Conveying equipment convenient to classify and used for testing semiconductor devices

Abstract

The utility model discloses a semiconductor device test conveying device convenient to classify, which comprises a conveying belt and supports, the bottom end of the conveying belt is provided with two sets of supports, the supports are internally provided with integrated frames, the top end of the conveying belt is provided with a limiting block, the side wall of one side of the conveying belt is provided with a movable air cylinder, and the movable air cylinder is provided with an air outlet. A moving air cylinder is installed on the conveying belt, an air cylinder pushing arm is installed at the output end of the moving air cylinder, a classifying block is installed at the end, away from the moving air cylinder, of the air cylinder pushing arm and slidably connected with the limiting block, a slope is installed on the side wall of the other side of the conveying belt, an adjusting frame is installed at the top end of the slope, and a two-way threaded rod is movably installed in the adjusting frame. According to the utility model, the semiconductor chips of different specifications can be conveniently classified, adjusted, identified and conveyed, the semiconductor chips can be conveniently clamped and overturned, the semiconductor chips can be conveniently subjected to adaptive adjustment, scanning and identification, and the convenience of classified conveying of the semiconductors is improved.

Description

Technical Field

[0001] This utility model relates to the field of conveying equipment technology, specifically to a conveying equipment for semiconductor device testing that facilitates classification. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators. Their conductivity at room temperature falls between that of conductors and insulators, making them crucial in the electronics industry. The production and research of semiconductor materials, devices, and integrated circuits have become an important part of the electronics industry. The importance of semiconductors is not only reflected in technological development but also has a significant impact on economic development. Most electronic products, such as computers, mobile phones, or digital recorders, have core components closely related to semiconductors. Currently, "semiconductor" is a general term for chips. After semiconductor production, they need to be tested, and only those that meet standards can be released for use. Traditional semiconductor testing methods often involve transporting semiconductor chips of a single specification for testing, which is inconvenient for classifying and transporting semiconductors of different specifications for testing. To improve this situation, a transport device for testing semiconductor devices that facilitates classification is proposed.

[0003] For example, a semiconductor packaging testing classification device disclosed in the authorization announcement number CN214555398U includes a turntable driven by a stepper motor. Multiple stations are set on the outer edge of the turntable, and each station is equipped with a pusher cylinder and a conveyor belt. One of the stations is an input conveyor belt and the rest are output conveyor belts. A vision inspection mechanism is set across the input conveyor belt, and the vision inspection mechanism is electrically connected to a vision inspection system.

[0004] Although it achieves a reasonable design, compact structure, and convenient use, by setting up a turntable and visual inspection mechanism, it can improve the sorting efficiency of semiconductor components, enhance the working ability of staff, facilitate the work of staff, and at the same time reduce the labor intensity of staff and improve the efficiency of sorting device use.

[0005] However, the existing conveying equipment does not solve the problem of being unable to conveniently classify, adjust, identify, and convey semiconductor chips of different specifications, nor is it convenient to clamp and flip semiconductor chips. It is also not conducive to adapting, adjusting, scanning, and identifying semiconductor chips, which affects the convenience of semiconductor classification and conveying. Utility Model Content

[0006] The purpose of this invention is to provide a semiconductor device testing conveying device that facilitates classification, thereby solving the problems mentioned in the background art, such as the inconvenience of conveying devices in classifying, adjusting, identifying and transporting semiconductor chips of different specifications, and the difficulty in clamping and flipping semiconductor chips, which hinders the adaptation, adjustment and scanning identification of semiconductor chips and affects the convenience of semiconductor classification and transport.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor device testing conveying device for easy classification, comprising a conveyor belt and supports. Two sets of supports are installed at the bottom end of the conveyor belt, each support having an integrated frame inside. A limit block is installed at the top end of the conveyor belt. A moving cylinder is installed on one side wall of the conveyor belt, and a cylinder push arm is installed at the output end of the moving cylinder. A classification block is installed at the end of the cylinder push arm away from the moving cylinder, and the classification block is slidably connected to the limit block. A ramp is installed on the other side wall of the conveyor belt, and an adjustment frame is installed at the top of the ramp. A bidirectional threaded rod is movably installed inside the adjustment frame. Two sets of bidirectional threaded sleeves are fitted on the surface of the bidirectional threaded rod, and the bidirectional threaded sleeves are threadedly connected to the bidirectional threaded rod and slidably connected to the adjustment frame. A servo motor is installed on the side wall of the adjustment frame, and the output end of the servo motor is connected to the bidirectional threaded rod. Moving blocks are installed on the side walls of the bidirectional threaded sleeves, and optical cameras are installed at the bottom ends of the moving blocks.

