Dispensing mechanism
By setting a buffer structure on the inner wall of the adhesive delivery tube, the problem of air mixing caused by water hammer effect was solved, and uniform output of die bond adhesive was achieved, improving the conductivity and heat dissipation performance of semiconductor devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-05
- Publication Date
- 2026-03-31
AI Technical Summary
In existing technologies, rapid movement of the dispensing head causes a water hammer effect in the die bond adhesive within the dispensing head, which mixes in air and affects the conductivity and heat dissipation performance of semiconductor devices.
A buffer structure is installed on the inner wall of the dispensing tube to mitigate the water hammer effect. The buffer structure surrounding the inner wall of the dispensing tube restricts the reverse movement of the die-bonding adhesive, prevents air from entering, and ensures the uniformity and purity of the dispensing.
It effectively suppresses the water hammer effect, ensures uniform output of die bond adhesive, and improves the conductivity and heat dissipation performance of semiconductor devices.
Smart Images
Figure CN224057839U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging technology, specifically to a dispensing mechanism. Background Technology
[0002] In related technologies, die bonding of semiconductor devices, including VCSEL (Vertical-Cavity Surface-Emitting Laser) wafers and LED chips, can be achieved using a single-pin, single-dispensing method. This method leads to uneven coverage on the bottom of the chip, resulting in voids at the four corners of the semiconductor device. To address this issue, current methods include improving the dispensing head design to increase the number of dispensing heads and rapidly and repeatedly dispensing the adhesive to achieve 100% coverage of the bottom of the semiconductor device. However, the rapid dispensing-movement-re-dispensing process can cause a "water hammer effect" within the dispensing head's channels, impacting the inner wall of the dispensing head and creating turbulence. This can introduce small amounts of air, resulting in air bubbles in the adhesive exiting the dispensing head. Even if the bottom of the semiconductor wafer is 100% covered by adhesive, the presence of these bubbles can still create voids, affecting the conductivity and heat dissipation performance of the semiconductor device. Utility Model Content
[0003] The main technical problem this invention solves is that, in related technologies, rapid movement of the dispensing head causes air to easily get into the die bond adhesive inside the dispensing head due to the water hammer effect, affecting the conductivity and heat dissipation performance of semiconductor devices.
[0004] This application provides a dispensing mechanism, including:
[0005] The adhesive guide tube has a first end and a second end that are opposite each other along the axial direction. An adhesive outlet channel is formed inside the adhesive guide tube, which connects the first end and the second end. A buffer structure is fixedly provided on the inner wall of the adhesive guide tube, and the buffer structure protrudes into the surface of the inner wall of the adhesive guide tube.
[0006] The glue dispensing section includes a plurality of glue dispensing heads arranged in parallel and extending along the axial direction, and each glue dispensing head is connected to the first end of the glue guide tube.
[0007] In one embodiment, the buffer structure is distributed around the inner wall of the guide tube, and the buffer structure forms a ring around the circumference of the guide tube.
[0008] In one embodiment, the buffer structure is made of an elastic material.
[0009] In one embodiment, the surface of the buffer structure is formed by splicing together multiple curved surfaces.
[0010] In one embodiment, the ratio between the axial extension dimension of the buffer structure and the distance between the buffer structure and the dispensing portion is greater than or equal to 1:1 and less than or equal to 3:1.
[0011] In one embodiment, the buffer structure includes at least two buffer sections, each of which is sequentially distributed along the axial direction on the inner wall of the guide tube, and there is a preset gap between adjacent buffer sections.
[0012] In one embodiment, each of the buffer structures includes a first buffer portion and a second buffer portion. The first buffer portion is located at a first position of the adhesive guide tube, and the second buffer portion is located at a second position of the adhesive guide tube. The inner diameter of the adhesive guide tube at the first position is less than or equal to the inner diameter of the adhesive guide tube at the second position. The first position is closer to the adhesive outlet than the second position.
