Memory bank test equipment

Abstract

The utility model discloses a memory bank test device which comprises a test host and an electric control module, the memory bank test device comprises a temperature control unit, one end of the temperature control unit is provided with an air inlet, the other end of the temperature control unit is provided with an air outlet, and the temperature control unit comprises a speed regulation fan, an air guide cover, a temperature control area, a heating rod and a heat conduction piece. The speed regulation fan, the wind scooper and the temperature control area are sequentially arranged in the first airflow direction, at least part of the memory bank is located in the temperature control area, the heat conduction piece is arranged in the wind scooper, and the heating rod is arranged in the heat conduction piece; under the driving of the speed regulation fan, airflow enters from the air inlet, passes through the heat conduction piece in the wind scooper in the first airflow direction, then reaches the memory bank in the temperature control area and finally flows out from the air outlet. The heat conduction piece can be arranged in the wind scooper, the heating rod is arranged in the heat conduction piece, the heating efficiency is high, and the heat insulation effect of equipment is good.

Description

Technical Field

[0001] This utility model relates to the field of memory module testing technology, and in particular to a memory module testing device. Background Technology

[0002] In the development and production of electronic products, memory module testing is a key step in ensuring product quality and stability. Temperature is one of the important factors affecting the operating performance of memory modules, so testing the operating status of memory modules at different temperatures is an important part of memory testing.

[0003] In existing memory module temperature testing equipment, the heating device generally uses a heating element placed outside the heat-conducting component and attached to it for heating. However, this setting leaves part of the heating element exposed to the air, resulting in poor heat insulation and low heating efficiency. It is difficult to quickly reach the required test temperature during testing, thus reducing testing efficiency and making it difficult for the test results to accurately reflect the performance of the memory module under different temperature conditions. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a memory module testing device with good heat insulation, high heating efficiency, and high testing efficiency.

[0005] This utility model is achieved through the following technical solution:

[0006] A memory module testing device includes a test host, wherein the memory module is plugged into the test host, and the memory module testing device includes:

[0007] A temperature control module includes a temperature control unit. One end of the temperature control unit is provided with an air inlet, and the other end is provided with an air outlet. The temperature control unit includes a speed-regulating fan, an air guide shroud, a temperature control area, a heating rod, and a heat-conducting component. The speed-regulating fan, the air guide shroud, and the temperature control area are arranged sequentially along a first airflow direction. At least part of the memory module is located within the temperature control area. The heat-conducting component is disposed within the air guide shroud, and the heating rod is disposed within the heat-conducting component.

[0008] The electronic control module is electrically connected to both the test host and the temperature control unit.

[0009] Driven by the speed-regulating fan, the airflow enters from the air inlet, passes through the heat-conducting component inside the air guide shroud along the first airflow direction, and then reaches the memory module in the temperature control area, finally flowing out from the air outlet.

[0010] Furthermore, the heat-conducting component has multiple fins on the side near the airflow, and the airflow can pass between the multiple fins.

[0011] Furthermore, the heat-conducting component has a cavity, and the heating rod is fixedly disposed within the cavity.

[0012] Furthermore, the outer surface of the heating rod is in contact with the inner surface of the cavity.

[0013] Furthermore, the air guide shroud has an air inlet at one end near the speed-regulating fan and an air outlet at the other end, which is connected to the temperature control area. The cross-section of the air guide shroud gradually decreases along the first airflow direction.

[0014] Furthermore, the test host is provided with multiple test areas, each including multiple slots for inserting the memory modules, and the number of temperature control units is also set to multiple, with each temperature control unit corresponding to one of the multiple test areas.

[0015] Furthermore, the memory module testing equipment also includes a housing, the testing host is mounted on the housing, the temperature control module is rotatably connected to the housing and can rotate between a closed position and an open position. When the temperature control module is in the closed position, the temperature control unit is in close contact with the housing, and the memory module is at least partially located within the temperature control area. When the temperature control module is in the open position, the testing area is exposed, and the memory module can be inserted into the slot.

[0016] Furthermore, the memory module testing equipment also includes a pair of symmetrically arranged nitrogen springs, one end of which is connected to the temperature control module and the other end of which is connected to the housing.

[0017] Furthermore, the test host includes a test motherboard, a heat sink attached to the CPU, and a cooling fan. The test motherboard has multiple slots on one side and the CPU on the other side. The cooling fan is used to dissipate the heat from the heat sink from the test host.

[0018] Furthermore, the test host includes a housing, the CPU, heat sink, and cooling fan are all housed inside the housing, and the slot is exposed outside the housing.

