Packaging unit convenient for heat dissipation and packaging structure

Abstract

The utility model belongs to the technical field of semiconductor packaging, and provides a packaging unit and a packaging structure convenient for heat dissipation. The packaging unit facilitating heat dissipation comprises a unit frame, a chip and a packaging body, the unit frame comprises a base island, the base island is provided with a working face and a heat dissipation face which are oppositely arranged, and the two side walls in the width direction of the base island extend outwards in the extending direction from the working face to the heat dissipation face; the chip is arranged on the working surface; the packaging body is used for wrapping the unit frame and the chip, and the heat dissipation surface is exposed out of the packaging body. According to the utility model, the heat dissipation efficiency of the packaging unit is improved, the temperature rise of the device is reduced, and the power density and the working efficiency of the device are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor packaging, especially to a packaging unit convenient for heat dissipation and a packaging structure. BACKGROUND

[0002] In the electronic packaging industry, the heat dissipation performance of devices is crucial to their reliability and overall system performance. With the continuous increase in power density of electronic devices, the heat dissipation problem becomes increasingly significant. Traditional electronic packaging technologies are mainly divided into plug-in type and surface mount type (patch). However, both of these technologies have deficiencies in heat dissipation efficiency and space utilization.

[0003] Specifically, although plug-in type packaging can withstand high power dissipation, its heat dissipation structure needs to be separated from the printed circuit board (PCB), often requiring additional installation of a heat sink or heat sink. This design not only occupies more space and increases system cost, but also makes it difficult to meet the urgent demand for miniaturization and high integration of modern electronic devices.

[0004] On the other hand, surface mount type (patch) packaging performs better in space utilization, but its heat dissipation path needs to be conducted through the PCB to the heat sink. Since the thermal conductivity of the PCB is relatively poor, this limits the power dissipation capacity of the entire system, which usually relies on the bottom for heat dissipation, with low efficiency and difficulty in meeting the heat dissipation requirements of high-power electronic devices.

[0005] Therefore, a new solution is needed to solve the above technical problems. SUMMARY

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a packaging unit and packaging structure convenient for heat dissipation, which solves the problem of low heat dissipation efficiency of the packaging structure in the prior art.

[0007] To achieve the above-mentioned purposes and other related purposes, the utility model provides a packaging unit convenient for heat dissipation, which is specifically configured as follows: a unit frame, a chip and a packaging body, the unit frame includes a base island, the base island has oppositely arranged working surfaces and heat dissipation surfaces, and the two side walls of the base island in the width direction extend outward along the extension direction of the working surface to the heat dissipation surface; the chip is arranged on the working surface; the packaging body is used to cover the unit frame and the chip, and the heat dissipation surface is exposed to the packaging body.

[0008] Optionally, the unit frame further comprises a first pin and a second pin oppositely arranged on both sides of the base island width direction and exposed to the package body, the first pin is connected with the base island as a whole; the second pin is arranged spaced apart from the base island, and the side of the second pin close to the base island is arranged in a position offset from the base island in a direction perpendicular to the plane of the unit frame.

[0009] Optionally, the first pin is provided with two, and the two first pins are arranged away from each other along the length direction of the base island; the second pin is provided with a plurality of, and the plurality of second pins are arranged side by side and spaced apart along the width direction of the base island.

[0010] Optionally, the first pin is provided with a first locking hole at the joint with the base island, and the second pin is provided with a second locking hole at the side close to the base island.

[0011] Optionally, a welding groove is arranged on the working surface where the chip is welded, and a glue overflow groove is arranged on the working surface in the circumferential direction of the chip.

[0012] Optionally, a limiting groove is further arranged on the working surface, the limiting groove is located outside the glue overflow groove; a first step is arranged on the heat dissipation surface, one or more than one convex edges are arranged on the side wall of the first step connected with the working surface, the two or more than two convex edges are arranged spaced apart, and the package body covers the first step and the convex edge.

[0013] Optionally, the package body has two oppositely arranged pressure welding grooves, and the pressure welding grooves are located on the side close to the second pin.

[0014] Optionally, the pressure welding groove is arranged on the side of the package body away from the heat dissipation surface, and the pressure welding groove is arranged in a conical structure which expands outward in a direction away from the heat dissipation surface.

[0015] Optionally, one or more than one glue feeding port is arranged on the side of the package body away from the heat dissipation surface.

