Semiconductor top-speed ice water all-in-one machine device based on TEC

Abstract

The utility model discloses a semiconductor top-speed ice water all-in-one machine device based on TEC. A water storage assembly, a refrigeration assembly, an ice making assembly, a discharging assembly, a heat dissipation assembly and an electrical control system are arranged in a shell assembly. The heat dissipation assembly is respectively connected with the refrigeration assembly and the ice making assembly; the refrigeration assembly comprises a TEC refrigeration module and a refrigeration module liquid cooling plate connected with the TEC refrigeration module; the ice-making assembly comprises a TEC ice-making module and an ice-making module liquid cooling plate connected with the TEC ice-making module; according to the heat dissipation assembly, the refrigeration module liquid cooling plate and the ice making module liquid cooling plate are connected in series through the heat conduction pipe, and the compressor and the condenser are connected through the heat conduction pipe. According to the ice making machine, heat exchange heat dissipation is provided for the refrigeration sheet through the compressor, a traditional water-cooling heat dissipation system is replaced, the refrigeration effect is improved, and the working efficiency of the ice making machine is improved under the condition that extra energy consumption is not increased. The problem that the ice making speed of a traditional compressor is low is solved, and the limitation of the environment temperature on semiconductor refrigeration equipment is also solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of semiconductor extremely fast ice water integrated machine device based on TEC. BACKGROUND

[0002] At present, the ice-making equipment in market mostly uses traditional compressor technology, and the ice-making speed is slow, and the temperature changes greatly during ice-making process. With the increasing demand for ice-making, especially in the field of catering, medical treatment, laboratory, the demand for rapid ice-making technology is increasingly urgent, and the ice-water system in prior art generally lacks efficient and rapid ice-making capacity. At the same time, as a kind of efficient and environmentally friendly refrigeration method, semiconductor refrigeration technology has been gradually applied to refrigerator, air conditioner and other equipment, but the heat dissipation problem of semiconductor refrigeration technology is still one of the bottlenecks of semiconductor refrigeration sheet. The traditional semiconductor refrigeration sheet cooling method usually relies on fan or liquid cooling system, which not only needs additional power supply, but also increases the complexity and volume of the equipment. Therefore, there is an urgent need for an ice-water integrated equipment that can realize rapid ice-making and efficient heat dissipation.

[0003] CN2024223987498 discloses an ice-making assembly and a semiconductor super-silent ice-water integrated machine device based on TEC, and the technical solution is that: the device realizes refrigeration and heating through semiconductor refrigeration sheet; wherein, the refrigeration assembly and the ice-making assembly are the core components of the super-silent ice-water integrated machine, each including a set of TEC refrigeration module and a water-cooled heat dissipation system, wherein the refrigeration assembly and the ice-making assembly share a set of heat dissipation system. The refrigeration assembly is used to reduce the temperature in the ice tank, so that the normal temperature water becomes 5℃ ice water, to ensure the temperature control and cooling effect during ice-water making process; the ice-making assembly is used to reduce the temperature in the ice-making tank, so that the ice water solidifies into ice blocks, to ensure the temperature control and cooling effect during ice-making process. The water-cooled plates of the refrigeration assembly and the ice-making assembly in the heat dissipation system are connected in series through pipeline, and the water-cooled heat sink is connected through pipeline, and the heat is dissipated through the heat dissipation fins and cooling pipeline in the water-cooled heat sink, and a fan is installed on the water-cooled heat sink to assist heat dissipation. However, in this scheme, the heat dissipation system still uses water-cooled heat dissipation, but the water-cooled heat dissipation speed is slow, which cannot meet the demand of extremely fast ice-making. UTILITY MODEL CONTENTS

[0004] The technical problem to be solved by the utility model is: how to solve the requirement of extremely fast ice-making in actual demand, therefore, a semiconductor extremely fast ice-water integrated machine device based on TEC is provided.

[0005] The technical scheme of the utility model is specifically:

[0006] A kind of semiconductor extremely fast ice water integrated device based on TEC, including shell assembly, water storage assembly, refrigeration assembly, ice making assembly, discharge assembly, heat dissipation assembly and electrical control system are arranged in shell assembly;Wherein, heat dissipation assembly is connected with refrigeration assembly and ice making assembly respectively;The refrigeration assembly includes TEC refrigeration module and the liquid cooling plate of refrigeration module connected with it;The ice making assembly includes TEC ice making module and the liquid cooling plate of ice making module connected with it;

[0007] The heat dissipation assembly connects refrigeration module liquid cooling plate and ice making module liquid cooling plate by heat pipe in series, and connects compressor and condenser by heat pipe.