[0019] Compared with existing technologies, the advantages of this utility model are:

[0020] 1. This utility model divides the test area into multiple areas, and each test area is equipped with a corresponding temperature control unit for heating. The memory modules in each test area will not affect each other, which improves the temperature uniformity index of the memory module test environment and greatly reduces the temperature error of the test environment, which can reach ±4℃.

[0021] 2. This utility model sets up a speed-regulating fan and a temperature sensor in the temperature control unit, blows air into the temperature control unit and passes through the heating component and the test area in sequence. By cooperating with the temperature sensor to control the speed of the speed-regulating fan, the airflow speed can be controlled, thereby accurately controlling the temperature in the test area.

[0022] 3. This utility model features a flip-up temperature control module mounted on the housing, with symmetrical nitrogen springs supporting the temperature control cover. This makes opening the temperature control module easier and allows the cover to be supported at its maximum angle, ensuring the cover is open for easy insertion of memory modules.

[0023] 4. The test area in this utility model is equipped with high-temperature resistant sealing strips at both the top and bottom to ensure independent and stable operation of the test area, precise and controllable ambient temperature, and avoid interference from external environmental factors.

[0024] 5. The housing of this utility model is also equipped with a door switch sensor to ensure that the temperature control module will not open when the equipment is working, so as to avoid damage to the equipment and affect the test results, thereby improving the safety of the equipment.

[0025] 6. This utility model places the CPU and socket of the test motherboard on opposite sides, so that heating of the test area will not affect the heat dissipation of the CPU on the other side, and will not affect the test efficiency and accuracy.

[0026] 7. This utility model places the heating module, i.e., the heating rod and the heat-conducting component, inside the air guide shroud, which makes the area outside the air guide shroud have good heat insulation effect, reduces the temperature rise in other areas of the equipment, and reduces the risk of damage to the equipment or injury to the test personnel.

[0027] 8. This utility model places the heating rod inside the heat-conducting component, and the outer surface of the heating rod is in contact with the inner surface of the cavity of the heat-conducting component, which makes the heat conduction efficiency higher, thereby making the equipment heating efficiency higher, reaching the required test temperature faster, and improving the test efficiency.

[0028] 9. The temperature control unit in this utility model first heats the airflow through the heating module, and then sends the heated airflow to the working area connected to the test area. The heated airflow heats the memory module to be tested, making it easier to control the temperature in the test area. At the same time, it avoids the memory module from being damaged by touching the heating module due to misalignment or other reasons when the heating module directly heats the memory module. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the closed-state structure of a memory module testing device according to an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of the open state structure of a memory module testing device according to an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the open state portion of a memory module testing device according to an embodiment of the present invention;

[0032] Figure 4 This is an exploded view of a test host according to an embodiment of the present invention;

[0033] Figure 5 This is a cross-sectional view of a temperature control unit according to an embodiment of the present invention;

[0034] Figure 6 This is a cross-sectional view of a test host according to an embodiment of the present invention;

[0035] Figure 7 This is a front view of a memory module testing device according to an embodiment of the present invention;

[0036] Figure 8 This is a rear view of a memory module testing device according to an embodiment of the present invention;

[0037] Figure 9 This is a partial cross-sectional view of a memory module testing device according to an embodiment of the present invention;

[0038] Figure 10 This is a perspective view of a wind direction adjusting block according to an embodiment of the present invention.

[0039] Labeling Explanation: 1. Enclosure; 10. Installation Space; 11. Front Panel; 110. Control Switch; 114. Status Indicator Light; 12. Rear Panel; 120. Power Interface; 121. I / O Interface; 122. Electric Cooling Fan; 15. Door Sensor Switch; 16. Opening Handle; 17. Foot Support; 2. Main Body of Equipment; 20. Test Host; 200. Test Mainboard; 201. Housing; 202. Heat Sink; 203. Cooling Fan; 204. Cover Plate; 205. Test Port; 206. Seal; 206a. First Sealing Ring; 206b. Second Sealing Ring; 207. Support Plate; 21. Test Area; 3. Temperature Control Module; 30. Temperature Control Unit; 300. Speed ​​Adjustment 302. Fan; 303. Temperature control area; 304. Heating rod; 305. Heat conductor; 306. Cavity; 307. Third heat insulation plate; 308. Air inlet; 309. Air outlet; 31. Temperature sensor; 310. Base plate; 312a. Working port; 312b. Temperature control cover; 313. Working area; 314. Air inlet; 315. Air outlet; 316. Air guide shroud; 317. Top plate; 318. Insulating air layer; 319. Air distribution plate; 320. Air direction adjustment block; 321. Rotating shaft; 322. First heat insulation plate; 40. Nitrogen spring; 5. Electrical control module; 9. Memory module; X. First airflow direction; Y. Second airflow direction. Detailed Implementation