[0016] The utility model further provides a packaging structure, including lead frame, and the lead frame is provided with a plurality of frame units, and each frame unit is provided with a plurality of packaging units.

[0017] As described above, the packaging unit and the packaging structure provided by the utility model have the following beneficial effects:

[0018] The working surface is used for mounting the chip, and the heat dissipation surface is exposed to the package when the package covering unit frame and the chip are covered, so that the heat generated by the chip during operation can be dissipated through the heat dissipation surface, which is beneficial to improve the heat dissipation efficiency of the packaging unit. Furthermore, the two side walls in the width direction of the base island extend outward along the extension direction of the working surface to the heat dissipation surface, so as to increase the area of the heat dissipation surface, which is beneficial to further improve the heat dissipation efficiency of the packaging unit, reduce the temperature rise of the device, and improve the power density and working efficiency of the device. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 A first perspective structural schematic view of the packaging unit convenient for heat dissipation according to an embodiment of the present application is shown.

[0020] Figure 2 A second perspective structural schematic view of the packaging unit convenient for heat dissipation according to an embodiment of the present application is shown.

[0021] Figure 3 A partial structural schematic view of Figure 1 is shown.

[0022] Figure 4 A structural schematic view of another perspective of Figure 3 is shown.

[0023] Figure 5 A structural schematic view of the packaging structure according to an embodiment of the present application is shown.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1-chip;

[0026] 2-package; 21-top glue port; 22-pressure welding groove;

[0027] 3-base island; 31-working surface; 32-heat dissipation surface; 33-glue overflow groove; 34-limiting groove; 35-first step; 36-convex edge;

[0028] 4-first pin; 41-first glue locking hole; 42-cutting rib port;

[0029] 5-second pin; 51-second glue locking hole;

[0030] 6-lead frame. DETAILED DESCRIPTION

[0031] The following describes the embodiments of the present application through specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the disclosure. The present application can also be implemented or applied through different specific embodiments, and the details in the specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present application.

[0032] It should be noted that the diagrams provided in the embodiments only illustrate the basic concept of the present application in a schematic manner, and only show the components related to the present application in the diagrams, not the number, shape and size of the components in actual implementation. The shape, number and proportion of each component in actual implementation can be changed at will, and the component layout form can also be more complex. The structure, proportion, size, etc. shown in the diagrams attached to the specification are only used to understand and read the content disclosed in the specification by those skilled in the art, and are not used to limit the implementation conditions of the present application. Therefore, any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" in the specification are only for the convenience of clear description, and are not used to limit the scope of the present application. The change or adjustment of the relative relationship, without substantially changing the technical content, is also considered as the scope of the present application.

[0033] As shown in Figures 1 to 4 Some embodiments of the present application provide a packaging unit facilitating heat dissipation, which comprises a unit frame, a chip 1 and a packaging body 2. The unit frame comprises a base island 3 having an oppositely arranged working surface 31 and heat dissipation surface 32. The chip 1 can be mounted on the working surface 31 by solder or the like. When the packaging body 2 covers the unit frame and the chip 1, the heat dissipation surface 32 is exposed to the packaging body 2. The heat generated by the chip 1 is transmitted to the heat dissipation surface 32 through the base island 3, and then dissipated through the heat dissipation surface 32, which is beneficial to improve the heat dissipation efficiency of the packaging unit of the present application. In addition, the two side walls of the base island 3 in the width direction extend outward along the extension direction of the working surface 31 to the heat dissipation surface 32, thereby increasing the area of the heat dissipation surface 32, which is further beneficial to improve the heat dissipation efficiency of the packaging unit, reduce the temperature rise of the device, and improve the power density and working efficiency of the device.

[0034] For example, the heat dissipation surface 32 is flush with the surface of the packaging body 2.

[0035] In some embodiments, the working surface 31 of the base island 3 is provided with a welding groove corresponding to the chip 1, which can enhance the uniformity of the solder filling, and the groove structure increases the contact area between the solder and the base island 3, improves the wettability of the solder, and ensures a more secure welding interface.

[0036] For example, the welding groove includes but is not limited to a cross-shaped groove and the like.

[0037] In some embodiments, in order to improve the reliability and stability of the package, the working surface 31 of the base island 3 is provided with a glue overflow groove 33 along the circumference of the chip 1, so that the glue overflowed during the installation of the chip 1 can flow into the glue overflow groove 33.

