Thermal infrared imager

Abstract

The utility model provides an infrared thermal imager. The infrared thermal imager comprises a housing; the infrared module, the SIM card module, the at least one cellular communication module and the main control module are packaged in the shell; the infrared module, the SIM card module and the cellular communication modules are all connected with the master control module. Therefore, on the basis of a basic infrared function, the thermal infrared imager also has a networking function based on the cellular communication module, the SIM card module and the main control module, and a hardware basis is provided for a call making function. On the basis of the functions and hardware, the functions and application scenes of the thermal infrared imager are enriched, so that the thermal infrared imager can be widely applied to industrial detection, fire safety, environment monitoring, field rescue and other scenes, and convenience is brought to users.

Description

Technical Field

[0001] This utility model relates to the field of infrared equipment technology, and in particular to an infrared thermal imager. Background Technology

[0002] Existing gas concentration detection technologies mainly include infrared thermal imaging, which images gas targets based on the absorption characteristics of leaked gas along the background radiation transmission path. As a non-contact, real-time monitoring technology, it has been widely used in recent years due to its high sensitivity, rapid response, and stable operation in complex environments. Infrared thermal imagers, as the core detection equipment using this technology, play a crucial role in industrial safety, environmental monitoring, and energy facility maintenance. They can be used to accurately detect gas leaks, providing important technical support for accident prevention and ensuring production safety.

[0003] However, existing infrared thermal imagers have limitations in their functional design, and their single function has become a key factor restricting their further expansion of application scenarios and improvement of user experience. Utility Model Content

[0004] In view of this, the present invention provides an infrared thermal imager that integrates multiple functions, which can enrich the functions and application scenarios of infrared thermal imagers and bring convenience to users.

[0005] This utility model provides an infrared thermal imager, comprising:

[0006] case;

[0007] An infrared module, a SIM card module, at least one cellular communication module, and a main control module are encapsulated within the housing.

[0008] The infrared module, the SIM card module, and each of the cellular communication modules are all connected to the main control module.

[0009] In one embodiment, the main control module uses a system-on-a-chip that integrates a microprocessor and a digital signal processor.

[0010] In one embodiment, the infrared thermal imager further includes at least one of the following:

[0011] The display screen is exposed outside the housing and is connected to the main control module;

[0012] A visible light module, which is encapsulated within the housing and connected to the main control module;

[0013] A geomagnetic sensor, which is encapsulated within the housing and connected to the main control module;

[0014] A six-axis gyroscope, which is encapsulated within the housing and connected to the main control module;

[0015] A laser ranging module, which is encapsulated within the housing and connected to the main control module;

[0016] A storage module, which is encapsulated within the housing and connected to the main control module;

[0017] A power system, encapsulated within the housing, includes a battery and a battery management module, the battery being connected to the battery management module; the battery management module is connected to the main control module.

[0018] A sensor module, which is encapsulated within the housing and connected to the main control module;

[0019] A positioning module, which is encapsulated within the housing and connected to the main control module;

[0020] An audio input / output module, which is encapsulated within the housing and connected to the main control module;

[0021] A heat dissipation module, which is encapsulated within the housing and connected to the main control module;

[0022] A wireless connection module, which is encapsulated within the housing and connected to the main control module.

[0023] In one embodiment, the positioning module includes a BeiDou positioning module; the BeiDou positioning module includes: a BeiDou positioning chip, a first control switch, and a second control switch;

[0024] The second control switch connects the main control module and the first control switch. The second control switch is used to disconnect or connect according to the control signal of the main control module, and to control the first control switch to disconnect or connect.

[0025] The first control switch connects the power system and the Beidou positioning chip.

[0026] In one embodiment, the infrared thermal imager further includes a PCB board; each of the modules and the modules are integrated on the PCB board.

[0027] In one embodiment, the antennas of the wireless connection module, the cellular communication module, and the positioning module are disposed on the top layer of the PCB board.

[0028] In one embodiment, the geomagnetic sensor is disposed on the top layer of the PCB board and away from metal devices.

[0029] In one embodiment, the main control module is disposed on the top layer of the PCB board, and the sensor module is disposed on the bottom layer of the PCB board, with the sensor module located away from the mapping area of ​​the main control module on the bottom layer.