[0008] Preferably, the top of the integrated frame is symmetrically equipped with slide rails, and two sets of sliders are slidably installed on the surface of each slide rail.

[0009] Preferably, two sets of support frames are provided above the integrated frame, and the support frames are respectively connected to two sets of sliders.

[0010] Preferably, a first electric push rod is movably installed on the side wall of the support frame, and a movable push arm is installed at the output end of each of the first electric push rods, and the movable push arm is connected to another set of support frames.

[0011] Preferably, gears are movably installed inside the integrated frame, and racks are installed at the bottom of the support frame, with the racks meshing with the gears.

[0012] Preferably, each of the support frames is equipped with two sets of second electric push rods, and each of the output ends of the second electric push rods is equipped with a lifting rod.

[0013] Preferably, each of the support frames is provided with a movable arm above it, and the movable arm is connected to the lifting rod.

[0014] Preferably, each of the moving arms is equipped with a flip motor, the output end of each flip motor is equipped with a flip shaft, and the surface of each flip shaft is equipped with a flip block.

[0015] Compared with the prior art, the beneficial effects of this utility model are: the conveying equipment not only realizes convenient classification, adjustment, identification and conveying of semiconductor chips of different specifications and convenient clamping and flipping of semiconductor chips, which facilitates the adaptation, adjustment and scanning identification of semiconductor chips, but also improves the convenience of semiconductor classification and conveying.

[0016] Semiconductor chips are sequentially placed on the surface of a ramp. As the semiconductors slide along the ramp and pass the adjustment frame, an optical camera performs visual inspection to analyze their specifications. The camera sends a signal to a computer, which then activates a moving cylinder. This cylinder moves a push arm, which in turn moves a sorting block, bringing its tip into contact with one side of the ramp. The semiconductor chips then move along the curved edge of the sorting block to the surface of the conveyor belt, where they are propelled by the belt. When the semiconductor chips reach between two sets of moving arms, a first electric push rod moves the push arm, which in turn moves the support frame. Gears and racks provide limiting support for the support frame, causing the two sets of support frames to move towards each other. The moving arm and the flipping block move closer together, and the flipping block centers and clamps the semiconductor chip. When other specifications of semiconductor chips need to be transported, the conveyor belt and the moving cylinder are opened in reverse to complete the transport of other specifications of semiconductor chips, which facilitates subsequent inspection. The servo motor drives the bidirectional threaded rod to rotate, which drives two sets of bidirectional threaded sleeves to move in opposite directions. The bidirectional threaded sleeves drive the moving block and the optical camera to move in opposite directions, thereby adjusting the relative distance between the two sets of optical cameras to adapt to different visual scanning ranges and better perform visual scanning of semiconductor chips. This realizes convenient classification, adjustment, identification and transport of semiconductor chips of different specifications, facilitates the adaptation, adjustment and scanning identification of semiconductor chips, and improves the convenience of semiconductor classification and transport.

[0017] When a semiconductor is transported with its back side facing up, it moves between two sets of flipping blocks. The moving arm then drives the flipping blocks to clamp and fix the semiconductor. The second electric push rod then drives the lifting rod to move upward, which in turn drives the moving arm, flipping blocks, and semiconductor to move upward. The flipping motor then drives the flipping blocks and semiconductor to flip, thus flipping the semiconductor to the front side. After that, the second electric push rod is turned off, and it drives the semiconductor to descend, releasing the two sets of moving arms. The semiconductor falls onto the surface of the conveyor belt and is then moved by the conveyor belt to the detection position, thus achieving convenient clamping and flipping of semiconductor chips. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a top view of the structure of this utility model;

[0020] Figure 3 This is a top sectional view of the adjustment frame of this utility model.

