High-damping anti-vibration seat of integrated circuit equipment

Abstract

The utility model relates to the technical field of anti-vibration, and discloses a high-damping anti-vibration seat of integrated circuit equipment, which comprises an anti-vibration seat and a base. According to the high-damping anti-vibration seat of the integrated circuit equipment, through the arrangement of the supporting seat, the base, the damping mechanism and the elastic mechanism, when the integrated circuit equipment is vibrated, the acting force borne by the supporting seat can be transmitted to the piston rod, the piston rod is forced to vibrate, and magnetorheological fluid is pushed to flow in the annular cavity; a magnetic field generated by the permanent magnet array enables magnetorheological fluid particles to form a chain-shaped structure, fluid shear stress is greatly increased, nonlinear viscous resistance is generated, meanwhile, vertical reciprocating motion of the piston rod cuts magnetic induction lines of the permanent magnet array, an eddy current effect is triggered, reverse electromagnetic damping force is generated, and the damping effect is improved. Therefore, magnetic circuit cutting and fluid extrusion are achieved while movement of the piston rod is achieved, a composite energy dissipation mechanism of electromagnetic damping and viscous damping is formed, and the energy dissipation efficiency and the resonance peak suppression efficiency are remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of vibration damping technology, and in particular to a high-damping vibration damping seat for integrated circuit equipment. Background Technology

[0002] Integrated circuits, also known as microcircuits, microchips, or wafers / chips, are a method of miniaturizing circuits (mainly semiconductor devices, but also passive components) in electronics. They are often manufactured on the surface of semiconductor wafers. Analog integrated circuits include sensors, power control circuits, and operational amplifiers, which process analog signals and perform functions such as amplification, filtering, demodulation, and mixing. With the continuous development of technology, integrated circuits have been widely used in people's daily lives; for example, computers, mobile phones, and most modern home appliances use integrated circuits.

[0003] However, existing integrated circuit equipment is often subjected to vibrations due to external impacts or other reasons during use. The anti-vibration bases used in existing integrated circuit equipment can mostly only buffer unidirectional vibrations, and their anti-vibration capability is weak, making the integrated circuits prone to damage. In addition, the anti-vibration bases used in existing integrated circuit equipment generally fasten and fix the equipment tightly, and the heat generated by the integrated circuits inside the equipment is easily trapped in the base during operation, resulting in poor heat dissipation and significantly reducing the service life of the equipment. Its practicality needs to be improved.

[0004] A high-damping, vibration-resistant base for integrated circuit equipment, disclosed in publication number CN215171844U, includes a lower base, a positioning groove, and an upper base. The positioning groove is located on the top surface of the lower base, and the upper base is embedded within the positioning groove. A support foot is fixedly installed below the lower base, and an anti-slip pad is attached to the bottom surface of the support foot. This invention overcomes the shortcomings of the prior art. The first and second spring positioning posts not only significantly increase the damping effect when the upper base moves relative to the lower base, but also substantially reduce the vibration frequency of the upper base during this movement, preventing damage to the integrated circuit equipment under vibration. It exhibits excellent vibration resistance and strong protection. The heat dissipation mesh can dissipate the heat generated during the operation of the integrated circuit equipment, ensuring vibration resistance without affecting the equipment's heat dissipation performance, thus possessing high practicality.

