Cleaning device and cleaning system
By setting a pressing mechanism in the cleaning device to fix the silicon wafers, the problem of incomplete cleaning caused by silicon wafers floating is solved, and thorough cleaning and efficient automated operation of silicon wafers are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-03-31
AI Technical Summary
During the cleaning process of photovoltaic silicon wafers, the wafers are light and buoyant, making them prone to floating and resulting in incomplete cleaning, which affects the quality of the cells.
Design a cleaning device comprising a tank and a pressing mechanism. A drive module drives a pressing assembly to press and fix silicon wafers, ensuring they are completely immersed in the cleaning solution. A transfer mechanism is used to achieve automated operation and efficient transfer.
It achieves thorough cleaning of silicon wafers, improves cleaning effect, shortens operation waiting time, improves the operating efficiency of cleaning equipment, and facilitates automated operation.
Smart Images

Figure CN224058313U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of cleaning equipment technology, specifically relating to a cleaning device and cleaning system. Background Technology
[0002] Photovoltaic power generation is one of the main ways to utilize solar energy. Due to its cleanliness, safety, convenience, and high efficiency, solar photovoltaic power generation has become a new industry of widespread concern and key development in countries around the world. Therefore, in-depth research and utilization of solar energy resources is of great significance for alleviating the resource crisis and improving the ecological environment. Silicon wafers are one of the essential components of photovoltaic power generation.
[0003] In the manufacturing process of photovoltaic silicon wafers, wafer cleaning is a crucial and vital step. The cleaning process involves inserting silicon wafers into a cleaning basket, which is then placed into a cleaning tank for further cleaning. However, due to the light weight of the silicon wafers, they can float to the surface during immersion in the cleaning solution, leading to incomplete cleaning and consequently affecting the quality of the subsequently manufactured cells. Utility Model Content
[0004] This application aims to provide a cleaning device and cleaning system that can solve the problem in the prior art where silicon wafers tend to float during the cleaning process using a cleaning basket, resulting in incomplete cleaning.
[0005] To solve the above-mentioned technical problems, this application is implemented as follows:
[0006] In a first aspect, embodiments of this application provide a cleaning apparatus, comprising:
[0007] The tank has a receiving cavity for accommodating a material carrier containing the parts to be cleaned.
[0008] The pressing mechanism includes a base, a drive module, and a pressing assembly. The base is located on one side of the tank, the drive module is mounted on the base, and the pressing assembly is connected to the drive module. The drive module is used to drive the pressing assembly to move relative to the tank so as to press and fix the part to be cleaned in the material carrier through the pressing assembly.
[0009] Optionally, the drive module includes a first moving module and a second moving module. The first moving module is mounted on the base, and the second moving module is movably connected to the first moving module. The tablet pressing assembly is movably connected to the second moving module. The first moving module is used to drive the second moving module to move up and down along a first direction, and the second moving module is used to drive the tablet pressing assembly to move along a second direction, wherein the second direction is perpendicular to the first direction.
[0010] Optionally, the tableting assembly includes a connector and a tableting structure. One end of the connector is connected to the second moving module, and the second moving module can drive the connector to move along a second direction. The tableting structure is connected to the other end of the connector and is used to press the part to be cleaned in the loading component.
[0011] Optionally, the pressing structure includes a main body and a pressing part. The main body is connected to the other end of the connector, and the pressing part is located on one side of the main body along the second direction. The pressing part is used to press the part to be cleaned in the material carrier.
[0012] Optionally, the tableting structure includes a first connecting rod, a second connecting rod, and a pressure rod. The first connecting rod is connected to the other end of the connector to form the main body. One end of the second connecting rod is connected to the first connecting rod, and the other end of the second connecting rod extends in a direction away from the first connecting rod along the second direction. The pressure rod is connected to the second connecting rod to form the tableting portion.
[0013] Optionally, the tablet pressing part has a pressing surface, and the pressing surface is provided with a plurality of slots, which are adapted to be inserted and engaged with the part to be cleaned in the material carrier;
[0014] And / or, the main body is provided with at least two tableting portions on one side along the second direction, and the at least two tableting portions are spaced apart along a third direction, which is perpendicular to the first direction and the second direction respectively.