[0021] Figure 4 This is a three-dimensional structural diagram of the support frame of this utility model;

[0022] Figure 5 This is a side view sectional structural diagram of the support frame of this utility model.

[0023] In the diagram: 1. Support frame; 2. Integrated frame; 3. Conveyor belt; 4. Moving arm; 5. Tilting block; 6. Limiting block; 7. Bearing frame; 8. Sorting block; 9. Cylinder push arm; 10. Moving cylinder; 11. Inclined beam; 12. Moving block; 13. Adjusting frame; 14. Optical camera; 15. Bidirectional threaded rod; 16. Bidirectional threaded sleeve; 17. Servo motor; 18. Slide rail; 19. Slider; 20. Gear; 21. Rack; 22. First electric push rod; 23. Moving push arm; 24. Second electric push rod; 25. Lifting rod; 26. Tilting motor; 27. Tilting shaft. Detailed Implementation

[0024] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0025] Please see Figure 1-5This utility model provides an embodiment of a semiconductor device testing conveying device for easy classification, comprising a conveyor belt 3 and a support 1. Two sets of supports 1 are installed at the bottom end of the conveyor belt 3, and each support 1 has an integrated frame 2 inside. A limit block 6 is installed at the top end of the conveyor belt 3. A movable cylinder 10 is installed on one side wall of the conveyor belt 3, which serves as a power drive. A cylinder push arm 9 is installed at the output end of the movable cylinder 10. A classification block 8 is installed at the end of the cylinder push arm 9 away from the movable cylinder 10, and the classification block 8 is slidably connected to the limit block 6. A ramp is installed on the other side wall of the conveyor belt 3. 11. An adjustment frame 13 is installed at the top of the ramp 11. A bidirectional threaded rod 15 is movably installed inside the adjustment frame 13. Two sets of bidirectional threaded sleeves 16 are fitted on the surface of the bidirectional threaded rod 15. The bidirectional threaded sleeves 16 are threadedly connected to the bidirectional threaded rod 15 and slidably connected to the adjustment frame 13. A servo motor 17 is installed on the side wall of the adjustment frame 13. The servo motor 17 plays the role of power drive. The output end of the servo motor 17 is connected to the bidirectional threaded rod 15. A moving block 12 is installed on the side wall of each bidirectional threaded sleeve 16. An optical camera 14 is installed at the bottom of each moving block 12.

[0026] First, the conveyor belt 3 is rotated forward, and semiconductor chips are placed sequentially on the surface of the ramp 11. As the semiconductors slide along the surface of the ramp 11 and pass the adjustment frame 13, the optical camera 14 performs visual inspection on the semiconductor chips to analyze their specifications. The visual camera sends a signal to the computer, which then activates the moving cylinder 10. The moving cylinder 10 drives the cylinder push arm 9 to move, which in turn moves the sorting block 8 so that its tip contacts one side of the ramp 11. The semiconductor chips move along the curved edge of the sorting block 8 to the surface of the conveyor belt 3, where the conveyor belt 3 moves them. When the semiconductor chips move between the two sets of moving arms 4, the first electric push rod 22 is activated, which drives the moving push arm 23 to move. With the sliding cooperation of the slider 19 and the slide rail 18, the moving push arm 23 moves the support frame 7. The gear 20 and rack 21 mesh together to provide limiting support for the support frame 7. The two sets of carrier frames 7 move towards each other, and the carrier frames 7 drive the moving arm 4 and the flipping block 5 to move closer to each other. The flipping block 5 centers and clamps the semiconductor chip. When other specifications of semiconductor chips need to be transported, the conveyor belt 3 and the moving cylinder 10 are opened in reverse to complete the transport of other specifications of semiconductor chips, which facilitates subsequent inspection. The servo motor 17 is turned on, and the servo motor 17 drives the bidirectional threaded rod 15 to rotate. Under the threaded connection between the bidirectional threaded rod 15 and the bidirectional threaded sleeve 16, the bidirectional threaded rod 15 drives the two sets of bidirectional threaded sleeves 16 to move towards each other. The bidirectional threaded sleeves 16 drive the moving block 12 and the optical camera 14 to move towards each other, thereby adjusting the relative distance between the two sets of optical cameras 14 to adapt to different visual scanning ranges and better perform visual scanning of semiconductor chips. This realizes convenient classification, adjustment, identification and transport of semiconductor chips of different specifications, facilitates the adaptation, adjustment and scanning identification of semiconductor chips, and improves the convenience of semiconductor classification and transport.

