Apparatus for manufacturing display device

Abstract

The utility model relates to an apparatus for manufacturing a display device. The apparatus may include: a chamber; a base disposed in the chamber; a diffuser facing the base; a shadow frame disposed between the base and the diffuser; a fixing member provided on at least one of a plurality of inner sides of the chamber; and a flow control member disposed on the at least one of the plurality of inner sides of the chamber to correspond to the fixing member, and including at least a portion disposed under the base, in which the flow control member is slidable in a direction when coupled to the fixing member.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2024-0044932, filed on April 2, 2024, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] One or more embodiments relate to an apparatus for manufacturing a display apparatus and a method of manufacturing a display apparatus, and the display apparatus can include a light emitting diode. BACKGROUND

[0004] A display apparatus visually displays data. The display apparatus can provide an image by using a light emitting diode. The use and structure of the display apparatus have become more diversified, and a structure that can be bent from an approximately flat state to have a certain angle has also been developed.

[0005] A display apparatus can include a plurality of pixels arranged in a pattern to provide an image. A number of layers including an emission layer can be included in the pixels arranged in a pattern. The number of layers can be arranged on a substrate in different patterns according to their types. SUMMARY

[0006] Each layer of the display apparatus can be formed by depositing a deposition material by using a mask having an opening corresponding to a pattern to be formed on a substrate. The deposition material can be deposited in a chamber of an apparatus for manufacturing a display apparatus. After the deposition material is deposited on the substrate, a cleaning material can be injected into the chamber to remove the deposition material remaining in the chamber. The flow rate of the cleaning material can vary according to regions in the chamber, and sufficient cleaning of the deposition material can not be performed in a specific region having a low flow rate.

[0007] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the description, or can be learned by practice of the present embodiments.

[0008] According to one or more embodiments, an apparatus for manufacturing a display apparatus can include a chamber having a plurality of inner sides, a susceptor disposed in the chamber, a diffuser facing the susceptor, a shadow frame disposed between the susceptor and the diffuser, a fixing member disposed on at least one of the plurality of inner sides of the chamber, and a flow control member disposed on the at least one of the plurality of inner sides of the chamber to correspond to the fixing member, and the flow control member includes at least a portion disposed under the susceptor, wherein the flow control member can be slidable in a direction after being coupled to the fixing member.

[0009] One of the flow control member and the fixing member can include a protrusion protruding in a direction different from the direction in which the flow control member slides, and the other of the flow control member and the fixing member can include a receiving portion in which the protrusion can be embedded.

[0010] The flow control member can be coupled to the fixing member by sliding the protrusion into the receiving portion in a direction perpendicular to the direction in which the protrusion protrudes.

[0011] The flow control member can include a first portion contacting the at least one of the plurality of inner sides of the chamber and a second portion protruding in a direction substantially perpendicular to the at least one of the plurality of inner sides of the chamber.

[0012] An end of the second portion can be rounded.

[0013] The second portion can overlap the shadow frame.

[0014] The flow control member can further include a third portion disposed at an end of the second portion, and an upper surface of the third portion can be disposed at a higher position than an upper surface of the second portion.

[0015] The at least one of the plurality of inner sides of the chamber can include a groove in which at least a portion of the fixing member can be embedded.

[0016] The fixing member can include a first portion embedded in the groove and partially filling the groove, and a second portion protruding to an outside of the groove and coupled to the flow control member.

[0017] In a first area adjacent to a corner of the chamber, a space above the flow control member and a space below the flow control member can be in a fluid communication state.

[0018] According to one or more embodiments, a method of manufacturing a display apparatus can include providing an apparatus for manufacturing the display apparatus, the apparatus including a chamber including a plurality of inner sides; depositing a deposition material on a substrate in the chamber and using a mask; and cleaning an inside of the chamber with a cleaning material, wherein the apparatus for manufacturing the display apparatus can include a fixing member disposed on at least one of the plurality of inner sides of the chamber and a flow control member disposed in the chamber, the flow control member being slidable in a direction when coupled to the fixing member, a flow of the cleaning material can be guided by the flow control member during the cleaning of the inside of the chamber.

[0019] One of the flow control member and the fixing member can include a protrusion protruding in a direction different from the one direction, and the other of the flow control member and the fixing member can include a receiving portion in which the protrusion can be embedded.

[0020] The flow control member can be coupled to the fixing member by sliding the protrusion into the receiving portion in a direction perpendicular to the direction in which the protrusion protrudes.

[0021] The flow control member can include a first portion contacting the at least one of the plurality of inner sides of the chamber and a second portion protruding in a direction substantially perpendicular to the at least one of the plurality of inner sides of the chamber.

[0022] An end of the second portion can be rounded.

[0023] The flow control member can further include a third portion disposed at an end of the second portion, wherein an upper surface of the third portion can be disposed at a higher position than an upper surface of the second portion.

[0024] The at least one of the plurality of inner sides of the chamber can include a groove in which at least a portion of the fixing member can be embedded.

[0025] The fixing member can include a first portion embedded in the groove and partially filling the groove and a second portion protruding to an outside of the groove and coupled to the flow control member.

[0026] In the cleaning of the interior of the chamber, a flow of the cleaning material can be guided to at least one of a plurality of corners inside the chamber by the flow control member.

[0027] In the cleaning of the interior of the chamber, a flow of the cleaning material between an upper side and a lower side inside the chamber can be substantially performed in at least one of a plurality of corners inside the chamber. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other aspects, features, and advantages of certain embodiments will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a schematic plan view illustrating an apparatus for manufacturing a display apparatus according to an embodiment;

[0030] Figure 2 is a schematic sectional view illustrating the apparatus for manufacturing a display apparatus taken along line II-II' of Figure 1 ;

[0031] Figure 3 is a schematic cross-sectional view showing the device for manufacturing a display apparatus taken along a line III-III' of Figure 1

[0032] Figure 4 is a perspective view showing a flow control member according to an embodiment;

[0033] Figure 5 is a perspective view showing a flow control member and a fixing member according to an embodiment;

[0034] Figure 6 is a perspective view showing a flow control member and a fixing member according to an embodiment from a different angle;

[0035] Figure 7 is a schematic cross-sectional view showing a state in which the flow control member and the fixing member can be coupled to each other according to an embodiment;

[0036] Figure 8 is a bottom view showing a state in which the flow control member and the fixing member can be coupled to each other according to an embodiment;

[0037] Figure 9 and Figure 10 is a perspective view showing a state in which the flow control member and the fixing member can be coupled to each other according to an embodiment;

[0038] Figure 11 is a schematic cross-sectional view schematically showing an inner side of a flow control member, a fixing member, and a chamber that can be coupled to each other;

[0039] Figure 12 is a schematic plan view schematically showing a device for manufacturing a display apparatus according to an embodiment;

[0040] Figure 13 is a schematic cross-sectional view showing a step (e.g., a single step) in a process of a method of manufacturing a display apparatus according to an embodiment;

[0041] Figure 14 is a schematic cross-sectional view showing a step in a process of a method of manufacturing a display apparatus according to an embodiment;

[0042] Figure 15A is a schematic plan view showing a step in a process of a method of manufacturing a display apparatus according to a first embodiment;

[0043] Figure 15B is a schematic plan view showing a step (e.g., a single step) in a process of a method of manufacturing a display apparatus according to a second embodiment; ​

[0044] Figure 16 is a schematic plan view showing a display device manufactured by using an apparatus for manufacturing a display device according to an embodiment; and

[0045] Figure 17 is a schematic cross-sectional view of the display device taken along the line XVII-XVII' of Figure 16 DETAILED DESCRIPTION

[0046] In the following description, for the purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words that refer to non-limiting examples of apparatuses or methods disclosed herein. It is apparent, however, that various embodiments can be practiced without these specific details or with one or more equivalent arrangements. Herein, various embodiments are not necessarily mutually exclusive, nor are they necessarily all inclusive of each other. For example, specific shapes, configurations, and features of an embodiment can be used or implemented in another embodiment.