[0005] While the aforementioned patent achieves excellent shock resistance and strong protection by using the first and second spring positioning posts to significantly increase the damping effect when the upper base moves relative to the lower base and greatly reduce the vibration frequency during this movement, thus preventing damage to the integrated circuit equipment under vibration, and providing heat dissipation mesh to dissipate the heat generated during the operation of the integrated circuit equipment, ensuring shock resistance without affecting the equipment's heat dissipation performance; however, this shock-resistant base relies on the passive damping design of the first and second spring positioning posts, which is insufficient to cope with the multi-frequency composite vibrations generated during the operation of the integrated circuit equipment, potentially leading to resonance risks. Furthermore, it only designs for vertical vibration and does not clearly explain the horizontal displacement control mechanism, which may not meet the requirements of integrated circuit equipment for simultaneous suppression of three-dimensional vibrations. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] The purpose of this utility model is to provide a high-damping vibration-damping base for integrated circuit equipment, which solves the problems mentioned in the background art. The passive damping design of the anti-vibration base, which relies on the first and second spring positioning columns, is difficult to cope with the multi-frequency composite vibration generated during the operation of integrated circuit equipment, which may lead to resonance risk. Furthermore, the design only focuses on vertical vibration and does not clearly explain the horizontal displacement control mechanism, which may not meet the requirements of integrated circuit equipment for synchronous suppression of three-dimensional vibration.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model provides the following technical solution: a high-damping vibration-damping base for integrated circuit equipment, comprising a vibration-damping base and a base. A limiting mechanism is threadedly connected to the upper part of the vibration-damping base. A damping mechanism is provided in the middle of the upper part of the base. Elastic mechanisms are evenly distributed above the base. The limiting mechanism includes four sets of lower cross springs threadedly connected to the upper part of the vibration-damping base. A ball joint is fixedly connected above the four sets of lower cross springs. An upper cross spring is fixedly connected to one side of the ball joint. A shape memory alloy limiting ring is provided at one end of each of the lower and upper cross springs. The damping mechanism includes an annular cavity located in the middle of the upper part of the base. A magnetorheological fluid is provided inside the annular cavity. A piston rod is connected through the surface of the annular cavity. A permanent magnet array is provided on the side of the annular cavity. The elastic mechanism includes multiple sets of conical buffer columns evenly distributed above the base. A disc spring is fixedly connected above each conical buffer column.

[0010] As a further embodiment of this utility model, the base is made of hard rubber, and four sets of grooves are symmetrically provided around the bottom of the base. The base is designed to suppress the transmission of low-frequency vibrations through its high rigidity.

[0011] As a further embodiment of this utility model, the four sets of upper cross springs are threadedly connected to the inner bottom wall of the groove, and the four sets of lower cross springs are evenly distributed around the vibration damping seat. The arrangement of the upper cross springs enhances the overall torsional and bending resistance.

[0012] As a further embodiment of this invention, a ring frame is provided on the side of the annular cavity, and the permanent magnet array is distributed in a ring inside the ring frame. The permanent magnet array provides a static magnetic field.

[0013] As a further embodiment of this utility model, a support base is fixedly connected to the top of the piston rod, and the disc spring is fixedly connected to the bottom of the support base. The disc spring provides high-frequency vibration isolation through elastic deformation.

[0014] As a further embodiment of this utility model, the diameter of the multiple sets of conical buffer columns gradually decreases from bottom to top, the multiple sets of conical buffer columns are made of silicone, and the disc spring is made of stainless steel or high carbon steel. The conical buffer columns are used to achieve dynamic stiffness adjustment.

[0015] As a further embodiment of this utility model, the vibration damping seat has fixing holes around its surface. These fixing holes are used for threaded connection to external structures, thus serving to fix the seat to the external structure.

[0016] (III) Beneficial Effects

[0017] This utility model provides a high-damping vibration-damping base for integrated circuit equipment, which has the following beneficial effects:

[0018] 1. The high-damping vibration-damping base for this integrated circuit device, through the arrangement of a support base, a base, a damping mechanism, and an elastic mechanism, allows the force on the support base to be transmitted to the piston rod when the integrated circuit device is subjected to vibration. The piston rod is forced to vibrate, pushing the magnetorheological fluid to flow in the annular cavity. The magnetic field generated by the permanent magnet array causes the magnetorheological fluid particles to form a chain structure, significantly increasing the fluid shear stress and generating nonlinear viscous drag. At the same time, the vertical reciprocating motion of the piston rod cuts the magnetic field lines of the permanent magnet array, inducing eddy current effect (electromagnetic induction) and generating a reverse electromagnetic damping force. Thus, the movement of the piston rod simultaneously achieves magnetic circuit cutting and fluid compression, forming a composite energy dissipation mechanism of electromagnetic damping and viscous damping, which significantly improves energy dissipation efficiency and the suppression efficiency of resonance peaks.