[0015] Optionally, the cleaning device further includes a transfer mechanism and a control component. The transfer mechanism is disposed opposite to the tank and is used to transfer the material into or out of the receiving cavity. The control component is electrically connected to the drive module and the transfer mechanism respectively, and is used to control the transfer mechanism to perform transfer operations and control the operation of the drive module based on the transfer action of the transfer mechanism.
[0016] Optionally, the cleaning device includes a plurality of tanks arranged at intervals, each tank being provided with at least one pressing mechanism, and the transfer mechanism being movable between the plurality of tanks.
[0017] Optionally, along a direction perpendicular to the spacing of the plurality of grooves, the transfer mechanism is located on one side of the groove, and the pressing mechanism is located on the other side of the groove.
[0018] Secondly, embodiments of this application propose a cleaning system, including: a material carrier and the cleaning device described in the first aspect, wherein the material carrier is used to load the part to be cleaned into and out of the receiving cavity.
[0019] In this application, a receiving cavity is provided in the tank to hold cleaning fluid for cleaning operations. A pressing mechanism is provided on one side of the tank. The pressing mechanism includes a drive module and a pressing assembly. During the cleaning process, when the workpiece to be cleaned is carried into the receiving cavity by a loading component, the driving module drives the pressing assembly to move relative to the tank, thereby pressing and fixing the workpiece to be cleaned in the loading component, ensuring the cleaning effect. Furthermore, using the pressing mechanism of this application, the position of the pressing assembly can be flexibly adjusted by the drive module so that the actions performed by the drive module can match the transfer action of the loading component. This shortens the operation waiting time, improves the overall operating efficiency of the device, and facilitates automated operation.
[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0021] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0022] Figure 1 This is a schematic diagram of a cleaning apparatus according to an embodiment of this application;
[0023] Figure 2 This is a schematic diagram of the pressing mechanism according to an embodiment of this application;
[0024] Figure 3 This is a schematic diagram of a tableting assembly according to an embodiment of this application;
[0025] Figure 4 This is a partial cross-sectional view of the tableting section according to an embodiment of this application;
[0026] Figure 5 This is a schematic diagram of a drive module according to an embodiment of this application;
[0027] Figure 6 This is a schematic diagram of the assembly structure of the transfer mechanism and the material carrier according to an embodiment of this application;
[0028] Figure 7 This is one of the schematic diagrams of the cooperation structure between the transfer mechanism and the pressing mechanism according to an embodiment of this application;
[0029] Figure 8 This is a second schematic diagram of the cooperation structure between the transfer mechanism and the pressing mechanism according to an embodiment of this application.
[0030] Figure label:
[0031] 1: Tank; 10: Receiving cavity; 11: Part to be cleaned; 12: Loading part; 2: Pressing mechanism; 21: Base; 22: Drive module; 221: First moving module; 222: Second moving module; 222a: Slider; 23: Tableting assembly; 231: Connector; 232: Tableting structure; 232a: Main body; 232b: Tableting part; 2320: Slot; 2321: First connecting rod; 2322: Second connecting rod; 2323: Pressing rod; 3: Transfer mechanism; 31: Mechanism body; 32: Transfer arm; 33: Hook; Z: First direction; X: Second direction; Y: Third direction. Detailed Implementation
[0032] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0033] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0034] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0035] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0036] The cleaning apparatus and cleaning system provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.
[0037] like Figure 1 and Figure 2 As shown, the cleaning apparatus according to some embodiments of this application includes a tank 1 and a pressing mechanism 2. The tank 1 is provided with a receiving cavity 10 for receiving a material carrier 12 containing a part 11 to be cleaned. The pressing mechanism 2 includes a base 21, a drive module 22 and a pressing assembly 23. The base 21 is located on one side of the tank 1. The drive module 22 is mounted on the base 21. The pressing assembly 23 is connected to the drive module 22. The drive module 22 is used to drive the pressing assembly 23 to move relative to the tank 1 so as to press and fix the part 11 to be cleaned in the material carrier 12 through the pressing assembly 23.