[0047] Unless otherwise indicated, embodiments shown are understood to provide features of the present disclosure. Thus, features, components, modules, layers, films, panels, regions, and / or aspects of various embodiments (hereinafter, individually or collectively referred to as "elements") can be combined, separated, interchanged, and / or rearranged, unless otherwise indicated, without departing from the present disclosure.

[0048] The use of cross-hatching and / or shading in the drawings is generally provided to illustrate the boundaries, edges, and / or surfaces of elements of the present disclosure. Unless otherwise specified, the presence or absence of cross-hatching and / or shading in no way limits or affects the scope of the present disclosure. In addition, for clarity and / or description purposes, the size of elements and / or regions can be exaggerated and / or not drawn to scale. When an embodiment can be implemented differently, a specific process sequence can be performed in a different order than described. For example, two consecutively described processes can be substantially simultaneously performed, or performed in an order opposite to that described. Moreover, the same reference numbers or reference characters can refer to the same elements.

[0049] ​When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or an intermediary element or layer may be present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, an intermediary element or layer is not present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without an intermediary element. Furthermore, the x, y, and z directions are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x, y, and z directions can be perpendicular to each other, or they can be different directions that are not perpendicular to each other.

[0050] For the purposes of this disclosure, "at least one of A and B" can be interpreted as only A, only B, or any combination of A and B. Furthermore, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0051] Although the terms “first” and “second” are used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, a first element can be named a second element.

[0052] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein to describe the relationship of one element to another (or multiple elements) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are also intended to cover different orientations of the device during use, operation, and / or manufacture. For example, if the device is flipped in the drawings, an element described as “below” or “under” other elements or features will subsequently be oriented “above” other elements or features. Thus, the term “below” can cover both above and below orientations. Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0053] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” as used herein are also intended to include the plural forms. Furthermore, when used in this specification, the terms “comprises,” “comprising,” and / or “includes,” indicate the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. It should also be noted that the terms “substantially,” “about,” and similar terms as used herein are used as approximate terms and not as terms of degree, and therefore are used to explain the inherent deviations in measurements, calculated values, and / or provided values ​​that will be recognized by those skilled in the art.

[0054] Various embodiments are described herein with reference to cross-sectional and / or exploded views as schematic diagrams of examples and / or intermediate structures. Therefore, variations in the shapes shown in the drawings will be expected due to factors such as manufacturing techniques and / or tolerances. Consequently, the embodiments disclosed herein should not be construed as limited to the specific shapes of the regions shown, but will include deviations in shape caused, for example, by manufacturing processes. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the precise shapes of the regions of the device, and are therefore not intended to be limiting.

[0055] In accordance with the conventions of the art, some embodiments are described and illustrated in the accompanying drawings from the perspective of functional blocks, components, and / or modules. Those skilled in the art will understand that these blocks, components, and / or modules are physically implemented by electronic (or optical) circuitry such as logic circuits, discrete components, microprocessors, hardwired circuits, memory elements, and wiring connections. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Where blocks, components, and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform the various functions discussed herein, and optionally can be driven by firmware and / or software. It is also contemplated that each block, component, and / or module may be implemented by dedicated hardware or as a combination of dedicated hardware performing some functions and processors performing other functions (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, without departing from the scope of the present invention, each block, component, and / or module of some embodiments may be physically separated into two or more interacting and discrete blocks, components, and / or modules. Furthermore, without departing from the scope of this invention, each block, component, and / or module of some embodiments may be physically combined into more complex blocks, components, and / or modules.

[0056] Unless otherwise defined or implied herein, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that, unless expressly defined herein, terms (such as those defined in a general dictionary) should be interpreted as having a meaning consistent with their context in the relevant field and their meaning in this disclosure, and should not be interpreted in an idealized or overly formal sense.

[0057] Figure 1 This is a schematic plan view illustrating an apparatus for manufacturing a display device according to an embodiment. Figure 2 It shows along Figure 1 A schematic cross-sectional view of an apparatus for manufacturing a display device, taken from line II-II'. Figure 3 It shows along Figure 1 A schematic cross-sectional view of a device for manufacturing a display device, taken from line III-III'.

[0058] Reference Figures 1-3 The apparatus 100 for manufacturing display devices may include a chamber 110, a flow control member 120, a fixing member 121, a shadow frame 130, a susceptor 140, a mask support 150, a deposition mask 151, a diffuser 160, and a pressure regulating member 180.

[0059] Room 110 may have interior space, and althoughFigures 1-3 Although not shown, a portion of chamber 110 may be open. A gate valve may be provided at the open portion of chamber 110. Depending on the operation of the gate valve, the open portion of chamber 110 may be opened or closed.

[0060] The flow control member 120 may be disposed (or positioned) on the inner side 110-1 of the chamber 110, or may be fixed to the inner side 110-1 of the chamber 110. In the embodiment and as shown in FIG. 1, in the plan view, the interior of the chamber 110 may have a substantially quadrilateral shape, and the flow control member 120 may extend in the same direction as the inner side 110-1 of the chamber 110, and may be disposed on the inner side 110-1 of the chamber 110. For example, the inner side 110-1 of the chamber 110 may extend in the x-direction or y-direction, and the flow control member 120 may also extend entirely in the x-direction or y-direction. The x-direction length or y-direction length of the flow control member 120 may be less than the x-direction length or y-direction length of the inner side 110-1 of the chamber 110. Therefore, the flow control member 120 may not be disposed in a specific region of the chamber 110. For example, the flow control member 120 may not be disposed in a first region SPC adjacent to each corner of the chamber 110.

[0061] The flow control member 120 may include: a first portion 120-1 that contacts (e.g., directly contacts) the inner side 110-1 of the chamber 110; a second portion 120-2 that protrudes substantially perpendicularly from the inner side 110-1 of the chamber 110; and a third portion 120-3 formed at the end of the second portion 120-2. In an embodiment, the flow control member 120 may extend entirely in the x-direction, and the second portion 120-2 of the flow control member 120 may protrude in a direction perpendicular to the x-direction (e.g., the y-direction). In an embodiment, the flow control member 120 may extend entirely in the y-direction, and the second portion 120-2 of the flow control member 120 may protrude in a direction perpendicular to the y-direction (e.g., in the x-direction). The more detailed structure of the first portion 120-1, the second portion 120-2, and the third portion 120-3 of the flow control member 120 will be described later.