[0030] In one embodiment, the audio input / output module includes a microphone, a power amplifier module, and a speaker; the microphone is connected to the main control module; the input terminal of the power amplifier module is connected to the main control module, and the output terminal of the power amplifier module is connected to the speaker. The power amplifier module is used to amplify the audio signal output by the main control module and drive the speaker to produce sound.

[0031] In one embodiment, the PCB board has a first protrusion and a second protrusion extending outward from the body and spaced apart;

[0032] The microphone includes a left channel microphone and a right channel microphone;

[0033] The power amplifier module includes a left channel power amplifier module and a right channel power amplifier module;

[0034] The loudspeaker includes a left channel loudspeaker connected to the left channel power amplifier module and a right channel loudspeaker connected to the right channel power amplifier module.

[0035] The left channel microphone and the left channel speaker are located on the top and bottom layers of the first protrusion, respectively, and the right channel microphone and the right channel speaker are located on the top and bottom layers of the second protrusion, respectively.

[0036] The infrared thermal imager provided by this utility model, through the configuration of an infrared module, a SIM card module, at least one cellular communication module, and a main control module, connects the infrared module, SIM card module, and each cellular communication module to the main control module. Thus, in addition to basic infrared functions, the infrared thermal imager also possesses network connectivity based on the cellular communication module, SIM card module, and main control module, and provides the hardware foundation for making phone calls. Based on the above functions and hardware foundation, the functionality and application scenarios of the infrared thermal imager are enriched, enabling its widespread application in industrial inspection, fire safety, environmental monitoring, and field rescue, bringing convenience to users. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the structure of an infrared thermal imager provided in an embodiment of the present invention;

[0038] Figure 2 This is a schematic diagram of the structure of an infrared thermal imager provided in an embodiment of the present invention;

[0039] Figure 3A schematic diagram of the circuit principle of a GPS positioning module provided in an embodiment of this utility model;

[0040] Figure 4 A schematic diagram of the circuit principle of the Beidou positioning module provided in an embodiment of this utility model;

[0041] Figure 5 This is a schematic diagram of the top layer layout of a PCB provided in one embodiment of the present invention. Detailed Implementation

[0042] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0043] It should be noted that all directional indicators (such as up, down, left, right, front, back, inside, outside, top, bottom, etc.) in the embodiments of this utility model are only used to explain the relative positional relationship between the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0044] It should also be noted that when a component is referred to as "fixed to" or "set on" another component, the component may be directly on the other component or there may be an intervening component present. When a component is referred to as "connected to" another component, it may be directly connected to the other component or there may be an intervening component present.

[0045] like Figure 1 As shown, one embodiment of this utility model provides an infrared thermal imager, including a housing 102, an infrared module 104, a SIM card module 106, at least one cellular communication module 108, and a main control module 110.

[0046] The infrared module 104, SIM card module 106, each cellular communication module 108, and main control module 110 are all encapsulated within the housing 102. The infrared module 104, SIM card module 106, and each cellular communication module 108 are all connected to the main control module 110. The housing 102 protects the electronic components, improves device reliability, and the integrated packaging simplifies the overall device design and reduces complex connections between modules.

[0047] In one embodiment, the housing 102 may be made of explosion-proof materials, such as explosion-proof engineering plastics or composite materials that have undergone special explosion-proof treatment. This enables the infrared thermal imager to adapt to extremely harsh working environments such as flammable and explosive environments, highly corrosive gases, or dusty environments.

[0048] The cellular communication module 108 is used to achieve long-distance data transmission based on mobile communication networks (such as 2G / 3G / 4G / 5G). In this embodiment, the infrared thermal imager includes at least one cellular communication module, which may be at least one of a 2G communication module, a 3G communication module, a 4G communication module, or a 5G communication module.

[0049] The SIM card module 106 may include a SIM card slot and a SIM card. The SIM card slot is provided with metal contacts. When the SIM card is inserted into the slot, the two establish a connection through the metal contacts. The SIM card slot is further connected to the main control module 110, thereby enabling communication between the SIM card and the main control module 110.