[0038] In this embodiment, a receiving cavity 10 is provided in the tank 1 to hold cleaning fluid for cleaning operations. A pressing mechanism 2 is provided on one side of the tank 1. The pressing mechanism 2 includes a drive module 22 and a pressing assembly 23. During the cleaning process, when the loading member 12 carries the part to be cleaned 11 into the receiving cavity 10 for cleaning, the drive module 22 can drive the pressing assembly 23 to move relative to the tank 1, so as to press and fix the part to be cleaned 11 in the loading member 12, thereby ensuring the cleaning effect of the part to be cleaned 11. Furthermore, by using the pressing mechanism 2 in this application, the position of the pressing assembly 23 can be flexibly adjusted by the drive module 22 so that the action performed by the drive module 22 can match the transfer action of the loading member 12. This can shorten the operation waiting time, improve the overall operating efficiency of the device, and also facilitate automated operation.
[0039] For example, the cleaning device in this application embodiment can be applied to the silicon wafer cleaning process in photovoltaic cell manufacturing. In the photovoltaic cell manufacturing process, after the silicon wafer is sliced, it needs to be cleaned. During cleaning, the silicon wafer (i.e., the part to be cleaned 11) is inserted into the cleaning basket (i.e., the material carrier 12). Multiple silicon wafers are loaded into the receiving cavity 10 at the same time using the cleaning basket for cleaning. However, under the buoyancy of the cleaning liquid, the silicon wafer will float up, resulting in incomplete cleaning.
[0040] Therefore, in this application, by configuring a pressing mechanism 2 on one side of the tank 1, after the cleaning basket containing silicon wafers is transferred above the receiving cavity 10, the driving module 22 can drive the pressing assembly 23 to move into the cleaning basket and press the pressing assembly 23 onto multiple silicon wafers, thereby allowing the pressing assembly 23 to enter the receiving cavity 10 together with the cleaning basket for cleaning. After cleaning is completed, the pressing assembly 23 is removed from the receiving cavity 10 together with the cleaning basket, and the driving module 22 drives the pressing assembly 23 away from the cleaning basket, thereby allowing the cleaning basket to be transferred to subsequent processes and avoiding interference from the pressing assembly 23 on the movement of the cleaning basket.
[0041] Of course, the cleaning device of this application embodiment can also be applied to other cleaning processes, and can be flexibly selected according to actual needs. This application embodiment does not limit this.
[0042] Optionally, such as Figure 7 and Figure 8 As shown, the cleaning device also includes a transfer mechanism 3 and a control unit (not shown in the figure). The transfer mechanism 3 is arranged opposite to the tank 1 and is used to move the material 12 into or out of the receiving cavity 10. The control unit is electrically connected to the drive module 22 and the transfer mechanism 3 respectively, and is used to control the transfer mechanism 3 to perform the transfer operation, and control the drive module 22 to run based on the transfer action of the transfer mechanism 3.
[0043] In this embodiment, a control unit is electrically connected to both the drive module 22 and the transfer mechanism 3. This allows the control unit to control the operation of both the transfer mechanism 3 and the drive module 22. During the process of the transfer mechanism 3 moving the loading component 12 into the receiving cavity 10, the drive module 22 is simultaneously controlled to move and press the tableting assembly 23 onto the component 11 to be cleaned within the loading component 12. After cleaning, the transfer mechanism 3 removes the loading component 12 from the receiving cavity 10, while the drive module 22 is simultaneously controlled to remove the tableting assembly 23 from the component 11. Thus, the control unit enables coordinated control between the transfer action of the transfer mechanism 3 and the driving action of the drive module 22, facilitating automated operation control, reducing waiting time, and improving cleaning efficiency.
[0044] Optionally, the cleaning device includes multiple tanks 1, which are arranged at intervals. Each tank 1 is provided with at least one pressing mechanism 2, and the transfer mechanism 3 can move between the multiple tanks 1.
[0045] In this embodiment, the cleaning device can be provided with multiple spaced-apart tanks 1, each tank 1 corresponding to at least one pressing mechanism 2, so that when cleaning each tank 1 is performed, the corresponding pressing mechanism 2 can be used to press and fix the parts 11 to be cleaned in the loading component 12. Furthermore, the transfer mechanism 3 can move between multiple tanks 1, so that the loading components 12 of multiple tanks 1 can be transferred using a single transfer mechanism 3, improving the utilization rate of the transfer mechanism 3, thereby helping to simplify the equipment structure and reduce equipment costs.