[0062] The fixing member 121 may be disposed on the inner side 110-1 of the chamber 110. In an embodiment, the fixing member 121 may be fixed to the wall defining the inner side 110-1 of the chamber 110. In an embodiment, the fixing member 121 may be embedded in the wall defining the inner side 110-1 of the chamber 110. For example, a groove 110-2 may be formed in the wall defining the inner side 110-1 of the chamber 110, and the fixing member 121 may be embedded in (or accommodated) in the groove 110-2.

[0063] The flow control member 120 and the fixing member 121 can be coupled to each other. In an embodiment, the fixing member 121 can be fixed to the inner side 110-1 of the chamber 110, and the flow control member 120 can be coupled to the fixing member 121 to be fixed to the inner side 110-1 of the chamber 110. The methods of coupling the flow control member 120 to the fixing member 121 and the methods of fixing the fixing member 121 to the inner side 110-1 of the chamber 110 will be described in detail below.

[0064] A shadow frame 130 can be disposed on the flow control member 120. The shadow frame 130 can secure the deposition mask 151 to the mask holder 150 by holding the deposition mask 151 between the shadow frame 130 and the mask holder 150. The shadow frame 130 may include an opening in its central portion that overlaps with the base 140. Although in Figure 1 In this embodiment, the shadow frame 130 has a generally quadrilateral shape with rounded corners, but this disclosure is not limited thereto. A portion of the shadow frame 130 may overlap with the flow control member 120. For example, a portion of the shadow frame 130 may overlap with the third portion 120-3 of the flow control member 120. As another example, the shadow frame 130 may overlap with portions of the third portion 120-3 and the second portion 120-2 of the flow control member 120. The shadow frame 130 can be raised or lowered in the z-direction by a separate linear actuator (not shown), and therefore, the spacing between the shadow frame 130 and the mask support 150, as well as the spacing between the shadow frame 130 and the flow control member 120, can be adjusted. Figure 2 In the middle, the shadow frame 130 can be lowered to contact the flow control member 120.

[0065] The base 140 may be disposed below the shadow frame 130 and the deposition mask 151. The base 140 may support and heat the substrate during the deposition process. The base 140 may include a separate heat source (not shown) that can heat the substrate disposed on the upper surface (or top surface) of the base 140. The base 140 may extend into the chamber 110 via a base support 140-1. For example, the base 140 may be raised or lowered in the z-direction by a linear actuator (not shown) separately provided in the base support 140-1.

[0066] A mask holder 150 may be disposed between the shadow frame 130 and the base 140. The mask holder 150 may have an open central portion, similar to the shadow frame 130. The openings of the shadow frame 130 and the mask holder 150 may overlap with the base 140. The mask holder 150 may extend to a lifting member 150-1 that may be disposed below the mask holder 150. For example, the mask holder 150 may be raised or lowered in the z-direction by a linear actuator (not shown) separately provided in the lifting member 150-1, and thus the spacing between the shadow frame 130 and the mask holder 150 may be adjusted. Therefore, the deposition mask 151 may be held between the shadow frame 130 and the mask holder 150.

[0067] A deposition mask 151 may be disposed between a shadow frame 130 and a mask holder 150, and held thereby by the shadow frame 130 and the mask holder 150. However, the deposition mask 151 may not always be held by the shadow frame 130 and the mask holder 150. Since the spacing between the shadow frame 130 and the mask holder 150 can be adjusted as described above, the deposition mask 151 can be released. The deposition mask 151 may be externally loaded into the chamber 110 or may be replaced. The deposition mask 151 may include a plurality of openings 151H, and the openings 151H of the deposition mask 151 may define an area in which the deposition material is deposited. This disclosure is not limited to... Figure 1 The shape or size of the opening 151H of the deposition mask 151 shown.

[0068] The diffuser 160 may face the deposition mask 151 and the base 140. In an embodiment, the deposition material may be contained within the diffuser 160 or may be supplied externally. In an embodiment, the diffuser 160 may vaporize or sublimate the deposition material by applying heat to it. In an embodiment, the diffuser 160 may receive gaseous deposition material externally. In an embodiment, the diffuser 160 may include a nozzle through which the gaseous deposition material is diffused into the chamber 110. The diffuser 160 may be fixed to the interior of the chamber 110 or may be disposed within the chamber 110 for linear movement in one direction (e.g., a single direction). For ease of illustration, the following detailed description will assume that the diffuser 160 may be fixed to the interior of the chamber 110.

[0069] The pressure regulating component 180 can extend into the chamber 110 to regulate the pressure within the chamber 110. For example, the pressure regulating component 180 can regulate the pressure in the chamber 110 to be equal to or approximately atmospheric pressure. Furthermore, the pressure regulating component 180 can regulate the pressure in the chamber 110 to be equal to or approximately a vacuum.

[0070] The pressure regulating component 180 may include a connecting pipe 182 connected to the chamber 110 and a pump 181 provided in the connecting pipe 182. Depending on the operation of the pump 181, outside air may be introduced through the connecting pipe 182 or gas in the chamber 110 may be discharged to the outside through the connecting pipe 182.

[0071] Figure 4 This is a perspective view showing a flow control component according to an embodiment. Figure 5 This is a perspective view showing the flow control member and the fixing member according to an embodiment. Figure 6 The images show perspective views of the flow control member and the fixing member from different angles according to an embodiment.

[0072] Reference Figures 4-6 The flow control member 120 may have a shape that extends integrally in one direction. For example, the flow control member 120 may have a shape that extends integrally in the y-direction. The flow control member 120 may protrude in a direction perpendicular to the direction of extension. For example, the flow control member 120 may extend integrally in the y-direction and may protrude in an x-direction that may be substantially perpendicular to the y-direction. The x-direction length of the portion of the flow control member 120 that protrudes in the x-direction may be less than the y-direction length (i.e., the total length of the flow control member 120 extending in the y-direction). In other words, the flow control member 120 may have a generally L-shaped cross-section that extends in one direction (e.g., the y-direction). However, the flow control member 120 may not necessarily extend in the y-direction and protrude in the x-direction. In another embodiment, the flow control member 120 may extend in the x-direction and protrude in the y-direction. For ease of explanation, the following description will assume that the flow control member 120 extends in the y-direction and protrudes in the x-direction.

[0073] The flow control member 120 may include a first portion 120-1, a second portion 120-2, and a third portion 120-3. Viewed from the y-direction side, the first portion 120-1 of the flow control member 120 may extend in one direction (e.g., the z-direction). The first portion 120-1 may be as shown in reference... Figures 1-3 The inner side 110-1 of the described contact chamber (see Figure 2The second portion 120-2 of the flow control member 120, when viewed from the y-direction side, may extend in one direction (e.g., the x-direction). In other words, the second portion 120-2 of the flow control member 120 may protrude from the first portion 120-1 in a direction substantially perpendicular to the direction in which the first portion 120-1 extends (e.g., the z-direction). The third portion 120-3 of the flow control member 120 may be formed at the end (e.g., the end in the x-direction) of the second portion 120-2. The third portion 120-3 may be a rounded end of the second portion 120-2. In an embodiment, the thickness (or z-direction length) of the third portion 120-3 may be greater than the thickness (or z-direction length) of the second portion 120-2. In an embodiment, the upper surface of the third portion 120-3 (e.g., the surface facing the +z direction) may be positioned higher than the upper surface (or the surface facing the +z direction) of the second portion 120-2. The first portion 120-1, the second portion 120-2, and the third portion 120-3 of the flow control member 120 can be formed separately and then coupled, or they can be integral with each other. As described above, the flow control member 120 can extend integrally in one direction (e.g., the y-direction), and the first portion 120-1, the second portion 120-2, and the third portion 120-3 of the flow control member 120 can also extend in one direction (e.g., the y-direction).