[0038] For example, the glue overflow groove 33 includes but is not limited to a U-shaped groove and the like.

[0039] In some embodiments, in order to improve the stability of the connection between the unit frame and the package 2, the working surface 31 of the base island 3 is further provided with a limiting groove 34 located outside the glue overflow groove 33.

[0040] For example, the cross section of the limiting groove 34 in the length direction can be provided as a dovetail groove and a U-shaped groove structure connected in communication, so as to improve the stability of the connection between the unit frame and the package 2. The limiting groove 34 can be provided on both sides of the base island 3 in the width direction, or on both sides of the base island 3 in the length direction, or on both sides of the base island 3 in the width and length directions.

[0041] In some embodiments, in order to improve the stability of the connection between the unit frame and the package 2, the heat dissipation surface 32 of the base island 3 is provided with a first step 35, and the sidewall of the first step 35 connected with the working surface 31 of the base island 3 is provided with one or more than one convex edge 36. When the convex edge 36 has two or more than two, the adjacent two convex edges 36 are spaced apart. The specific number of convex edges 36 is adaptively set according to actual needs. When the package 2 covers the base island 3, the package 2 covers the first step 35 and the convex edge 36.

[0042] For example, the first step 35 can be connected with the convex edge 36, or can be spaced apart from the convex edge 36, and the convex edge 36 protrudes from the circumferential sidewall of the base island 3.

[0043] In some embodiments, the unit frame further comprises a first pin 4 and a second pin 5, the first pin 4 and the second pin 5 are oppositely arranged and respectively located at both sides of the base island 3 in the width direction of the base island 3, and the first pin 4 and the second pin 5 are partially exposed on the package 2. The first pin 4 is connected with the base island 3 as a whole. The second pin 5 is arranged in a spaced manner with the base island 3, and the side of the second pin 5 close to the base island 3 is arranged in a staggered manner with the base island 3 in a direction perpendicular to the plane of the unit frame, which can reduce the thermal coupling between the base island 3 and the pin, avoid heat concentration in a certain area, cause local overheating, and also be beneficial to improve the overall heat dissipation efficiency.

[0044] In an example, the first pin 4 is provided with two, the two first pins 4 extend along the length direction of the base island 3, and the extending directions of the two first pins 4 are opposite. The second pin 5 is provided with a plurality of, the plurality of second pins 5 are arranged side by side and extend along the width direction of the base island 3, and the adjacent two second pins 5 are arranged in a spaced manner.

[0045] For example, the second pin 5 can be provided with 7, and the combination form of the 7 pins can be 1+1+5, 1+6, etc. When the combination form of the pins is 1+1+5, one gate, one driving pole, and five source pins are connected to form a Kelvin drive, which is beneficial to reduce the driving loss and improve the driving efficiency. When the combination form of the pins is 1+6, one gate is connected with six source poles.

[0046] In an example, the first pin 4 is provided with a cutout 42, which is beneficial to release stress when the package unit is cut.

[0047] In some embodiments, in order to make the plastic sealing material of the package 2 more evenly fill the cavity, and avoid the overflow of the excess plastic sealing material to the pin, the first pin 4 is provided with a first glue locking hole 41 at the joint with the base island 3, and the side of the second pin 5 close to the base island 3 is provided with a second glue locking hole 51. For example, the second glue locking hole 51 is provided with two, which are respectively arranged on both sides of the second pin 5.

[0048] In some embodiments, in order to ensure the uniform filling and effective injection of the plastic sealing material into the cavity, the side of the package 2 away from the heat dissipation surface 32 is provided with more than one glue top hole 21. At the same time, the glue top hole 21 can also be used as a fulcrum when the package 2 is pushed out of the cavity. The number of glue top holes 21 can be 1, 2, 3, 4, etc., which can be adaptively set according to actual needs.

[0049] In this embodiment, the number of glue top holes 21 is 3, and the three glue top holes 21 are respectively located at the three vertices of the triangle.

[0050] In some embodiments, in order to facilitate the connection between the electrodes of the chip 1 in the package 2 and the external pins or other circuits by the soldering technology, the package 2 is provided with the press-welding grooves 22. The press-welding grooves 22 are provided with two and oppositely arranged on the two sides of the package 2. Specifically, the two press-welding grooves 22 are arranged on the two sides of the length direction of the base island 3 and located on the side close to the second pin 5.