[0050] The infrared thermal imager possesses networking capabilities based on a cellular communication module 108 and a SIM card module 106. Specifically, each cellular communication module 108 is an integrated hardware component, containing a communication chip, antenna, radio frequency circuitry, and other hardware, which, combined with an embedded software protocol stack, enables wireless data interaction. The SIM card module 106 interacts logically with each cellular communication module 108 through a main control module 110. The cellular communication module 108 reads the user's identity and authentication information from the SIM card, completes network registration, and establishes a communication link with the base station via the antenna. Together, they enable the infrared thermal imager's networking function and provide the hardware foundation for making phone calls.

[0051] This infrared thermal imager has at least one cellular mobile communication module, such as any one or more of 2G / 3G / 4G / 5G communication modules. When the infrared thermal imager has multiple 2G / 3G / 4G / 5G communication modules (e.g., 4G and 5G), it can adaptively switch networks based on network signal strength and quality. In different network environments, it can seamlessly switch to the optimal network, ensuring a stable network connection and efficient data transmission capabilities, thereby guaranteeing smooth wireless data interaction.

[0052] The aforementioned infrared thermal imager, configured with an infrared module, a SIM card module, at least one cellular communication module, and a main control module, connects to the main control module. Thus, in addition to basic infrared functionality, the infrared thermal imager also possesses network connectivity based on the cellular communication module, SIM card module, and main control module, providing the hardware foundation for making phone calls. Based on these functions and hardware foundations, the capabilities and application scenarios of the infrared thermal imager are enriched, enabling its widespread use in industrial inspection, fire safety, environmental monitoring, and field rescue, bringing convenience to users.

[0053] In one embodiment, to meet the gas concentration detection requirements of the infrared thermal imager, the main control module 110 adopts a system-on-chip (SOC) that integrates a microprocessor and a digital signal processor, such as the SRM930 chip. The SOC provides high-performance computing services. By equipping the infrared thermal imager with an SOC and integrating AI algorithms into it, the infrared thermal imager can utilize AI algorithms to achieve gas concentration detection.

[0054] The infrared module 104 can use a 640*512 uncooled gas detector to collect infrared images of the application scenario and transmit them to the microprocessor of the main control module 110 via MIPI signal. The microprocessor's AI algorithm identifies the leaking gas area in the infrared image and uses DSP to analyze the difference between the leaking gas area and the background infrared radiation to determine the gas concentration.

[0055] In this embodiment, the main control module 110 adopts a system-on-a-chip that integrates a microprocessor and a digital signal processor, which has powerful computing power and provides efficient computing support for the infrared thermal imager. It can meet the needs of the infrared thermal imager to run complex AI algorithms and provides a hardware foundation for its intelligent functions.

[0056] In one embodiment, the infrared thermal imager also includes a display screen, exposed outside the housing 102 and connected to the main control module 110, for displaying relevant information output by the main control module 110. For example, a user can view information such as gas concentration detection information, image information, and wireless network connection status output by the main control module 110 through the display screen. To facilitate user operation, the display screen can be a touch screen, allowing the user to interact with the infrared camera via touch.

[0057] In one embodiment, such as Figure 2 As shown, the infrared thermal imager also includes a visible light module 112, which is encapsulated within a housing 102 and connected to the main control module 110, enabling the infrared thermal imager to also acquire visible light images. The main control module can also fuse infrared and visible light images to obtain a fused image, realizing the complementary application of infrared and visible light in different environments.

[0058] In one embodiment, the infrared thermal imager further includes a geomagnetic sensor 114, which is encapsulated within a housing 102 and connected to the main control module 110. The geomagnetic sensor 114 detects the three-dimensional direction (X / Y / Z axes) of the Earth's magnetic field, providing raw magnetic field data. Based on the magnetic field direction and intensity information in this data, the main control module 110 calculates and determines the absolute orientation of the infrared thermal imager. Therefore, based on the geomagnetic sensor, the infrared thermal imager can function as an electronic compass, enabling it to help users determine location in rescue, exploration, and other scenarios.