[0074] The flow control member 120 may include a receiving portion 120-R formed in a first portion 120-1. The receiving portion 120-R may be a groove formed in the first portion 120-1 of the flow control member 120 to receive a protrusion 121-P of the fixing member 121, which will be described later. Multiple receiving portions 120-R may be provided in the flow control member 120 (e.g., a single flow control member 120). In embodiments and as described... Figure 5 As shown, the flow control member 120 may include, for example, four receiving portions 120-R. However, this disclosure is not limited to this number. The receiving portions 120-R may be disposed on one of the surfaces of the first portion 120-1 of the flow control member 120, opposite to the surface on which the second portion 120-2 may be disposed. For example, among the multiple surfaces of the first portion 120-1, the second portion 120-2 may protrude from the surface facing the +x direction, and the receiving portions 120-R may be formed in the surface facing the -x direction.

[0075] like Figure 5As shown, the fixing member 121 can extend integrally in one direction (e.g., the y-direction), just like the flow control member 120. The length (e.g., the y-direction length) of the fixing member 121 extending along the aforementioned direction can be less than the y-direction length of the flow control member 120. Therefore, and as... Figure 5 As shown, the fixing member 121 can be paired with a plurality of flow control members 120.

[0076] like Figure 6 As shown, the fixing member 121 may include a body 121-1, a protrusion 121-P, and a plurality (e.g., two) openings 121-2 formed in the body 121-1. (See also...) Figure 2 The portion of the fixing member 121 embedded in the wall of the inner side 110-1 of the limiting chamber 110 can be the main body 121-1 of the fixing member 121. The groove 110-2 formed in the wall can be configured to receive the main body 121-1 of the fixing member 121. Viewed from the x-direction, in Figure 5 and Figure 6 In this design, the main body 121-1 of the fixing member 121 has a quadrilateral shape with rounded corners, and the shape of the main body 121-1 can be changed in various ways. The opening 121-2 formed in the main body 121-1 of the fixing member 121 can be a hole, for a device (e.g., a screw BT) for fixing the fixing member 121 to the inner side 110-1 of the chamber 110. (See also...) Figure 11 The opening 121-2 of the fixing member 121 can pass through the body 121-1.

[0077] The protrusion 121-P of the fixing member 121 may protrude from the body 121-1 in one direction (e.g., the x-direction). In an embodiment, the protrusion 121-P may have a substantially coin-shaped form, and the diameter of the coin-shaped form may be greater than the z-direction length of the body 121-1 of the fixing member 121. The portion having the coin-shaped form may extend to the body 121-1 through a connecting portion having a diameter smaller than the diameter of the coin-shaped form. In another embodiment, the portion having the coin-shaped form and the connecting portion may together constitute the protrusion 121-P.

[0078] The protrusion 121-P can be embedded in the receiving portion 120-R of the flow control member 120. When the protrusion 121-P is embedded in the receiving portion 120-R, the receiving portion 120-R of the flow control member 120 and the protrusion 121-P of the fixing member 121 can engage with each other. For example, and as... Figure 5 and Figure 6As shown, the protrusion 121-P can have the coin shape described above, and the receiving portion 120-R can be a slot formed to receive the coin shape. In an embodiment, the opening 121-2 of the fixing member 121 can be arranged symmetrically with respect to the protrusion 121-P of the fixing member 121. For example, the opening 121-2 of the fixing member 121 can be arranged symmetrically along the y-direction with respect to the protrusion 121-P.

[0079] Figure 7 This is a schematic cross-sectional view showing the state in which the flow control component and the stationary component can be coupled to each other according to an embodiment. Figure 8 This is a bottom view showing the state in which the flow control component and the stationary component can be coupled to each other according to an embodiment.

[0080] Reference Figure 7 and Figure 8 The flow control member 120 and the fixing member 121 can extend to each other through the engagement between the receiving portion 120-R and the protrusion 121-P.

[0081] The receiving portion 120-R of the flow control member 120 may be a groove formed in the first portion 120-1 of the flow control member 120. For example, the receiving portion 120-R may extend along both the z and y directions and may be formed in the first portion 120-1. Due to the receiving portion 120-R, the lower surface (or -z direction surface) of the first portion 120-1 of the flow control member 120 may be open. The receiving portion 120-R may not extend through the first portion 120-1 in the z direction. Therefore, the upper surface (or +z direction surface) of the first portion 120-1 of the flow control member 120 may not be open. In other words, the z direction length of the receiving portion 120-R may be less than the z direction length of the first portion 120-1.

[0082] The z-direction length of the receiving portion 120-R can vary along the x-direction. In an embodiment, the z-direction length of the receiving portion 120-R can increase towards the +x direction. For example, refer to... Figure 7 The receiving portion 120-R may include a first receiving portion 120-R1 and a second receiving portion 120-R2 that are adjacent to each other. Relatively speaking, the z-direction length of the first receiving portion 120-R1 may be greater than the z-direction length of the second receiving portion 120-R2. Viewed from the y-direction, due to the z-direction length difference between the first receiving portion 120-R1 and the second receiving portion 120-R2, the receiving portion 120-R may include a z-direction stepped portion. Due to this z-direction stepped portion, the first portion 120-1 of the flow control member 120 may be formed to embed or retain the protrusion 121-P of the fixing member 121 therein.

[0083] Similarly, the y-direction length of the receiving portion 120-R can vary along the x-direction. In an embodiment, the y-direction length of the receiving portion 120-R can increase towards the +x direction. For example, refer to... Figure 8 The y-direction length of the first receiving portion 120-R1 can be greater than the y-direction length of the second receiving portion 120-R2. Viewed from the -z direction, due to the difference in y-direction length between the first receiving portion 120-R1 and the second receiving portion 120-R2, the receiving portion 120-R can have a bottleneck shape. Due to the bottleneck shape, the first portion 120-1 of the flow control member 120 can be formed to embed or retain the protrusion 121-P of the fixing member 121 therein.