[0008] Water storage assembly is arranged in the shell assembly, and the water storage assembly includes water storage tank, and normal temperature drinking water is stored in the water storage tank;The water storage tank is connected with water storage inlet pipe and water storage outlet pipe, and a cold water pump is arranged in the water storage tank, and the cold water pump is connected with water storage inlet pipe and water storage outlet pipe;The cold water pump pumps normal temperature drinking water in the water storage tank into the refrigeration assembly.

[0009] Water storage inlet pipe and water storage outlet pipe are arranged at the bottom of the water storage tank.

[0010] The refrigeration assembly includes TEC refrigeration module and ice tank;Wherein, the TEC refrigeration module includes first semiconductor refrigeration sheet, and the cold end of the first semiconductor refrigeration sheet is fixedly connected with cold end fin, and the cold end fin is located in the ice tank and contacts with water in the ice tank;The hot end of the first semiconductor refrigeration sheet is connected with refrigeration module liquid cooling plate, and the refrigeration module liquid cooling plate is connected with heat dissipation assembly.

[0011] A temperature sensor is arranged in the ice tank, and the water storage assembly is connected with the ice tank through water storage outlet pipe;The ice tank is connected with ice water outlet pipe, and the ice water outlet pipe is connected with discharge assembly.

[0012] The ice making assembly includes TEC ice making module and ice making forming mechanism, and the TEC ice making module includes second semiconductor refrigeration sheet, and the cold end of the second semiconductor refrigeration sheet is provided with ice tray, and the ice tray is connected with ice making forming mechanism below;The hot end of the second semiconductor refrigeration sheet is provided with ice making module liquid cooling plate, and the ice making module liquid cooling plate is connected with heat dissipation assembly.

[0013] A heat pipe inlet and outlet is arranged in the ice making module liquid cooling plate of the ice making assembly, the heat pipe inlet and outlet is connected with heat pipe, and the heat pipe is connected with compressor and condenser in sequence.

[0014] A flow restrictor is arranged on the heat pipe, and a condensing fan is arranged on the condenser.

[0015] The compressor and the condenser are arranged in the shell assembly, which are built-in compressors.

[0016] The discharge assembly is arranged on the shell assembly, and the discharge assembly comprises a solid discharge mechanism and a liquid discharge mechanism; the liquid discharge mechanism comprises a water mixing tank, and the water mixing tank is connected with an ice water outlet pipe of the ice tank and a water storage outlet pipe of the water storage assembly through proportional electromagnetic valves respectively; the temperature sensor in the ice tank and the proportional electromagnetic valve are connected with a temperature controller.

[0017] The ice-water integrated machine provides heat exchange and heat dissipation for the refrigeration fin through the compressor, replaces the traditional water cooling heat dissipation system, improves the refrigeration effect, and improves the working efficiency of the ice maker without increasing additional energy consumption. Both the slow ice making speed of the traditional compressor and the limitation of the environmental temperature on the semiconductor refrigeration equipment are solved. The liquid cooling structure is connected with the compressor refrigeration system through the heat conduction pipe, and the heat surface temperature of the semiconductor refrigeration fin can be maintained at 5℃ at the lowest, which greatly reduces the cold surface temperature of the refrigeration fin compared with the air cooling heat dissipation, so as to improve the refrigeration effect of the ice-water integrated machine and realize 3-minute super-speed ice making. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is an appearance view of the utility model;

[0019] Figure 2 It is an internal structure view of the utility model;

[0020] Figure 3 It is an ice making assembly and heat dissipation structure;

[0021] Figure 4 It is a schematic view of the heat dissipation assembly.

[0022] The reference signs are:

[0023] The water storage assembly 1; the discharge assembly 2; the water dripping groove 3; the compressor 4; the condenser 5; the water storage tank body 6; the ice tank 7; the second semiconductor refrigeration fin 8; the ice tray 9; the ice making module liquid cooling plate 10; the water tank 11; the heat conduction pipe inlet and outlet 12; the heat conduction pipe 13; the throttling device 14; the condensing fan 15; the ice storage tank 16; the ice making assembly 17; the refrigeration assembly 18; the shell assembly 100; the solid discharge mechanism 202; the liquid discharge mechanism 201. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0025] As Figure 1 , Figure 2As shown, a semiconductor-based TEC ice water all-in-one device includes a housing assembly 100, a water storage assembly 1, a refrigeration assembly 18, an ice making assembly 17, a discharge assembly, a heat dissipation assembly, and an electrical control system arranged in the housing assembly 100; wherein the heat dissipation assembly is connected with the refrigeration assembly and the ice making assembly 17, respectively.

