a negative pressure environment for the plurality of air holes 130, so as to stably adsorb the product to the upper surface of the platform 1, and the movement of the product is avoided. According to different sizes of the product, the air holes 130 outside the covering surface of the product can be blocked by a diaphragm (such as a transparent frosted adhesive tape), so as to match products of different sizes, and the versatility of the platform 1 is improved.

[0049] As shown in Figure 4 andFigure 5 As shown, multiple longitudinal air channels 12 are spaced apart along the length direction inside the stage 1, and the longitudinal air channels 12 extend along the width direction of the stage 1. Vertical air channels 13 are also provided inside the stage 1, and multiple vertical air channels 13 are connected to each longitudinal air channel 12. The vertical air channels 13 penetrate the upper surface of the stage 1 and form air holes 130. The multiple vertical air channels 13 spaced equally along the width direction of the stage 1 in each longitudinal air channel 12 create an array of air holes 130 on the upper surface of the stage 1, thereby increasing the adsorption area of ​​the stage 1.

[0050] Furthermore, a transverse air passage 14 is provided within the platform 1 along its width direction. The transverse air passage 14 extends along the length direction of the platform 1 and communicates with each longitudinal air passage 12. The air pipe of the first vacuum generator is connected to the transverse air passage 14. Specifically, the first vacuum generator is connected to the transverse air passage 14 via an air pipe connector. Since the transverse air passage 14 is connected to each longitudinal air passage 12, the first vacuum generator can provide a negative pressure environment to each air hole 130 through the transverse air passage 14, the longitudinal air passage 12, and the vertical air passage 13 to ensure stable adsorption of the product. It should be noted that the longitudinal air passage 12 passes through the front and rear ends of the platform 1, and the transverse air passage 14 passes through the left and right ends of the platform 1. The ports of the longitudinal air passage 12 at the front and rear ends of the platform 1 are sealed with plugs 10, and the ports of the transverse air passage 14 at the left and right ends of the platform 1 are also sealed with plugs 10 to ensure the sealing of the longitudinal air passage 12 and the transverse air passage 14 and avoid air leakage.

[0051] like Figures 3-5 As shown, along the height direction of the stage 1 (vertical direction in the figure), both the longitudinal air passage 12 and the transverse air passage 14 are located above the liquid cooling hole 11. This arrangement ensures that the air passages and the liquid cooling hole 11 are at different heights, preventing interference between them.

[0052] like Figure 1 and Figure 6As shown, the solidification liquid cooling device further comprises a material receiving mechanism, which comprises a lifting assembly (not shown in the figure) arranged below the loading platform 1 and a suction rod 4. The loading platform 1 is provided with a through hole 15 in the height direction, and the suction rod 4 is arranged in the through hole 15. The lifting assembly is in transmission connection with the suction rod 4, so as to drive the suction rod 4 to rise to a material receiving position or to fall to a material placing position in the height direction of the loading platform 1. When the suction rod 4 rises to the material receiving position, the top end of the suction rod 4 extends out of the through hole 15 and supports the product. When the suction rod 4 falls to the material placing position, the top end of the suction rod 4 is located in the through hole 15, so as to release the product to the upper surface of the loading platform 1. The lifting assembly drives the suction rod 4 to rise to the material receiving position to support the product to be cooled, and then drives the suction rod 4 to fall to the material placing position, so that the product to be cooled is placed on the upper surface of the loading platform 1. The upper surface of the loading platform 1 is provided with air holes 130 covered by the product, so as to stably place the product on the loading platform 1 through vacuum adsorption.

[0053] Further, the material receiving mechanism further comprises a second vacuum generator, and a gas pipe of the second vacuum generator is connected with the suction rod 4, so that the suction rod 4 can adsorb or release the product. By arranging the second vacuum generator, the suction rod 4 can tightly adsorb the product through vacuum adsorption, so as to avoid shaking or falling of the product on the suction rod 4, and the stability of the material receiving process of the suction rod 4 is improved.