[0013] In one embodiment, the dispensing mechanism further includes a plurality of guide portions corresponding to the dispensing heads, wherein a connecting channel is formed in the guide portion, and the dispensing tube and each of the dispensing heads are sealed and connected through the connecting channel; the inner diameter of the connecting channel decreases uniformly in the direction close to the dispensing head.
[0014] In one embodiment, the glue dispensing section has glue dispensing heads arranged in a regular polygonal pattern.
[0015] In one embodiment, the adhesive guide tube and the adhesive dispensing part are an integral structure; and / or, the cross-sectional shape of the adhesive dispensing head is circular or square.
[0016] According to the dispensing mechanism of the above embodiment, since a buffer structure protruding from the inner wall surface is provided on the inner wall of the dispensing tube, the water hammer effect is effectively mitigated, so that the die bond adhesive from the buffer structure to the dispensing part is compacted, and the dispensing part is uniform and pure, thereby ensuring the conductivity and heat dissipation performance of the semiconductor device. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the water hammer effect in the dispensing mechanism of related technologies.
[0018] Figure 2 This is a schematic diagram of the dispensing mechanism in an embodiment of this application.
[0019] Figure 3 This is a schematic diagram of the die-bonding adhesive in the dispensing mechanism of this application embodiment.
[0020] Figure 4 This is a schematic diagram of a buffer structure for the dispensing mechanism in an embodiment of this application.
[0021] Figure 5This is a schematic diagram of another buffer structure for the dispensing mechanism in an embodiment of this application.
[0022] Figure 6 This is a schematic diagram of another buffer structure setting for the dispensing mechanism in an embodiment of this application.
[0023] Figure 7 This is a schematic diagram of another buffer structure setting for the dispensing mechanism in an embodiment of this application.
[0024] Figure 8 This is a schematic diagram of the adhesive dispensing section structure in an embodiment of this application.
[0025] Explanation of reference numerals in the attached figures:
[0026] 1-Guide tube; 11-First end; 12-Second end; 13-Dispensing channel;
[0027] 2-Glue dispensing section; 21-Glue dispensing head;
[0028] 3-Buffer structure; 31-First buffer section; 32-Second buffer section;
[0029] 4-Guiding section;
[0030] 5-Die bonding adhesive;
[0031] 6-bubbles. Detailed Implementation
[0032] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.
[0033] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.
[0034] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).
[0035] Please refer to Figure 1 When the dispensing mechanism performs dispensing operations by rapidly and repeatedly stacking dispensing materials, the movement of the dispensing mechanism causes the fluid die bond adhesive 5 to sway and impact the inner wall of the guide tube 1, forming a water hammer effect. This causes turbulence in the die bond adhesive 5, mixing air between the die bond adhesive 5. In this case, the die bond adhesive 5 output from the dispensing head 21 of the dispensing section 2 will contain air bubbles 6, which will cause air bubbles 6 in the die bond area of the semiconductor device, potentially causing voids and affecting the conductivity and heat dissipation performance of the semiconductor device.
[0036] This application provides a dispensing mechanism in its embodiments. Please refer to [link / reference]. Figure 2 The dispensing mechanism includes:
[0037] The adhesive guide tube 1 has a first end 11 and a second end 12 that are opposite each other along the axial direction. An adhesive outlet channel 13 is formed inside the adhesive guide tube 1, which connects the first end 11 and the second end 12. A buffer structure 3 is fixedly provided on the inner wall of the adhesive guide tube 1, and the buffer structure 3 protrudes from the surface of the inner wall of the adhesive guide tube 1.
[0038] The glue dispensing section 2 includes a plurality of glue dispensing heads 21 arranged in parallel and extending along the axial direction, and each glue dispensing head 21 is connected to the first end 11 of the glue guide tube 1.