[0026] The refrigeration assembly 18 includes a TEC refrigeration module and a refrigeration module liquid cooling plate connected therewith.

[0027] The ice making assembly 17 includes a TEC ice making module and an ice making module liquid cooling plate connected therewith.

[0028] The heat dissipation assembly connects the refrigeration module liquid cooling plate and the ice making module liquid cooling plate through a heat conduction pipe, and connects the compressor 4 and the condenser 5 through the heat conduction pipe.

[0029] The following is a detailed analysis:

[0030] The water storage assembly 1 is arranged in the housing assembly 100 and includes a water storage tank 6 in which normal temperature drinking water is stored; the water storage tank 6 is connected with a water storage inlet pipe and a water storage outlet pipe, and preferably the water storage inlet pipe and the water storage outlet pipe are arranged at the bottom of the water storage tank 6. A cold water pump is arranged in the water storage tank 6 and connected with the water storage inlet pipe and the water storage outlet pipe; the cold water pump pumps the normal temperature drinking water in the water storage tank 6 into the refrigeration assembly.

[0031] The refrigeration assembly is arranged in the housing assembly 100 and communicates with the water storage assembly, and is used for preparing ice water. The refrigeration assembly includes a TEC refrigeration module and an ice tank 7; wherein the TEC refrigeration module includes a first semiconductor refrigeration sheet, the cold end of the first semiconductor refrigeration sheet is fixedly connected with a cold end fin, the cold end fin is located inside the ice tank 7 and contacts the water in the ice tank 7; the hot end of the first semiconductor refrigeration sheet is connected with a refrigeration module liquid cooling plate, the refrigeration module liquid cooling plate mainly dissipates heat and cools the hot end of the first semiconductor refrigeration sheet, and the refrigeration module liquid cooling plate is connected with the heat dissipation assembly.

[0032] It should be noted that the cold end of the first semiconductor refrigeration sheet and the cold end fin, and the refrigeration module liquid cooling plate and the hot end of the first semiconductor refrigeration sheet are all coated with a heat conduction material to achieve sufficient heat conduction. By energizing the first semiconductor refrigeration sheet, the cold end temperature of the first semiconductor refrigeration sheet is lower than the hot end temperature of the first semiconductor refrigeration sheet, so as to absorb the heat of the cold end fin.

[0033] The cold end fin of the TEC refrigeration module is located inside the ice tank 7 to cool the water in the ice tank 7. A temperature sensor is arranged in the ice tank 7 to monitor the water temperature in real time. The water storage assembly 1 is connected to the ice tank 7 through a water outlet pipe, thereby realizing water supply from the water storage assembly 1 to the ice tank 7. The ice tank 7 is connected to an ice water outlet pipe, and the ice water outlet pipe is connected to a mixing water tank arranged on the discharging assembly 2. A proportional electromagnetic valve is arranged on the ice water outlet pipe. The temperature sensor and the proportional electromagnetic valve are both connected to a temperature controller.

[0034] The ice making assembly is arranged in the shell assembly 100 and communicates with the refrigeration assembly. When ice cubes are needed, ice water in the refrigeration assembly is transported to the ice making assembly to make ice cubes. The ice making assembly includes a TEC ice making module and an ice making forming mechanism, as shown in Figure 3 The TEC ice making module includes a second semiconductor refrigeration fin 8. The cold end of the second semiconductor refrigeration fin 8 is provided with an ice tray 9, and the lower part of the ice tray 9 is connected to the ice making forming mechanism. The hot end of the second semiconductor refrigeration fin is provided with an ice making module liquid cooling plate 10, which mainly cools and dissipates heat from the hot end of the second semiconductor refrigeration fin 8. The ice making module liquid cooling plate 10 is connected to a heat dissipation assembly.

[0035] It should be noted that the ice tray 9 and the cold end of the second semiconductor refrigeration fin, and the ice making module liquid cooling plate 10 and the hot end of the second semiconductor refrigeration fin are evenly coated with a heat-conducting material to achieve sufficient heat conduction. By energizing the second semiconductor refrigeration fin, the temperature of the cold end of the second semiconductor refrigeration fin is lower than that of the hot end of the second semiconductor refrigeration fin, so as to absorb the heat of the ice tray 9. The cold end ice tray adopts thermal insulation measures. The main purpose of the thermal insulation layer is to reduce the heat loss of the cold end and further improve the ice making speed. By changing the current direction of the second semiconductor refrigeration fin, the temperature of the ice tray can be raised and lowered.

