Vacuum defoaming and packaging device of FOPLP based on temperature rise

Abstract

The utility model relates to the technical field of vacuum packaging and defoaming, and particularly discloses a FOPLP vacuum defoaming and packaging device based on temperature rise, which comprises a storage box frame, a heating placement layer is fixedly mounted on the outer surface of the storage box frame, a vacuum pump is fixedly mounted in the storage box frame, and the heating placement layer is fixedly mounted on the outer surface of the storage box frame. And a storage box is fixedly mounted in the storage box frame. According to the FOPLP vacuum defoaming and packaging device based on temperature rise, liquid stored in the storage box can be heated through the temperature limiting heating rod assembly, so that the liquid in the storage box can be heated to the required proper temperature; and then, the liquid heated by the storage box can circulate in the heating placement layer through starting of the pump body, so that the heating placement layer can be uniformly heated by the liquid, a packaged packaging material can be uniformly heated during subsequent packaging of a to-be-packaged chip, bubbles in the packaging material can be discharged, and the packaging efficiency of the to-be-packaged chip is improved. Therefore, the packaging effect and quality are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to vacuum packaging bubble removal technical field, concretely is a kind of vacuum bubble removal packaging device of FOPLP based on temperature promotion. BACKGROUND

[0002] With the development of electronic equipment constantly towards miniaturization, high performance, chip to packaging technology is proposed higher requirement, flip chip packaging as a commonly used chip packaging technology, in improving chip performance, reduce packaging size etc. It has significant advantages, and with the rapid development of semiconductor industry, FOPLP technology is favored because it can realize higher integration, smaller size packaging, but in FOPLP packaging process, bubble problem seriously affects product quality and performance, traditional packaging mode is difficult to effectively solve, the existing packaging device has limitation in bubble removal link, will lead to bubble removal not completely, not only will produce waste because of bubble, and still lead to the increase of chip packaging scrap rate. UTILITY MODEL CONTENT

[0003] The utility model aims at providing a kind of vacuum bubble removal packaging device of FOPLP based on temperature promotion to solve the problem of slow and incomplete chip packaging bubble removal in the above background technology.

[0004] To achieve the above object, the utility model provides the following technical scheme: a kind of vacuum bubble removal packaging device of FOPLP based on temperature promotion, including storage box frame, the outer surface of the storage box frame is fixedly installed with heating placement layer, and disc-shaped channel is provided in the inside of heating placement layer, the inside of the storage box frame is fixedly installed with vacuum pump, and the pipeline of vacuum pump penetrates the outer surface of heating placement layer, the inside of the storage box frame is fixedly installed with storage tank, and the side of storage tank is equipped with injection inlet, pump circulation mechanism is arranged between the storage tank and heating placement layer, and the heated heat storage medium can be circulated in the inside of heating placement layer by pump circulation mechanism.

[0005] Preferably, the pump circulation mechanism comprises: a pump body fixedly installed on one side of the storage tank, a temperature limiting heating rod assembly is screw-mounted in the inside of the storage tank, the outer surface of the temperature limiting heating rod assembly is tightly attached to the outer surface of the storage tank, one end of the heating placement layer is connected to the storage tank, and one end of the pump body is connected to the heating placement layer.

[0006] The above technical scheme can heat the heat storage medium in the storage tank by starting the temperature limiting heating rod assembly, and the heat storage medium stored in the storage tank can be uniformly heated in the inside of the heating placement layer by starting the pump body, so that the packaging material can be heated more uniformly during chip packaging, the viscosity of the chip packaging material is reduced, and the bubble removal efficiency and speed of the packaging material are improved.

[0007] Preferably, the outer surface of the storage box frame is uniformly fixedly installed with jacking and retracting cylinders arranged in a triangular shape, the output end of the jacking and retracting cylinders is fixedly installed with a shielding box cover, and the outer surface of the sealing gasket is fixedly installed on the outer surface of the heating and placing layer and tightly abuts against the outer surface of the shielding box cover.

[0008] By arranging the jacking and retracting cylinders in a triangular shape, the jacking and retracting cylinders can synchronously push the shielding box cover during use, the shielding box cover can stably move up and down, the encapsulation and heat conduction platform can be conveniently placed on the outer surface of the heating and placing layer, the gap between the shielding box cover and the storage box frame is eliminated by the sealing gasket, and the gas cannot enter the inside of the shielding box cover through the gap during vacuumizing, so that the encapsulation and heat conduction platform can be conveniently taken out for encapsulation while ensuring that the gas cannot leak during vacuumizing.

