Control panel, electric control assembly and air conditioner

Abstract

The utility model discloses a control panel, an electric control assembly and an air conditioner, and relates to the related technical field of air conditioning equipment, and the control panel comprises a circuit board which is provided with a first surface and a second surface which are arranged back to back; at least one first component, wherein the at least one first component is fixedly connected to the first surface; at least one second component, wherein the at least one second component is fixedly connected to the second surface; wherein the first component and the second component are fixedly connected with the circuit board through different connection modes respectively, and the first component and the second component are different types of devices respectively. The technical scheme provided by the utility model aims to solve the technical problem of unreasonable layout of components on the existing control panel.

Description

Technical Field

[0001] This utility model relates to the technical field of air conditioning equipment, specifically to a control board, electrical control components, and an air conditioner. Background Technology

[0002] Air conditioner circuit boards typically use single-sided or double-sided PCBs. Single-sided PCBs can only accommodate components on one side, resulting in low space utilization. On the other hand, the component layout of existing double-sided PCBs is very disorganized, leading to large finished circuit board areas, high costs, and complex manufacturing processes. Utility Model Content

[0003] The main purpose of this utility model is to provide a control board, electrical control components and air conditioner, which aims to solve the technical problem of unreasonable component layout on existing control boards.

[0004] To achieve the above objectives, in a first aspect, this utility model proposes a control board, comprising: a circuit board having a first surface and a second surface disposed opposite to each other; at least one first component, the at least one first component being fixedly connected to the first surface; and at least one second component, the at least one second component being fixedly connected to the second surface; wherein the first component and the second component are fixedly connected to the circuit board through different connection methods, and the first component and the second component are different types of devices.

[0005] Preferably, the first component is a surface mount device, the first surface has a surface mount portion, and the first component is fixedly connected to the location of the surface mount portion.

[0006] Preferably, a solder paste layer is provided between each of the first components and the corresponding surface mount portion, the solder paste layer being used to fix the first component in the corresponding surface mount portion.

[0007] Preferably, the second component is a plug-in component with plug-in pins, the circuit board has a through hole that penetrates the first surface and the second surface, and the plug-in pins of the second component are located inside the through hole.

[0008] Preferably, the through hole has a first pad on the first surface and a second pad on the second surface, and the plug-in pin of the second component is fixedly connected to the first pad and the second pad.

[0009] Preferably, the circuit board is provided with through holes, and for any patch portion on the first surface, the patch portion and any through hole are spaced apart.

[0010] Preferably, the through hole is a circular hole, and there is a preset distance between any point on the edge of the patch portion and the center of any through hole adjacent to the patch portion.

[0011] Preferably, the preset distance is greater than or equal to 2 mm and less than or equal to 3 mm.

[0012] Secondly, this utility model also provides an electronic control component, including an electronic control box and a control board as described in any one of the first aspects, wherein the control board is disposed inside the electronic control box.

[0013] Thirdly, this utility model also provides an air conditioner, including the electronic control components described in the second aspect.

[0014] In this utility model, by setting different types of components on two opposite surfaces of the circuit board, multiple components on the same side of the circuit board belong to the same type of components. This allows each side to use only one process during manufacturing, eliminating the need to use multiple processes on the same side to fix different types of components, thereby improving manufacturing efficiency and reducing process costs. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This diagram illustrates the structure of a control board according to an embodiment of this application.

[0017] Figure 2 A schematic diagram of the circuit board of the control board provided in this embodiment is shown;

[0018] Figure 3 A schematic diagram of the electronic control components of the control board provided in this embodiment is shown.

[0019] Explanation of icon numbers:

[0020]

[0021]

[0022] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0025] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] Air conditioner circuit boards typically use single-sided or double-sided PCBs. Single-sided PCBs can only accommodate components on one side, resulting in low space utilization. On the other hand, the component layout of existing double-sided PCBs is very disorganized, leading to large finished circuit board areas, high costs, and complex manufacturing processes.

[0029] Based on this, this embodiment provides a control board. By setting different types of components on two opposite surfaces of the circuit board, the components on the same side of the circuit board are of the same type. This allows each side to be manufactured using only one process, eliminating the need to use multiple processes on the same side to fix different types of components, thereby improving manufacturing efficiency and reducing process costs.

[0030] Figure 1 This invention provides a schematic diagram of the structure of a control board according to an embodiment of this application. The present invention proposes a control board 01, as shown below. Figure 1 As shown, the control board 01 includes: a circuit board 10, at least one first component 13, and at least one second component 14. The circuit board 10 has a first surface 11 and a second surface 12 facing away from each other. The first component 13 is fixedly connected to the first surface 11, and the second component 14 is fixedly connected to the second surface 12. That is, the first component 13 and the second component 14 are respectively fixed on two opposite surfaces of the circuit board 10. The first component 13 and the second component 14 are fixedly connected to the circuit board 10 through different connection methods, and the first component 13 and the second component 14 are different types of devices.

