High-power TO device

Abstract

The utility model relates to a high-power TO device, which is characterized in that a tube socket is provided with a semiconductor cooler TEC, the semiconductor cooler TEC is provided with a tungsten copper block, the tungsten copper block is L-shaped, the lower end face of the tungsten copper block is attached to the semiconductor cooler TEC, a laser chip is arranged on the vertical face of the tungsten copper block in a dispensing manner, the tungsten copper block is provided with a collimating lens above the laser chip, and the collimating lens is connected with the laser chip. A converging lens is arranged in the laser through hole in the tube cap; after the scheme is adopted, the chip is arranged on the vertical face of the tungsten copper block, the collimating lens is tightly attached to the upper portion of the chip, more light emitted by the chip can be converged to the converging lens and transmitted to the optical fiber, the light loss is small, and the assembly coupling power is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of optical communication field, and specifically high-power TO product. BACKGROUND

[0002] Traditional TO( Transistor Outline )Package includes tube base, pin, chip and tube cap, focusing lens is generally provided on tube cap, for small TO, its size is smaller, chip is cooled by tube base and metal tube, metal tube cap can completely play the role of heat dissipation, but some chips needing heat dissipation are placed above tungsten copper block, but for high-power product such as high-power laser, its product size is larger, high-power chip generates heat when working, and it requires to be closer to heat sink, but the laser emitted by chip itself has scattering angle, so the distance between chip and ball lens on the side tube cap of heat sink after being close to heat sink changes, so part of laser with scattering angle cannot be converged after reaching ball lens on tube cap, causing the situation of low coupling power. SUMMARY

[0003] The utility model aims at providing a kind of TO device with small optical loss and high assembly coupling power.

[0004] To achieve the above purpose, the utility model provides a kind of high-power TO device, including tube base, pin, chip and tube cap, tube base is provided with semiconductor refrigerator TEC, "L" shaped tungsten copper block is arranged on semiconductor refrigerator TEC, tungsten copper block lower end surface is attached on semiconductor refrigerator TEC, laser chip is arranged on the vertical surface of tungsten copper block "L" shape by glue dispensing, collimating lens is arranged above laser chip on the vertical surface of tungsten copper block, and converging lens is arranged in laser through hole on tube cap.

[0005] After the above scheme, the utility model is arranged on the vertical surface of L-shaped tungsten copper block, so that the chip is closer to semiconductor refrigerator TEC, collimating lens is arranged above chip, which solves the problem that scattered light energy is more converged to converging lens and transmitted to optical fiber when chip is far away from tube cap, with small optical loss and high assembly coupling power. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1 It is structure schematic diagram of the utility model.

[0007] Label explanation:

[0008] 1, tube base; 2, laser chip; 3, tube cap; 31, converging lens; 4, optical fiber; 5, collimating lens; 6, tungsten copper block; 7, TEC, i.e. semiconductor refrigerator. DETAILED DESCRIPTION

[0009] To explain in detail the technical content, structural features, objectives and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0010] Please see Figure 1 This utility model discloses a high-power TO device. A tube base 1 has pins (not shown in the diagram). The tube base 1 is externally encapsulated with a tube cap 3, and an optical fiber 4 is connected to the tube cap 3. The tube base 1 is made of metal, and a semiconductor cooler TEC7 is attached to it. A tungsten copper block 6, shaped like an "L," is attached to the TEC7, with its lower end face attached to the TEC7. A laser chip 2 is glued to the vertical surface of the tungsten copper block 6. A collimating lens 5 is attached directly above the laser chip 2 on the tungsten copper block 6, with the light emission center of the laser chip 2 aligned with the center of the collimating lens 5. A converging lens 31 is located within a laser through-hole on the tube cap 3, coaxial with the aforementioned collimating lens 5. An optical fiber 4 is connected to the outside of the laser through-hole on the tube cap 3. The collimating lens 5 is close to the laser chip 2, so all the scattered light emitted by the laser chip 2 is collimated into parallel light by the collimating lens 5, reducing light loss. The parallel light is then converged by the converging lens 31 before entering the optical fiber, thus improving the optical coupling efficiency of the component.

[0011] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent shape or structural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high power TO device comprising a can, a lead, a die and a cap, characterized by: The pipe base is provided with a semiconductor cooler TEC, the semiconductor cooler TEC is provided with a tungsten copper block in the shape of L, the lower end surface of the tungsten copper block is attached to the semiconductor cooler TEC, a laser chip is arranged on the vertical surface of the tungsten copper block in the shape of L by glueing, a collimating lens is arranged above the laser chip on the vertical surface of the tungsten copper block, and a converging lens is arranged in the laser through hole of the pipe cap.

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