[0059] In one embodiment, the infrared thermal imager further includes a six-axis gyroscope 116, which is encapsulated within a housing 102 and connected to the main control module 110. Specifically, the six-axis gyroscope 116 includes a three-axis gyroscope and a three-axis accelerometer, capable of measuring the acceleration and rotational angular velocity of the infrared thermal imager. Through data fusion algorithms (such as complementary filtering or Kalman filtering), the attitude angles (pitch angle, roll angle, and yaw angle) of the device can be calculated.

[0060] The main control module 110, combining information such as the direction detected by the geomagnetic sensor 114 and the attitude angle detected by the six-axis gyroscope 116, can determine whether the infrared thermal imager is stationary or in motion. In motion, it can further distinguish specific movement modes such as walking and running. When the infrared thermal imager is in motion and needs to acquire images, the main control module 110 can use algorithms to perform image stabilization to ensure stable and clear imaging. Furthermore, the main control module 110 can integrate data from the geomagnetic sensor 114 and the six-axis gyroscope 116 to determine whether the device is in landscape or portrait mode and control the screen rotation accordingly, providing a more user-friendly visual experience. Simultaneously, it can also detect changes in the device's state from stationary to moving based on this sensor information, thereby enabling screen wake-up functionality.

[0061] In one embodiment, the laser ranging module 118 is encapsulated within a housing 102 and connected to the main control module 110. The laser ranging module 118 may include a laser transmitter, a receiver, an optical system, a time counter or phase detector, a control circuit, and a microprocessor. The ranging principle of the laser ranging module 118 is as follows: the laser transmitter emits a short-pulse laser, which is reflected back to the receiver after encountering the target object. By measuring the time difference required for the laser to travel from emission to reception, and utilizing the constant speed of light, the distance between the target object and the rangefinder is calculated. The laser ranging module 118 and the main control module 110 transmit data via UART. UART is a commonly used serial communication protocol suitable for short-range, low-speed data transmission. At different test distances, the laser ranging module 118 returns different encoded values. After receiving these encoded values, the main control module 110 converts them into the actual measured distance according to a preset algorithm or mapping relationship, thereby achieving accurate ranging functionality.

[0062] In one embodiment, the infrared thermal imager further includes a storage module 120, which is encapsulated within a housing 102 and connected to the main control module 110. The storage module 120 includes a card slot and a memory card, such as an SD card or a TF card, for storing infrared or visible light image data, system configuration information, or algorithm programs acquired by the main control module 110.

[0063] In one embodiment, such as Figure 2As shown, the infrared thermal imager also includes a power system 122 encapsulated within the housing 102. Specifically, the power system 122 includes a battery 1221 and a battery management module 1222, with the battery 1221 connected to the battery management module 1222 and the battery management module 1222 connected to the main control module 110.

[0064] The battery 1221 can be mounted on the PCB board, and all the aforementioned modules are integrated on the PCB board, with the battery supplying power to these modules. The battery 1221 can be a lithium iron phosphate battery. The battery management module 1222 is connected to the main control module 110. More specifically, the battery management module 1222 connects to the main control module 110 via I2C for data transmission and to power other components of the infrared thermal imager. The battery management module 1222 monitors the charging voltage through a charging IC and features high-precision charging current and voltage regulation, charging preprocessing, termination, and charging status monitoring. The main control module 110 can control the charging current, charging voltage, and charging time of the battery 1221 by controlling the battery management module 1222.

[0065] In one embodiment, the infrared thermal imager further includes a sensor module 124 encapsulated within a housing 102, and a main control module 110 connected to the sensor module 124. The sensor module 124 can integrate sensors with various functions as needed, collect environmental information, and send the collected environmental information to the main control module 110. The main control module 110 can adjust the operating status of the infrared thermal imager and its components in real time based on the environmental information.

[0066] In one embodiment, the sensor module 124 includes a light intensity sensor, which detects the external light intensity and transmits the collected light intensity to the main control module 110. The main control module 110 dynamically adjusts the screen brightness parameters of the display screen based on the real-time collected light intensity data. Specifically, when the ambient light intensity exceeds a preset threshold (such as in a strong outdoor light environment), the main control module 110 brightens the display screen through PWM dimming technology or a current-driven adjustment mechanism, thereby effectively combating strong light reflection and glare interference; conversely, when the light intensity is below the safe viewing range (such as in a low-light environment at night), the main control module 110 gradually reduces the backlight power of the display screen, using a graded attenuation strategy to achieve a smooth brightness transition and avoid visual discomfort caused by sudden changes.