[0046] In some embodiments, the cleaning device may have one or more tanks 1. When there are multiple tanks 1, they can be arranged at intervals, and the transfer mechanism 3 can move between the multiple tanks 1. The specific number of tanks 1 can be flexibly set according to actual needs and is not limited here.
[0047] In some embodiments, one pressing mechanism 2 may be provided for each groove 1, or multiple pressing mechanisms 2 may be provided. Specifically, the configuration of the pressing mechanism 2 corresponding to each groove 1 can be determined according to the structure of the material carrier 12 that can be accommodated in the groove 1.
[0048] Optionally, along the direction of the interval arrangement of the multiple tanks 1 perpendicular to the direction of the interval arrangement, the transfer mechanism 3 is located on one side of the tank 1, and the pressing mechanism 2 is located on the other side of the tank 1.
[0049] In this embodiment of the application, by placing the transfer mechanism 3 on one side of the tank 1 and the pressing mechanism 2 on the other side of the tank 1, it is convenient for the transfer mechanism 3 and the pressing mechanism 2 to work together, and it is also convenient for the transfer mechanism 3 to move between multiple tanks 1, thereby improving the overall structural layout rationality of the cleaning device.
[0050] In some embodiments, the transfer mechanism 3 may be a robotic arm, such as... Figure 6 and Figure 7 As shown, the robotic arm includes a main body 31, a transfer arm 32, and a hook 33. The main body 31 is positioned opposite to the tank 1. The transfer arm 32 is connected to the main body 31 and extends above the tank 1. The hook 33 is connected to the side of the transfer arm 32 facing the tank 1. The main body 31 can drive the transfer arm 32 to move relative to the tank 1. The hook 33 on the transfer arm 32 can be used to pick up and remove a loading piece 12 containing the part 11 to be cleaned. This allows the loading piece 12 to be transferred into the tank 1 and removed from the tank 1.
[0051] The main body 31 can drive the transfer arm 32 to move vertically and horizontally, thereby adjusting the position of the transfer arm 32 relative to the tank 1 and realizing the transfer operation of the material carrier 12. Of course, the specific structure of the transfer mechanism 3 can be flexibly set according to actual needs, and is not limited here.
[0052] Optionally, such as Figure 1 and Figure 5 As shown, the drive module 22 includes a first moving module 221 and a second moving module 222. The first moving module 221 is mounted on the base 21, and the second moving module 222 is movably connected to the first moving module 221. The tablet pressing assembly 23 is movably connected to the second moving module 222. The first moving module 221 is used to drive the second moving module 222 to move up and down along the first direction Z, and the second moving module 222 is used to drive the tablet pressing assembly 23 to move along the second direction X, which is perpendicular to the first direction Z.
[0053] In this embodiment, by setting a first moving module 221 and a second moving module 222, the first moving module 221 can adjust the position of the tableting assembly 23 along the first direction Z, and the second moving module 222 can adjust the position of the tableting assembly 23 along the second direction X. This, in conjunction with the transfer mechanism 3 to transfer the material carrier 12, enables coordinated operation between the transfer operation of the material carrier 12 and the placement operation of the tableting assembly 23, facilitating operation control.
[0054] Specifically, such as Figure 5 As shown, the second moving module 222 is slidably connected to the first moving module 221 along the first direction Z. The first moving module 221 can drive the second moving module 222 to move up and down along the first direction Z. The second moving module 222 is provided with a slider 222a. The second moving module 222 can drive the slider 222a to move horizontally along the second direction X. In this way, the connector 231 in the tableting assembly 23 is fixedly connected to the slider 222a. Thus, the position of the tableting assembly 23 along the first direction Z can be adjusted by the first moving module 221, and the position of the tableting assembly 23 along the second direction X can be adjusted by the second moving module 222.
[0055] It should be noted that the first moving module 221 and the second moving module 222 can be linear moving module structures such as lead screw slider moving module, gear rack moving module, and guide rail slider moving module. The specific structure of the first moving module 221 and the second moving module 222 can be flexibly set according to actual needs, and is not limited here.