[0009] Preferably, the outer surface of the shielding box cover is fixedly installed with a transparent observation cover designed in an L shape, the transparent observation cover tightly abuts against the shielding box cover, and the outer surface of one side of the shielding box cover is fixedly installed with a control module, and the other end of the control module is fixedly installed in the inside of the storage box frame.

[0010] By arranging the transparent observation cover, the vacuum defoaming effect of the chip encapsulation during vacuumizing can be directly observed, and the L-shaped design of the transparent observation cover can make the observation surface larger and the observation more convenient.

[0011] Preferably, the outer surface of the storage box frame near the vacuum pump is slidably connected with a filter screen, one end of the vacuum pump is connected with the outer surface of the storage box frame, the outer surface of the pipeline between the vacuum pump and the heating and placing layer is fixedly installed with a two-way air path electromagnetic valve, one end of the two-way air path electromagnetic valve is a gas discharge port, one end of the two-way air path electromagnetic valve is connected with the storage box frame, and the filter screen on the side surface of the storage box frame is connected with one end of the two-way air path electromagnetic valve.

[0012] By arranging the filter screen, a small amount of dust particles carried in the air during the use of the vacuum pump and the two-way air path electromagnetic valve can be filtered and removed, so as to reduce the influence of the dust in the air on the chip encapsulation.

[0013] Preferably, the outer surface of the shielding box cover is fixedly installed with an air pressure gauge, the outer surface of one side of the air pressure gauge is threadedly installed with an air pressure detection probe, and the other end of the air pressure detection probe is located in the inside of the shielding box cover.

[0014] The above technical scheme can realize real-time viewing and knowing of the air pressure in the heating placement layer and the inside of the shielding box cover, and can realize real-time measurement of the air pressure value by the air pressure detection probe, so that the air pressure between the heating placement layer and the shielding box cover can be automatically stopped when reaching the set value, different kinds of chip packaging materials can be used, and the vacuum pressure of air extraction can be flexibly adjusted.

[0015] Preferably, the outer surface of the heating placement layer is uniformly rotatably provided with a clamping plate, and the clamping plate is in sliding connection with the heating placement layer.

[0016] The above technical scheme can realize real-time viewing and knowing of the air pressure in the heating placement layer and the inside of the shielding box cover, and can realize real-time measurement of the air pressure value by the air pressure detection probe, so that the air pressure between the heating placement layer and the shielding box cover can be automatically stopped when reaching the set value, different kinds of chip packaging materials can be used, and the vacuum pressure of air extraction can be flexibly adjusted.

[0017] Compared with the prior art, the vacuum bubble removal packaging device for FOPLP based on temperature improvement has the advantages that:

[0018] 1. The liquid stored in the storage tank can be heated by the temperature limiting heating rod assembly, so that the liquid in the storage tank can be heated to the required appropriate temperature, and then the heated liquid in the storage tank can be circulated in the heating placement layer by starting the pump body, so that the heating placement layer can be uniformly heated by the liquid, and the subsequent packaging material for packaging the chip can be uniformly heated, so that the air bubbles in the packaging material can be discharged, thereby improving the effect and quality of packaging;

[0019] 2. The triangular design of the jacking and retracting air cylinder can make the jacking and retracting air cylinder more stable when jacking and retracting the shielding box cover, and can conveniently put and take out the packaging and heat platform with the chip in the packaging device, and after the packaging and heat platform is placed above the heating placement layer, the clamping plate can be fixed, so that the effect of packaging will not be affected by the movement and vibration of the packaging and heat platform during the vacuum extraction process.