[0039] The dispensing mechanism in this embodiment is used to perform die bonding operations on semiconductor devices, including VCESL wafers and LED chips. In order to ensure the coverage of the die bond adhesive 5 on the semiconductor devices, the dispensing mechanism in this embodiment can use a moving and superimposed method to dispense adhesive, that is, to make the dispensing mechanism dispense adhesive to the same die bonding area multiple times according to a set route. Compared with single dispensing, the coverage effect of the die bond adhesive 5 can be significantly improved.
[0040] To achieve the dispensing operation, the dispensing mechanism includes a guide tube 1 and a dispensing section 2. The guide tube 1 is used to contain and guide the die-bonding adhesive 5, and can temporarily hold the adhesive 5 within it. To facilitate the flow of the die-bonding adhesive 5, the guide tube 1 typically has a circular cross-sectional shape.
[0041] In addition, the adhesive guide tube 1 in this embodiment can serve as a delivery conduit, with one end connected to a container holding the die bond adhesive 5 and the other end connected to the dispensing section 2; or, the adhesive guide tube 1 itself can also serve as a container for storing the die bond adhesive 5. Of the first end 11 and the second end 12 of the adhesive guide tube 1 that are axially opposite, the first end 11 is connected to the dispensing section 2, and the second end 12 is connected to the source of the die bond adhesive 5.
[0042] To achieve adhesive dispensing, the first end 11 of the dispensing tube 1 is connected to the dispensing section 2. To improve the coverage of the die-bonding adhesive 5 on the semiconductor device after dispensing, the dispensing section 2 may include multiple dispensing heads 21, each arranged in parallel and connected to the first end 11. In this configuration, each dispensing head 21 is connected to the dispensing tube 1, thus the die-bonding adhesive 5 within the dispensing tube 1 is dispensed through each dispensing head 21. Since the dispensing heads 21 are arranged in parallel, their dispensing surfaces are on the same plane, dispensing adhesive from the same plane. Compared to a structure with only a single dispensing head 21, this significantly improves the coverage effect of the dispensing section 2, increasing the coverage area. The gaps between the dispensing heads 21 can be filled by moving the dispensing mechanism to fill the gaps left by the die-bonding adhesive 5 after the previous dispensing, thereby ensuring the coverage of the die-bonding adhesive 5 on the die-bonding area without wasting the adhesive 5.
[0043] When the dispensing mechanism performs dispensing operations by rapidly and repeatedly layering adhesive, the movement of the dispensing mechanism causes the fluid-like die-bonding adhesive 5 to slosh and impact the inner wall of the guide tube 1, creating a water hammer effect. This causes turbulence in the die-bonding adhesive 5, mixing air between the adhesive particles. In this case, air bubbles will be present in the die-bonding adhesive 5 output from the dispensing head 21 of the dispensing section 2, resulting in air bubbles in the die-bonding area of the semiconductor device. This could potentially create voids, affecting the conductivity and heat dissipation performance of the semiconductor device. To avoid the above problems, the dispensing mechanism in this embodiment includes a buffer structure 3, which is disposed on the inner wall of the guide tube 1, and the buffer structure 3 is specifically constructed to protrude from the surface of the inner wall of the guide tube 1. This means that the buffer structure 3 forms a stepped structure within the adhesive guide tube 1, which can, to a certain extent, limit the reverse movement of the die-bonding adhesive 5 near the dispensing section 2, thereby weakening the water hammer effect, reducing or even eliminating air mixing into the die-bonding adhesive 5, and ensuring the uniformity of the die-bonding adhesive 5 output from the dispensing head 21. Please refer to [reference needed]. Figure 2 and Figure 3 .
[0044] In some alternative embodiments, please refer to Figure 4To enhance the effectiveness of the buffer structure 3 in mitigating water hammer, the buffer structure 3 can be distributed around the inner wall of the adhesive tube 1, forming a ring around the circumference of the adhesive tube 1. In other words, the buffer structure 3 can be positioned 360° around the adhesive tube 1, effectively limiting the reverse movement of the die-attach adhesive 5 at every angle. Compared to a non-ring-shaped structure, this significantly improves the suppression of water hammer.