[0056] In some embodiments, the working principle of the cleaning apparatus of this application is explained as follows, taking the cleaning of silicon wafers as an example:
[0057] The control unit controls the transfer mechanism 3 to transfer the cleaning basket containing silicon wafers to a preset position above the receiving cavity 10. Simultaneously, the control unit controls the first moving module 221 to drive the second moving module 222, causing the pressing assembly 23 to rise from its initial Z-axis position along the first direction Z to a first position. Furthermore, the control unit controls the second moving module 222 to drive the pressing assembly 23 along the second direction X from its initial X-axis position to the pressing position above the cleaning basket (e.g., ...). Figure 7 As shown in the diagram, the upper pressing position is located between the cleaning basket and the transfer arm 32. When the pressing assembly 23 is in the upper pressing position, there is a gap between the pressing assembly 23 and the cleaning basket. Subsequently, the first moving module 221 drives the second moving module 222 to lower the pressing assembly 23 from the upper pressing position to the pressing position where the pressing assembly 23 contacts the silicon wafer in the cleaning basket, so as to press the silicon wafer with the pressing assembly 23.
[0058] Then, the transfer mechanism 3 is controlled by the control unit to lower the cleaning basket, while the first drive module 22 drives the pressing assembly 23 to descend synchronously. During the descent, the pressing assembly 23 is kept in contact with the silicon wafers in the cleaning basket until the cleaning basket and the pressing assembly 23 enter the receiving cavity 10 together, and the silicon wafers in the cleaning basket are completely immersed in the cleaning solution, thus performing the cleaning operation on the silicon wafers in the receiving cavity 10. During the silicon wafer cleaning operation, the transfer mechanism 3 can be controlled to separate from the cleaning basket so that the transfer mechanism 3 can move to other tanks 1 to continue the corresponding transfer operation.
[0059] After the silicon wafer cleaning is completed, the transfer mechanism 3 moves above the tank 1, then descends and picks up the cleaning basket from the receiving cavity 10. The transfer mechanism 3 then lifts the cleaning basket, while the first drive module 22 simultaneously drives the pressing assembly 23 to rise synchronously. During the ascent, the pressing assembly 23 remains in contact with the silicon wafer in the cleaning basket until the cleaning basket reaches a preset position above the receiving cavity 10. Next, the first moving module 221 operates independently to raise the pressing assembly 23 to the upper pressing position, ensuring separation of the pressing assembly 23 from the silicon wafer. Then, the second moving module 222 operates to return the pressing assembly 23 from the upper pressing position back to its initial X-axis position along the second direction X. The first moving module 221 then operates to return the pressing assembly 23 to its initial Z-axis position, thus restoring the pressing mechanism's position. Finally, the transfer mechanism 3 removes the cleaning basket from above the receiving cavity for transfer to subsequent processes.
[0060] It is understood that the operation steps of the above embodiments are for reference only. Those skilled in the art can flexibly set the operation process based on actual operation needs, and no limitation is made here.
[0061] Optionally, such as Figure 2As shown, the tableting structure 232 includes a main body 232a and a tableting part 232b. The main body 232a is connected to the other end of the connector 231, and the tableting part 232b is disposed on the side of the main body 232a along the second direction X. The tableting part 232b is used to press the cleaned part 11 in the loading part 12.
[0062] In this embodiment, the tableting structure 232 includes a main body 232a and a tableting part 232b. The main body 232a is connected to the second moving module 222 via a connector 231. The tableting part 232b is positioned on one side of the main body 232a along the second direction X. Before cleaning, the second moving module 222 moves the entire tableting assembly 23 closer to the tank 1 along the second direction X, allowing the tableting part 232b to extend above the receiving cavity 10 to press the part 11 to be cleaned. After cleaning, the second moving module 222 moves the entire tableting assembly 23 away from the tank 1 along the second direction X, allowing the tableting part 232b to move away from the top of the receiving cavity 10, thus facilitating the transfer mechanism 3 to remove the material 12 from the tank 1.