[0020] 3. Through the control module, the time, pressure and value of vacuumizing can be adjusted, so that the vacuum pump can start and extract the gas in the bubble removing and packaging device, the gas pressure value in the device can be directly observed through the pressure gauge, and the gas pressure value can be monitored in real time according to the gas pressure detection probe, so as to ensure the stability and efficient operation of the packaging device during the whole packaging process, and the bubble removing effect is greatly improved through the cooperation of temperature and vacuum, and the packaging yield is significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a three-dimensional structure schematic view of the storage box frame and the heating placement layer of the utility model;

[0022] Figure 2 It is a three-dimensional structure schematic view of the storage box frame and the jacking and retracting cylinder of the utility model;

[0023] Figure 3 It is a three-dimensional structure schematic view of the clamp plate and the spring explosion of the utility model;

[0024] Figure 4 It is a three-dimensional structure schematic view of the shielding box cover and the transparent observation cover of the utility model;

[0025] Figure 5 It is a three-dimensional structure schematic view of the storage box and the vacuum pump of the utility model;

[0026] Figure 6 It is a three-dimensional structure schematic view of the storage box and the temperature-limiting heating rod assembly of the utility model.

[0027] In the figure: 1, storage box frame; 2, heating placement layer; 3, sealing gasket; 4, jacking and retracting cylinder; 5, shielding box cover; 6, storage box; 7, temperature-limiting heating rod assembly; 8, pump body; 9, vacuum pump; 10, two-way air path electromagnetic valve; 11, control module; 12, transparent observation cover; 13, pressure gauge; 14, gas pressure detection probe; 15, filter screen; 16, clamp plate; 17, spring; 18, packaging heat-conducting platform. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0029] Please refer to Figures 1-6The utility model provides a technical scheme: a vacuum bubble removal packaging device of FOPLP based on temperature promotion, including depositing box frame 1, the outer surface fixed mounting of depositing box frame 1 has heating and placing layer 2, and the inside of heating and placing layer 2 is provided with disc-shaped channel, the inside fixed mounting of depositing box frame 1 has vacuum pump 9, and the pipeline of vacuum pump 9 penetrates the outer surface of heating and placing layer 2, the inside fixed mounting of depositing box frame 1 has storage box 6, and the one side of storage box 6 is equipped with injection inlet, and the pump dynamic circulation mechanism is set up between storage box 6 and heating and placing layer 2, and the heat storage medium after heating can be circulated in the inside of heating and placing layer 2 through the pump dynamic circulation mechanism.

[0030] Through storage box 6 can store heat storage medium, and can be filled and replaced to heat storage medium through injection inlet, simultaneously, the heat medium in the inside of storage box 6 can be extracted and is sent to the inside of heating and placing layer 2 and moves through pump body 8, makes the heat medium move in the coil in the inside of heating and placing layer 2, makes heating and placing layer 2 can be heated evenly, to more evenly heat the chip placed in the inside of device, makes the packaging material in the chip during packaging can be heated more evenly, makes bubble more easily be heated and be discharged from the packaging material of packaging, improves the quality and effect when the chip is packaged.

[0031] The pump dynamic circulation mechanism comprises: a pump body 8, the pump body 8 is fixedly installed on one side of the outer surface of the storage box 6, and a temperature limiting heating rod assembly 7 is screw-mounted in the inside of the storage box 6, and the outer surface of the temperature limiting heating rod assembly 7 is tightly attached to the outer surface of the storage box 6, one end of the heating and placing layer 2 is connected to the storage box 6, and one end of the pump body 8 is connected to the heating and placing layer 2.

[0032] The heat storage medium in the storage box 6 can be heated by starting the temperature limiting heating rod assembly 7, and then the heat storage medium in the storage box 6 is circulated and flows in the heating and placing layer 2 by starting the pump body 8 to realize uniform heating, so that the chip is heated more uniformly during the packaging process.

[0033] The outer surface of the depositing box frame 1 is uniformly fixedly installed with jacking contraction air cylinders 4, and the jacking contraction air cylinders 4 are arranged in a triangular shape, an output end of each jacking contraction air cylinder 4 is fixedly installed with a shielding box cover 5, and the outer surface of the sealing gasket 3 is tightly attached to the outer surface of the shielding box cover 5.

[0034] The lifting and contracting cylinders 4 are arranged in a triangular shape, so that the shielding box cover 5 can be pushed synchronously when in use, ensuring that the shielding box cover 5 moves stably up and down, facilitating the placement of the packaging heat conduction platform 18 on the outer surface of the heating placement layer 2 or the removal of the packaging heat conduction platform 18 from the heating placement layer 2. In addition, the sealing gasket 3 arranged between the shielding box cover 5 and the storage box frame 1 can eliminate the gap between the two, effectively prevent gas from entering the inside of the shielding box cover 5 from the gap during vacuumizing, facilitate the taking and placing of the packaging heat conduction platform 18, ensure that there is no gas leakage during the vacuumizing process, and improve the convenience in use.