[0067] In one embodiment, the sensor module 124 includes a temperature and humidity sensor for monitoring the internal temperature and humidity of the thermal imager housing. The temperature and humidity sensor is located inside the housing and contains humidity-sensitive and temperature-sensitive elements for monitoring the internal temperature and humidity of the thermal imager housing. The temperature and humidity sensor communicates bidirectionally with the main control module via a high-precision signal transmission interface. When the detected internal temperature and humidity exceed a corresponding threshold, the main control module 110 adjusts the operating status of the infrared thermal imager accordingly. For example, when the internal temperature or humidity is too high, the main control module 110 can control the infrared thermal imager to force shutdown and enter a protection mode, thereby protecting the electronic components of the infrared thermal imager.

[0068] In one embodiment, the sensor module 124 includes a first temperature sensor for monitoring the temperature of the main control module 110. The first temperature sensor collects temperature data from the main control module 110 and transmits the temperature data to the main control module 110. When the main control module 110 detects that the temperature is greater than a threshold, it can activate the heat dissipation module to prevent the main control module from overheating.

[0069] In one embodiment, the sensor module 124 includes a second temperature sensor for monitoring the temperature of the battery. The second temperature sensor collects the temperature data of the battery and transmits the temperature data to the main control module 110. When the main control module 110 detects that the temperature of the battery 1221 is greater than a threshold, it can control the battery management module 1222 to cut off the power supply to prevent the battery from overheating.

[0070] In one embodiment, the infrared thermal imager further includes a heat dissipation module 126 encapsulated within a housing 102 and connected to the main control module 110. The heat dissipation module 126 primarily consists of a fan, but may also be equipped with other auxiliary heat dissipation components to enhance heat dissipation. When the main control module 110 detects through its sensor components that the internal temperature of the housing, the temperature of the main control module, or the temperature of other electronic components exceeds a preset safety threshold, it sends a start signal to the heat dissipation module 126, causing the fan to begin operating. This reduces the temperature of the main control module 110, the internal temperature of the housing, or other electronic components, preventing performance degradation or damage due to overheating.

[0071] In one embodiment, the infrared thermal imager further includes a wireless connection module 128 encapsulated within a housing. The wireless connection module 128 can be a Wi-Fi module, Bluetooth module, or the like. The infrared thermal imager can transmit data and interact via the wireless connection module 128.

[0072] In one embodiment, the infrared thermal imager further includes an audio input / output module 132 encapsulated within a housing 102 and connected to the main control module 110. Configuring the audio input / output module 132 provides the hardware foundation for the voice interaction and audio output functions of the infrared thermal imager.

[0073] Specifically, the audio input / output module 132 includes: a speaker 1321, a power amplifier module 1322, and a microphone 1323.

[0074] Microphone 1323 is connected to main control module 110. Microphone 1323 collects voice signals, and main control module 110 can recognize the content of the voice signals.

[0075] The input terminal of the power amplifier module 1322 is connected to the main control module 110, and the output terminal of the power amplifier module 1322 is connected to the speaker 1321. The power amplifier module 1322 is used to amplify the audio signal output by the main control module 110 and drive the speaker 1321 to produce sound.

[0076] By equipping the infrared thermal imager with a speaker 1321, a power amplifier module 1322, and a microphone 1323, the infrared thermal imager can achieve voice control and voice interaction functions. For example, the microphone 1323 collects voice signals. If the main control module 110 recognizes the voice signal as a voice control command, it executes or calls other modules to execute the corresponding command. For example, if the microphone 1323 collects a photo-taking command input in voice mode, the main control module 110 recognizes it and calls the infrared module 104 to capture an image. If the main control module 110 cannot recognize the voice signal, it can output voice feedback, which is played through the power amplifier module 1322 and the speaker 1321. For example, when the main control module 110 cannot recognize the voice signal, it can play the voice message "Sorry, I didn't hear you clearly, please say it again" through the power amplifier module 1322 and the speaker 1321.