[0027] The top of the integrated frame 2 is symmetrically equipped with slide rails 18, and two sets of sliders 19 are slidably installed on the surface of each slide rail 18. Two sets of support frames 7 are provided on the top of the integrated frame 2, and the support frames 7 are respectively connected to the two sets of sliders 19.

[0028] First electric push rods 22 are movably installed on the side walls of the support frame 7. The first electric push rods 22 serve as power drives. Each output end of the first electric push rods 22 is equipped with a movable push arm 23, and the movable push arm 23 is connected to another set of support frames 7.

[0029] Gears 20 are movably installed inside the integrated frame 2, and racks 21 are installed at the bottom of the support frame 7. The racks 21 and gears 20 mesh with each other. Two sets of second electric push rods 24 are installed inside the support frame 7. The second electric push rods 24 play a power driving role. Lifting rods 25 are installed at the output end of the second electric push rods 24.

[0030] Each support frame 7 is equipped with a movable arm 4, and the movable arm 4 is connected to the lifting rod 25. Each movable arm 4 is equipped with a tilting motor 26, which serves as a power drive. Each tilting motor 26 is equipped with a tilting shaft 27 at its output end, and a tilting block 5 is installed on the surface of the tilting shaft 27.

[0031] When a semiconductor is transported with its back side facing up, when the semiconductor moves between the two sets of flipping blocks 5, the moving arm 4 drives the flipping blocks 5 to clamp and fix it. Then, the second electric push rod 24 is opened, which drives the lifting rod 25 to move upward. The lifting rod 25 drives the moving arm 4, the flipping blocks 5, and the semiconductor to move upward. Then, the flipping motor 26 is opened, which drives the flipping blocks 5 and the semiconductor to flip through the flipping shaft 27, thereby flipping the semiconductor to the front side. Then, the second electric push rod 24 is closed, which drives the semiconductor to descend and releases the two sets of moving arms 4. The semiconductor falls onto the surface of the conveyor belt 3 and is moved by the conveyor belt 3 to the detection position, realizing convenient clamping and flipping of semiconductor chips.

[0032] Working principle: First, the conveyor belt 3 rotates forward, placing semiconductor chips sequentially on the surface of the ramp 11. As the semiconductors slide along the surface of the ramp 11 and pass the adjustment frame 13, the optical camera 14 performs visual inspection on the semiconductor chips to analyze their specifications. The visual camera sends a signal to the computer, which then activates the moving cylinder 10. The moving cylinder 10 drives the cylinder push arm 9 to move, which in turn moves the sorting block 8, bringing its tip into contact with one side of the ramp 11. The semiconductor chips then move along the curved edge of the sorting block 8 to the conveyor belt. The surface of the conveyor belt 3 is moved by the conveyor belt 3. When the semiconductor chip moves between the two sets of moving arms 4, the first electric push rod 22 drives the moving push arm 23 to move. Under the sliding cooperation of the slider 19 and the slide rail 18, the moving push arm 23 drives the carrier frame 7 to move. The gear 20 and rack 21 provide limiting support for the carrier frame 7, thereby driving the two sets of carrier frames 7 to move towards each other. The carrier frame 7 drives the moving arm 4 and the flipping block 5 to move closer to each other. The flipping block 5 centers and clamps the semiconductor chip. When it is necessary to transport semiconductor chips of other specifications, the conveyor belt 3 and the moving arm 4 are opened in reverse. The pneumatic cylinder 10 can complete the conveying operation of semiconductor chips of other specifications to facilitate subsequent inspection. The servo motor 17 drives the bidirectional threaded rod 15 to rotate, which in turn drives the two sets of bidirectional threaded sleeves 16 to move in opposite directions. The bidirectional threaded sleeves 16 drive the moving block 12 and the optical camera 14 to move in opposite directions to adjust the relative distance between the two sets of optical cameras 14, thereby adapting to different visual scanning ranges and better visually scanning the semiconductor chips. When a semiconductor is transported with its back side facing up, when the semiconductor moves between the two sets of flipping blocks 5, the moving arm... After the flipping block 5 clamps and fixes the semiconductor, the second electric push rod 24 drives the lifting rod 25 to move upward. The lifting rod 25 drives the moving arm 4, the flipping block 5, and the semiconductor to move upward. The flipping motor 26 drives the flipping block 5 and the semiconductor to flip through the flipping shaft 27, thereby flipping the semiconductor to the front. Then, the second electric push rod 24 is turned off, and the second electric push rod 24 drives the semiconductor to descend and releases the two sets of moving arms 4. The semiconductor falls onto the surface of the conveyor belt 3 and is moved by the conveyor belt 3 to the detection position, thereby completing the use of the semiconductor device testing conveyor equipment for easy classification.