[0035] The outer surface of the shielding box cover 5 is fixedly installed with a transparent observation cover 12, and the transparent observation cover 12 is designed in an L shape. The transparent observation cover 12 is tightly attached to the shielding box cover 5. The outer surface of one side of the shielding box cover 5 is fixedly installed with a control module 11, and the other end of the control module 11 is fixedly installed in the inside of the storage box frame 1.

[0036] The design of the transparent observation cover 12 allows the operator to directly observe the vacuum defoaming condition of the chip packaging inside the shielding box cover 5 during vacuumizing. At the same time, the L-shaped structure of the transparent observation cover 12 effectively expands the observation surface, greatly improving the convenience of observation, and facilitating the timely grasp of the packaging process and effect.

[0037] The outer surface of the storage box frame 1 near the vacuum pump 9 is slidingly inserted with a filter screen 15. One end of the vacuum pump 9 is connected to the outer surface of the storage box frame 1. The outer surface of the pipeline between the vacuum pump 9 and the heating placement layer 2 is fixedly installed with a two-way air path electromagnetic valve 10. One end of the two-way air path electromagnetic valve 10 is a gas discharge port. One end of the two-way air path electromagnetic valve 10 is connected to the storage box frame 1. The filter screen 15 on the side surface of the storage box frame 1 is connected to one end of the two-way air path electromagnetic valve 10.

[0038] The setting of the filter screen 15 can effectively intercept and filter the fine dust, particles and dust carried in the air when the vacuum pump 9 and the two-way air path electromagnetic valve 10 are operated for pumping and air release. By setting this protective barrier of the filter screen 15, the amount of free dust in the clean room can be greatly reduced, so as to reduce the adverse effects of dust on the chip packaging process, effectively ensure the cleanliness of the packaging environment, and improve the quality of chip packaging.

[0039] The outer surface of the shielding box cover 5 is fixedly installed with an air pressure gauge 13. The outer surface of one side of the air pressure gauge 13 is threadedly installed with an air pressure detection probe 14. The other end of the air pressure detection probe 14 is located in the inside of the shielding box cover 5.

[0040] The air pressure gauge 13 and the air pressure detection probe 14 can work cooperatively to provide accurate air pressure monitoring guarantee for the chip packaging process, the air pressure data inside the heating placement layer 2 and the shielding box cover 5 are collected in real time through the air pressure detection probe 14, and the air pressure is displayed in real time through the air pressure gauge 13, so that the operator can intuitively obtain the current air pressure value, when the internal air pressure reaches the pre-set threshold value, the control module 11 will automatically trigger the instruction to make the pump body 8 stop running, and ensure that the cavity air pressure is stable in the target range. The control of the control module 11 breaks the limitation of the packaging material, and can flexibly adapt to high-end chip packaging materials with strict vacuum degree requirements and conventional packaging materials, and the air pressure parameters are freely set to realize fine adjustment of the vacuum pressure, and effectively improve the compatibility of the equipment and the universality of the packaging process.

[0041] The outer surface of the heating placement layer 2 is uniformly rotatably provided with a clamping plate 16, and the clamping plate 16 is in sliding connection with the heating placement layer 2. The outer surface of the heating placement layer 2 is provided with a bolt, and a spring 17 is arranged between the heating placement layer 2, the clamping plate 16 and the bolt. The outer surface of the heating placement layer 2 is placed with a packaging heat conduction platform 18, and the outer surface of the packaging heat conduction platform 18 is in close contact with the outer surface of the heating placement layer 2. The outer surface of the packaging heat conduction platform 18 is in close contact with the outer surface of the clamping plate 16.

[0042] The spring 17 and the clamping plate 16 form an elastic clamping structure, which provides a stable and reliable fixing scheme for the packaging heat conduction platform 18. After the packaging heat conduction platform 18 is placed on the outer surface of the heating placement layer 2, the spring 17 can push the clamping plate 16 by its own elastic force to fix the packaging heat conduction platform 18 placed on the heating placement layer 2. This design effectively offsets the external force influence such as air flow impact and vibration that may be generated during the vacuumizing process, ensures that the packaging heat conduction platform 18 always maintains accurate positioning, avoids the interference of position deviation with the vacuum packaging process of the chip, and provides strong support for the high precision and stability of the chip packaging.