[0077] In one embodiment, the infrared thermal imager further includes a positioning module 130 encapsulated within a housing. The positioning module 130 is connected to the main control module 110. The positioning module 130 may include at least one of a GPS positioning module and a BeiDou positioning module. The positioning module 130 can provide accurate geographic coordinates, facilitating the main control module 110 to associate the data collected by the infrared thermal imager with specific address locations.

[0078] In one embodiment, the positioning module 130 employs a GPS positioning module and a BeiDou positioning module, which can enhance the reliability and stability of positioning.

[0079] In one embodiment, such as Figure 3 As shown, the GPS positioning module includes a GPS antenna J14, an impedance matching circuit P41, a power amplifier P42, and a filter chip LB1.

[0080] The GPS antenna J14 is connected to the impedance matching circuit P41.

[0081] The power amplifier device P42 includes a power amplifier chip U12, a first filter circuit P421, and a second filter circuit P422. The impedance matching circuit P41 is connected to the signal input terminal of the power amplifier chip U12 through the first filter circuit P421. The signal output terminal of the power amplifier chip U12 is connected to the signal input terminal of the filter chip LB1 through the second filter circuit P422.

[0082] The main control module 110 is located at the signal output terminal of the filter chip LB1.

[0083] The impedance matching circuit P41 includes capacitors C591 and C129, and resistor R124. The two ends of resistor R124 are connected to one end of capacitor C129 and one end of capacitor C591, respectively. The other end of capacitors C129 and C591 are grounded. Impedance matching circuit P41 performs impedance matching on the weak signal received by the GPS antenna, improving the sensitivity of signal reception.

[0084] The signal processed by the impedance matching circuit P41 is filtered by the first filter circuit P421 and then input to the power amplifier chip U12 for power amplification. After power amplification, the signal is filtered by the second filter circuit P422 and then input to the filter chip LB1 for further filtering before being input to the main control module 110.

[0085] The first filter circuit P421 includes an inductor L17 and a resistor R126. One end of the resistor R126 is grounded, and the other end is connected to the resistor R126.

[0086] The second filter circuit includes a resistor R125 and an inductor L18. One end of the inductor L18 is grounded, and the other end is connected to the resistor R125.

[0087] The power signal input terminal of the power amplifier P42 is also equipped with a filter circuit (resistor R122 and capacitor C127, and capacitor C128 as shown in the figure) to filter out high-frequency noise in the power supply and improve the stability of the power signal.

[0088] In this embodiment, the GPS positioning module uses a power amplifier and a filter chip to filter and amplify the GPS signal, thereby enhancing the GPS signal and making GPS positioning more accurate.

[0089] In one embodiment, such as Figure 4 As shown, the BeiDou positioning module includes a BeiDou positioning chip U87, a first control switch Q4, and a second control switch Q9.

[0090] The first control switch Q4 is connected to the power supply and the Beidou positioning chip U87, and the second control switch Q9 is connected to the main control module 110 and the first control switch Q4.

[0091] In practical applications, there may be situations where the Beidou positioning chip U87 is powered on but the main control module 110 cannot recognize it. To address this, when the main control module 110 cannot detect the Beidou positioning chip U87, it sends a shutdown control signal to the second control switch Q9. The second control switch Q9 then opens, and with the second control switch Q9 open, the first control switch Q4 opens, cutting off the power supply to the Beidou positioning chip U87, thus powering it down.

[0092] Then, the main control module 110 sends a start control signal to the second control switch Q9, and the second control switch Q9 is turned on. When the second control switch Q9 is turned on, the first control switch Q4 is turned on, and the power supply provides power to the Beidou positioning chip U87, and the Beidou positioning chip U87 is powered on.

[0093] Thus, by continuously powering on and off, the process continues until the main control module recognizes the Beidou positioning chip U87. In this embodiment, a first control switch is set to connect the power supply and the Beidou positioning chip, and a second control switch is set to connect the main control module and the first control switch. This allows the main control module to control the power-on and power-off of the Beidou positioning chip, in order to deal with situations where the Beidou positioning chip cannot be recognized.