[0051] For example, the press-welding grooves 22 are arranged on the side of the package 2 away from the heat dissipation surface 32, and the press-welding grooves 22 are provided with a conical structure which expands outwardly along the direction away from the heat dissipation surface 32, so that the operator can press the bottom of the press-welding groove 22 by using the tool.

[0052] In summary, the package unit provided by the utility model is convenient for heat dissipation, the working surface is arranged on the base island, the working surface is used for mounting the chip, when the package covers the unit frame and the chip, the heat dissipation surface is exposed to the package, so that the heat generated by the chip during work can be dissipated through the heat dissipation surface, which is favorable for improving the heat dissipation efficiency of the package unit; furthermore, the two side walls in the width direction of the base island expand outwardly along the extension direction of the working surface to the heat dissipation surface, so as to increase the area of the heat dissipation surface, which is favorable for further improving the heat dissipation efficiency of the package unit, reducing the temperature rise of the device, improving the power density and working efficiency of the device.

[0053] As shown in the figure, Figure 5 Some embodiments of the utility model also provide a package structure, which comprises a lead frame 6 and the package unit convenient for heat dissipation arranged on the lead frame 6. The lead frame 6 is provided with a plurality of frame units, and each frame unit is provided with a plurality of package units.

[0054] In the embodiment, the lead frame 6 is divided into 20 frame units, each frame unit is provided with 2 rows and 10 columns of package units, and a pre-cutting channel is arranged between the adjacent two frame units.

[0055] For example, the material of the lead frame 6 includes but is not limited to KFC copper alloy.

[0056] The above-mentioned embodiments only exemplarily illustrate the principle and effect of the utility model, and are not used for limiting the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.

Claims

1. A package unit facilitating heat dissipation, characterized by, The application relates to a heat-dissipating package unit. The unit frame comprises a base island with oppositely arranged working and heat-dissipating surfaces, and two side walls of the base island extending outward along the extending direction of the working surface to the heat-dissipating surface; A chip is arranged on the working surface; A package body is arranged to cover the unit frame and the chip, and the heat-dissipating surface is exposed to the package body.

2. The package unit of claim 1, wherein: The unit frame further comprises a first pin and a second pin arranged oppositely on both sides of the base island in the width direction and exposed to the package body, the first pin is connected to the base island integrally; the second pin is arranged spacedly from the base island, and the side of the second pin close to the base island is arranged in a staggered mode along the direction perpendicular to the plane of the unit frame.

3. The package unit of claim 2, wherein: The first pin is arranged in two, and the two first pins are arranged away from each other along the length direction of the base island; the second pin is arranged in multiple, and the multiple second pins are arranged side by side and spacedly along the width direction of the base island.

4. The package unit of claim 2, wherein: The first pin is arranged with a first glue locking hole at the joint with the base island, and the side of the second pin close to the base island is arranged with a second glue locking hole.

5. The package unit of any one of claims 1-4, wherein: The working surface is arranged with a welding groove at the position where the chip is welded, and the working surface is arranged with a glue overflow groove along the circumferential direction of the chip.

6. The package unit of claim 5, wherein: The working surface is further arranged with a limiting groove, and the limiting groove is located outside the glue overflow groove; the heat-dissipating surface is arranged with a first step, and the side wall of the first step connecting with the working surface is arranged with more than one convex edge, and the more than two convex edges are arranged spacedly, and the package body covers the first step and the convex edge.

7. The package unit of any one of claims 2-4, wherein: The package body is arranged with two oppositely arranged pressure welding grooves on the side close to the second pin.

8. The package unit of claim 7, wherein: The pressure welding groove is arranged on the side of the package body away from the heat-dissipating surface, and the pressure welding groove is arranged in a conical structure, and the conical structure expands outward along the direction away from the heat-dissipating surface.

9. The package unit of claim 1, wherein: The side of the package body away from the heat-dissipating surface is arranged with more than one glue feeding opening.

10. A package structure, characterized by, The application relates to a heat-dissipating package unit. The lead frame is arranged with a plurality of frame units; The heat-dissipating package unit according to any one of claims 1-9 is arranged on the lead frame, and a plurality of the heat-dissipating package units are arranged in each frame unit.

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