[0043] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A vacuum degassing and encapsulation device for FOPLP based on temperature rise, comprising a storage rack (1), wherein a heating placement layer (2) is fixedly installed on the outer surface of the storage rack (1), and a disc-shaped channel is provided inside the heating placement layer (2), wherein a vacuum pump (9) is fixedly installed inside the storage rack (1), and the pipe of the vacuum pump (9) penetrates through the outer surface of the heating placement layer (2), characterized in that: The inside of the storage box frame (1) is fixedly provided with a storage box (6), one side of the storage box (6) is provided with an injection port, and the storage box (6) and the heating placement layer (2) are provided with a pump circulating mechanism.

2. The vacuum debubbling packaging device based on temperature-boosted FOPLP according to claim 1, wherein: The pump circulating mechanism comprises a pump body (8) fixedly installed on one side of the outer surface of the storage box (6), and a temperature limiting heating rod assembly (7) is screwedly installed in the inside of the storage box (6), and the outer surface of the temperature limiting heating rod assembly (7) is tightly combined with the outer surface of the storage box (6), one end of the heating placement layer (2) is connected with the storage box (6), and one end of the pump body (8) is connected with the heating placement layer (2).

3. The vacuum debubbling packaging device based on temperature-boosted FOPLP of claim 1, wherein: The outer surface of the storage box frame (1) is uniformly fixedly provided with jacking contraction air cylinders (4), the jacking contraction air cylinders (4) are arranged in a triangular shape, the output end of the jacking contraction air cylinders (4) is fixedly provided with a shielding box cover (5), the outer surface of the heating placement layer (2) is fixedly provided with a sealing gasket (3), and the outer surface of the sealing gasket (3) is tightly combined with the outer surface of the shielding box cover (5).

4. The vacuum debubbling packaging device based on temperature-boosted FOPLP of claim 3, wherein: The outer surface of the shielding box cover (5) is fixedly provided with a transparent observation cover (12), the transparent observation cover (12) is designed in an L shape, the transparent observation cover (12) is tightly combined with the shielding box cover (5), one side of the outer surface of the shielding box cover (5) is fixedly provided with a control module (11), and the other end of the control module (11) is fixedly installed in the inside of the storage box frame (1).

5. The vacuum debubbling package device of FOPLP based on temperature boost according to claim 1, wherein: The outer surface of the storage box frame (1) is slidably connected with a filter screen (15) near the vacuum pump (9), one end of the vacuum pump (9) is connected with the outer surface of the storage box frame (1), the outer surface of the pipeline between the vacuum pump (9) and the heating placement layer (2) is fixedly provided with a two-way air path electromagnetic valve (10), one end of the two-way air path electromagnetic valve (10) is a gas discharge port, one end of the two-way air path electromagnetic valve (10) is connected with the storage box frame (1), and the filter screen (15) on the side surface of the storage box frame (1) is connected with one end of the two-way air path electromagnetic valve (10).

6. The vacuum debubbling package device of FOPLP based on temperature boost according to claim 3, characterized in that: The outer surface of the shielding box cover (5) is fixedly provided with an air pressure gauge (13), one side of the outer surface of the air pressure gauge (13) is screwedly provided with an air pressure detection probe (14), and the other end of the air pressure detection probe (14) is located in the inside of the shielding box cover (5).

7. The vacuum debubbling package device of FOPLP based on temperature boost according to claim 1, wherein: The outer surface of the heating placement layer (2) is uniformly rotatably provided with a clamping plate (16), the clamping plate (16) is slidably connected with the heating placement layer (2), the outer surface of the heating placement layer (2) is provided with a bolt, springs (17) are arranged between the heating placement layer (2), the clamping plate (16) and the bolt, the outer surface of the heating placement layer (2) is provided with an encapsulated heat conduction platform (18), the outer surface of the encapsulated heat conduction platform (18) is combined with the outer surface of the heating placement layer (2), and the outer surface of the encapsulated heat conduction platform (18) is combined with the outer surface of the clamping plate (16).

Images