[0040] The following detailed, non-limiting description of the utility model's technical solution, in conjunction with preferred embodiments and accompanying drawings, is provided. In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0041] like Figure 1 As shown, an embodiment of the present invention provides a memory module testing device for performing performance testing on a memory module 9 under a controlled ambient temperature. The memory module testing device includes a main body 2 and a temperature control module 3. The main body 2 is used for performance testing of the memory module 9, and has slots for inserting the memory module 9. The temperature control module 3 is movably mounted on the main body 2 and can heat the memory module 9 inserted into the slot for high-temperature performance testing. By opening or closing the temperature control module 3, testers can easily insert the memory module 9 into the main body 2 without affecting the heating effect of the temperature control module 3.

[0042] Specifically, refer to Figure 3 The main body 2 of the equipment includes a housing 1, a testing host 20, and an electrical control module 5. Both the testing host 20 and the temperature control unit 30 are electrically connected to the electrical control module 5. The housing 1 is constructed of profiles and has an internal installation space 10. This installation space 10 can be horizontally divided into a first installation space and a second installation space, distributed front and rear. The testing host 20 is installed in the first installation space and fixed to the housing 1 with screws. The electrical control module 5 is installed in the second installation space. This modular design, separating the two parts for easy installation and subsequent maintenance, facilitates the installation and maintenance of the equipment.

[0043] Further reference Figure 2The test host 20 is used to test the memory modules 9. The test host 20 has multiple test areas 21, each including multiple slots for inserting the memory modules 9. In this embodiment, four test areas 21 are arranged along a straight line, and each test area 21 contains four slots arranged along the same straight line. Experiments show that the heat generated by the four memory modules 9 during testing has a relatively small impact on the ambient temperature, making it easier for the device to maintain a stable ambient temperature within the test areas 21.

[0044] Key reference Figure 2 and Figure 3 The temperature control module 3 includes multiple temperature control units 30, each corresponding to one of the multiple test areas 21. These units heat the memory modules 9 within their respective test areas 21. Each temperature control unit 30 also includes a temperature sensor 308 to monitor the temperature within the test area 21. Both the test host 20 and the temperature control units 30 are electrically connected to the electronic control module 5. Each of the four temperature control units 30 can independently control the temperature of its corresponding test area 21, allowing for more precise adjustment of the test environment temperature and improving the accuracy of the test results.

[0045] For more details, please refer to the following: Figure 5 The temperature control module 3 also includes a temperature control cover 31, and four temperature control units 30 are arranged in a straight line, with the outer shell of the temperature control unit 30 fixedly connected to the temperature control cover 31 by screws. One end of the outer shell of the temperature control unit 30 is provided with an air inlet 306, and the other end is provided with an air outlet 307 to realize airflow.

[0046] The temperature control unit 30 includes a speed-regulating fan 300, an air guide shroud 313, a temperature control zone 302, a heating rod 303, and a heat-conducting component 304, all housed within a casing. The speed-regulating fan 300, air guide shroud 313, and temperature control zone 302 are arranged sequentially along a first airflow direction X, with the memory module 9 at least partially located within the temperature control zone 302. The heat-conducting component 304 is housed within the air guide shroud 313, and the heating rod 303 is housed within the heat-conducting component 304. Driven by the speed-regulating fan 300, external airflow enters through the air inlet 306 on the casing of the temperature control unit 30, travels along the first airflow direction X, passes through the heat-conducting component 304 within the air guide shroud 313, is heated, and then reaches the memory module 9 within the temperature control zone 302, finally exiting through the air outlet 307. The specific working principle is as follows: the heating rod 303 heats the heat-conducting component 304. In this embodiment, the heat-conducting component 304 is made of aluminum, which has excellent thermal conductivity and a larger contact surface with the airflow compared to the heating rod 303. This allows the heated heat-conducting component 304 to heat the flowing airflow, thus ensuring that the airflow entering the temperature control area 302 is heated. Simultaneously, a working port 309a is provided on the base plate 309 of the temperature control unit 30, corresponding to the temperature control area 302. The memory module 9 can pass through the working port 309a. Furthermore, the airflow can heat the entire test area 21 through the working port 309a, enabling the temperature control unit 30 to heat the memory module 9 in the corresponding test area 21. Finally, the airflow exits from the air outlet 307 on the outer shell of the temperature control unit 30 to prevent airflow accumulation and affecting the heating effect.