[0054] Specifically, the loading platform 1 is provided with four through holes 15 arranged in a rectangular shape, and the top ends of the four suction rods 4 are respectively provided with suction cups, so as to support and adsorb the product through the four suction cups, and the stability of the product adsorption is improved. The second vacuum generator provides a negative pressure environment to the four suction rods 4 through the air path block. In other embodiments, the number and position of the through holes 15 and the suction rods 4 can be flexibly adjusted according to the material receiving requirement, which is not limited here. Meanwhile, the suction cups are made of rubber material, so as to avoid scratching the surface of the product. When the suction rod 4 rises to the material receiving position, the suction cup extends out of the corresponding through hole 15 and is higher than the upper surface of the loading platform 1. The second vacuum generator is turned on and the suction cup adsorbs the product. When the suction rod 4 falls to the material placing position, the suction cup on the suction rod 4 returns to the initial position and is not higher than the upper surface of the loading platform 1. At this time, the second vacuum generator is turned off and the suction cup releases the product, so as to vacuum adsorb the product through the air holes 130 of the loading platform 1.

[0055] As Figure 6As shown, the lower portion of the carrier 1 is provided with a rack 5, and the lifting assembly is arranged on the rack 5. The receiving mechanism further comprises a bracket 6, the suction rod 4 is installed on the bracket 6, and the output end of the lifting assembly is connected with the bracket 6. One of the bracket 6 and the rack 5 is provided with a sliding block 81, and the other of the bracket 6 and the rack 5 is provided with a sliding rail 82, and the sliding rail 82 and the sliding block 81 are in sliding fit. Through the sliding fit of the sliding rail 82 and the sliding block 81, the stability of the bracket 6 and the suction rod 4 moving between the receiving position and the discharging position is improved. In the embodiment, one sliding block 81 is installed on each of the left and right sides of the bracket 6, and the left and right inner side walls of the rack 5 are correspondingly provided with sliding rails 82, and the sliding blocks 81 and the sliding rails 82 are in one-to-one sliding fit. In other embodiments, one sliding rail 82 is installed on each of the left and right sides of the bracket 6, and the left and right inner side walls of the rack 5 are correspondingly provided with sliding blocks 81.

[0056] The lifting assembly of the embodiment is a motor, a lead screw and a guide block. The motor is installed on the rack 5, the lead screw is installed on the rack 5 in the height direction of the rack 5 and can rotate relative to the rack 5, and the guide block is threadedly sleeved on the lead screw. The guide block is fixedly connected with the bracket 6, so that the guide block, the bracket 6 and the suction rod 4 jointly move up and down along the height direction of the carrier 1.

[0057] Further, as shown in the drawings, Figure 6 The receiving mechanism comprises two sensors 7, which are arranged on the rack 5 in the height direction of the carrier 1 and are in communication connection with the lifting assembly. The bracket 6 is provided with a limiting piece 61 for triggering the sensor 7. The limiting piece 61 is configured to trigger the sensor 7 located above when the suction rod 4 is raised to the receiving position, and to trigger the sensor 7 located below when the suction rod 4 is lowered to the discharging position. By arranging the sensor 7, the limit of the lifting displacement of the bracket 6 in the height direction of the carrier 1 can be accurately detected, so that the bracket 6, the carrier 1 or the rack 5 are prevented from being contacted and collided, and the safety of the solidification liquid cooling device during operation is improved.

[0058] Specifically, the solidification liquid cooling device further comprises a control module, and the two sensors 7 are electrically connected with the control module. When the bracket 6 is lowered to the limit position, the limiting piece 61 on the left side of the bracket 6 can move to the sensor 7 below, the sensor 7 below detects the limiting piece 61 (i.e. the sensor 7 below is triggered) and sends a signal to the control module, and the control module controls the lifting assembly to stop after receiving the signal, so as to avoid the bracket 6 from continuing to lower. Similarly, when the bracket 6 is raised to the limit position, the limiting piece 61 on the left side of the bracket 6 can move to the sensor 7 above, the sensor 7 above detects the limiting piece 61 (i.e. the sensor 7 above is triggered) and sends a signal to the control module, and the control module controls the lifting assembly to stop after receiving the signal, so as to avoid the bracket 6 from continuing to raise. Since the control module is a prior art, the structure and working principle of the control module will not be described here.