[0036] The structure of the ice making forming mechanism is the same as that disclosed in CN2024223987498, which includes a water tank 11, an ice making unit, and a flow guide structure. The water tank 11 includes a water tank body. A turnover motor is installed on one side of the water tank. After the ice making is completed, the turnover motor drives the water tank to overturn, pours the remaining water into the rear wall, and flows into the lower ice tank along the inclined surface of the flow guide structure for recycling. The specific structure is not described here.

[0037] The heat dissipation assembly connects the refrigeration module liquid cooling plate and the ice making module liquid cooling plate through a heat conduction pipe 13, and connects the compressor 4 and the condenser 5 through the heat conduction pipe. The working principle of the ice making assembly is described as follows. Figure 4As shown, the heat pipe inlet and outlet 12 is arranged in the ice-making module liquid cooling plate 10 of the ice-making assembly, the heat pipe inlet and outlet 12 is connected with the heat pipe 13, and the heat pipe 13 is connected with the compressor 4 and the condenser 5 in sequence.

[0038] The working principle of the heat dissipation assembly is that a pipeline is arranged in the ice-making module liquid cooling plate, the heat pipe 13 is connected through the pipeline, and the heat pipe 13 is connected with the compressor 4 and the condenser 5 to form a system.

[0039] Similarly, the refrigeration module liquid cooling plate and the ice-making module liquid cooling plate are connected in series through the heat pipe 13 and are connected to the compressor heat dissipation system.

[0040] It should be noted that in the present application, the compressor 4 and the condenser 5 are arranged in the housing assembly 100, and the compressor 4 is an internal compressor.

[0041] The discharge assembly 2 is arranged on the housing assembly 100 and is used for discharging medium in the refrigeration assembly and the ice-making assembly.

[0042] The solid discharge mechanism 202 is a storage ice tank 16 and is used for discharging solid ice blocks.

[0043] The liquid discharge mechanism 201 includes a water mixing tank, and the water mixing tank is connected with the ice-water outlet pipe of the ice tank 7 and the water storage outlet pipe of the water storage assembly 1 through proportional electromagnetic valves.

[0044] The electrical control system 9 is used for setting and adjusting the working parameters of the novel ice-water integrated machine, is responsible for monitoring and adjusting the running state of the novel ice-water integrated machine, and users can operate and set through a control panel.

[0045] The working principle of the novel ice-water integrated machine is as follows:

[0046] The utility model discloses a semiconductor extremely fast ice water all-in-one machine device based on TEC, including shell subassembly, water storage subassembly sets up in the shell subassembly, the water storage subassembly stores the drinking water for water supply. When working, the water storage subassembly transports the normal temperature water through the water storage water outlet pipe to the refrigeration subassembly, and the refrigeration subassembly is set up in the shell subassembly and is communicated with the water storage subassembly, is used for preparing ice water, and the ice making subassembly is set up in the shell subassembly and is communicated with the refrigeration subassembly, when needing ice block, the ice water in the refrigeration subassembly is transported to the ice making subassembly and makes ice block, and the discharge assembly is set up on the shell subassembly, and the medium in the refrigeration subassembly and the ice making subassembly is discharged, and the electrical control system is used for setting and adjusting the working parameter of ice water all-in-one machine, and is responsible for monitoring and adjusting the running state of ice water all-in-one machine.

[0047] In the utility model, the heat dissipation assembly connects the liquid cooling plate of the refrigeration assembly and the ice making assembly through the heat pipe, connects the compressor and the condenser through the heat pipe, in order to ensure the high -efficient heat dissipation, and the hot face of the refrigeration piece is connected closely with the compressor condenser through the heat pipe system, and is designed with the temperature control device, so as to keep the hot face temperature of the refrigeration piece in the optimum working range. The heat dissipation heat of the condenser is conducted to the hot face of the refrigeration piece through the heat pipe, promotes the release of heat, and makes the refrigeration piece keep high -efficient heat dissipation in the operation process.

[0048] The semiconductor refrigeration piece heat dissipation of the utility model utilizes the compressor condenser system and can keep the hot face of the refrigeration piece at a lower temperature, solves the environmental limitation of the traditional semiconductor ice maker, and realizes 3 minutes ice production. The ice making unit of the product contains two refrigeration pieces, and the volume is compact, the power is small, the cost is low, and the mixed water tank can quickly realize the cold water drinking demand of various water temperatures.

[0049] The above only is the preferred implementation of the utility model, should point out, for the person skilled in the art, without departing from the overall concept of the utility model, still can make a number of changes and improvements, these also should be regarded as the protection range of the utility model.

