Protective device of wafer sensor

Abstract

The utility model discloses a protection device of a wafer sensor. The protection device comprises a drainage groove. The wafer sensor is arranged on the outer wall of the process module. The process module is of a box structure, and the top is provided with an overflow edge. The drainage groove is formed in the outer wall between the top surface of the wafer sensor and the overflow edge, a gap is formed between an outlet of the drainage groove and the wafer sensor, and an overflow-free liquid flowing area is formed on the peripheral side of the wafer sensor. According to the utility model, the wafer sensor can be protected and prevented from being influenced by overflow, so that the false alarm probability of the wafer sensor is reduced, and the service life of the wafer sensor is prolonged.

Description

Technical Field

[0001] This utility model relates to a semiconductor integrated circuit manufacturing equipment, and particularly to a protection device for a wafer sensor. Background Technology

[0002] Chemical mechanical polishing (CMP) plays a crucial role in the front-side thinning process of wafers. Since advanced CMP equipment often requires thousands of sensors, their sensitivity is critical to stable production. Some existing CMP equipment use an overflow cleaning method for their drying modules, which keeps the wafer sensors constantly damp, increasing the probability of false alarms.

[0003] like Figure 1A The image shown is a front view of an existing process module equipped with wafer sensors, specifically the view corresponding to the XZ plane; as shown... Figure 1B The image shows a side view of an existing process module equipped with a wafer sensor, i.e., the view corresponding to the YZ plane. The wafer sensor is installed on the outer wall of the drying module 101, which has a tank structure, and adopts a magnetic patch design. The wafer sensor includes a transmitter 2021 and a receiver 2022. Figure 1B In the other wafer sensor, the transmitter is marked 2021' and the receiver is marked 2022'.

[0004] To ensure a clean environment, the inner tank of the drying module 101 adopts an overflow design, as shown by arrow 103. The overflowing deionized water (DIW) will extend along the outer wall of the inner tank to the receiving end 2022 of the wafer sensor, thereby affecting the light intensity value of the receiving end 2022. This makes the wafer sensor prone to false alarms and reduces its service life. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a protection device for wafer sensors, which can protect wafer sensors and prevent wafer sensors from being affected by overflow current, thereby reducing the probability of false alarms of wafer sensors and extending the service life of wafer sensors.

[0006] To solve the above-mentioned technical problems, the wafer sensor protection device provided by this utility model includes: a flow channel.

[0007] The wafer sensor is mounted on the outer wall of the process module, which has a box-like structure and an overflow edge at the top.

[0008] The drainage channel is disposed on the outer wall between the top surface of the wafer sensor and the overflow edge, and there is a gap between the outlet of the drainage channel and the wafer sensor, forming a non-overflow liquid flow zone around the wafer sensor.

[0009] A further improvement is that the wafer sensor includes a transmitter and a receiver, the transmitter being disposed on a first side of the outer wall and the receiver being disposed on a second side of the outer wall, the first side and the second side being a pair of opposing sides.

[0010] A further improvement is that the signal emitted by the transmitting end is an optical signal.

[0011] A further improvement is that the structure in which the transmitter and receiver are fixed to the outer wall includes a magnetic patch.

[0012] A further improvement is that the drainage groove is disposed on the second side of the top of the receiving end.

[0013] A further improvement is that the groove structure of the drainage channel is U-shaped.

[0014] A further improvement is that the side of the drainage channel has a strip-shaped structure;

[0015] The drainage channel is inclinedly disposed on the outer wall, and the outlet of the drainage channel is located at the lowest end of the inclined drainage channel.

[0016] A further improvement is that the process module is the drying module of a CMP machine.

[0017] A further improvement is that the number of the wafer sensors includes multiple sensors.

[0018] In this application, by setting a drainage groove on the outer wall between the top surface of the wafer sensor and the overflow edge, dry and wet separation can be achieved, so that the wafer sensor is in the dry area corresponding to the area where there is no overflow liquid flow. This can prevent the adverse effects of moisture on the wafer sensor. Therefore, this utility model can protect the wafer sensor and avoid the wafer sensor from being affected by overflow, thereby reducing the probability of false alarms of the wafer sensor and extending the service life of the wafer sensor. Attached Figure Description

[0019] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0020] Figure 1A This is a front view of an existing process module equipped with wafer sensors;

[0021] Figure 1B This is a side view of an existing process module equipped with wafer sensors;

[0022] Figure 2A This is a side view of a process module equipped with a wafer sensor and a protection device according to an embodiment of the present invention;

[0023] Figure 2B This is a front view of a process module equipped with a wafer sensor and a protection device according to an embodiment of the present invention. Detailed Implementation

[0024] like Figure 2A The image shown is a side view of the process module 201 equipped with a wafer sensor and a protection device according to an embodiment of this utility model; that is, the view corresponding to the YZ plane. Figure 2B The image shown is a front view of a process module 201 equipped with a wafer sensor and a protection device according to an embodiment of the present invention, i.e., the view corresponding to the XZ plane; the protection device for the wafer sensor provided by the present invention includes: a flow channel 204.