[0031] In one example, in the vertical direction, the first surface 11 is the lower surface of the circuit board 10, i.e., the bottom surface, and the second surface 12 is the upper surface of the circuit board 10, i.e., the top surface.

[0032] The connection methods between the first component 13 and the second component 14 and the circuit board 10 include, but are not limited to, one or more of the following: through-hole soldering, surface mount technology, flexible circuit board connection using flexible circuit board 10, connection via spring probe, and flip chip connection.

[0033] At least one first component 13 is fixedly connected to the first surface 11, and at least one second component 14 is fixedly connected to the second surface 12. That is, all components on the first surface 11 of the circuit board belong to the same type, and all components on the second surface 12 of the circuit board belong to another type. In this way, the same manufacturing process can be used for all components on the same surface during the manufacturing process, improving manufacturing efficiency and reducing process costs.

[0034] Correspondingly, the types of the first component 13 and the second component 14 include, but are not limited to, surface mount devices, through-hole devices, ball grid arrays, crimp connectors, and conductive adhesive connectors.

[0035] Compared to related technologies that place different types of components on the same side and then use different processes to fix these components onto the circuit board 10, this embodiment allows the same type of components to be placed on the same side of the circuit board 10. During manufacturing, all components on the same surface can be manufactured using the same process, improving manufacturing efficiency and reducing costs.

[0036] Figure 2 A schematic diagram of the circuit board of the control board provided in this embodiment is shown, as follows: Figure 2 As shown, in this embodiment, the first component 13 is a surface mount device, the first surface 11 has a surface mount portion 15, and the first component 13 is fixedly connected to the position of the surface mount portion 15.

[0037] Surface mount devices include, for example, capacitors, resistors, inductors, diodes, transistors, integrated circuits, optoelectronic devices, and photodiodes.

[0038] The first surface 11 has a surface mount portion 15, which helps to achieve high-density integration and reduce the size and weight of the control board 01. It can also help to automate the placement of surface mount devices, thereby improving production efficiency and accuracy and reducing human error.

[0039] In this embodiment, as Figure 2 As shown, a solder paste layer 16 is provided between each first component 13 and the corresponding surface mount part 15, and the solder paste layer 16 is used to fix the first component 13 in the corresponding surface mount part 15.

[0040] The solder paste layer 16 provides good electrical connection and mechanical fixation, which helps to improve the stability and reliability of components.

[0041] Furthermore, compared to related technologies where surface mount devices are first fixed using red glue reflow soldering to prevent them from falling off during wave soldering, and then soldered using wave soldering, this embodiment directly uses solder paste. The solder paste melts during reflow soldering to fix the components onto the circuit board 10, eliminating the need for red glue and saving the steps involved in related technologies, thus further improving process efficiency.

[0042] In this embodiment of the application, the second component 14 is a plug-in device. The second component 14 has plug-in pins 18. The circuit board 10 is provided with a through hole 17, which penetrates the first surface 11 and the second surface 12. The plug-in pins 18 of the second component 14 are located in the through hole 17.

[0043] In one example, the second component 14 is, for example, a connector, relay, transformer, inductor, capacitor, heat sink, switch, button, display, and indicator light.

[0044] In this embodiment, the first component 13 is a surface mount device and the second component 14 is a through-hole device, which can adapt to different device requirements. Surface mount components are suitable for automated and high-speed production, while through-hole components are more suitable for occasions that require high-strength mechanical connections.

[0045] The circuit board 10 has a through-hole 17 that extends through the first surface 11 and the second surface 12. The insertion pin 18 of the second component 14 is located within the through-hole 17. This allows the component to be soldered from the other side of the circuit board 10, increasing process flexibility.

[0046] In this embodiment, the through hole 17 has a first pad (not shown in the figure) corresponding to the first surface 11, and the through hole 17 has a second pad (not shown in the figure) corresponding to the second surface 12. The plug-in pin 18 of the second component 14 is fixedly connected to the first pad and the second pad.

[0047] In one example, the first and second pads can be made of copper, alloys, etc. During wave soldering, when the circuit board 10 passes through the wave soldering machine, the plug-in pins 18 are wetted by the molten solder wave. The surface tension and capillary action of the solder wave cause the liquid solder to climb up along the plug-in pins 18 and the hole walls of the through hole 17, fill the through hole 17, and spread on the first and second pads, expelling the flux gas and air in the through hole 17. Finally, after cooling, the first and second pads form a stable solder joint, thereby achieving electrical and mechanical connection with the plug-in pins 18.

[0048] In this embodiment, the first pad and the second pad provide stable electrical connection points, enhance the fixation of the plug-in pin 18, improve the reliability of the connection, help improve the welding quality, and reduce welding defects.

[0049] In this embodiment, the circuit board is provided with through holes, and for any patch portion 15 on the first surface 11, the patch portion 15 and any through hole 17 are spaced apart.