[0084] The protrusion 121-P of the fixing member 121 can be embedded in the receiving portion 120-R of the flow control member 120. For example, the protrusion 121-P may include a first protrusion 121-P1 having a substantially coin-shaped shape that substantially matches the first receiving portion 120-R1, and the first protrusion 121-P1 can be embedded in the first receiving portion 120-R1. The diameter (e.g., z-direction length) of the first protrusion 121-P1 may be close to the z-direction length of the first receiving portion 120-R1. Similar to the receiving portion 120-R, the z-direction length (or diameter) of the protrusion 121-P may vary along the x-direction. In an embodiment, the diameter (or z-direction length) of the protrusion 121-P may increase toward the +x direction. For example, the protrusion 121-P may include a first protrusion 121-P1 and a second protrusion 121-P2 connecting the first protrusion 121-P1 to the body 121-1. See also Figure 7 and Figure 8 The diameter of the first protrusion 121-P1 can be larger than the diameter of the second protrusion 121-P2. The first protrusion 121-P1 can overlap with the first receiving portion 120-R1, and the second protrusion 121-P2 can overlap with the second receiving portion 120-R2. In other words, the first protrusion 121-P1 can be embedded in the first receiving portion 120-R1, and the second protrusion 121-P2 can be embedded in the second receiving portion 120-R2. With the above structure, the protrusion 121-P can be embedded in the receiving portion 120-R, and the first portion 120-1 of the flow control member 120 forming the receiving portion 120-R can substantially retain the protrusion 121-P.

[0085] Figure 9 and Figure 10 This is a perspective view showing the state in which the flow control component and the stationary component can be coupled to each other according to an embodiment.

[0086] Reference Figure 9 andFigure 10 The fixing member 121 can be fixed to the inner side 110-1 of the chamber 110. The flow control member 120 can be translated (or slid) in one direction (e.g., the -z direction). In an embodiment, the flow control member 120 and the fixing member 121 can be aligned such that the protrusion 121-P of the fixing member 121 can be inserted into the receiving portion 120-R of the flow control member 120 (see...). Figure 8 In the flow control component 120, a plurality of receiving portions 120-R may be included, and the plurality of receiving portions 120-R may be arranged at a certain interval. A fixing member 121 may be disposed on the inner side 110-1 of the chamber 110, and may be arranged at a interval approximately equal to the spacing of the receiving portions 120-R. In an embodiment, the surface of the flow control component 120 (e.g., a single surface) (e.g., the surface of the first portion 120-1 facing the -x direction) may be disposed on the same plane as the inner side 110-1 of the chamber 110 facing the +x direction. Therefore, and as... Figure 10 As shown, when the flow control member 120 is coupled to the fixed member 121, the first portion 120-1 of the flow control member 120 can contact (e.g., directly contact) the inner side 110-1 of the chamber 110.

[0087] Due to the above structure, the flow control component 120 can be attached to and removed from the fixed component 121 by simple operation (e.g., translation), thereby facilitating the maintenance of the flow control component 120.

[0088] Figure 11 It is a schematic cross-sectional view showing the flow control components, fixing components, and the inner side of the chamber that can be coupled to each other.

[0089] Reference Figure 11 The flow control component 120 has been described (see Figure 6 The coupling between the fixing member 121 and the inner side 110-1 of the chamber 110 (see below) will therefore focus on the fixing member 121 and the inner side 110-1 of the chamber 110. Figure 2 ) coupling.

[0090] The wall of the inner side 110-1 of the chamber 110 may include a recess 110-2 in which a portion of the fixing member 121 may be embedded. For example, the wall may include a recess 110-2 in which the body 121-1 of the fixing member 121 may be embedded. The body 121-1 of the fixing member 121 may be embedded in the recess 110-2, and the protrusion 121-P may extend outside the recess 110-2, for example, beyond the surface of the inner side 110-1 of the chamber 110. In an embodiment, the depth (or x-direction length) of the recess 110-2 may be greater than the x-direction length of the body 121-1 of the fixing member 121. The body 121-1 of the fixing member 121 may only partially fill the recess 110-2. The surface of the fixing member 121 facing the +x direction may be recessed compared to the surface of the inner side 110-1 of the chamber 110 facing the +x direction. Therefore, the main body 121-1 of the fixing member 121 can be spaced apart from the first part 120-1 of the inner side 110-1 of the contact (e.g., direct contact) chamber 110 of the flow control member 120.

[0091] The groove 110-2 may include a threaded hole extending further in the +x direction. The threaded hole may have threads on its inner surface and may be configured to receive a screw BT of a specific size therein.

[0092] The fixing member 121 may include an opening 121-2 extending in the x-direction. The opening 121-2 may be formed to receive a screw BT therein. A portion of the opening 121-2 may have a diameter substantially the same as the diameter of a screw BT of a specific size, such that the head of the screw BT can be inserted. Another portion of the opening 121-2 may have a smaller diameter than the portion in which the head of the screw BT can be inserted, and threads may be formed on the inner surface of the body 121-1 of the fixing member 121 in the corresponding portion. In an embodiment, the other portion of the opening 121-2 and the threaded hole of the recess 110-2 may be aligned and may have the same diameter.

[0093] The screw BT can be configured to pass through both the opening 121-2 of the fixing member 121 and the threaded hole of the groove 110-2 in the inner side 110-1 of the chamber 110. The screw BT can engage with the threads of the opening 121-2 and the threaded hole to secure the fixing member 121 to the groove 110-2. The depth of the opening 121-2 can be sufficient such that the head of the screw BT does not protrude outside the opening 121-2.

[0094] With the above structure, the fixing member 121 can be configured such that only the protrusion 121-P protrudes from the inner side 110-1 of the chamber 110, and the fixing member 121 can be coupled to the chamber 110.

[0095] Figure 12This is a schematic plan view illustrating an apparatus for manufacturing a display device according to an embodiment.

[0096] Reference Figure 12 In the flow control member 120 provided in chamber 110, the x-direction length of the flow control member 120 arranged parallel to the x-direction can be defined as a first length L1. Similarly, in the flow control member 120 provided in chamber 110, the y-direction length of the flow control member 120 arranged parallel to the y-direction can be defined as a second length L2. In the inner side 110-1 of chamber 110, the x-direction length of the inner side 110-1 parallel to the x-direction can be defined as a third length L3. Similarly, in the inner side 110-1 of chamber 110, the y-direction length of the inner side 110-1 parallel to the y-direction can be defined as a fourth length L4.

[0097] Although chamber 110 has a basically square shape, making Figure 12 The third length L3 and the fourth length L4 can be the same, but this disclosure is not limited thereto. In an embodiment, the fourth length L4 can be greater than the third length L3. In an embodiment, the third length L3 can be greater than the fourth length L4. The following will describe in detail assuming that the fourth length L4 can be greater than the third length L3 such that the fourth length L4 can be the length of the longer side and the third length L3 can be the length of the shorter side.

[0098] In one embodiment, the first length L1 can be approximately 70% to approximately 80% of the third length L3. In another embodiment, the first length L1 can be approximately 75% to approximately 80% of the third length L3. In yet another embodiment, the first length L1 can be approximately 80% of the third length L3.

[0099] In one embodiment, the second length L2 may be approximately 70% to approximately 89% of the fourth length L4. In another embodiment, the second length L2 may be approximately 80% to approximately 89% of the fourth length L4. In yet another embodiment, the second length L2 may be approximately 85% to approximately 89% of the fourth length L4. In yet another embodiment, the second length L2 may be approximately 89% of the fourth length L4.

[0100] Due to the above structure, the flow control member 120 may not be disposed on a portion of the inner side 110-1 of the chamber 110. For example, the flow control member 120 may not be disposed on the reference side. Figure 1 In the first region SPC described.