[0094] like Figure 4 As shown, the Beidou positioning module also includes a reset switch Q19 connected to the reset pin of the Beidou positioning chip U87. The reset switch Q19 is connected to the reset pin of the Beidou positioning chip U87 and the main control module 110. The main control module 110 can control the reset operation of the Beidou positioning chip.

[0095] In one embodiment, the first control switch Q4, the second control switch Q9, and the reset switch Q19 may be MOSFETs.

[0096] In one embodiment, the infrared thermal imager further includes a PCB board; all modules and components are integrated on the PCB board. Specifically, such as Figure 2 In the device shown, all modules and units are integrated onto a PCB board, through which the electronic components are electrically connected. This integrated design not only optimizes the signal transmission paths between components and reduces electromagnetic interference, but also significantly improves the overall performance and reliability of the system. Thus, while ensuring functional integrity, it achieves significant miniaturization and weight reduction of the infrared thermal imager structure. For example, the infrared thermal imager can be designed as a portable, handheld device, with significantly reduced size and weight, making it easy for users to hold with one hand and carry, greatly expanding the application scenarios of infrared thermal imagers.

[0097] Considering that the wireless connection module 128, cellular communication module 108 and positioning module 130 of the infrared thermal imager all have antennas, by setting the antennas of the wireless connection module 128, cellular communication module 108 and positioning module 130 on the top layer of the PCB board, the interference of the antennas to other devices can be reduced, and assembly can be facilitated.

[0098] In one embodiment, the geomagnetic sensor 114 is also disposed on the top layer of the PCB board and away from metal components (such as heat dissipation modules). The geomagnetic sensor 114 works by detecting changes in the Earth's magnetic field when a ferromagnetic object passes by, but metal can easily interfere with the geomagnetic sensor. By disposing of it on the top layer of the PCB board and away from metal components, the influence of metal on the geomagnetic sensor 114 can be effectively reduced, thereby reducing detection errors.

[0099] like Figure 5 The diagram shows a top-level layout of a PCB board according to an embodiment. The main control module 110 is located on the top layer of the PCB board, and the sensor module 124 is located on the bottom layer of the PCB board, and its location is far away from the mapping area of ​​the main control module 110 on the bottom layer.

[0100] The main control module 110 typically generates electromagnetic interference, fluctuations, noise, and heat during operation. These factors can all interfere with the sensor, and the signal lines between the main control module 110 and the sensor may interfere with each other, leading to signal distortion or misjudgment.

[0101] In this embodiment, by placing the main control module 110 on the top layer of the PCB board and the sensor module 124 on the bottom layer of the PCB board, and far away from the mapping area of ​​the main control module 110 on the bottom layer, the mutual interference between the sensor and the main control module 110 can be reduced.

[0102] In one embodiment, microphone 1323 includes a left-channel microphone and a right-channel microphone; power amplifier module 1322 includes a left-channel power amplifier module and a right-channel power amplifier module; speaker 1321 includes a left-channel speaker connected to the left-channel power amplifier module and a right-channel speaker connected to the right-channel power amplifier module. Thus, stereo sound acquisition can be achieved using the left and right channel microphones, and stereo sound playback can be achieved using the left and right channel power amplifier modules and speakers.

[0103] In addition, to improve the sound playback effect, the main control module 110 can also integrate a sound re-sampling program to perform echo cancellation, noise suppression and other processing on the re-sampling audio signal, thereby improving the audio output quality.

[0104] In one embodiment, the shape of the PCB board is adapted to the shape of the housing 102, thereby facilitating the installation and fixation of the PCB board and improving overall stability. For example... Figure 5As shown, the PCB board 50 has a first protrusion 501 and a second protrusion 502 extending outward from the main body and spaced apart, thereby forming a PCB board shape that fits the outer shell.

[0105] By utilizing the structure of the two bumps on the PCB board 50, the left channel microphone and left channel speaker are located on the top and bottom layers of the first bump 501, respectively, and the right channel microphone and right channel speaker are located on the top and bottom layers of the second bump 502, respectively. This allows for full utilization of the PCB board 50's own structure to optimize the spacing between the microphones and speakers of the left and right channels, thereby improving stereo sound acquisition and playback performance.