Claims

1. A TEC-based semiconductor super-fast ice-water all-in-one machine device, comprising a housing assembly (100), a water storage assembly (1), a refrigeration assembly (18), an ice making assembly (17), a discharge assembly, a heat dissipation assembly and an electrical control system are arranged in the housing assembly (100); wherein, The heat dissipation assembly is connected with the refrigeration assembly and the ice making assembly (17) respectively; characterized in that the refrigeration assembly (18) comprises a TEC refrigeration module and a refrigeration module liquid cooling plate connected with the TEC refrigeration module; and the ice making assembly (17) comprises a TEC ice making module and an ice making module liquid cooling plate connected with the TEC ice making module. The heat dissipation assembly connects the refrigeration module liquid cooling plate and the ice making module liquid cooling plate through a heat conduction pipe, and connects the compressor (4) and the condenser (5) through the heat conduction pipe.

2. A TEC-based semiconductor-based ultra-fast ice and water dispenser device according to claim 1, wherein: The water storage assembly (1) is arranged in the shell assembly (100), and comprises a water storage tank (6) in which normal temperature drinking water is stored; the water storage tank (6) is connected with a water storage inlet pipe and a water storage outlet pipe, and a cold water pump is arranged in the water storage tank (6) and connected with the water storage inlet pipe and the water storage outlet pipe; the cold water pump pumps the normal temperature drinking water in the water storage tank (6) into the refrigeration assembly.

3. A TEC-based semiconductor-based ultra-fast ice and water dispenser device according to claim 2, wherein: The water storage inlet pipe and the water storage outlet pipe are arranged at the bottom of the water storage tank (6).

4. The TEC-based semiconductor-based ultra-fast ice and water dispenser device of claim 1, wherein: The refrigeration assembly (18) comprises a TEC refrigeration module and an ice tank (7); the TEC refrigeration module comprises a first semiconductor refrigeration sheet, and the cold end of the first semiconductor refrigeration sheet is fixedly connected with a cold end fin, which is located inside the ice tank (7) and in contact with water in the ice tank (7); the hot end of the first semiconductor refrigeration sheet is connected with a refrigeration module liquid cooling plate, and the refrigeration module liquid cooling plate is connected with the heat dissipation assembly.

5. A TEC-based semiconductor-based ultra-fast ice and water dispenser device according to claim 4, wherein: A temperature sensor is arranged in the ice tank (7), and the water storage assembly (1) is connected with the ice tank (7) through the water storage outlet pipe; the ice tank (7) is connected with an ice water outlet pipe, and the ice water outlet pipe is connected with the discharging assembly.

6. A TEC-based semiconductor-based ultra-fast ice and water dispenser device according to claim 1, wherein: The ice making assembly comprises a TEC ice making module and an ice making forming mechanism, the TEC ice making module comprises a second semiconductor refrigeration sheet (8), the cold end of the second semiconductor refrigeration sheet (8) is provided with an ice tray (9), and the ice tray (9) is connected with the ice making forming mechanism below; the hot end of the second semiconductor refrigeration sheet is provided with an ice making module liquid cooling plate (10), and the ice making module liquid cooling plate (10) is connected with the heat dissipation assembly.

7. A TEC-based semiconductor-based ultra-fast ice and water dispenser device according to claim 6, wherein: A heat conduction pipe inlet and outlet (12) is arranged in the ice making module liquid cooling plate (10) of the ice making assembly, the heat conduction pipe inlet and outlet (12) is connected with a heat conduction pipe (13), and the heat conduction pipe (13) is connected with the compressor (4) and the condenser (5) in sequence.

8. The TEC-based semiconductor-based ultra-fast ice and water dispenser device of claim 1, wherein: A throttling device (14) is arranged on the heat conduction pipe (13), and a condenser fan (15) is arranged on the condenser (5).

9. The TEC-based semiconductor-based ultra-fast ice and water dispenser device of claim 1, wherein: The compressor (4) and the condenser (5) are arranged inside the shell assembly (100), and are an internal compressor (4).

10. A TEC-based semiconductor-based ultra-fast ice and water dispenser device according to claim 4, wherein: The discharging assembly (2) is arranged on the shell assembly (100), and comprises a solid discharging mechanism (202) and a liquid discharging mechanism (201); the liquid discharging mechanism (201) comprises a water mixing tank, the water mixing tank is connected with the ice water outlet pipe of the ice tank (7) and the water storage outlet pipe of the water storage assembly (1) through a proportional electromagnetic valve; and the temperature sensor in the ice tank and the proportional electromagnetic valve are connected with a temperature controller.

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