[0101] Figure 13 This is a schematic cross-sectional view illustrating steps (e.g., individual steps) in a process of manufacturing a display device according to an embodiment.

[0102] Reference Figure 13The diagram illustrates the steps of depositing a deposition material on a display substrate D. First, with the pressure regulating member 180 bringing the internal pressure of the chamber 110 to the same as or approximately the atmospheric pressure, the display substrate D can be loaded into the chamber 110 from the outside. The display substrate D can be loaded into the chamber 110 in various ways. For example, the display substrate D can be loaded into the chamber 110 from the outside using a robotic arm or similar device positioned outside the chamber 110.

[0103] Deposition mask 151 can be as follows Figure 13 The arrangement shown is within chamber 110. For example, a deposition mask 151 can be held between the shadow frame 130 and the mask holder 150. In an embodiment, the deposition mask 151 can be loaded into chamber 110 from the outside, just as the substrate D is shown. For ease of illustration, the following description will assume that the deposition mask 151 can be positioned within chamber 110, and will only show that the substrate D can be loaded into chamber 110 from the outside.

[0104] When the display substrate D is loaded into chamber 110, the display substrate D can be placed on base 140. A separately provided vision component (not shown) can capture the position of deposition mask 151, and the display substrate D and deposition mask 151 can be aligned by finely adjusting the positions of the display substrate D and deposition mask 151 via a controller.

[0105] With the display substrate D loaded into chamber 110, the deposition mask 151 can be held between the shadow frame 130 and the mask holder 150. In an embodiment, the deposition mask 151 can be sufficiently spaced from the base 140, such that the display substrate D can be disposed between the deposition mask 151 and the base 140. For this purpose, the shadow frame 130 and the mask holder 150 can also be sufficiently spaced from the base 140. After the display substrate D is loaded into chamber 110 such that the display substrate D is disposed between the deposition mask 151 and the base 140 and aligned with the deposition mask 151, the shadow frame 130, the mask holder 150, and the deposition mask 151 can be lowered together (or moved in the -z direction). Therefore, the deposition mask 151 can be in close contact with the display substrate D. The display substrate D can contact the upper surface of the base 140.

[0106] Pump 181 can evacuate chamber 110 by drawing gas from chamber 110 and discharging the gas to the outside, and maintain the pressure in chamber 110 at a state equal to or close to a vacuum.

[0107] The deposition step can now be performed. In this embodiment, the deposition step can be performed using chemical vapor deposition (CVD). The diffuser 160 can be operated to diffuse the deposited material, which is in a gaseous or vapor state, within the chamber 110.

[0108] During or after the deposition step, a heat source (not shown) of the substrate 140 can heat the substrate 140 and the display substrate D in contact with the substrate 140. The portion of the surface of the display substrate D that overlaps with the opening 151H of the deposition mask 151 can contact the deposited material diffused through the diffuser 160 inside the chamber 110. The deposited material can chemically react with or on the surface of the display substrate D, and a film can be formed on the display substrate D overlapping the opening 151H of the deposition mask 151. The deposition mask 151 can provide a deposition area equivalent to or approximating the deposition area (e.g., a predetermined or selectable deposition area). The above operations can be repeated on multiple display substrates D.

[0109] After the deposition process, the deposited material that has fully diffused into chamber 110 can be placed (or deposited) on the surface of components inside chamber 110. For example, a portion of the deposited material can be placed on the surface of deposition mask 151, shadow frame 130, mask support 150, and / or base 140. If gas is removed from chamber 110 by pressure regulating member 180, the placed deposited material may remain on the surface of components in chamber 110 without being discharged from chamber 110. Therefore, a cleaning process to remove the placed deposited material from chamber 110 may be required. The cleaning process may include separating the placed deposited material from the surface of components in chamber 110 and discharging the deposited material to the outside of chamber 110.

[0110] Figure 14 This is a schematic cross-sectional view illustrating steps in the process of manufacturing a display device according to an embodiment.

[0111] Reference Figure 14 The steps inside the cleaning chamber 110 are shown after the deposition step. First, a cleaning material injection component 170 can be provided from outside the chamber 110. The cleaning material injection component 170 may include a plasma chamber 171 and an injection tube 172.

[0112] In the first step S1, a first material M1 and a second material M2 may be introduced into the plasma chamber 171 during the cleaning step. In an embodiment, the first material M1 may be argon (Ar), and the second material M2 may be nitrogen trifluoride (NF3). After the first material M1 and the second material M2 are introduced into the plasma chamber 171, a voltage may be applied to the plasma chamber 171 to convert the first material M1 into a plasma state. The first material M1 in the plasma state may react with the second material M2 to generate a third material M3 in the plasma state. In an embodiment, the third material M3 may be fluorine (F) in the plasma state. The third material M3 may be a cleaning material for the interior of the cleaning chamber 110.

[0113] In the second step S2, the third material M3 can be introduced into the chamber 110 through the injection tube 172. In an embodiment, the injection tube 172 can extend to the diffuser 160, and the third material M3 can be diffused into the chamber 110 through the diffuser 160. In an embodiment, the injection tube 172 can extend to a separate path and means to diffuse the third material M3 into the chamber 110.

[0114] In the third step S3, the third material M3 can react with the fourth material M4 to generate the fifth material M5. The fourth material M4 can be a solid deposited material remaining in chamber 110, the third material M3 can be a cleaning material in a plasma state, and the fifth material M5 can be a gaseous material. In an embodiment, the fourth material M4 can be silicon oxynitride (SiO2). x N y ) or silicon nitride (SiN) x The fifth material M5 can be silicon tetrafluoride (SiF4). The gaseous fifth material M5 can flow freely within chamber 110 and can be pumped and discharged to the outside of chamber 110. In the following context, when the third material M3 reacts with the fourth material M4 to form the fifth material M5, this means that the third material M3 cleans the fourth material M4.

[0115] In the fourth step S4, the fifth material M5 can be discharged to the outside of chamber 110 through the pressure regulating member 180 connected to chamber 110. The fifth material M5 can flow around components in chamber 110 such as shadow frame 130, mask support 150, and base 140. For example, the fifth material M5 can flow toward the inner side 110-1 of chamber 110 in a horizontal direction perpendicular to the z-direction, and then can flow substantially along the z-direction toward the connecting pipe 182 of pressure regulating member 180.

[0116] Figure 15A This is a schematic plan view illustrating the steps in the process of manufacturing a display device according to the first embodiment. Figure 15B This is a schematic plan view illustrating steps (e.g., individual steps) in the process of manufacturing a display device according to the second embodiment.

[0117] exist Figure 15A and Figure 15B In the diagram, the diffusion path of the third material M3, which serves as a cleaning material, can be marked by arrows. Figure 15A The first embodiment and Figure 15BThe difference between the second embodiments is that the flow control member 120 may not be provided in the chamber 110 of the first embodiment, while the flow control member 120 may be provided in the chamber 110 of the second embodiment. The diffusion path of the third material M3 can vary depending on whether the flow control member 120 is provided.

[0118] Refer to together Figure 14 and Figure 15A The third material M3 can diffuse from the center of chamber 110. Because the shadow frame 130, mask support 150, and base 140 can be located at the center of chamber 110, the third material M3 can diffuse towards the inner wall of chamber 110 in a direction substantially perpendicular to the z-direction, rather than in the -z direction. As the third material M3 diffuses towards the inner wall of chamber 110, it can clean the fourth material M4 formed on the inner wall of chamber 110.