[0063] It is understood that the structure of the tablet pressing part 232b can be matched with the placement structure of the part to be cleaned 11 in the carrier 12, so that when the tablet pressing structure 232 is moved into the carrier 12, the tablet pressing part 232b can contact the part to be cleaned 11 in the carrier 12, thereby pressing and fixing the part to be cleaned 11 in the carrier 12. Exemplarily, the tablet pressing part 232b can be a plate-shaped structure or a strip-shaped structure, as long as it can meet the pressing and fixing function of the part to be cleaned 11. Those skilled in the art can flexibly set it according to actual needs, and there is no limitation here.
[0064] In some embodiments, such as Figure 2 As shown, the main body 232a has at least two pressing parts 232b on one side along the second direction X. The at least two pressing parts 232b are spaced apart along the third direction Y, which is perpendicular to the first direction Z and the second direction X, respectively.
[0065] Understandably, to improve cleaning efficiency, multiple cleaning units can be provided in the material carrier 12, and multiple parts 11 to be cleaned can be placed in each cleaning unit. Furthermore, by providing multiple pressing parts 232b on one side of the main body 232a along the second direction X, so that the multiple pressing parts 232b correspond one-to-one with the multiple cleaning units in the material carrier 12, the pressing structure 232 can simultaneously achieve the pressing action on the parts 11 to be cleaned in different areas of the material carrier 12, so as to better meet production needs and improve cleaning efficiency.
[0066] Optionally, such as Figure 3As shown, the tablet compression structure 232 includes a first connecting rod 2321, a second connecting rod 2322, and a pressure rod 2323. The first connecting rod 2321 is connected to the other end of the connector 231 to form a main body 232a. One end of the second connecting rod 2322 is connected to the first connecting rod 2321, and the other end of the second connecting rod 2322 extends along the second direction X in a direction away from the first connecting rod 2321. The pressure rod 2323 is connected to the second connecting rod 2322 to form a tablet compression portion 232b.
[0067] In this embodiment, a pressing structure 232 with a frame structure is formed by connecting the first connecting rod 2321, the second connecting rod 2322 and the pressure rod 2323. This satisfies the pressing action of the pressure rod 2323 on the part to be cleaned 11 in the material carrier 12. At the same time, the frame structure facilitates actual processing and assembly, and also reduces the overall weight of the pressing assembly 23, which facilitates the transfer operation of the drive module 22.
[0068] Specifically, two second connecting rods 2322 are arranged at intervals on one side of the first connecting rod 2321 along the second direction X, and a pressure rod 2323 is connected between the two second connecting rods 2322. The two second connecting rods 2322 and the pressure rod 2323 provided between the two second connecting rods 2322 together form a pressing part 232b.
[0069] Furthermore, such as Figure 3 As shown, a tablet pressing part 232b or multiple tablet pressing parts 232b can be provided on one side of the first connecting rod 2321 along the second direction X. A pressing rod 2323 or multiple pressing rods 2323 can be provided between the two second connecting rods 2322 corresponding to each tablet pressing part 232b.
[0070] It is understood that in each tablet compression section 232b, there may be a slotted gap between the first connecting rod 2321 and the adjacent compression rod 2323, as well as between two adjacent compression rods 2323, so that the cleaning fluid can flow freely on the upper and lower sides of the tablet compression structure 232 during the cleaning operation, thereby helping to improve the cleaning effect.
[0071] Optionally, such as Figure 4 As shown, the tablet pressing part 232b has a pressing surface, and the pressing surface is provided with a plurality of slots 2320, which are adapted to be inserted and engaged with the part 11 to be cleaned in the material carrier 12.
[0072] In this embodiment, the pressing part 232b is provided with a pressing surface, which is adapted to contact the part 11 to be cleaned in the carrier 12 to achieve the pressing action of the part 11 to be cleaned. Furthermore, a plurality of slots 2320 are provided in the pressing surface so that when the pressing structure 232 is placed in the carrier 12, each part 11 to be cleaned can be at least partially inserted into the corresponding slot 2320, thereby playing a limiting and fixing role for the part 11 to be cleaned, and avoiding large displacement of the part 11 to be cleaned during the cleaning process, which would cause damage.
[0073] The shape of the slot 2320 provided in the tablet pressing section 232b can be determined according to the structure of the part 11 to be cleaned, and is not limited here.