[0019] 2. The high-damping vibration damping seat of this integrated circuit equipment, through the setting of the vibration damping seat and the limiting mechanism, when the integrated circuit equipment is subjected to vibration, the force on the support seat will be transmitted to the upper cross spring at the bottom. The upper cross spring absorbs vibration energy through elastic deformation, provides nonlinear stiffness support, and limits the lateral displacement of the vibration damping seat. The ball joint fixed at the bottom of the upper cross spring allows the upper cross spring and the lower cross spring to rotate freely in three-dimensional space. Multi-degree-of-freedom rotation is used to compensate for displacement deviation, avoid stress concentration caused by rigid connection, and maintain overall stability. The shape memory alloy limiting ring triggers rigid constraint when the displacement exceeds the limit, limits the vibration displacement amplitude to achieve adaptive limiting protection, and prevents structural overload or resonance. Thus, under the joint action of the limiting mechanism, the vibration energy is evenly distributed to each node, which not only avoids fatigue damage caused by single-point stress concentration, but also improves the stability and energy dissipation efficiency of the overall system. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the limiting mechanism of this utility model;

[0022] Figure 3 This is a schematic diagram of the damping mechanism of this utility model;

[0023] Figure 4 This is a schematic diagram of the elastic mechanism structure of this utility model.

[0024] In the diagram: 1. Vibration damping seat; 2. Base; 3. Limiting mechanism; 301. Lower cross spring; 302. Ball joint; 303. Upper cross spring; 304. Shape memory alloy limiting ring; 4. Damping mechanism; 401. Annular cavity; 402. Magnetorheological fluid; 403. Piston rod; 404. Permanent magnet array; 5. Elastic mechanism; 501. Conical buffer column; 502. Disc spring; 6. Annular frame; 7. Support seat. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0026] Please see Figures 1 to 4This utility model provides a technical solution: a high-damping vibration damping seat for integrated circuit equipment, including a vibration damping seat 1 and a base 2. A limiting mechanism 3 is threadedly connected to the upper part of the vibration damping seat 1. A damping mechanism 4 is disposed in the middle of the upper part of the base 2. Elastic mechanisms 5 are evenly distributed above the base 2. The limiting mechanism 3 includes four sets of lower cross springs 301 threadedly connected to the upper part of the vibration damping seat 1. A ball joint universal joint 302 is fixedly connected above the four sets of lower cross springs 301. An upper cross spring 303 is fixedly connected to one side of the ball joint universal joint 302. Both the cross spring 301 and the upper cross spring 303 are provided with a shape memory alloy limiting ring 304 at one end. The damping mechanism 4 includes an annular cavity 401 located in the middle of the upper part of the base 2. The annular cavity 401 is provided with a magnetorheological fluid 402. A piston rod 403 is connected through the surface of the annular cavity 401. A permanent magnet array 404 is provided on the side of the annular cavity 401. The elastic mechanism 5 includes multiple sets of conical buffer columns 501 evenly distributed above the base 2. A disc spring 502 is fixedly connected above the conical buffer column 501.

[0027] The base 2 is made of hard rubber. Four sets of grooves are symmetrically opened around the bottom of the base 2. The base 2 is designed to suppress the transmission of low-frequency vibrations through its high rigidity.

[0028] Four sets of upper cross springs 303 are threaded to the inner bottom wall of the groove, and four sets of lower cross springs 301 are evenly distributed around the vibration damping seat 1. The setting of the upper cross springs 303 plays a role in improving the overall torsional and bending resistance.

[0029] A ring frame 6 is provided on the side of the annular cavity 401, and a permanent magnet array 404 is distributed in a ring inside the ring frame 6. The permanent magnet array 404 serves to provide a static magnetic field.

[0030] A support base 7 is fixedly connected to the top of the piston rod 403, and a disc spring 502 is fixedly connected to the bottom of the support base 7. The disc spring 502 plays a role in providing high-frequency vibration isolation through elastic deformation.

[0031] The diameter of the multiple sets of conical buffer columns 501 gradually decreases from bottom to top. The multiple sets of conical buffer columns 501 are made of silicone, and the disc springs 502 are made of stainless steel or high carbon steel. The conical buffer columns 501 are used to adjust the dynamic stiffness.

[0032] The vibration damping seat 1 has fixing holes around its surface. These fixing holes are used for threaded connection to the external structure, and they serve to fix the external structure in place.