[0119] The diffusion rate of the third material M3 starting from the center of chamber 110 can be the same in all directions. Therefore, the diffusion rate of the third material M3 along the x-direction or y-direction and the diffusion rate of the third material M3 along a direction inclined to the x-direction or y-direction can be the same. For example, the diffusion rate of the third material M3 towards the inner side 110-1 of chamber 110 and the diffusion rate of the third material M3 towards the corner of chamber 110 (or the first region SPC) can be the same. Because the interior of chamber 110 has a substantially quadrilateral shape, the distance from the center of chamber 110 to the corner of chamber 110 (or the first region SPC) can be greater than the distance from the center of chamber 110 to the inner side 110-1. Therefore, the time taken for the third material M3, diffusing at the same speed, to reach the corner of chamber 110 (or the first region SPC) can be greater than the time taken for the third material M3 to reach the inner side 110-1 of chamber 110. Therefore, due to the time it takes for the third material M3 to reach the corner of chamber 110 (or the first area SPC), the final completion time of cleaning may increase even if the third material M3 reaches the inner side 110-1 of chamber 110 and completes cleaning.

[0120] Refer to together Figure 14 and Figure 15B Unlike the first embodiment, in the second embodiment, a flow control member 120 may be provided on the inner side 110-1 of the chamber 110. Because the x-direction length or y-direction length of the flow control member 120 may be less than the x-direction length or y-direction length of the inner side 110-1 of the chamber 110, the flow control member 120 may not be provided at the corner (or the first region SPC) of the chamber 110.

[0121] In the second embodiment, when the third material M3 diffuses in the x or y direction and reaches the inner wall of the chamber 110, the third material M3 may not be oriented in the -z direction, unlike the first embodiment. The diffusion of the third material M3 in the -z direction can be blocked by the flow control member 120, and the diffusion path of the third material M3 can be bent in one direction. For example, the diffusion direction of the third material M3 flowing along the x direction can be changed to the +y or -y direction, and the diffusion direction of the third material M3 flowing along the y direction can be changed to the +x or -x direction. The third material M3 with its changed diffusion direction can diffuse along the flow control member 120 to the corner of the chamber 110 (or the first region SPC). The third material M3 reaching the region adjacent to the corner of the chamber 110 (or the first region SPC) can flow together with the fifth material M5 in the -z direction.

[0122] In the second embodiment, where the third material M3 is guided to the corner (or first area SPC) of chamber 110 using the flow control member 120, the amount of the third material M3 reaching the corner (or first area SPC) of chamber 110 can be increased. Therefore, the area adjacent to the corner (or first area SPC) of chamber 110 can be cleaned more quickly, and thus, the total cleaning time can be reduced compared to the first embodiment.

[0123] Some indicators in the cleanroom 110 are divided into the first embodiment and the second embodiment and compared.

[0124]

[0125] Classification First embodiment Figure 15A ) Second embodiment Figure 15B ) Cleaning time (seconds) 850 595 Cleaning time per substrate (seconds) 60 58 Monthly substrate throughput (units) 165,000 172,700

[0126] Referring to Table 1, cleaning time refers to the time required to completely clean the interior of chamber 110. The cleaning time per substrate can be obtained by dividing the cleaning time by the number of display substrates that can be produced per cleaning using the apparatus used to manufacture display devices, and can refer to the time required to produce a display substrate (e.g., a single display substrate) and completely remove any residual deposited material in chamber 110. Monthly substrate production capacity refers to the number of display substrates that can be produced per month under the condition of repeated production of display substrates and cleaning of chamber 110.

[0127] The cleaning time in the first embodiment is approximately 850 seconds. The cleaning time in the second embodiment is approximately 595 seconds. Therefore, the cleaning time in the second embodiment is approximately 255 seconds less than the cleaning time in the first embodiment. The cleaning time per substrate in the first embodiment is approximately 60 seconds. The cleaning time per substrate in the second embodiment is approximately 58 seconds. Therefore, the cleaning time per substrate in the second embodiment is approximately 2 seconds less than the cleaning time per substrate in the first embodiment. Thus, it has been found that by using the flow control member 120, the time spent inside the cleaning chamber 110 can be reduced.

[0128] The monthly substrate production capacity of the first embodiment can be approximately 165,000. The monthly substrate production capacity of the second embodiment can be approximately 172,700. Therefore, the monthly substrate production capacity of the second embodiment can be approximately 7,700 more than that of the first embodiment. Because the time spent inside the cleaning room 110 in the second embodiment can be shorter than that in the first embodiment, more display substrates can be produced in the same amount of time, and therefore, the monthly substrate production capacity of the second embodiment can be greater than that of the first embodiment.

[0129] Figure 16 This is a schematic plan view illustrating a display device manufactured according to an embodiment using an apparatus for manufacturing a display device. Figure 17 It shows along Figure 16 A schematic cross-sectional view of the display device taken by line XVII-XVII'.

[0130] Reference Figure 16 and Figure 17 The display device 20 may include a substrate 21 comprising a display area DA and a non-display area NDA outside the display area DA. A light-emitting device (or light-emitting apparatus) 28 may be disposed in the display area DA, and a power supply line (not shown) may be disposed in the non-display area NDA. Furthermore, a pad component C may be disposed in the non-display area NDA.

[0131] Multiple deposition material patterns can be set in the display area DA. The display area DA can have an irregular shape.

[0132] The display device 20 may include a display substrate D, an intermediate layer 28-2 disposed on the display substrate D, and a counter electrode 28-3 disposed on the intermediate layer 28-2. Furthermore, the display device 20 may include a thin-film encapsulation layer E disposed on the counter electrode 28-3.

[0133] The display substrate D may include a substrate 21, a thin-film transistor (TFT), a via layer 27, and a pixel electrode 28-1.

[0134] The substrate 21 can be formed of a plastic or metal material. Alternatively, the substrate 21 can be formed of polyimide (PI). A thin-film transistor (TFT) can be disposed on the substrate 21, a via layer 27 can be configured to cover the TFT, and a light-emitting device 28 can be disposed on the via layer 27.

[0135] A buffer layer 22 formed of organic and / or inorganic compounds may be further disposed on the upper surface of the substrate 21, and the buffer layer 22 may include SiO2. x (x≥1) and / or SiN x (x≥1).

[0136] After the active layer 23, arranged in a specific pattern, is disposed on the buffer layer 22, the active layer 23 may be covered by the gate insulating layer 24. The active layer 23 may include a source region 23-1 and a drain region 23-3, and may further include a channel region 23-2 between the source region 23-1 and the drain region 23-3. The active layer 23 may be formed comprising various materials. In embodiments, the active layer 23 may include inorganic semiconductor materials (such as amorphous silicon or crystalline silicon). In embodiments, the active layer 23 may include oxide semiconductors. In embodiments, the active layer 23 may include organic semiconductor materials. However, for ease of illustration, the following description will assume that the active layer 23 is formed of amorphous silicon.