[0106] In this embodiment of the invention, by upgrading the hardware of the infrared thermal imager, it integrates components such as an infrared module, a visible light module, a sensor module, a SIM card module, a storage module, a laser ranging module, a geomagnetic sensor, a wireless connection module, a power amplifier module, and a microphone. A high-performance integrated SOC is configured as the main control module. Based on the above hardware configuration, the infrared thermal imager can meet gas detection requirements while possessing multiple functions such as networking, ranging, illumination, infrared acquisition, visible light acquisition, and voice interaction. This greatly enriches the functionality and application scenarios of the infrared thermal imager, bringing convenience to users.

[0107] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. An infrared thermal imager characterized by, The infrared thermal imager comprises: a shell; an infrared module, a SIM card module, at least one cellular communication module and a master control module encapsulated in the shell; the infrared module, the SIM card module and each cellular communication module are connected with the master control module.

2. The infrared thermal imager of claim 1, wherein, The master control module adopts a system on chip integrating a microprocessor and a digital signal processor.

3. The infrared thermal imager of claim 1 or 2, characterized in that, The infrared thermal imager further comprises at least one of the following: a display screen exposed to the shell and connected with the master control module; a visible light module encapsulated in the shell and connected with the master control module; a geomagnetic sensor encapsulated in the shell and connected with the master control module; a six-axis gyroscope encapsulated in the shell and connected with the master control module; a laser ranging module encapsulated in the shell and connected with the master control module; a storage module encapsulated in the shell and connected with the master control module; a power supply system encapsulated in the shell, the power supply system comprising a battery and a battery management module, the battery being connected with the battery management module, and the battery management module being connected with the master control module; a sensor module encapsulated in the shell and connected with the master control module; a positioning module encapsulated in the shell and connected with the master control module; an audio input / output module encapsulated in the shell and connected with the master control module; a heat dissipation module encapsulated in the shell and connected with the master control module; a wireless connection module encapsulated in the shell and connected with the master control module.

4. The infrared thermal imager of claim 3, wherein, The positioning module comprises a Beidou positioning module; the Beidou positioning module comprises a Beidou positioning chip, a first control switch and a second control switch; the second control switch connects the master control module and the first control switch, and is used for disconnecting or conducting according to a control signal of the master control module and controlling the first control switch to disconnect or conduct; the first control switch connects the power supply system and the Beidou positioning chip.

5. The infrared thermal imager of claim 3, wherein, The infrared thermal imager further comprises a PCB board; each module and each module are integrated on the PCB board.

6. The infrared thermal imager of claim 5, wherein, Antennas of the wireless connection module, the cellular communication module and the positioning module are arranged on a top layer of the PCB board.

7. The infrared thermal imager of claim 5, wherein, The geomagnetic sensor is arranged on the top layer of the PCB board and is away from devices made of metal materials.

8. The infrared thermal imager of claim 5, wherein, The master control module is arranged on the top layer of the PCB board, the sensor module is arranged on a bottom layer of the PCB board and is away from a mapping area of the master control module on the bottom layer.

9. The infrared thermal imager of claim 5, wherein, The audio input / output module comprises a microphone, a power amplifier module and a speaker; the microphone is connected with the main control module; the input end of the power amplifier module is connected with the main control module, the output end of the power amplifier module is connected with the speaker, and the power amplifier module is used for power amplification processing of the audio signal output by the main control module and driving the speaker to sound.

10. The infrared thermal imager of claim 9, wherein, The PCB board has a first protrusion and a second protrusion which extend outward from the main body and are arranged at intervals; The microphone comprises a left channel microphone and a right channel microphone; The power amplifier module comprises a left channel power amplifier module and a right channel power amplifier module; The speaker comprises a left channel speaker connected with the left channel power amplifier module and a right channel speaker connected with the right channel power amplifier module; The left channel microphone and the left channel speaker are respectively located at the top layer and the bottom layer of the first protrusion, and the right channel microphone and the right channel speaker are respectively located at the top layer and the bottom layer of the second protrusion.

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