[0045] In some alternative embodiments, please refer to Figure 5 To enhance the effectiveness of the buffer structure 3 in mitigating water hammer, the buffer structure 3 can be made of an elastic material. Because the buffer structure 3 is made of an elastic material, when the die bond adhesive 5 oscillates due to the movement of the dispensing mechanism, the buffer structure 3 can deform and fill the oscillating die bond adhesive 5, preventing it from being filled with air. This further enhances the suppression of the water hammer effect and ensures uniform and continuous dispensing.
[0046] In some alternative embodiments, please continue to refer to Figure 5 To further enhance the suppression of water hammer effect, the surface of the buffer structure 3 can be formed by splicing together multiple curved surfaces. In other words, the surface of the buffer structure 3 can be an irregular curved surface. Therefore, the buffer structure 3 can limit the oscillation range of the die bond adhesive 5 while ensuring the fluidity of the die bond adhesive 5, so that the die bond adhesive 5 output during the dispensing process can be replenished in a timely manner, avoiding the mixing of air into the die bond adhesive 5.
[0047] In some alternative embodiments, please refer to Figure 6 To ensure the suppression of water hammer effect, the die-bonding adhesive 5 is compacted between the buffer mechanism and the dispensing part 2, preventing air from being trapped within it. The ratio between the axial extension of the buffer structure 3 and the distance between the buffer structure 3 and the dispensing part 2 is greater than or equal to 1:1 and less than or equal to 3:1. In other words, the ratio between the total extension length X1 of the buffer structure 3 and the distance X2 between the buffer structure 3 and the dispensing part 2 is between 1:1 and 3:1.
[0048] In some alternative embodiments, please refer to Figure 7To further enhance the mitigation effect against water hammer, the buffer structure 3 may specifically include at least two buffer sections, each sequentially distributed along the axial direction on the inner wall of the dispensing tube 1, with a preset gap between adjacent buffer sections. In other words, the dispensing mechanism in this embodiment can employ a multi-stage buffer structure 3, with multiple buffer sections arranged along the axial direction, each buffer section achieving a certain degree of protection against water hammer. For this multi-stage buffer structure 3, each buffer section can have a different structure; for example, some may be annular while others are non-annular; some may be made of flexible material while others are made of rigid material; some may have a planar surface while others have a curved surface, etc. Of course, each buffer section can also have the same structure.
[0049] In some alternative embodiments, please continue to refer to Figure 7 According to the structure of the guide tube 1, each buffer structure 3 includes a first buffer part 31 and a second buffer part 32. The first buffer part 31 is located at a first position of the guide tube 1, and the second buffer part 32 is located at a second position of the guide tube 1. The inner diameter of the guide tube 1 at the first position is less than or equal to the inner diameter of the guide tube 1 at the second position. The first position is closer to the glue outlet 2 than the second position. That is to say, the buffer structures 3 can be set sequentially according to the change of the inner diameter of the guide tube 1 itself. Generally speaking, the inner diameter of the guide tube 1 is smallest at the closest point to the glue outlet 2, and the further away from the glue outlet 2, the larger the inner diameter of the guide tube 1. The different buffer parts corresponding to the buffer structures 3, such as the first buffer part 31 and the second buffer part 32, are such that the first buffer part 31 is set closer to the first end 11 of the guide tube 1 than the second buffer part 32, and the second buffer part 32 is set closer to the second end 12 than the first buffer part 31.
[0050] In some alternative embodiments, please refer to Figure 8 To achieve smooth dispensing, the dispensing mechanism also includes several guide sections 4 corresponding to the dispensing heads 21. Each guide section 4 has a connecting channel, and the guide tube 1 and each dispensing head 21 are sealed and connected through the connecting channel. The inner diameter of the connecting channel decreases uniformly towards the dispensing head 21. The guide section 4 connects the guide tube 1 and each dispensing head 21. To prevent the die-bonding adhesive 5 from clogging or remaining at the connection between the guide tube 1 and the dispensing head 21, the guide tube 1 and the dispensing head 21 are connected through the guide section 4. The guide section 4 has a connecting channel, and the inner diameter of this connecting channel gradually decreases towards the dispensing head 21, giving it an overall funnel shape.