[0033] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A conveying device for facilitating classification of semiconductor devices under test, comprising a conveyor belt (3) and a support (1), characterized in that: The bottom end of the conveying belt (3) is provided with two groups of supports (1), the inside of the support (1) is provided with an integrated frame (2), the top end of the conveying belt (3) is provided with a limiting block (6), a moving cylinder (10) is installed on the side wall of one side of the conveying belt (3), the output end of the moving cylinder (10) is provided with a cylinder push arm (9), the end of the cylinder push arm (9) away from the moving cylinder (10) is provided with a classification block (8), and the classification block (8) is in sliding connection with the limiting block (6), an inclined slope (11) is installed on the side wall of the other side of the conveying belt (3), the top end of the inclined slope (11) is provided with an adjusting frame (13), a bidirectional screw rod (15) is movably installed in the inside of the adjusting frame (13), two groups of bidirectional screw sleeves (16) are sleeved on the surface of the bidirectional screw rod (15), the bidirectional screw sleeve (16) is in threaded connection with the bidirectional screw rod (15), and the bidirectional screw sleeve (16) is in sliding connection with the adjusting frame (13), a servo motor (17) is installed on the side wall of the adjusting frame (13), the output end of the servo motor (17) is connected with the bidirectional screw rod (15), and the side wall of the bidirectional screw sleeve (16) is provided with a moving block (12).

2. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 1, wherein: The top end of the integrated frame (2) is symmetrically provided with a sliding rail (18), and the surface of the sliding rail (18) is slidably provided with two groups of sliding blocks (19).

3. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 1, wherein: The top of the integrated frame (2) is provided with two groups of bearing frames (7), and the bearing frame (7) is connected with the two groups of sliding blocks (19) respectively.

4. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 3, wherein: The side wall of the bearing frame (7) is movably provided with a first electric push rod (22) respectively, the output end of the first electric push rod (22) is provided with a moving push arm (23), and the moving push arm (23) is connected with the other group of bearing frames (7) respectively.

5. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 1, wherein: The inside of the integrated frame (2) is movably provided with a gear (20), and the bottom end of the bearing frame (7) is provided with a rack (21), and the rack (21) is in meshing connection with the gear (20).

6. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 3, wherein: The inside of the bearing frame (7) is provided with two groups of second electric push rods (24), the output end of the second electric push rod (24) is provided with a lifting rod (25).

7. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 3, wherein: The top of the bearing frame (7) is provided with a moving arm (4), and the moving arm (4) is connected with the lifting rod (25).

8. The delivery apparatus for facilitating classification of semiconductor devices under test as defined in claim 7, wherein: The inside of the moving arm (4) is provided with a turnover motor (26), the output end of the turnover motor (26) is provided with a turnover shaft (27), and the surface of the turnover shaft (27) is provided with a turnover block (5).

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