[0137] The active layer 23 can be formed by forming an amorphous silicon film on the buffer layer 22, crystallizing the amorphous silicon film to form a polycrystalline silicon film, or patterning the polycrystalline silicon film. In the active layer 23, the source region 23-1... Show) or switch thin film transistor (not shown) is doped with impurities.

[0138] A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 covering the gate electrode 25 can be disposed on the upper surface of the gate insulating layer 24. After the contact hole H1 can be formed in the interlayer insulating layer 26 and the gate insulating layer 24, a source electrode 27-1 and a drain electrode 27-2 can be disposed on the interlayer insulating layer 26 to contact the source region 23-1 and the drain region 23-3, respectively.

[0139] The via layer 27 can be disposed on the thin-film transistor (TFT), and the pixel electrode 28-1 of the light-emitting device 28 can be disposed on the via layer 27. The pixel electrode 28-1 contacts the drain electrode 27-2 of the TFT through a via H2 formed in the via layer 27. The via layer 27 may include inorganic and / or organic materials, and may have a single-layer or multi-layer structure. The via layer 27 can be formed as a planarization film, such that the upper surface of the via layer 27 can be approximately flat regardless of the curvature of the lower film, or the via layer 27 can be formed to be curved along the curvature of the lower film.

[0140] After the pixel electrode 28-1 is disposed on the via layer 27, the pixel defining film 29 may be formed of organic and / or inorganic materials to cover the pixel electrode 28-1 and the via layer 27, and may be open to expose the pixel electrode 28-1.

[0141] The intermediate layer 28-2 and the counter electrode 28-3 can be disposed on the pixel electrode 28-1. In an embodiment, the counter electrode 28-3 can be disposed on the entire surface of the display substrate D. The counter electrode 28-3 can be disposed on the intermediate layer 28-2 and the pixel defining film 29. For ease of explanation, the following description will assume that the counter electrode 28-3 is disposed on the intermediate layer 28-2 and the pixel defining film 29.

[0142] Pixel electrode 28-1 can be used as an anode, and counter electrode 28-3 can be used as a cathode. However, the polarities of pixel electrode 28-1 and counter electrode 28-3 can be interchanged. Pixel electrode 28-1 and counter electrode 28-3 can be insulated from each other through intermediate layer 28-2, and voltages of different polarities can be applied to intermediate layer 28-2 to cause the organic emitting layer to emit light.

[0143] Intermediate layer 28-2 may include an organic emission layer. In an alternative example, intermediate layer 28-2 may include an organic emission layer, and may also include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. The embodiments are not limited thereto, and intermediate layer 28-2 may include an organic emission layer, and may also include various other functional layers (not shown).

[0144] A unit pixel may include multiple subpixels, and subpixels may emit light of various colors. For example, a subpixel may include subpixels for emitting red, green, and blue light, or it may include subpixels for emitting red, green, blue, and white light. A subpixel may include an intermediate layer 28-2 (e.g., a single intermediate layer 28-2).

[0145] The thin-film encapsulation layer E may include multiple inorganic layers or may include both inorganic and organic layers. The organic layer of the thin-film encapsulation layer E may be formed from a polymer and may have a single-layer or multi-layer structure formed from any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy resin, polyethylene, polyacrylate, and combinations thereof. The inorganic layer of the thin-film encapsulation layer E may have a single-layer or multi-layer structure that may include metal oxides or metal nitrides. Specifically, the inorganic layer may include SiN. x The thin film encapsulation layer E can be any one of Al2O3, SiO2, TiO2, and combinations thereof. The outermost layer of the thin film encapsulation layer E exposed to the outside can be an inorganic layer to prevent moisture from penetrating into the light-emitting device. The thin film encapsulation layer E can be formed using the apparatus described above for manufacturing display devices.

[0146] The thin-film encapsulation layer E may include at least one sandwich structure in which at least one organic layer can be embedded between at least two inorganic layers. In an example, the thin-film encapsulation layer E may include at least one sandwich structure in which at least one inorganic layer can be embedded between at least two organic layers. In an embodiment, the thin-film encapsulation layer E may include a sandwich structure in which at least one organic layer can be embedded between at least two inorganic layers and a sandwich structure in which at least one inorganic layer can be embedded between at least two organic layers.

[0147] According to the embodiment described above, the presence of cleaning materials in room 110 (see...) can be controlled. Figure 1 The flow direction within the chamber 110 is controlled. Therefore, because the flow of cleaning material can be directed to areas within the chamber 110 with relatively low flow rates, no additional gas injection is required to clean these areas. Consequently, the amount of cleaning material that should be injected to adequately clean the interior of the chamber 110 can be reduced.

[0148] Furthermore, according to the embodiment described above, since the flow of cleaning material can be controlled, the time required to completely clean the interior of room 110 with a certain amount of cleaning material can be reduced.

[0149] Furthermore, according to the embodiment described above, because of the flow control member (e.g., capable of controlling the flow direction of the cleaning material) Figure 1 The flow control component 120 shown can be easily attached to and removed from the interior of the chamber 110, thus facilitating the maintenance of the device used in manufacturing the display equipment.

[0150] It should be understood that the embodiments described herein are to be considered in a descriptive sense only and are not intended to be limiting. The description of features or aspects in each embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the appended claims.

Claims

1. An apparatus for manufacturing a display device, characterized by comprising: The device includes: a chamber having a plurality of inner sides; a base disposed in the chamber; a diffuser facing the base; a shadow frame disposed between the base and the diffuser; a fixing member disposed on at least one of the plurality of inner sides of the chamber; and a flow control member disposed on the at least one of the plurality of inner sides of the chamber to correspond to the fixing member, and the flow control member includes at least a portion disposed under the base, wherein the flow control member is slidable in a direction when coupled to the fixing member. 2.The device of claim 1, wherein one of the flow control member and the fixing member includes a protrusion protruding in a direction different from the direction in which the flow control member slides, and the other of the flow control member and the fixing member includes a receiving portion into which the protrusion is fitted.

3. The apparatus of claim 2, wherein, The flow control member is coupled to the fixing member by sliding the protrusion into the receiving portion in a direction perpendicular to the direction in which the protrusion protrudes.

4. The apparatus of claim 1, wherein, The flow control member includes: a first portion contacting the at least one of the plurality of inner sides of the chamber; and a second portion protruding in a direction perpendicular to the at least one of the plurality of inner sides of the chamber.

5. The apparatus of claim 4, wherein, An end of the second portion is rounded.

6. The apparatus of claim 4, wherein, The second portion overlaps the shadow frame. 7.The device of claim 4, wherein the flow control member further includes a third portion disposed at an end of the second portion, and an upper surface of the third portion is disposed at a higher position than an upper surface of the second portion.

8. The apparatus of claim 1, wherein, The at least one of the plurality of inner sides of the chamber includes a groove into which at least a portion of the fixing member is fitted.

9. The apparatus of claim 8, wherein, The fixing member includes: a first portion fitted into the groove and partially filling the groove; and a second portion protruding to an outside of the groove and coupled to the flow control member.

10. The apparatus of claim 1, wherein, In a first area adjacent to a corner of the chamber, a space above the flow control member and a space under the flow control member are in a state of being fluidly communicated.

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