[0047] In addition, the outlet of the temperature control area 302 is close to the air outlet 307, and the aforementioned temperature sensor 308 is installed on the housing at the air outlet 307, so that the temperature sensor 308 can detect the temperature in the test area 21 more timely and accurately.

[0048] Optionally, a cavity 304a is formed within the heat-conducting component 304, and the heating rod 303 is fixedly disposed within the cavity 304a. This ensures that the heating rod 303 is completely embedded in the heat-conducting component 304, and the entire heating module is fixed inside the air guide shroud 313, greatly increasing the heating efficiency. A third heat insulation plate 305 is also provided between the heat-conducting component 304 and the air guide shroud 313, keeping the area outside the air guide shroud 313 at room temperature and improving the heat insulation effect of the equipment.

[0049] In this embodiment, the outer surface of the heating rod 303 is attached to the inner surface of the cavity 304a, thereby further improving the heating efficiency.

[0050] In addition, multiple fins are provided on the side of the heat conductor 304 near the airflow, allowing the airflow to pass between the fins, thereby increasing the contact area between the airflow and the heat conductor 304. The heat from the heating rod 303 can be conducted to the multiple fins through the area in contact with the heat conductor 304. When the airflow passes between the multiple fins, it will be heated and then flow to the temperature control area 302 to heat the test area 21.

[0051] Optional, refer to Figure 3 and Figure 5 The outer casing of the temperature control unit 30 is approximately rectangular, with an air inlet 306 and an air outlet 307 located at its far ends. The interior of the casing has a strip-shaped space, within which a first heat insulation plate 321 is fixedly installed. This first heat insulation plate 321, vertically positioned, divides the strip-shaped space near the air inlet 306 into a working area 310. A second heat insulation plate 322 is also installed within the strip-shaped space. The working area 310 is formed by the first heat insulation plate 321, the second heat insulation plate 322, a base plate 309, and a speed-regulating fan 300. An air guide shroud 313 is disposed within the working area 310 and is attached to the base plate 309. In this embodiment, the entire heating module is fixed inside the air guide shroud 313. The air guide shroud 313 is positioned within the working area 310, which consists of multiple heat insulation plates, preventing other areas within the equipment from experiencing temperature increases due to heat emitted by the heating rod 303, thus avoiding damage to the equipment or injury to testing personnel.

[0052] Optionally, the top plate 314 of the temperature control unit 30 is also made of heat insulation material, and a heat insulation air layer 315 is formed between the top plate 314 and the second heat insulation plate 322. Through double medium insulation, the heating rod 303 is further prevented from affecting other areas.

[0053] Furthermore, the air guide shroud 313 has an air inlet 312a at one end near the speed-regulating fan 300 and an air outlet 312b at the other end, which is connected to the temperature control area 302. Along the first airflow direction X, the cross-section of the air guide shroud 313 gradually decreases, which accelerates the airflow when it flows out of the air outlet 312b. This ensures that the heated airflow has sufficient velocity when it enters the temperature control area 302, so that it can better cover the entire temperature control area 302. Ultimately, this makes the temperature of the test area 21 more uniform and the test results more accurate.

[0054] Optionally, an airflow adjustment block 317 is also provided near the air outlet 312b, as shown in the reference. Figure 10 The wind direction adjustment block 317 is approximately a triangular prism and is rotatably mounted on the base plate 309 via the rotating shaft 317a. The relatively turbulent airflow is transformed into a smoother airflow after passing through the wind direction adjustment block 317, thus avoiding uneven heating and improving the accuracy of the test.

[0055] Optionally, a flow equalization plate 316 is fixed between the air guide shroud 313 and the temperature control area 302. The flow equalization plate 316 can make the airflow from the second area 312 to the temperature control area 302 more stable, making the temperature in the temperature control area 302 more uniform, thereby making the ambient temperature of the four memory modules 9 in the test area 21 consistent, and making the test results more accurate. Preferably, the flow equalization plate 316 is fitted to the first heat insulation plate 321, making the internal structure of the temperature control unit 30 more compact.