[0051] In some alternative embodiments, please refer to Figure 8To ensure the coverage of the die bond adhesive 5, the dispensing heads 21 in the dispensing section 2 can be arranged in a regular polygonal pattern. Specifically, the number of dispensing heads 21 can be 3, 4, 9, 16, etc., and they can be arranged in the form of equilateral triangles, 2×2 squares, 3×3 squares, 4×4 squares, etc. The more dispensing heads 21 there are, the closer the shape of the dispensing adhesive is to the required square. This can improve the coverage of the die bond adhesive 5 without wasting it, and can also reduce the need for moving the dispensing head, thereby reducing the consumption of the die bond adhesive 5.
[0052] In some alternative embodiments, to ensure the durability of the dispensing mechanism and improve the flowability of the die bond adhesive 5, preventing blockage at the joint, the dispensing tube 1 and the dispensing part 2 can be an integral structure. For example, the dispensing tube 1 and the dispensing part 2 can be integrally molded by injection molding.
[0053] In some alternative embodiments, in order to improve the coverage of the die bond adhesive 5, the cross-sectional shape of the dispensing head 21 can be circular or square.
[0054] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.
Claims
1. A dispensing mechanism, characterized in that, include: The adhesive guide tube has a first end and a second end that are opposite each other along the axial direction. An adhesive outlet channel is formed inside the adhesive guide tube, which connects the first end and the second end. A buffer structure is fixedly provided on the inner wall of the adhesive guide tube, and the buffer structure protrudes into the surface of the inner wall of the adhesive guide tube. The glue dispensing section includes a plurality of glue dispensing heads arranged in parallel and extending along the axial direction, and each glue dispensing head is connected to the first end of the glue guide tube.
2. The dispensing mechanism as described in claim 1, characterized in that, The buffer structure is distributed around the inner wall of the guide tube, and the buffer structure forms a ring around the circumference of the guide tube.
3. The dispensing mechanism as described in claim 1, characterized in that, The buffer structure is made of an elastic material.
4. The dispensing mechanism as described in claim 1, characterized in that, The surface of the buffer structure is formed by splicing together multiple curved surfaces.
5. The dispensing mechanism as described in claim 1, characterized in that, The ratio between the axial extension dimension of the buffer structure and the distance between the buffer structure and the dispensing part is greater than or equal to 1:1 and less than or equal to 3:
1.
6. The dispensing mechanism as described in claim 1, characterized in that, The buffer structure includes at least two buffer sections, each of which is sequentially distributed along the axial direction on the inner wall of the guide tube, and there is a preset gap between adjacent buffer sections.
7. The dispensing mechanism as described in claim 6, characterized in that, Each of the aforementioned buffer structures includes a first buffer section and a second buffer section. The first buffer section is located at a first position of the adhesive guide tube, and the second buffer section is located at a second position of the adhesive guide tube. The inner diameter of the adhesive guide tube at the first position is less than or equal to the inner diameter of the adhesive guide tube at the second position. The first position is closer to the adhesive outlet than the second position.
8. The dispensing mechanism according to any one of claims 1-7, characterized in that, The dispensing mechanism further includes several guide portions corresponding to the dispensing heads, each guide portion having a connecting channel formed therein, and the dispensing tube and each dispensing head being sealed and connected through the connecting channel; the inner diameter of the connecting channel decreases uniformly along the direction closer to the dispensing head.
9. The dispensing mechanism according to any one of claims 1-7, characterized in that, In the glue dispensing section, each glue dispensing head is arranged in a regular polygonal pattern.
10. The dispensing mechanism according to any one of claims 1-7, characterized in that, The adhesive guide tube and the adhesive dispensing part are an integral structure; and / or, the cross-sectional shape of the adhesive dispensing head is circular or square.