[0059] The above embodiments only illustrate the basic principles and characteristics of the present application, and the present application is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present application, and these changes and modifications all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A solidification liquid cooling device characterized by, include: A stage (1) is provided with a plurality of liquid cooling holes (11) spaced apart along the length direction inside the stage (1). The liquid cooling holes (11) extend along the width direction of the stage (1) and penetrate through both ends of the width direction of the stage (1). A plurality of air holes (130) are also provided on the upper surface of the stage (1). The air holes (130) are used for vacuum adsorption of the product to be cooled. A first vacuum generator, wherein the air pipe of the first vacuum generator is connected to a plurality of air holes (130); The connecting pipe (2) connects two adjacent liquid cooling holes (11) at the same side of the width direction of the platform (1) so that multiple liquid cooling holes (11) are connected in series to form a liquid cooling channel. A cold source, wherein the liquid supply pipe (91) of the cold source is connected to the inlet of the liquid cooling channel, and the liquid return pipe (92) of the cold source is connected to the outlet of the liquid cooling channel to supply coolant to the liquid cooling channel.

2. The solidification liquid cooling device according to claim 1, characterized by The curing liquid cooling device also includes: The connector (3) is installed at both ends of the connecting pipe (2); at the same end of the platform (1) along the width direction, the connector (3) abuts against the end face of the platform (1) along the width direction. A sealing element is provided at the same end of the platform (1) along the width direction, between the joint (3) and the end face of the platform (1) corresponding to each other along the width direction.

3. The solidified liquid cooling device of claim 1, wherein, The inlet and outlet of the liquid cooling channel are both located at the same end of the platform (1) along the width direction, so that the liquid delivery pipe (91) and the liquid return pipe (92) are both located at the same end of the platform (1) along the width direction.

4. The solidified liquid cooling device of claim 1, wherein, The curing liquid cooling device further includes a receiving mechanism, which includes: A lifting assembly is disposed below the platform (1); The suction rod (4) is provided with a through hole (15) along the height direction of the platform (1). The suction rod (4) passes through the through hole (15). The lifting assembly is connected to the suction rod (4) so ​​that the suction rod (4) is raised to the receiving position or lowered to the discharging position along the height direction of the platform (1). When the suction rod (4) is raised to the receiving position, the top end of the suction rod (4) extends out of the through hole (15) and receives the product. When the suction rod (4) is lowered to the discharging position, the top end of the suction rod (4) is located in the through hole (15) so as to release the product onto the upper surface of the platform (1).

5. The solidification liquid cooling device of claim 4, wherein, The receiving mechanism also includes a second vacuum generator, the air pipe of which is connected to the suction rod (4) so ​​that the suction rod (4) can adsorb or release the product.

6. The solidification liquid cooling device of claim 4, wherein, A platform (5) is provided below the platform (1), and the lifting assembly is provided on the platform (5); The material receiving mechanism further comprises a support (6), the suction rod (4) is installed on the support (6), and the output end of the lifting assembly is connected with the support (6); one of the support (6) and the rack (5) is provided with a sliding block (81), and the other of the support (6) and the rack (5) is provided with a sliding rail (82), and the sliding rail (82) and the sliding block (81) are in sliding fit.

7. The solidification liquid cooling device of claim 6, wherein, The material receiving mechanism comprises two sensors (7), and the two sensors (7) are arranged at intervals along the height direction of the carrier table (1) on the rack (5) and are in communication connection with the lifting assembly. The support (6) is provided with a limiting piece (61) for triggering the sensor (7), the limiting piece (61) is configured to trigger the sensor (7) located above when the suction rod (4) is raised to the material receiving position, and trigger the sensor (7) located below when the suction rod (4) is lowered to the material placing position.

8. The solidification liquid cooling device according to any one of claims 1 to 7, characterized by A plurality of longitudinal air channels (12) are arranged at intervals in the length direction in the carrier table (1), and the longitudinal air channels (12) extend along the width direction of the carrier table (1). A plurality of vertical air channels (13) are further arranged in the carrier table (1), and each longitudinal air channel (12) is provided with a plurality of vertical air channels (13) in communication, and the vertical air channels (13) penetrate through the upper surface of the carrier table (1) and form the air holes (130).

9. The solidification liquid cooling device of claim 8, wherein, A transverse air channel (14) is arranged in the width direction in the carrier table (1), the transverse air channel (14) extends along the length direction of the carrier table (1) and is in communication with each longitudinal air channel (12), and the air pipe of the first vacuum generator is connected with the transverse air channel (14).

10. The solidification liquid cooling device of claim 9, wherein, Along the height direction of the carrier table (1), the longitudinal air channel (12) and the transverse air channel (14) are located above the liquid cooling hole (11).

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