[0056] Further refer to 2 and Figure 3 The test area 21 on the test host 20 is exposed on the outside of the enclosure 1. The temperature control module 3 is rotatably connected to the enclosure 1 and can rotate between a closed position and an open position. When the temperature control module 3 is in the closed position, the temperature control unit 30 is in close contact with the enclosure 1, and the memory module 9 is at least partially located within the temperature control area 302. When the temperature control module 3 is in the open position, the test area 21 is exposed, and the memory module 9 can be inserted into the slot. The method of rotating the temperature control module 3 to open or close facilitates the insertion and testing of the memory module 9.

[0057] Specifically, the memory module testing equipment also includes a pair of symmetrically arranged nitrogen springs 40. One end of the nitrogen springs 40 is connected to the temperature control module 3, and the other end is connected to the housing 1. Specifically, both ends are connected by rotation, so that when the user flips open the temperature control module 3, the nitrogen springs 40 can extend and retract synchronously, making it easier to open the temperature control cover 31, and the temperature control module 3 can be suspended in the open position, making it convenient for the user to insert the memory module 9.

[0058] Optional, please refer to. Figure 2 and Figure 3 The housing 1 is also equipped with a pair of door sensor switches 15. The door sensor switches 15 are located in front of the test host 20. They can detect whether the temperature control module 3 is in the closed position, ensuring that it will not open during normal equipment testing or when the heating module is above room temperature, thereby avoiding safety accidents caused by human error.

[0059] Optionally, the temperature control cover 31 is also equipped with opening handles 16 on both sides for easy gripping by the user.

[0060] In addition, four feet 17 are installed at the bottom of the enclosure 1 to raise the equipment and prevent water from entering the equipment or the bottom from being unable to ventilate and affect heat dissipation.

[0061] Furthermore, we will focus on referring to Figure 4 and Figure 6The test host 20 includes a test motherboard 200, a heatsink 202 attached to the CPU, and a cooling fan 203. The test motherboard 200 has multiple slots on one side and the CPU on the other. The cooling fan 203 blows hot air out of the test host 20, with the airflow flowing in the second airflow direction Y, thus dissipating heat from the heatsink 202. During testing, the memory modules 9 on the test motherboard 200 need to be heated, while the CPU needs to be cooled, creating a conflict. Therefore, this invention places the slots and CPU on opposite sides of the test motherboard 200. A CPU cooling mechanism, namely the heatsink 202 and cooling fan 203, is located on the side where the CPU is located to cool the CPU. This ensures good CPU cooling on the test motherboard 200 without affecting the heating of the memory modules 9 in the slots on the other side, guaranteeing the accuracy of the test results.

[0062] Specifically, please refer to Figure 4 The test host 20 includes a housing 201. The CPU, heat sink 202 and cooling fan 203 are all housed inside the housing 201. The slots are exposed outside the housing 201, so that the test host 20 can be removed separately for easy maintenance and repair.

[0063] In addition, the test host 20 also includes a cover plate 204 and a tray plate 207. The tray plate 207 is fixedly connected to the housing 201 and forms a heat dissipation space between the tray plate 207 and the housing 201. The test motherboard 200 is fixed on the tray plate 207, and the CPU and heat sink 202 are arranged in the heat dissipation space. Six cooling fans 203 are arranged on one side of the housing 201 to blow air out of the housing 201 to remove the heat from the heat sink 202 and thus dissipate heat from the CPU.

[0064] Further reference Figure 9 A cover plate 204 is positioned above the test motherboard 200, and multiple test ports 205 corresponding to the test area 21 are formed on the cover plate 204. Sealing elements 206 are provided around each test port 205. In this embodiment, the sealing element 206 includes a first sealing ring 206a and a second sealing ring 206b. When the temperature control module 3 is in the closed position, one side of the first sealing ring 206a abuts against the cover plate 204, and the other side abuts against the base plate 309 of the temperature control unit 30. One side of the second sealing ring 206b abuts against the cover plate 204, and the other side abuts against the test motherboard 200. The first sealing ring 206a and the second sealing ring 206b seal the test area 21, ensuring a stable test environment for the memory module 9 within the test area 21 and preventing interference from external factors, thus improving the accuracy of the test results.

[0065] In addition, refer to Figure 7 , Figure 8In this embodiment, the front panel 11 of the enclosure 1 is equipped with a control switch 110 and status indicator lights 114 electrically connected to the electronic control module 5. The control switch 110 is used to control the start and stop of the device. There are four groups of status indicator lights 114, each corresponding to one of the four test areas 21, and each group has four lights, corresponding one-to-one with the four slots, used to display the test status of the memory modules 9 in the corresponding slots. The rear panel 12 of the enclosure 1 is equipped with a power interface 120 and an I / O interface 121 electrically connected to the electronic control module 5, used for power input and connection of I / O devices or signal output, respectively, so that test results can be exported to external devices for storage or retrieval. In addition, the rear panel 12 is also equipped with at least four electronically controlled cooling fans 122 to cool the electronic control module 5.