[0025] The wafer sensor is mounted on the outer wall of the process module 201, which has a box structure and an overflow edge at the top.

[0026] In this embodiment of the application, the wafer sensor includes a transmitter 2021 and a receiver 2022. The transmitter 2021 is disposed on a first side of the outer wall, and the receiver 2022 is disposed on a second side of the outer wall. The first side and the second side are a pair of opposite sides.

[0027] The signal emitted by the transmitter 2021 is an optical signal.

[0028] In some embodiments, the structure for fixing the transmitter 2021 and the receiver 2022 to the outer wall includes magnetic patches. In other embodiments, the transmitter 2021 and the receiver 2022 may also be fixed to the outer wall using other structures such as screws, as needed.

[0029] The drainage channel 204 is disposed on the outer wall between the top surface of the wafer sensor and the overflow edge. There is a gap between the outlet of the drainage channel 204 and the wafer sensor, and a non-overflow liquid flow zone is formed on the periphery of the wafer sensor.

[0030] like Figure 2A As shown in this embodiment, the drainage groove 204 is disposed on the second side of the top of the receiving end 2022. This protects the receiving end 2022. In other embodiments, the drainage groove 204 can also be disposed on the first side of the top of the transmitting end 2021 as needed.

[0031] Figure 2A The image also shows an enlarged view of the drainage groove 204, which is composed of... Figure 2A As shown, the groove structure of the drainage groove 204 is U-shaped.

[0032] like Figure 2BThe side of the drainage groove 204 has a strip-shaped structure.

[0033] The drainage channel 204 is inclinedly disposed on the outer wall, and the outlet of the drainage channel 204 is located at the lowermost end of the inclined drainage channel 204. Figure 2A As indicated by arrow 203, the overflowing liquid will be collected by the drainage channel 204; Figure 2B As can be seen from arrow line 205, since the drainage channel 204 is inclined, after the liquid enters the drainage channel 204, it will flow along arrow line 205 under the action of gravity and finally flow out from the outlet of the drainage channel 204. Since the outlet of the drainage channel 204 is far away from the wafer sensor, it will not affect the peripheral area of ​​the wafer sensor, so that the peripheral area of ​​the wafer sensor remains a dry area, achieving dry and wet separation.

[0034] In this embodiment, the process module 201 is the drying module of a CMP machine.

[0035] The number of wafer sensors includes multiple sensors. Figure 2A The image shows two wafer sensors. The transmitter of the other wafer sensor is marked with a separate label 2021' and the receiver is marked with a separate label 2022'. The two wafer sensors are placed vertically and aligned, so they can share a single drainage channel 204.

[0036] In this embodiment, by providing a drainage groove 204 on the outer wall between the top surface of the wafer sensor and the overflow edge, dry and wet separation can be achieved, so that the wafer sensor is in the dry area corresponding to the area where there is no overflow liquid flow. This can prevent the adverse effects of moisture on the wafer sensor. Therefore, this embodiment can protect the wafer sensor and avoid the wafer sensor from being affected by overflow, thereby reducing the probability of false alarms of the wafer sensor and extending the service life of the wafer sensor.

[0037] The present invention has been described in detail above through specific embodiments, but these are not intended to limit the present invention. Many modifications and improvements can be made by those skilled in the art without departing from the principles of the present invention, and these should also be considered within the scope of protection of the present invention.

Claims

1. A wafer sensor protection device, comprising: The application relates to a wafer sensor and a process module. The wafer sensor is arranged on the outer wall of the process module, which is in a box structure and has an overflow edge on the top. The drain groove is arranged on the outer wall between the top surface of the wafer sensor and the overflow edge, and a space is formed between the outlet of the drain groove and the wafer sensor, and the circumferential side of the wafer sensor forms a no-overflow liquid flow area. The wafer sensor comprises a transmitting end and a receiving end, the transmitting end is arranged on the first side of the outer wall, and the receiving end is arranged on the second side of the outer wall, and the first side and the second side are a pair of opposite sides.

2. The wafer sensor protection apparatus of claim 1, wherein: The signal transmitted by the transmitting end is an optical signal.

3. The wafer sensor protection apparatus of claim 2, wherein: The structure for fixing the transmitting end and the receiving end on the outer wall comprises a magnetic patch.

4. The wafer sensor protection apparatus of claim 2, wherein: The drain groove is arranged on the second side on the top of the receiving end.

5. The wafer sensor protection apparatus of claim 2, wherein: The groove structure of the drain groove is in a U-shaped structure.

6. The wafer sensor protection apparatus of claim 1, wherein: The side of the drain groove is in a strip-shaped structure.

7. The wafer sensor protection apparatus of claim 6, wherein: The drain groove is arranged on the outer wall in an inclined manner, and the outlet of the drain groove is located at the lowermost end of the drain groove arranged in an inclined manner. The process module is a drying module of a CMP machine.

8. The wafer sensor protection apparatus of claim 1, wherein: The number of the wafer sensors comprises a plurality.

9. The wafer sensor protection apparatus of claim 2, wherein: ​

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