[0050] Maintaining a proper spacing between the surface mount unit 15 and the via 17 reduces the risk of solder bridging during soldering. This layout helps reduce interference between components, improving circuit stability and performance. It also makes repairs or rework easier, preventing difficulties or damage to other components due to excessively close proximity between components.

[0051] In this embodiment, the through hole 17 is a circular hole, and there is a preset distance between any point on the edge of the patch portion 15 and the center of any through hole 17 adjacent to the patch portion 15.

[0052] As described above, in this embodiment of the application, the through-hole device is disposed on the second surface 12, and the surface mount device is disposed on the first surface 11. The through-hole pins 18 of the through-hole device will be exposed on the second surface 12. In the controller manufacturing process, the surface mount device is first reflow soldered to the circuit board 10 using solder paste. After the surface mount device is soldered, a high-temperature resistant tooling fixture is used to cover all the surface mount devices of the solder paste process, exposing only the pins of the through-hole device. This is to prevent the high temperature of wave soldering from affecting the surface mount device that has been soldered by reflow soldering. Then, the through-hole device is soldered by wave soldering.

[0053] Based on the above process, it can be seen that in this embodiment, the preset distance between any point on the edge of the patch portion 15 and the center of any through hole 17 adjacent to the patch portion 15 can prevent the solder from the wave soldering from touching the patch device, prevent the solder wave from causing thermal or physical impact on the patch device, avoid damage to the soldered patch device, and also reduce the risk of solder bridging during soldering.

[0054] In this embodiment, the preset distance is greater than or equal to 2 mm and less than or equal to 3 mm. This satisfies the soldering process requirements, prevents the solder from the wave soldering from touching the surface mount devices, and prevents the solder wave from causing thermal or physical impact on the surface mount devices. It also meets the size requirements of the circuit board 10, achieving a balance between component integration and soldering process requirements, improving the space utilization of the circuit board 10 and the quality and performance of the final product.

[0055] Figure 3 A schematic diagram of the electronic control components of the control board provided in this embodiment is shown, as follows: Figure 3 As shown, this utility model also proposes an electronic control component, which includes an electronic control box 30 and a control board 01 as described in any of the above claims, with the control board 01 disposed inside the electronic control box 30.

[0056] The specific structure of the control board 01 is as described in the above embodiments. Since this electronic control component adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0057] The control board 01 is integrated on the air conditioner circuit board. The integrated design facilitates the maintenance and replacement of the electrical control structure. The electrical components are uniformly installed inside the electrical control box, which enables effective control of product quality and reduces the assembly cost of the electrical control structure.

[0058] In a preferred embodiment of this utility model, the electronic control component is an air conditioning circuit board.

[0059] This utility model also proposes an air conditioner, including the above-mentioned electronic control components. Since this air conditioner adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0060] Applying the aforementioned control board 01 to an air conditioner can improve the control accuracy and energy efficiency of the air conditioner, while reducing space occupation. The integrated design helps to reduce costs and improve production efficiency, thereby enhancing overall performance.

[0061] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.

Claims

1. A control board, characterized by, The utility model relates to a control board, comprising: a circuit board having a first surface and a second surface arranged oppositely; at least one first component fixedly connected to the first surface; at least one second component fixedly connected to the second surface; wherein the first component and the second component are fixedly connected to the circuit board by different connection manners, and the first component and the second component are different types of components.

2. The control panel of claim 1, wherein, The first component is a surface mount device, the first surface has a surface mount part, and the first component is fixedly connected to the surface mount part.

3. The control panel of claim 2, wherein, A tin paste layer is arranged between each first component and the corresponding surface mount part, and the tin paste layer is used to fix the first component in the corresponding surface mount part.

4. A control panel as claimed in any one of claims 1 to 3, wherein, The second component is an insert component, the second component has insert pins, the circuit board is provided with through holes, the through holes pass through the first surface and the second surface, and the insert pins of the second component are located in the through holes.

5. The control panel of claim 4, wherein, The through hole corresponds to a first pad on the first surface, and the through hole corresponds to a second pad on the second surface, and the insert pins of the second component are fixedly connected to the first pad and the second pad.

6. The control panel of claim 4, wherein, The circuit board is provided with through holes, and for any surface mount part on the first surface, the surface mount part is arranged at intervals with any through hole.

7. The control panel of claim 6, wherein, The through hole is a circular hole, and any point on the edge of the surface mount part and the center of any through hole adjacent to the surface mount part have a preset distance.

8. The control panel of claim 7, wherein, The preset distance is greater than or equal to 2 mm and less than or equal to 3 mm.

9. An electrically controlled assembly, characterized by The utility model relates to an electric control box and the control board of any one of claims 1-8, wherein the control board is arranged in the electric control box.

10. An air conditioner characterized by comprising: The utility model relates to an electric control assembly, comprising the electric control assembly of claim 9.

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