[0074] Optionally, this application embodiment also provides a cleaning system, including a material carrier 12 and the cleaning device in the above embodiment, wherein the material carrier 12 is used to load the parts to be cleaned into and out of the receiving cavity 10.
[0075] In this embodiment, a receiving cavity 10 is provided in the tank 1 to hold cleaning fluid for cleaning operations. A pressing mechanism 2 is provided on one side of the tank 1. The pressing mechanism 2 includes a drive module 22 and a pressing assembly 23. During the cleaning process, when the loading member 12 carries the part to be cleaned 11 into the receiving cavity 10 for cleaning, the drive module 22 can drive the pressing assembly 23 to move relative to the tank 1, so as to press and fix the part to be cleaned 11 in the loading member 12, thereby ensuring the cleaning effect of the part to be cleaned 11. Furthermore, by using the pressing mechanism 2 in this application, the position of the pressing assembly 23 can be flexibly adjusted by the drive module 22 so that the action performed by the drive module 22 can match the transfer action of the loading member 12. This can shorten the operation waiting time, improve the overall operating efficiency of the device, and also facilitate automated operation.
[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0077] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. A cleaning device, characterized in that, The cleaning device comprises a groove body, a pressing mechanism and a control member. The groove body is provided with a containing cavity for containing a carrier piece loaded with a cleaning object. The pressing mechanism comprises a base, a driving module and a pressing assembly.
2. The cleaning apparatus according to claim 1, characterized by The base is arranged on one side of the groove body. The driving module is installed on the base.
3. The cleaning apparatus of claim 2, wherein The pressing assembly is connected to the driving module.
4. The cleaning apparatus of claim 3, wherein The driving module drives the pressing assembly to move relative to the groove body so as to press and fix the cleaning object in the carrier piece by the pressing assembly.
5. The cleaning apparatus of claim 4, wherein The driving module comprises a first moving module and a second moving module.
6. The cleaning apparatus of claim 4, wherein The first moving module is installed on the base. The second moving module is movably connected to the first moving module.
7. The cleaning apparatus of any one of claims 1-6, wherein, The pressing assembly is movably connected to the second moving module.
8. The cleaning apparatus of claim 7, wherein The first moving module drives the second moving module to move up and down in a first direction.
9. The cleaning apparatus of claim 8, wherein The second moving module drives the pressing assembly to move in a second direction perpendicular to the first direction.
10. A cleaning system characterized by, The pressing assembly comprises a connecting piece and a pressing structure. One end of the connecting piece is connected to the second moving module. The second moving module drives the connecting piece to move in the second direction. The pressing structure is connected to the other end of the connecting piece. The pressing structure is used to press the cleaning object in the carrier piece. The pressing structure comprises a main body and a pressing part. The main body is connected to the other end of the connecting piece. The pressing part is arranged on one side of the main body along the second direction. The pressing part is used to press the cleaning object in the carrier piece. The pressing structure comprises a first connecting rod, a second connecting rod and a pressing rod. The first connecting rod is connected to the other end of the connecting piece to form the main body. One end of the second connecting rod is connected to the first connecting rod. The other end of the second connecting rod extends in the second direction away from the first connecting rod. The pressing rod is connected to the second connecting rod to form the pressing part. The pressing part has a pressing surface provided with a plurality of clamping grooves. The clamping grooves are adapted to be inserted and matched with the cleaning object in the carrier piece. At least two pressing parts are arranged on one side of the main body along the second direction. The at least two pressing parts are arranged in a third direction perpendicular to the first direction and the second direction. The cleaning device further comprises a carrier moving mechanism and a control member. The carrier moving mechanism is arranged opposite to the groove body. The carrier moving mechanism is used to move the carrier piece into or out of the containing cavity. The control member is electrically connected to the driving module and the carrier moving mechanism. The control member controls the carrier moving mechanism to perform the moving operation and controls the driving module to operate based on the moving action of the carrier moving mechanism. The cleaning device comprises a plurality of groove bodies. The plurality of groove bodies are arranged in intervals. Each groove body is provided with at least one pressing mechanism. The carrier moving mechanism can move between the plurality of groove bodies. The carrier moving mechanism is arranged on one side of the groove body. The pressing mechanism is arranged on the other side of the groove body. The carrier member is used to load the washing member into and out of the accommodating cavity.