[0066] During operation, the temperature control module 3 is initially in the open state. The operator inserts the memory module 9 into the slot in the test area 21. After insertion, the user grasps the opening handle 16 to close the temperature control cover 31, so that the temperature control area 302 on the temperature control unit 30 is connected and tightly connected to the corresponding test area 21. Then, the control switch 110 is turned on, and the heating rod 303 and the speed-regulating fan 300 in the temperature control unit 30 are started, blowing hot air into the test area 21 to heat the memory module 9. At the same time, the test motherboard 200 starts testing.

[0067] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A memory stick testing apparatus comprising a test host (20) on which a memory stick (9) is plugged, characterized in that, The memory bar testing device comprises: A temperature control module (3) comprising a temperature control unit (30), one end of the temperature control unit (30) being provided with an air inlet (306) and the other end being provided with an air outlet (307), the temperature control unit (30) comprising a speed-regulated fan (300), a wind guide cover (313), a temperature control area (302), a heating rod (303) and a heat conducting member (304), the speed-regulated fan (300), the wind guide cover (313) and the temperature control area (302) being sequentially arranged along a first airflow direction (X), the memory bar (9) being at least partially located in the temperature control area (302), the heat conducting member (304) being arranged in the wind guide cover (313), and the heating rod (303) being arranged in the heat conducting member (304); An electric control module (5), the testing host (20) and the temperature control unit (30) being electrically connected with the electric control module (5); Under the driving of the speed-regulated fan (300), air flows into the air inlet (306), passes through the heat conducting member (304) in the wind guide cover (313) along the first airflow direction (X), further reaches the memory bar (9) in the temperature control area (302), and finally flows out of the air outlet (307).

2. The memory stick testing apparatus according to claim 1, wherein A plurality of fins are arranged on one side of the heat conducting member (304) close to the airflow, and the airflow can pass through the fins.

3. The memory module testing device of claim 2, wherein, A cavity (304a) is formed in the heat conducting member (304), and the heating rod (303) is fixedly arranged in the cavity (304a).

4. The memory module testing device of claim 3, wherein, The outer surface of the heating rod (303) is attached to the inner surface of the cavity (304a).

5. The memory module testing device of claim 1, wherein, One end of the wind guide cover (313) close to the speed-regulated fan (300) is provided with an air inlet (312a), the other end is provided with an air outlet (312b) and is in communication with the temperature control area (302), and the cross section of the wind guide cover (313) gradually decreases along the first airflow direction (X).

6. The memory module testing device of claim 1, wherein, A plurality of testing areas (21) are arranged on the testing host (20), each testing area (21) comprising a plurality of slots for plugging the memory bar (9), and the number of the temperature control units (30) is also set to be multiple, and each temperature control unit (30) corresponds to one testing area (21).

7. The memory module testing device of claim 6, wherein, The memory bar testing device further comprises a box body (1), the testing host (20) being arranged on the box body (1), the temperature control module (3) being rotatably connected with the box body (1) and being capable of rotating between a closed position and an open position, when the temperature control module (3) is in the closed position, the temperature control unit (30) is tightly attached to the box body (1), the memory bar (9) is at least partially located in the temperature control area (302), when the temperature control module (3) is in the open position, the testing area (21) is exposed, and the memory bar (9) can be plugged into the slot.

8. The memory module testing device of claim 7, wherein, The memory bank testing device further comprises a pair of symmetrically arranged nitrogen springs (40), one end of the nitrogen springs (40) being connected with the temperature control module (3), and the other end being connected with the box body (1).

9. The memory module testing device of claim 6, wherein, The test host (20) comprises a test mainboard (200), a heat dissipation block (202) attached to the CPU, and a heat dissipation fan (203), one side of the test mainboard (200) is provided with a plurality of the slots, and the other side is provided with the CPU, and the heat dissipation fan (203) is used for discharging the heat of the heat dissipation block (202) out of the test host (20).

10. The memory module testing device of claim 9, wherein, The test host (20) comprises a shell (201), and the CPU, the heat dissipation block (202) and the heat dissipation fan (203) are all arranged in the shell (201), and the slot is exposed outside the shell (201).

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