[0033] In this invention, the working steps of the device are as follows:

[0034] First step: When the integrated circuit device is vibrated, the force on the support base 7 is transmitted to the piston rod 403. The piston rod 403 is forced to vibrate, which pushes the magnetorheological fluid 402 to flow in the annular cavity 401. The magnetic field generated by the permanent magnet array 404 causes the magnetorheological fluid 402 particles to form a chain structure, which greatly increases the fluid shear stress and generates nonlinear viscous drag. At the same time, the vertical reciprocating motion of the piston rod 403 cuts the magnetic field lines of the permanent magnet array 404, triggering the eddy current effect (electromagnetic induction) and generating a reverse electromagnetic damping force.

[0035] The second step: When the integrated circuit device is subjected to vibration, the force on the support base 7 is transmitted to the upper cross spring 303 at the bottom. The upper cross spring 303 absorbs vibration energy through elastic deformation, provides nonlinear stiffness support, and limits the lateral displacement of the vibration damping base 1. The ball joint universal joint 302 fixed at the bottom of the upper cross spring 303 allows the upper cross spring 303 and the lower cross spring 301 to rotate freely in three-dimensional space. Multi-degree-of-freedom rotation is used to compensate for displacement deviation and avoid stress concentration caused by rigid connection. The shape memory alloy limit ring 304 triggers rigid constraint when the displacement exceeds the limit, limiting the vibration displacement amplitude to achieve adaptive limit protection. It should be noted that the device structure and drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0036] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-damped anti-vibration mount for an integrated circuit device, comprising an anti-vibration mount (1) and a base (2), characterized in that: The upper part of the anti-vibration seat (1) is threadedly connected with a limiting mechanism (3), the upper middle part of the base (2) is provided with a damping mechanism (4), and the upper part of the base (2) is uniformly distributed with elastic mechanisms (5), The limiting mechanism (3) comprises four groups of lower cross spring leaves (301) threadedly connected to the upper part of the anti-vibration seat (1), the upper part of the four groups of lower cross spring leaves (301) is fixedly connected with a spherical hinge universal joint (302), one side of the spherical hinge universal joint (302) is fixedly connected with an upper cross spring leaf (303), and one end of the lower cross spring leaf (301) and the upper cross spring leaf (303) is provided with a memory alloy limiting ring (304), The damping mechanism (4) comprises an annular cavity (401) arranged in the upper middle part of the base (2), a magnetorheological fluid (402) arranged in the annular cavity (401), a piston rod (403) penetratingly connected to the surface of the annular cavity (401), and a permanent magnet array (404) arranged on the side surface of the annular cavity (401), The elastic mechanism (5) comprises a plurality of groups of conical buffer columns (501) uniformly distributed on the upper part of the base (2), and the upper part of the conical buffer column (501) is fixedly connected with a disc spring (502).

2. The high-damped anti-vibration mount for an integrated circuit device of claim 1, wherein: The base (2) is made of hard rubber material, and four recesses are symmetrically formed in the bottom of the base (2).

3. The high-damped anti-vibration mount for an integrated circuit device of claim 1, wherein: Four groups of the upper cross spring leaves (303) are threadedly connected to the inner bottom wall of the recess, and four groups of the lower cross spring leaves (301) are uniformly distributed around the anti-vibration seat (1).

4. The high-damped anti-vibration mount for an integrated circuit device of claim 1, wherein: The side surface of the annular cavity (401) is provided with an annular frame (6), and the permanent magnet array (404) is annularly arranged in the inner part of the annular frame (6).

5. The high-damped anti-vibration mount for an integrated circuit device of claim 1, wherein: The top end of the piston rod (403) is fixedly connected with a support seat (7), and the disc spring (502) is fixedly connected to the bottom of the support seat (7).

6. The high-damped anti-vibration mount for an integrated circuit device of claim 1, wherein: The diameters of the plurality of groups of conical buffer columns (501) gradually decrease from bottom to top, the material of the plurality of groups of conical buffer columns (501) is silica gel material, and the material of the disc spring (502) is stainless steel or high-carbon steel material.

7. The high-damped anti-vibration mount for an integrated circuit device of claim 1, wherein: The surface of the anti-vibration seat (1) is provided with a fixing hole around, and the fixing hole is used for threadedly connecting with an external structure.

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